JPH0697137A - Substrate cleaning equipment - Google Patents

Abstract

PURPOSE:To provide a substrate cleaning equipment in which cleaning of the surface of a substrate by means of a cleaning jig, drying of the substrate after cleaning, and cleaning of the rear surface of the substrate are all carried out well. CONSTITUTION:A supporting pin 19 for supporting a rectangular substrate W in horizontal attitude and a positioning pin 20 for determining the supporting position of the rectangular substrate W in the horizontal direction are provided on a first rotary table 18 rotatable around a vertical axis P1 thus constitution a first substrate supporting means 16 whereas a suction hole 30 for vacuum sucking the rectangular substrate W is made through a second rotary table 25 rotatable around the vertical axis Pi while mounting the rectangular substrate W thus constituting a second substrate supporting means 17 and then the second rotary table 25 is moved up and down. This constitution allows switching between a state where the rectangular substrate W is held on the second rotary table 25 while being sucked and the surface thereof is cleaned through sliding of a cleaning brush 3 and a state where the rectangular substrate W is supported by the supporting pin 19 and cleaning liquid is fed through a cleaning liquid nozzle 37 to clean the rear surface or shake off the cleaning liquid.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device,
In order to clean a substrate such as a substrate for an optical disk, the substrate is provided with a substrate supporting means for placing and supporting the substrate in a horizontal posture and rotating about a vertical axis, and a cleaning tool for slidingly cleaning the substrate. Cleaning device

[0002]

2. Description of the Related Art In the case of rotatably supporting a substrate in a substrate cleaning apparatus as described above, there is conventionally known Japanese Patent Laid-Open No. 2-8614
As described in Japanese Patent No. 4 publication, a rotary table that rotates around a vertical axis is provided with a support pin for mounting and supporting the substrate and a positioning member that determines a horizontal support position of the substrate, thereby mechanically supporting the substrate. Either hold the substrate, or form a suction hole for sucking and holding the substrate by vacuum suction on the upper surface of the rotary table that mounts and supports the substrate and rotates about the vertical axis. I was using that method.

[0003]

However, when the cleaning treatment is performed by sliding the upper surface of the substrate with a cleaning tool while rotating the substrate, the above-mentioned method of mechanically holding the substrate is
Since the positioning member contacting the peripheral end surface of the substrate comes into contact with the cleaning tool, there is a drawback that the cleaning ability near the positioning member is reduced due to the contact and the life of the cleaning tool is shortened.

On the other hand, in the method of vacuum-adsorbing the substrate, even if the cleaning liquid is shaken off after cleaning, that is, so-called spin drying, water drops remain on the lower surface of the substrate in contact with the rotary table, and there is a drawback. However, there is a drawback that the lower surface of the substrate that is in contact with the rotary table cannot be cleaned.

The present invention has been made in view of the above circumstances, and makes it possible to satisfactorily perform both the cleaning of the upper surface of the substrate with a cleaning tool and the drying after cleaning and the cleaning of the lower surface of the substrate. The purpose is to

[0006]

In order to achieve the above-mentioned object, the present invention provides a substrate supporting means for mounting and supporting the substrate in a horizontal posture and rotating the substrate about an axis in the vertical direction. In a substrate cleaning device equipped with a cleaning tool for sliding contact cleaning,
First substrate support including substrate supporting means on a first rotary table that rotates around an axis in the vertical direction, and support pins for mounting and supporting the substrate and a positioning member that determines a supporting position of the substrate in the horizontal direction. And a second substrate supporting means having a suction hole for sucking and holding the substrate by vacuum suction formed on the upper surface of the second rotary table that rotates about the vertical axis. A substrate supporting means switching mechanism that moves up and down the substrate supporting means and the second substrate supporting means relative to a position where the substrate is mounted and supported on the support pin and a position where the substrate is suction-held on the second rotary table. And a lower surface cleaning means for supplying a cleaning liquid to the lower surface of the substrate.

[0007]

According to the configuration of the substrate cleaning apparatus of the present invention, when cleaning the upper surface of the substrate by sliding with the cleaning tool, the second substrate supporting means sucks and holds the substrate, and the positioning member can clean the substrate. On the other hand, when the lower surface of the substrate is washed or shaken off and dried by rotation, the substrate is mechanically held by the first substrate supporting means, and the entire lower surface can be well washed without leaving traces of water droplets and the like. Can be dried.

[0008]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 1 is a partially omitted side view showing an embodiment of a substrate cleaning apparatus according to the present invention. In FIG. 1, reference numeral 1 denotes a substrate supporting means for mounting a square substrate W in a horizontal posture. And is configured to rotate around the first rotation axis P1 in the vertical direction.

A second substrate which is located above the rectangular substrate W and is parallel to the first rotary shaft core P1 is provided on the tip end side of the swing arm 2.
The cleaning brush 3 is attached so as to be rotatable around the rotation axis P2 (see FIG. 2), and the cleaning brush 3 and the first electric motor 4 provided on the swing arm 2 form a first belt type transmission mechanism. It is interlockingly connected through 5. The cleaning brush 3 is configured by implanting bristles made of nylon, mohair, or the like at the bottom of the brush body. Instead of the cleaning brush 3, a felt-like material that allows a cleaning liquid to soak in,
A drum type brush or the like may be used, and these are collectively referred to as a cleaning tool.

An arm support shaft 6 integrally provided with a swing arm 2 is provided on a base 7 so as to be movable up and down and rotated, and the arm support shaft 6 and a second electric motor 8 are of a second belt type. The cleaning brush 3 is interlocked and coupled through the transmission mechanism 9.
Can be driven and displaced over the standby position A, the rotation center position B corresponding to the first rotation axis P1 for rotating the rectangular substrate W, and the outer side position C outside the rotation locus of the rectangular substrate W. It is configured.

An air cylinder 10 is provided below the arm support shaft 6, and a push-up member 12 is integrally connected to a cylinder rod 11 of the air cylinder 10. On the other hand, a fixed position is adjusted at an intermediate position of the arm support shaft 6. The stopper 13 is attached as much as possible, and the support base 14 is provided on the base 7. The stopper 13 and the support base 14 contact the stopper 13 with the support base 14, and the height of the lowered position of the cleaning brush 3, that is, The height of the rectangular substrate W with respect to the upper surface is maintained at a predetermined height.

With the above structure, when the cleaning brush 3 is displaced from the standby position A to the central position B of the rectangular substrate W at the start of cleaning, the cleaning brush 3 pushes up the pushing member 1 of the air cylinder 10.
2 rises and is pushed up by pushing up the arm support shaft 6. When the cleaning brush 3 is displaced from the central position B of the rectangular substrate W to the outer side position C of the rectangular substrate W outside the rotation trajectory of the rectangular substrate W, the cleaning brush 3 is stopped by the stopper 13.
Is lowered to a position where it comes into contact with the support base 14, and cleaning is performed while maintaining that position. In the figure, reference numeral 15 denotes a nozzle that supplies a cleaning liquid such as pure water to the upper surface of the rectangular substrate W.

The substrate supporting means 1 includes a first substrate supporting means 16 and a second substrate supporting means as shown in the partially cutaway side view of the essential part of FIG. 2 and the plan view of the essential part of FIG. It is composed of 17 and.

The first substrate supporting means 16 mounts and supports the rectangular substrate W on a first rotary table 18 which has a rectangular outer shape and is driven and rotated about a first rotation axis P1 in the vertical direction. .. and positioning pins 20 ... As positioning members that determine the supporting position of the rectangular substrate W in the horizontal direction. It is essential that the height of the positioning pin 20 is higher than that of the support pin 19, and in the embodiment, in order to reliably position the rectangular substrate W, the upper end of the positioning pin 20 is a corner supported by the support pin 19. It is arranged to be located above the upper surface of the mold substrate W.

The cylindrical shaft 18a integral with the first rotary table 18 is
The support frame 21 is rotatably provided via ball bearings 22 ...
And are interlockingly connected via a third belt type transmission mechanism 24.

In the second substrate supporting means 17, a support shaft 25a integral with the second rotary table 25 is fitted in the cylindrical shaft 18a via a spline fitting mechanism 26 so as to be slidable only in the vertical direction. Moreover, the lower part of the support shaft 25a is projected below the cylindrical shaft 18a, and the rotary joint 27 and the pipe 2 are attached to the projecting end.
A vacuum suction source 29 is connected via 8, while suction holes 30 ... Are formed dispersedly on the upper surface of the second rotary table 25, and suction holes 30 ... And a rotary joint 27 are formed in the support shaft 25a. The rectangular substrates W are connected via the through holes 31 and can be held by suction by vacuum suction. In the vacuum suction source 29, air is sucked in a gas-liquid separated state, and moisture is not sucked into an intake pump or the like.

The rotary joint 27 is integrally attached to the support arm 32, and the guide rod 33 to which the support arm 32 is integrally attached is fitted in the guide cylinder 34 so as to be slidable in the vertical direction. Support arm 32
Is connected to the air cylinder 35, and the expansion and contraction of the air cylinder 35 causes the second substrate supporting means 17 to move to the first
With respect to the substrate supporting means 16 of FIG. The means switching mechanism 36 is configured.

A cleaning liquid nozzle 37 as a lower surface cleaning means is provided on the lower side of the peripheral portion of the first rotary table 18 so that a cleaning liquid such as pure water can be supplied to the lower surface of the rectangular substrate W.

The cleaning operation with the above configuration will be described. First, the rectangular substrate W is loaded while the second rotary table 25 is raised, and the rectangular substrate W is suction-held by the second substrate supporting means 17. Next, with the cleaning brush 3 raised,
It is displaced from the standby position A to the central position B of the rectangular substrate W. Then, the second rotating table 25 is rotated to rotate the supported rectangular substrate W, and while the cleaning liquid is supplied from the nozzle 15, at the same time, the cleaning brush 3 is rotated to touch the upper surface of the rectangular substrate W. Lower to height. Then, while maintaining the height, the rectangular substrate W is reciprocally displaced from the central position B of the rectangular substrate W to the outer side position C outside the rotational trajectory of the rectangular substrate W, and the entire upper surface of the rectangular substrate W is slidably washed. The second substrate supporting means 17 supports the rectangular substrate W by vacuum suction without a positioning member that abuts against the edge of the rectangular substrate W and regulates its position. Therefore, the cleaning brush is used. Three
Does not come into contact with the positioning member, and the vicinity of the peripheral edge of the rectangular substrate W is well cleaned.

Subsequently, the direction of the rectangular substrate W supported by the second substrate supporting means 17 is changed to the first substrate supporting means 16
The rotation of the second turntable 25 is stopped so as to match the direction of the first turntable 18 of FIG. Then, when the vacuum suction source 29 is stopped and the second rotary table 25 is lowered, the rectangular substrate W is supported by the first substrate supporting means 16. At this time, the rectangular substrate W is the first substrate supporting means 1
Support pin 1 in the state of being positioned by the positioning pin 20 of 6
9 is mounted on. Then, in this state, the first rotary table 18 is rotated to rotate the supported rectangular substrate W, and the cleaning liquid is supplied from the cleaning liquid nozzle 37, whereby the lower surface of the rectangular substrate W is cleaned. Since the first substrate supporting means 16 supports the rectangular substrate W by the positioning pins 20 and the support pins 19, the rectangular substrate W is
The entire lower surface, including the portion that was in contact with the rotary table 5, was cleaned well.

After that, the supply of the cleaning liquid is stopped and the first
By rotating the rotary table 18 at high speed, the cleaning liquid is shaken off and the rectangular substrate W is dried. In the first substrate supporting means 16, since the rectangular substrate W is supported with a very narrow contact area at the upper end of the support pin 19, the rectangular substrate W is
The entire upper and lower surfaces are well dried, and no water droplets remain on the central portion of the substrate surface.

As the substrate supporting means switching mechanism 36, the first rotary table 18 may be moved up and down. Further, the present invention is not limited to the rectangular rectangular substrate W, but can be applied to a substrate cleaning apparatus for cleaning a square rectangular substrate or a circular substrate.

[0024]

According to the substrate cleaning apparatus of the present invention, when the upper surface of the substrate is slidably cleaned by the cleaning tool, the substrate is suction-held by the second substrate supporting means and can be cleaned without being disturbed by the positioning member. Therefore, a high cleaning effect can be obtained, and since there is no interference between the cleaning tool and the positioning member, the life of the cleaning tool can be extended and the economical efficiency can be improved.

On the other hand, when the lower surface of the substrate is washed or shaken off by rotation, the substrate is mechanically held by the first substrate supporting means, so that water drops and the like such as when the substrate is suction-held by vacuum suction are retained. It is possible to avoid leaving a mark, and the entire lower surface of the substrate can be well cleaned and dried.

[Brief description of drawings]

FIG. 1 is a partially omitted side view showing an embodiment of a substrate cleaning apparatus according to the present invention.

FIG. 2 is a partially cutaway side view of a main part.

FIG. 3 is a plan view of a main part.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Substrate support means 3 ... Cleaning brush as a cleaning tool 16 ... 1st board | substrate support means 17 ... 2nd board | substrate support means 18 ... 1st turntable 19 ... Support pin 20 ... Positioning pin 25 as a positioning member 25 ... Second rotary table 30 ... Suction hole 36 ... Substrate supporting means switching mechanism 37 ... Cleaning liquid nozzle as lower surface cleaning means P1 ... First rotation axis W ... Square substrate

Claims (1)

[Claims] 1. A substrate cleaning apparatus comprising: a substrate supporting means for mounting and supporting a substrate in a horizontal posture and rotating about a vertical axis; and a cleaning tool for cleaning the substrate by sliding contact. A first substrate provided with a supporting pin for mounting and supporting the substrate and a positioning member for determining a supporting position of the substrate in a horizontal direction on a first rotary table that rotates around the vertical axis. Supporting means, and second substrate supporting means having a suction hole for sucking and holding the substrate by vacuum suction formed on the upper surface of the second rotary table that rotates around the vertical axis, and , The first substrate support means and the second substrate support means are positioned relative to a position where the substrate is mounted and supported on the support pin and a position where the substrate is sucked and held on the second rotary table. Board support means switching mechanism that moves up and down Substrate cleaning apparatus, characterized in that it and a lower surface washing means for supplying a cleaning liquid to the lower surface of the substrate.