JP3779483B2 - Substrate cleaning apparatus and cleaning method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cleaning apparatus and method for cleaning a substrate such as a glass substrate for a liquid crystal display (LCD) or a semiconductor wafer.
[0002]
[Prior art]
In general, in the liquid crystal display manufacturing process, for example, an ITO (Indium Tin Oxide) thin film, an electrode pattern, or the like is formed on an LCD substrate (glass substrate) in the same manner as that used in the semiconductor manufacturing process. A series of processes are performed in which a circuit pattern or the like is reduced using technology and transferred to a photoresist and developed.
[0003]
In such a process, a resist solution is applied on a glass substrate, and then an exposure process and a development process are performed. Before such a series of predetermined processes, a circuit pattern defect occurs, wiring short-circuiting, It is necessary to clean the surface of the glass substrate to which the resist solution is applied in order to prevent defocusing during exposure and generation of particles.
[0004]
For this reason, a cleaning device is provided in a processing system for applying and developing a resist. In a conventional cleaning device, an arm is arranged on the side of a glass substrate held by a holding means such as a spin chuck, and a brush or nozzle attached to the tip of the arm by swinging this arm while rotating the glass substrate. Is moved above the glass substrate to perform scrubber cleaning and megasonic cleaning.
[0005]
[Problems to be solved by the invention]
However, in the above-described cleaning device, the arm is in a so-called cantilever support state, and thus there is a problem that it is weak in strength. In particular, as the size of the LCD panel increases, the size of the glass substrate increases, and the cleaning area also increases. For this reason, it is necessary to lengthen the arm, however, the strength of the arm is further reduced. Also, most conventional cleaning apparatuses usually have a brush or nozzle only at one location on the tip of the arm. For this reason, there is a problem that the cleaning area is not large and it takes a considerable time to clean the entire surface of a recent large glass substrate.
[0006]
Accordingly, an object of the present invention is to provide a cleaning means having a higher strength than conventional.
[0007]
[Means for Solving the Problems]
  The invention of claim 1 is a cleaning apparatus for cleaning a substrate, a holding means for holding the substrate, a cleaning means for cleaning the surface of the substrate held by the holding means, and a movement for supporting and moving the cleaning means from both sides. And the cleaning means is a scrubber cleaning means and a nozzle cleaning means. The nozzle cleaning means comprises a plurality of nozzles for supplying a processing liquid to the surface of the substrate, and the nozzles are pressurized. Supply processing solutionpluralSupplying jet nozzle and ultrasonically oscillated treatment liquidpluralA megasonic nozzle, saidpluralWith jet nozzlepluralWhat is a megasonic nozzle?On the surface of the substratePlaced opposite the center of the substrate,The innermost jet nozzle and megasonic nozzle are set so as to discharge the processing liquid toward the center of the substrate held by the holding means, and the remaining jet nozzle and megasonic nozzle are set in the direction of substrate rotation. It is set to discharge the processing liquid in the direction alongIt is characterized by that.
[0008]
  According to the cleaning apparatus of claim 1, the cleaning means can be supported from both sides by the moving means, and therefore has higher strength than the conventional cleaning apparatus that supports the arm in a cantilever state. I can. For this reason, it is possible to increase the size of the cleaning means corresponding to a recent large-sized glass substrate and the like, and it is possible to widen the cleaning area.In addition, by supplying the treatment liquid from a plurality of nozzles, the cleaning area can be increased, and it becomes possible to deal with a recent large glass substrate.
[0009]
In the cleaning apparatus of claim 1,furtherA pair of guide means arranged in parallel across the holding means may be provided.Also saidThe holding means is configured to rotate the substrate and includes a cup surrounding the substrate held by the holding means, and the cleaning means is configured to be movable between a standby position outside the cup and the inside of the cup. May be.AlsoThe scrubber cleaning means and the nozzle cleaning means may be supported by independent moving means, and each moving means may be configured to be independently movable.The aboveThe standby position of the nozzle cleaning means and the standby position of the scrubber cleaning means are preferably arranged opposite to each other on the opposite side of the cup.
[0010]
  Also saidThe scrubber cleaning means may be composed of either a disk brush or a roll brush.
[0012]
  SaidDifferent types of processing solutions are supplied from multiple nozzlesYou may do it.In the present specification, the treatment liquid is used to include a cleaning liquid.
[0014]
  Directional direction of these multiple nozzlesIs itIt is preferable that each can be changed. Then, for example, the processing liquid can be appropriately supplied to an appropriate location such as the center of the substrate or the vicinity of the peripheral edge, and uniform and efficient cleaning can be performed.
[0015]
  Also saidThere are a plurality of jet nozzles and megasonic nozzles, at least one jet nozzle and megasonic nozzle each discharge liquid in the direction of rotation of the substrate, and at least one other jet nozzle and megasonic nozzle each in the center direction of the substrate Set to discharge liquidMay be.
[0016]
  Furthermore, holdingYou may provide the nozzle which supplies a process liquid or drying gas at least to the back surface of the board | substrate hold | maintained at the means. Then, it becomes possible to clean the back surface as well as the front surface of the substrate.In that caseIt is preferable that the orientation direction of the nozzle is configured to be changeable. If it does so, a process liquid, drying gas, etc. can be suitably supplied now to suitable places, such as the center of a board | substrate, and a peripheral part vicinity.
[0017]
  Also holdA nozzle for supplying a predetermined gas to the back surface of the substrate held by the means is provided.e,The direction in which the gas is supplied from the nozzle to the back surface of the substrate is from the peripheral edge of the substrate toward the central portion.You may do it.
[0018]
  Also for holding meansThere is a nozzle for the back surface that selectively supplies different types of processing liquid to the back surface of the held substrate.May be.This placeTypeIt is possible to propose that one of the different processing solutions is pure water and the other is a surfactant or a solution containing the same. AgainFurthermore, saidThe nozzle for the back surface has a plurality of nozzles for supplying different types of processing liquids for each type of the processing liquid, and at least one of these nozzles discharges the liquid in the rotation direction of the substrate. Further, at least one of them may be set so as to discharge the liquid toward the center of the substrate.
[0019]
  The substrate cleaning method includes a step of holding the substrate on the holding means, a step of cleaning the surface of the substrate by moving the scrubber cleaning means, and a step of cleaning the surface of the substrate by moving the nozzle cleaning means. AndThe nozzle cleaning means includes a plurality of nozzles for supplying a processing liquid to the surface of the substrate, and the nozzle supplies a plurality of jet nozzles for supplying a pressurized processing liquid and a processing liquid subjected to ultrasonic vibration. A plurality of megasonic nozzles, wherein the plurality of jet nozzles and the plurality of megasonic nozzles are arranged opposite to each other across the center of the substrate on the surface of the substrate;During cleaning by the nozzle cleaning meansFrom the innermost jet nozzle and megasonic nozzle,The center of the substrate held and rotated by the holding meansThe treatment liquid is supplied in the direction, and the remaining jet nozzle and megasonic nozzleTreatment liquid along the direction of substrate rotationIs suppliedA method for cleaning a substrate is provided.
[0020]
  TheHorizontallyA step of cleaning the surface of the substrate by pressing the cleaning member of the scrubber cleaning means with a predetermined pressure while maintaining a parallel state with the substrate held by the substrate, and maintaining a parallel state with the horizontally held substrate Cleaning the surface of the substrate by simultaneously supplying different types of processing liquids to the substrate from the nozzle cleaning means that moves while moving.And supplying the processing liquid to the center of the rotating substrate surface held by the holding means and supplying the processing liquid along the rotation direction of the substrate during the cleaning by the nozzle cleaning means.A method for cleaning a substrate is provided. In this case, different types of treatment liquid andIs thatIt can be proposed that one is a cleaning liquid that cleans the surface of the substrate by pressurization, and the other is a cleaning liquid that cleans by supplying ultrasonically vibrated cleaning liquid to the surface of the substrate.
[0021]
  The cleaning method for each of these substratesExampleFor example, the scrubber cleaning means can be cleaned by reciprocating from one end to the other end of the substrate. MaBeforeThe nozzle cleaning means may be reciprocated from the end of the substrate to the center. AndLeverageThe substrate held by the holding means is rotated during cleaning by the nozzle cleaning means.You may do it.
[0022]
  NayouAt the time of cleaning by the nozzle cleaning means, it is preferable to perform the back surface cleaning by supplying the treatment liquid to the back surface of the substrate held by the holding means.
[0023]
  Further, the cleaning method of the present invention comprises:furtherYou may provide the process of drying a board | substrate. On the spotBeforeIt is preferable to rotate the substrate held by the holding means at a high speed when the substrate is dried. Then, the substrate can be dried in a short time, and the processing time can be reduced. NayouWhen drying the substrate, it is preferable to dry the back surface by supplying a drying gas to the back surface of the substrate held by the holding means.
[0024]
  And even more, Rotating the substrate held by the holding means at a higher speed than when cleaning by the nozzle means, and supplying a predetermined gas from the back side of the substrate toward the center of the substrate to dry the substrate.You may do it.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a preferred embodiment of the present invention is referred to as a glass substrate G (hereinafter referred to as “substrate G”) for a liquid crystal display (LCD). It is needless to say that the present invention can also be applied to a cleaning apparatus used in a resist processing system for forming a photoresist on the surface.
[0026]
FIG. 1 is a perspective view of a resist processing system 1 including a cleaning device 15 according to an embodiment of the present invention. A carrier stage 2 on which a carrier C containing a predetermined number of substrates G is placed is placed at the forefront of the resist processing system 1, and a carrier C placed on the carrier stage 2 is placed behind the carrier stage 2. The loading / unloading apparatus 3 for performing the operation of taking out the substrate G from the carrier and the operation of loading the substrate G into the carrier C is on standby. In the center of the resist processing system 1, two transfer paths 6 and 7 are formed in series with the relay unit 5 interposed therebetween, and transfer arms 8 and 9 that transfer the substrate G move through these transfer paths 6 and 7. It is configured to do.
[0027]
Two cleaning devices 15, an adhesion device 16, a cooling device 17, and two coating devices 18 are arranged on both sides of the transport path 6. A plurality of baking devices 20 and two developing devices 21 are arranged on both sides of the transport path 7. Although not shown, an exposure apparatus or the like is appropriately connected to the rear of the resist processing system 1.
[0028]
In this resist processing system 1, first, the substrate G is taken out from the carrier C placed on the carrier stage 2 by the carry-in / out device 3. The substrate G thus taken out is transferred to the transfer arm 8, moved along the transfer path 6, and transferred to the cleaning device 15. Then, scrubber cleaning and nozzle cleaning of the substrate G are performed in the cleaning device 15. Next, the substrate G is transported to the adhesion device 16 by the transport arm 8, subjected to a hydrophobic treatment, and further cooled by the cooling device 17.
Next, the substrate G is transported to the coating device 17 by the transport arm 8, and a photoresist film, that is, a photosensitive film is formed on the surface of the substrate G by coating. Next, the substrate G is transferred to the transfer arm 9 via the relay unit 5 and transferred to the baking apparatus 20. After the photoresist film is heated and pre-baked, a predetermined pattern is exposed by an exposure device (not shown). The exposed substrate G is transported to the developing device 21 by the transport arm 9 and developed by the developer, and then the substrate G is returned into the carrier C via the transport arm 9, the relay unit 5, and the transport arm 9. It is configured as follows.
[0029]
Next, a detailed configuration of the cleaning device 15 according to the embodiment of the present invention will be described. FIG. 2 is a longitudinal sectional view of the cleaning device 15, and FIG. 3 is a plan view of the cleaning device 15.
[0030]
A column 31 is erected on the upper surface of the table 30, and a cup 32 is supported on the upper end of the column 31. The cup 32 has a cylindrical shape with an open top surface, and holding means 33 as a holding mechanism for holding the substrate G in the horizontal direction (horizontal state) is disposed therein. In the illustrated example, the holding means 33 includes a spin chuck portion 35, a support column portion 36, and an elevating portion 37.
[0031]
A plurality of pins 40 are implanted on the upper surface of the spin chuck portion 35 for holding the substrate G while positioning it. The spin chuck portion 35 is rotatably supported around the support portion 36 via a bearing 41, and the rotational power of the motor 42 attached to the lower surface of the base 30 causes the pulley 43, the belt 44 and the pulley 45 to move. As a result, the spin chuck part 35 rotates by being transmitted through the substrate G, whereby the substrate G held on the upper surface of the spin chuck part 35 is rotated in the clockwise direction in the plan view (direction of arrow CW (Clockwise) shown in FIG. 3). It is configured to be able to be rotated.
[0032]
On the upper surface of the support column 36, three nozzles 50, 50, 50 and 51, 51, 51 for supplying the processing liquid to the back surface of the substrate G held by the spin chuck unit 35, and the substrate G One nozzle 52 is provided for supplying a predetermined gas, for example, a drying gas toward the center of the substrate. The nozzle 50 is configured to supply pure water as a rinse treatment liquid, for example. The nozzle 51 is configured to supply a chemical solution other than pure water, for example, a surfactant for preventing static electricity or the like, or a liquid containing a surfactant, for example, a solvent for dissolving a resist. The nozzle 52 is, for example, N as a drying gas.₂It is configured to supply gas or the like. Further, the supply of the liquid from the nozzle 50 or the nozzle 51 is selected independently, and is configured to be supplied simultaneously or selectively.
[0033]
The directivity directions of these nozzles 50, 51, and 52 are all configured to be changeable. In this embodiment, one of the nozzles 50 is held by a spin chuck portion 35 as shown in FIG. The other two are adjusted so as to be directed toward the center of the back surface of the substrate G, and the other two are directed in the direction along the rotation direction CW of the substrate G. Similarly, one of the nozzles 51 is adjusted to point toward the center of the back surface of the substrate G, and the other two are adjusted to point in the direction along the rotation direction CW of the substrate G. The nozzle 52 is adjusted so as to be directed to the center of the back surface of the substrate G.
[0034]
The elevating part 37 is supported by the upper end of a piston rod 55 that passes through the center of the column part 36, and the elevating part 37 moves up and down as the piston rod 55 expands and contracts by the operation of the cylinder 56. In FIG. 2, an elevating part 37 ′ indicated by a one-dot chain line indicates a state where the elevating part is raised by the extension operation of the cylinder 56. At the time of loading / unloading the substrate G, the elevating part 37 is lifted in this way, so that the substrate G is transferred to and from the transfer arm 8 fitted in the cleaning device 15.
2 shows a state where the elevating unit 37 is lowered by the shortening operation of the cylinder 56. In this way, when the elevating unit 37 is lowered, the substrate G received from the transfer arm 8 is held on the upper surface of the spin chuck unit 35 while being positioned by the pins 40.
[0035]
Next, a pair of guides 60 and 61 arranged in parallel so as to sandwich the holding means 33 are provided above the cup 32. Further, scrubber cleaning means 63 and nozzle cleaning means 64 configured to reciprocate along these guides 60 and 61 are provided. The scrubber cleaning means 63 and the nozzle cleaning means 64 shown in FIGS. 2 and 3 are both configured to be independently movable, and are in a standby position outside the cup 32, that is, in a standby state in which they are moved outside the substrate G. Is shown. In the illustrated example, when in the standby state as described above, the scrubber cleaning means 63 is located on the left side with the holding means 33 interposed therebetween, and the nozzle cleaning means 64 is located on the right side so that they face each other. Yes.
[0036]
The scrubber cleaning means 63 is configured to include a disc brush or a roll brush.
[0037]
First, FIG. 5 shows a left side view of the cleaning apparatus 15 configured to clean the surface of the substrate G by the scrubber cleaning means 63 having a large number of disk brushes 70. A moving member 71 is disposed so as to straddle the upper side of the cup 32. The moving member 71 is supported by guides 60 and 61 disposed on both sides of the cup 32 so as to be able to reciprocate. A reciprocating mechanism 69 for reciprocating the moving member 71 along the guides 60 and 61 is formed in the vicinity of the guide 61.
That is, the reciprocating mechanism 69 includes a two-stage pulley 74 attached to a support member 73 erected on the base 30 and an endless belt 68 wound around a pulley 75 shown in FIG. The driving force is transmitted through the pulley 77, the belt 78, and the two-stage pulley 74, so that the endless belt 68 rotates. As shown in FIG. 5, the moving member 71 is connected to the upper surface of the endless belt 68 via a connecting member 80 and a bracket 81, whereby the scrubber cleaning means 63 as a whole is guided by the guide 60, It is configured to reciprocate along 61.
[0038]
A vertical guide 85 and a cylinder 86 are disposed on the upper surface of the moving member 71, and both ends of the scrubber body 87 are supported by the vertical guide 85 and the cylinder 86. On the lower surface of the scrubber main body 87, a large number of rotating shafts 88 that are rotated by the driving force of a motor built in the scrubber main body 87 are provided, and disc brushes 70 are respectively attached to the lower ends of the rotating shafts 88.
When the scrubber main body 87 is lowered by the shortening operation of the cylinder 86, the disk brush 70 comes into contact with the surface of the substrate G held on the upper surface of the spin chuck portion 35 in the cup 32. FIG. 5 shows a state in which the cylinder 86 is shortened and the scrubber body 87 is lowered and the disk brush 70 is in contact with the surface of the substrate G.
As will be described later, when the scrubber cleaning means 63 is moved from the standby position into the cup 32 and from the cup 32 to the standby position, the scrubber main body 87 is raised by the extension operation of the cylinder 86, and the disk The brush 70 is raised to a position higher than the opening of the cup 32.
[0039]
As shown in FIG. 7, the disc brushes 70 are closely arranged on the lower surface of the scrubber main body 87 without a gap. At the time of cleaning, the scrubber main body 87 is lowered by the shortening operation of the cylinder 86, so that these disk brushes 70 are pressed and brought into contact with each other so as to cross the surface of the substrate G. The scrubber cleaning means 63 is reciprocated along the guides 60 and 61 according to the forward / reverse rotation of the motor 76 while rotating the disk brush 70, thereby cleaning the entire surface of the substrate G without leakage.
[0040]
Further, as shown in FIG. 8, a nozzle 90 is disposed on the side surface of the scrubber body 87, and when rotating the disk brush 70, a processing liquid such as pure water is discharged from the nozzle 90, A processing liquid is supplied to the surface of the substrate G.
[0041]
Next, FIG. 9 shows a left side view of the cleaning apparatus 15 configured to clean the surface of the substrate G by the scrubber cleaning means 63 provided with one roll brush 100. As in the case described above with reference to FIG. 5, the moving member 101 arranged so as to straddle the upper side of the cup 32 can reciprocate along the guides 60 and 61. A reciprocating mechanism 99 for reciprocating the moving member 101 along the guides 60 and 61 is configured near the guide 61. Since the specific configuration of the reciprocating mechanism 99 is the same as that of the reciprocating mechanism 69 described with reference to FIGS. 5 and 6, the reciprocating mechanism 99 shown in FIG. Detailed description will be omitted by giving the same reference numerals to the same components.
[0042]
A vertical guide 105 and a cylinder 106 are disposed on the upper surface of the moving member 101, and both ends of the scrubber body 107 are supported by the vertical guide 105 and the cylinder 106. Below the scrubber body 107, a roll brush 100 rotatably supported between the plates 108 and 109 is horizontally disposed. The roll brush 100 is connected to a pulley 110, a belt from a motor built in the scrubber body 107. It rotates with the driving force transmitted via 111 and the pulley 112.
[0043]
When the scrubber body 107 is lowered by the shortening operation of the cylinder 106, the roll brush 100 comes into contact with the surface of the substrate G held on the upper surface of the spin chuck portion 35 in the cup 32. As in the case described above with reference to FIG. 5, when the scrubber cleaning means 63 is moved from the standby position into the cup 32, when it is moved from the cup 32 to the standby position, and when the cylinder 106 is extended. The scrubber body 107 is raised, and the roll brush 100 is raised to a position higher than the opening of the cup 32.
[0044]
At the time of cleaning, the scrubber body 107 is lowered by the shortening operation of the cylinder 106 described above to bring the roll brush 100 into contact with the surface of the substrate G, and the motor 76 while rotating the roll brush 100. The scrubber cleaning means 63 is reciprocated along the guides 60 and 61 according to the forward and reverse rotations of the substrate G, thereby cleaning the entire surface of the substrate G without leakage.
[0045]
As shown in FIG. 10, a nozzle 115 is also arranged on the side surface of the scrubber main body 107. When the roll brush 100 is rotated, a cleaning liquid such as pure water is discharged from the nozzle 115, and the substrate G The cleaning liquid is supplied to the surface of the surface. In the present embodiment, one roll brush 100 is configured, but a plurality of roll brushes 100 may be provided in parallel to the substrate G.
[0046]
Next, FIG. 11 shows a right side view of the cleaning device 15 for explaining the nozzle cleaning means 64. Similar to the scrubber cleaning means 63 described above with reference to FIGS. 5 and 9, the moving member 121 is disposed so as to straddle the upper side of the cup 32. The moving member 121 is supported by guides 60 and 61 disposed on both sides of the cup 32 so as to be able to reciprocate. A reciprocating mechanism 122 for reciprocating the moving member 121 along the guides 60 and 61 is configured in the vicinity of the guide 61.
[0047]
That is, the reciprocating mechanism 122 includes a two-stage pulley 123 attached to a support member 73 erected on the base 30 and an endless belt 125 wound around a pulley 124 shown in FIG. The driving force is transmitted through the pulley 127, the belt 128, and the two-stage pulley 123, so that the endless belt 125 rotates. As shown in FIG. 11, the moving member 121 is connected to the upper surface of the endless belt 125 via the connecting member 130 and the bracket 131, so that the entire nozzle cleaning means 64 is guided by the guide 60, according to the forward / reverse rotation of the motor 126. It is configured to reciprocate along 61.
[0048]
  A vertical guide 135 and a cylinder 136 are disposed on the upper surface of the moving member 71, and the nozzle support member 137 is supported so as to be moved up and down along the vertical guide 135 by the operation of the cylinder 136. On the lower surface of the nozzle support member 137, different types of processing liquids on the surface of the substrate G, for example,WashA plurality of nozzles 141, 142, 143, 144, 145, 146, 147, and 148 as a mechanism for supplying the cleaning liquid are mounted. In the example shown in the figure, half of the nozzles 141 to Up to 144 is constituted by a jet nozzle that supplies a cleaning liquid pressurized to 30 to 70 kg / cm 2 to the surface of the substrate G, and the remaining half nozzles 145 to 148 ultrasonically vibrate the cleaning liquid to about 1 megahertz. It consists of a megasonic nozzle that supplies the surface of G.
[0049]
When the nozzle support member 137 is lowered by the shortening operation of the cylinder 136, the nozzles 141 to 148 can supply the cleaning liquid to the surface of the substrate G held on the upper surface of the spin chuck portion 35 in the cup 32. It descends to the height. FIG. 11 shows a state in which the cylinder 136 is shortened and the nozzle support member 137 is lowered, and the nozzles 141 to 148 are lowered to the vicinity of the surface of the substrate G. As will be described later, when the nozzle cleaning means 64 is moved from the standby position into the cup 32 and from the cup 32 to the standby position, the nozzle support member 137 is raised by the extension operation of the cylinder 136, and Each nozzle 141 to 148 is raised to a position higher than the opening of the cup 32.
[0050]
At the time of cleaning, the nozzle support member 137 is lowered by the shortening operation of the cylinder 136 described above to bring the nozzles 141 to 148 close to the surface of the substrate G and pressurize the cleaning liquid pressurized from the nozzles 141 to 144. And a cleaning liquid that is ultrasonically vibrated from each of the nozzles 145 to 148 is supplied. 2 is operated to rotate the spin chuck portion 35, and the substrate G is rotated in the clockwise direction CW in plan view. The entire surface of the substrate G is cleaned without leakage by reciprocating the nozzle cleaning means 64 along the guides 60 and 61 according to the forward and reverse rotation of the motor 126. When cleaning is performed by the nozzle cleaning means 64 in this way, the rotation of the spin chuck portion 35 is started by the operation of the motor 42, so that the nozzle cleaning means 64 reciprocates from the end of the substrate G to the center. It is enough to move.
[0051]
Further, the directivity directions of the nozzles 141 to 148 provided below the nozzle support member 137 are configured to be freely changeable. In this embodiment, as shown in FIG. The innermost nozzle 144 is directed to the center of the back surface of the substrate G held by the spin chuck portion 35, and the remaining three nozzles 141 to 143 are directed to a direction along the rotation direction CW of the substrate G. It has been adjusted. Similarly, the innermost nozzle 145 of the megasonic nozzles is directed to the center of the back surface of the substrate G held by the spin chuck portion 35, and the remaining three nozzles 146 to 148 are rotated in the direction of rotation of the substrate G. It is adjusted to point in the direction along the CW.
[0052]
Next, the operation of the cleaning device 15 according to this embodiment configured as described above will be described.
[0053]
First, the substrate G is carried into the cleaning device 15 by the transfer arm 8 of the resist processing system 1 described in FIG. Then, when the elevating unit 37 described with reference to FIG. 2 is raised, the substrate G that has been held on the transfer arm 8 up to now is received on the elevating unit 37 so as to be pushed up. Then, after the transfer arm 8 has moved out of the cleaning device 15, the elevating unit 37 is lowered, whereby the substrate G is held in a state where the substrate G is positioned on the upper surface of the spin chuck unit 35 by the pins 40.
[0054]
Next, cleaning is performed by the scrubber cleaning means 63 described above with reference to FIG. 5 or FIG.
[0055]
Here, in the case of the scrubber cleaning means 63 provided with the disk brush 70 of FIG. 5, the scrubber cleaning means 63 is first moved above the cup 32 by the operation of the reciprocating mechanism 69, and the scrubber main body is shortened by the cylinder 86 operation. The disk brush 70 is brought into contact with a predetermined pressure while the state 87 is lowered and the surface of the substrate G is maintained in a parallel state. The scrubber cleaning means 63 is moved along the guides 60 and 61 by operating the reciprocating mechanism 69 while rotating each disk brush 70, and the scrubber cleaning means 63 is moved from the one end to the other end of the substrate G. By reciprocating while maintaining the parallel state, the entire surface of the substrate G is cleaned without leakage. When the cleaning with the brush is completed, the scrubber body 87 is raised by the extension operation of the cylinder 86, and the scrubber cleaning means 63 is returned to the standby position outside the cup 32 by the operation of the reciprocating mechanism 69.
[0056]
Similarly, in the case of the scrubber cleaning means 63 provided with the roll brush 100 of FIG. 9, the scrubber cleaning means 63 is first moved above the cup 32 by the operation of the reciprocating mechanism 99, and the scrubber main body is shortened by the operation of the cylinder 106. 107 is lowered, and the roll brush 100 is brought into contact with the surface of the substrate G with a predetermined pressure while maintaining a parallel state. The scrubber cleaning means 63 is moved along the guides 60 and 61 by operating the reciprocating mechanism 99 while rotating the roll brush 100, and the scrubber cleaning means 63 is maintained in a parallel state from one end to the other end of the substrate G. By reciprocating in this state, the entire surface of the substrate G is cleaned without leakage. When the cleaning with the brush is completed in this way, the scrubber body 107 is raised by the extension operation of the cylinder 106, and the scrubber cleaning means 63 is returned to the standby position outside the cup 32 by the operation of the reciprocating mechanism 99.
[0057]
Next, cleaning is performed by the nozzle cleaning means 64 described above with reference to FIG. That is, first, the nozzle cleaning means 64 is moved above the cup 32 by the operation of the reciprocating mechanism 122, the nozzle support member 137 is lowered by the shortening operation of the cylinder 136, and the nozzles 141 to 148 are moved to the vicinity of the surface of the substrate G. It will be in the state of descending while maintaining the parallel state. Then, the supply of the pressurized cleaning liquid is started from the nozzles 141 to 144, and the supply of the cleaning liquid ultrasonically vibrated from the nozzles 145 to 148 is started.
[0058]
The operation timing of the liquid supply by the nozzles 141 to 144 and the liquid supply by the nozzles 145 to 148 can be set as appropriate, and after either one is operated, the other may be operated. After stopping the operation, the other operation may be stopped, or the start time and the stop time may be set at the same time.
[0059]
Further, the spin chuck portion 35 is rotated at the first predetermined rotation number, and the substrate G is rotated in the clockwise direction CW. Then, by operating the reciprocating mechanism 122, the nozzle cleaning means 64 is reciprocated along the guides 60, 61 from one end to the other end of the substrate G while maintaining a parallel state, so that the entire surface of the substrate G is moved. Supply cleaning solution and clean without leaks. In this case, since the substrate G is rotated, the nozzle cleaning means 64 does not need to reciprocate from one end to the other end of the substrate G, and the nozzle cleaning means 64 reciprocates from the end to the center of the substrate G. If moved, the entire surface of the substrate G can be cleaned without leakage.
When the cleaning is completed, the nozzle support member 137 is lifted by the extension operation of the cylinder 136, and the nozzle cleaning means 64 is returned to the standby position outside the cup 32 by the operation of the reciprocating mechanism 122.
[0060]
Further, when cleaning is performed by the nozzle cleaning means 64 performed in this way, the cleaning liquid is discharged from the nozzles 50 and 51 described above with reference to FIG. 5, whereby the back surface of the substrate G held by the spin chuck portion 35 is discharged. Clean the back surface by supplying a cleaning solution.
[0061]
The operation timing of the liquid supply by the nozzle 50 and the liquid supply by the nozzle 51 can be set as appropriate. After either one is operated, the other may be operated, or after one of the operations is stopped. The other operation may be stopped, and the start time and stop time may be simultaneously set.
[0062]
When the cleaning of the substrate G is completed in this manner, a step of drying the substrate G is performed next. That is, the rotational speed of the motor 42 shown in FIG. 2 is increased, and the substrate G held on the spin chuck portion 35 is rotated at a second predetermined rotational speed higher than the first predetermined rotational speed in the process. Let That is, it is rotated at a higher speed. As a result, the cleaning liquid adhering to the surface of the substrate G is spun off around by the centrifugal force, and the substrate G becomes dry in a short time. In addition, while the substrate G is rotated at a high speed in this way, the drying gas is discharged from the nozzle 52 described above with reference to FIG. The back surface of the substrate G held by the unit 35 is dried.
[0063]
Thus, after cleaning and drying the substrate G through the above steps, the rotation of the motor 42 is stopped and the elevating unit 37 is raised, so that the substrate G that has been held in the spin chuck unit 35 up to now is raised. Push up. Then, after the transfer arm 8 of the resist processing system 1 is fitted into the cleaning device 15, the elevating unit 37 is lowered, whereby the substrate G is transferred onto the transfer arm 8. The substrate G thus transferred onto the transfer arm 8 is appropriately carried into the next processing step in the resist processing system 1.
[0064]
As described above, according to the cleaning device 15 described in this embodiment, since the nozzle cleaning means 64 and the scrubber cleaning means 63 are supported from both sides by the guides 60 and 61, the conventional cleaning which was supported in a cantilever state. Higher strength than that of the apparatus can be obtained, and the nozzle cleaning means 64 and the scrubber cleaning means 63 can be enlarged corresponding to the recent large-sized glass substrate and the cleaning area is widened. It becomes possible to do. In addition, although it demonstrated based on the washing | cleaning apparatus 15 which wash | cleans the glass substrate G for LCD, this invention is applicable similarly to what wash | cleans other board | substrates, such as a semiconductor wafer and a printed circuit board.
[0065]
【The invention's effect】
According to the present invention, since the nozzle cleaning means and the scrubber cleaning means are supported from both sides by the guide means arranged with the holding means interposed therebetween, compared with the conventional cleaning apparatus that supports the arm in a cantilever state. High strength can be obtained. For this reason, the nozzle cleaning means and the scrubber cleaning means can be enlarged corresponding to the recent large-sized glass substrate, and the cleaning area can be increased.
[Brief description of the drawings]
FIG. 1 is a perspective view of a resist processing system provided with a cleaning apparatus according to an embodiment of the present invention.
FIG. 2 is a longitudinal sectional view of a cleaning device.
FIG. 3 is a plan view of the cleaning device.
FIG. 4 is an explanatory diagram of a directing direction of a nozzle provided on the upper surface of a support column.
FIG. 5 is a left side view of a cleaning apparatus configured to clean the surface of a substrate by a scrubber cleaning means including a disc brush.
FIG. 6 is an explanatory diagram of a reciprocating mechanism.
7 is a bottom view of the scrubber body according to the embodiment of FIG.
FIG. 8 is a side view of the scrubber body according to the embodiment of FIG.
FIG. 9 is a left side view of a cleaning apparatus configured to clean the surface of a substrate by a scrubber cleaning means including a roll brush.
FIG. 10 is a side view of the scrubber body according to the embodiment of FIG.
FIG. 11 is a right side view of the cleaning device for explaining the nozzle cleaning means.
FIG. 12 is an explanatory diagram of the directing direction of each nozzle of the nozzle cleaning means.
[Explanation of symbols]
G substrate
15 Cleaning device
32 cups
33 Holding means
60, 61 guide
63 Scrubber cleaning means
64 Nozzle cleaning means
70 Disc brush
100 roll brush
141-148 nozzles

Claims (9)

In a cleaning apparatus for cleaning a substrate, the substrate has a holding means for holding the substrate, a cleaning means for cleaning the surface of the substrate held by the holding means, and a moving means for supporting and moving the cleaning means from both sides.
The cleaning means is a scrubber cleaning means and a nozzle cleaning means,
The nozzle cleaning means includes a plurality of nozzles for supplying a processing liquid to the surface of the substrate,
The nozzle includes a plurality of jet nozzles that supply pressurized processing liquid, and a plurality of megasonic nozzles that supply ultrasonically oscillated processing liquid, the plurality of jet nozzles and a plurality of megasonic nozzles, Are arranged opposite to each other across the center of the substrate on the surface of the substrate,
The innermost jet nozzle and the megasonic nozzle are set to discharge the processing liquid toward the center of the substrate held by the holding means,
The remaining jet nozzle and megasonic nozzle are set so as to discharge the processing liquid in a direction along the rotation direction of the substrate. In a cleaning apparatus for cleaning a substrate, the substrate has a holding means for holding the substrate, a cleaning means for cleaning the surface of the substrate held by the holding means, and a moving means for supporting and moving the cleaning means from both sides.
The cleaning means is a nozzle cleaning means;
The nozzle cleaning means includes a plurality of nozzles for supplying a processing liquid to the surface of the substrate,
The nozzle includes a plurality of jet nozzles that supply pressurized processing liquid, and a plurality of megasonic nozzles that supply ultrasonically oscillated processing liquid, the plurality of jet nozzles and a plurality of megasonic nozzles, Are arranged opposite to each other across the center of the substrate on the surface of the substrate ,
The innermost jet nozzle and the megasonic nozzle are set to discharge liquid toward the center of the substrate held by the holding means,
The remaining jet nozzle and megasonic nozzle are set so as to discharge liquid in a direction along the rotation direction of the substrate. Further, a nozzle for supplying a predetermined gas to the back surface of the substrate held by the holding means is provided, and the direction of supplying the gas from the nozzle to the back surface of the substrate is from the peripheral edge of the substrate toward the center portion. The substrate cleaning apparatus according to claim 1, wherein the substrate cleaning apparatus is a substrate cleaning apparatus. The substrate according to any one of claims 1 to 3, further comprising a back surface nozzle for selectively supplying different types of processing liquids to the back surface of the substrate held by the holding means . Cleaning device. 5. The substrate cleaning apparatus according to claim 4 , wherein one of the different types of processing liquid is pure water and the other is a surfactant or a liquid containing the same. . The nozzle for the back surface has a plurality of nozzles for supplying different types of processing liquids for each type of the processing liquid, and at least one of these nozzles discharges the liquid in the rotation direction of the substrate. 6. The substrate cleaning apparatus according to claim 4, wherein at least one of them is discharged and liquid is discharged toward the center of the substrate. Holding the substrate on the holding means;
Moving the scrubber cleaning means to clean the surface of the substrate;
Cleaning the surface of the substrate by moving the nozzle cleaning means,
The nozzle cleaning means includes a plurality of nozzles for supplying a processing liquid to the surface of the substrate,
The nozzles are a plurality of jet nozzles that supply pressurized processing liquid, and a plurality of megasonic nozzles that supply ultrasonically oscillated processing liquid, the plurality of jet nozzles and a plurality of megasonic nozzles, Are arranged opposite to each other across the center of the substrate on the surface of the substrate,
At the time of cleaning by the nozzle cleaning means, the processing liquid is supplied from the innermost jet nozzle and megasonic nozzle toward the center of the rotating substrate held by the holding means, and the remaining jet nozzles And the rotation direction of the substrate from the megasonic nozzle The substrate cleaning method is characterized in that the processing liquid is supplied along the substrate. Cleaning the surface of the substrate by moving the scrubber cleaning means while maintaining a parallel state with the horizontally held substrate and pressing the cleaning member of the scrubber cleaning means at a predetermined pressure;
A step of cleaning the surface of the substrate by simultaneously supplying different types of processing liquids to the substrate from a nozzle cleaning means that moves while maintaining a parallel state with the substrate held horizontally,
The nozzle cleaning means includes a plurality of nozzles for supplying a processing liquid to the surface of the substrate,
The nozzle includes a plurality of jet nozzles that supply pressurized processing liquid, and a plurality of megasonic nozzles that supply ultrasonically oscillated processing liquid, the plurality of jet nozzles and a plurality of megasonic nozzles, Are arranged opposite to each other across the center of the substrate on the surface of the substrate,
At the time of cleaning by the nozzle cleaning means, the processing liquid is supplied from the innermost jet nozzle and megasonic nozzle toward the center of the rotating substrate held by the holding means, and the remaining jet nozzles The substrate cleaning method is characterized in that the processing liquid is supplied from the megasonic nozzle along the rotation direction of the substrate. 9. The method according to claim 7, further comprising a step of drying the substrate by supplying a gas from the peripheral edge of the substrate toward the center while the substrate is being rotated. Substrate cleaning method.

Images