JP2000070875A - Base cleaning apparatus and base cleaning - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a base cleaning apparatus and a cleaning method by which even a base with unevenness can be sufficiently cleaned. SOLUTION: A rotating stage 12 for placing a base W is connected with a motor 10 through a rotating shaft. The motor 10 can be rotated in the normal direction or in the reverse direction. In addition, a brush arm 25 and a nozzle arm 35 respectively holding a cleaning brush 20 and a cleaning nozzle 30 are provided so as to make their lengths variable by extending and contracting actions. When cleaning is performed, while the base W is rotated in the normal direction and in the reverse direction by means of the motor 10, the cleaning brush 20 and the cleaning nozzle 30 are moved in parallel to the main face of the base W and along a straight line passing through the rotational center of the base W. Therefore, there exists no shaded part of the uneven part seen from the cleaning brush 20 and the cleaning nozzle 30 as the whole cleaning treatment and even the uneven part can be sufficiently cleaned.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for cleaning a substrate while rotating a thin substrate (hereinafter referred to as "substrate") such as a semiconductor substrate or a liquid crystal glass substrate.

[0002]

2. Description of the Related Art Generally, various processes such as resist coating, exposure, development and the like are sequentially performed on the above-mentioned substrate to perform desired substrate processing. At this time, if particles and the like adhere to the substrate and become contaminated, the characteristics of the processed substrate are significantly deteriorated. Therefore, the above-described substrate cleaning apparatus uses various cleaning means such as a cleaning brush and a cleaning nozzle. do it,
Wash the substrate.

The above-mentioned various cleaning means are provided at the tip of an arm having a rotation axis outside a turntable on which a substrate is placed and rotated. The cleaning means is configured to be evacuated to the outside of the turntable so as not to disturb the transfer of the substrate before and after the cleaning process by the rotation of the arm, and to be positioned above the substrate surface during the cleaning process. I have.

The cleaning brush during the cleaning process is disposed at a position in contact with the rotating substrate or at a position close to the substrate with a small space therebetween, and is driven from the center of rotation of the substrate toward the peripheral edge thereof, and is positioned on the surface of the substrate. It has the function of sweeping out particles.

[0005] Further, the cleaning by the cleaning nozzle during the cleaning process is performed such that the landing point of the discharged cleaning liquid is reciprocated between the center of rotation of the substrate and the peripheral portion, and the particles adhering to the substrate are separated. It has a function to do. The separated particles are removed by the centrifugal force of the rotation of the substrate.

[0006]

As described above, in the conventional substrate cleaning apparatus, the substrate is cleaned using a cleaning means such as a cleaning brush or a cleaning nozzle while rotating the substrate. Sometimes the following problems have occurred.

FIG. 7 is a view for explaining a state of conventional substrate cleaning. In some cases, unevenness such as a circuit pattern is formed on the substrate W. In the example of FIG. 7, a convex portion P1 and a concave portion P2 are formed on the surface of the substrate W. While the cleaning brush 90 is in contact with the substrate W, the substrate W
Is rotated in the direction indicated by arrow A7 to perform the cleaning process.

[0008] As the substrate W rotates in the direction indicated by the arrow A7, the cleaning brush 90 eventually comes into contact with the concave portion P2 and the convex portion P1, and cleans these portions. At this time,
Since the cleaning brush cannot sufficiently contact the portion S2 of the concave portion P2 and the portion S1 of the convex portion P1,
Contaminants such as particles attached to those portions cannot be removed. That is, the concave portion P2 and the convex portion P are viewed from the cleaning brush 90 in a direction opposite to the rotation direction of the substrate W.
It is not possible to sufficiently clean the respective shaded portions of No. 1.

In the conventional substrate cleaning, the rotation of the arm drives the cleaning brush 90 from the center of rotation of the substrate W toward the peripheral edge, so that the movement locus of the cleaning brush 90 on the substrate W is arc-shaped. And the cleaning efficiency was not always good.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a substrate cleaning apparatus and method capable of sufficiently cleaning even a substrate having irregularities.

Another object of the present invention is to provide a substrate cleaning apparatus and method which are excellent in cleaning efficiency.

[0012]

Means for Solving the Problems To solve the above problems, the invention of claim 1 is a substrate cleaning apparatus for performing a cleaning process while rotating a substrate, wherein (a) the substrate cleaning apparatus is held in a substantially horizontal posture. Rotating means for rotating the substrate in a first direction and a second direction opposite to the first direction; and (b) cleaning means for cleaning the surface of the substrate.

According to a second aspect of the present invention, in the substrate cleaning apparatus according to the first aspect of the present invention, the driving means moves the cleaning means along a straight line passing through the center of rotation of the substrate in parallel with the main surface of the substrate. Means are further provided.

According to a third aspect of the present invention, there is provided the substrate cleaning apparatus according to the second aspect of the present invention, wherein the driving means includes a telescopic arm having the cleaning means connected to one end and having a variable length by a telescopic operation. I am preparing.

According to a fourth aspect of the present invention, in the substrate cleaning apparatus according to the third aspect of the present invention, the first arm having the cleaning means connected to one end and the first arm can be housed in the telescopic arm. A second arm is provided, and the expansion and contraction operation is performed by changing the storage state of the first arm in the second arm.

According to a fifth aspect of the present invention, in the substrate cleaning apparatus of the second aspect, the cleaning means is connected to one end of the driving means, and the cleaning means is moved along the straight line by bending and stretching operations. A bending arm is provided.

According to a sixth aspect of the present invention, in the substrate cleaning apparatus according to the fifth aspect of the present invention, a first arm having the cleaning means connected to one end of the bending and extending arm, and the first arm connected to one end. The second arm is provided, and the bending operation is performed by changing the relative bending state of the first arm and the second arm.

According to a seventh aspect of the present invention, in the substrate cleaning apparatus according to any one of the first to fifth aspects,
The cleaning means includes a cleaning brush for cleaning the substrate by abutting on the main surface of the substrate or approaching the main surface at a predetermined interval.

According to an eighth aspect of the present invention, in the substrate cleaning apparatus according to any one of the first to fifth aspects,
The cleaning means includes a cleaning nozzle for discharging a cleaning liquid onto the main surface of the substrate to clean the substrate.

According to a ninth aspect of the present invention, there is provided a substrate cleaning method for performing a cleaning process while rotating a substrate, the method comprising: (a) rotating a substrate held in a substantially horizontal posture in a first direction;
A rotating step, (b) a first cleaning step of performing a cleaning process by a cleaning unit on the substrate rotating in the first direction, and (c) a second cleaning step in a direction opposite to the first direction. A second rotation step of rotating the substrate in the second direction, and a second cleaning step of performing a cleaning process by the cleaning means on the substrate rotating in the second direction.

According to a tenth aspect of the present invention, there is provided the substrate cleaning method according to the ninth aspect, further comprising the step of moving the cleaning means along a straight line passing through the center of rotation of the substrate.

According to a eleventh aspect of the present invention, in the substrate cleaning method according to the ninth or tenth aspect, the cleaning means abuts on the main surface of the substrate or approaches the main surface of the substrate at a predetermined interval. And a cleaning brush for cleaning the substrate.

According to a twelfth aspect of the present invention, in the substrate cleaning method according to the ninth or tenth aspect, the cleaning means discharges a cleaning liquid onto the main surface of the substrate to clean the substrate. The nozzle is included.

[0024]

Embodiments of the present invention will be described below in detail with reference to the drawings.

<1. FIG. 1 is a front view showing an example of a substrate cleaning apparatus according to the present invention. Also,
FIG. 2 is a plan view of the substrate cleaning apparatus of FIG. A substrate cleaning apparatus according to the present invention is a rotary substrate cleaning apparatus (spin scrubber) for cleaning a substrate using a cleaning brush and a cleaning nozzle while rotating the substrate. This substrate cleaning apparatus roughly includes a substrate rotating mechanism for rotating the substrate, a brush cleaning mechanism using a cleaning brush, and a nozzle cleaning mechanism using a cleaning nozzle.

A rotary shaft 11 is provided below the rotary table 12, and the rotary shaft 11 is connected to the motor 10. on the other hand,
A plurality of support pins 13 are erected on the upper surface of the turntable 12,
The substrate W is held in a substantially horizontal posture by the support pins 13. The motor 10 can rotate in the forward or reverse direction, and with the rotation of the motor 10, the turntable 12 and the substrate W also rotate in both the forward and reverse directions, as shown by an arrow A1. A cup 15 for collecting the substrate W and the cleaning liquid scattered from the turntable 12 during the rotation process is arranged around the turntable 12.

The brush cleaning mechanism of the substrate cleaning apparatus is realized by a cleaning brush 20, a brush arm 25, and an air cylinder 28. The cleaning brush 20 is a cleaning unit that performs substrate cleaning by abutting on the main surface of the substrate W or approaching the main surface at a predetermined interval. The brush arm 25 includes a first arm 25a and a second arm 25b. First
The cleaning brush 20 is attached to one end of the arm 25a vertically downward, and the first arm 25a can be housed inside the second arm 25b.

The structure of the brush arm 25 will be further described with reference to FIG. One end of the first arm 25a (the end opposite to the side where the cleaning brush 20 is attached)
A slide portion 27 is fixedly mounted on the
Is slidable inside the second arm 25b. On the other hand, the second arm 25b is provided with an air supply / discharge unit 26. By supplying or discharging air from the air supply / discharge unit 26 to the inside of the second arm 25b, the second arm 25b is provided.
The position of the first arm 25a can be moved. That is, the brush arm 25 can change the storage state of the first arm 25a in the second arm 25b by a so-called air cylinder mechanism. The brush arm 25 expands and contracts as the state of storage of the first arm 25a in the second arm 25b changes.

As described above, the brush arm 25 of the first embodiment is a telescopic arm whose length is made variable by a telescopic operation. When the brush arm 25 expands and contracts, the cleaning brush 20 can be linearly moved between the rotation center of the substrate W and the peripheral edge.
That is, the brush arm 25 not only holds the cleaning brush 20 but also moves the first arm 2 to the second arm 25b.
By changing the storage state of 5a, it expands and contracts, and has a function as a driving means for moving the cleaning brush 20 along a straight line passing through the center of rotation of the substrate W in parallel with the main surface of the substrate W.

Returning to FIG. 1 and FIG.
Is connected to the piston 29 of the air cylinder 28,
The air cylinder 28 can be moved up and down. As the brush arm 25 moves up and down, the cleaning brush 20 also moves up and down in the vertical direction. Therefore, the cleaning brush 20 can perform a horizontal linear movement and a vertical lifting / lowering operation by the brush arm 25 and the air cylinder 28. The cleaning brush 2 during the cleaning process
The specific operation of 0 will be described later. The mechanism for changing the storage state of the first arm 25a in the second arm 25b is not limited to the air cylinder mechanism, but may be any other mechanism (for example, a mechanism using a rack and a pinion, a mechanism using a pulley and a belt). Etc.). Further, the brush arm 25 may be moved up and down using a pulse motor and a ball screw instead of the air cylinder 28.

On the other hand, the nozzle cleaning mechanism of the substrate cleaning apparatus
This is realized by the cleaning nozzle 30, the nozzle arm 35 and the air cylinder 38. The configurations of the nozzle arm 35 and the air cylinder 38 are the same as those of the brush arm 25 and the air cylinder 28 described above. That is, when the storage state of the first arm 35a in the second arm 35b is changed, the nozzle arm 35 expands and contracts, and as a result, the cleaning nozzle 30 is rotated in parallel with the main surface of the substrate W by the rotation center of the substrate W. It travels along a straight line passing through. Further, as the piston 39 of the air cylinder 38 moves up and down, the nozzle arm 35 and the cleaning nozzle 30 move up and down.

The cleaning nozzle 30 is a cleaning means for cleaning the substrate by discharging a cleaning liquid (pure water in this embodiment) onto the main surface of the substrate W. The direction of the discharge is set at a predetermined angle with respect to the substrate W. The nozzle arm 35 is provided to be inclined from the vertical direction. Further, the position and angle at which the cleaning nozzle 30 is held can be adjusted. Therefore, even if the cleaning nozzle 30 itself is not located at the rotation center of the substrate W, the cleaning liquid can be supplied to the rotation center. In this manner, the cleaning nozzle 30 is provided inclined so that the cleaning nozzle 30 and the cleaning brush 20 do not interfere with each other even if both are located near the rotation center of the substrate W. In order to

Next, the cleaning operation in the above-described substrate cleaning apparatus will be described. Table 1 below shows an example of the cleaning operation in the substrate cleaning apparatus.

[0034]

[Table 1]

First, the substrate W is loaded into the apparatus, and is mounted on the support pins 13 of the turntable 12 in a horizontal posture (first step). The transfer of the substrate is performed by a transfer robot outside the cleaning apparatus. When the substrate is carried in, the brush arm 25 and the nozzle arm 35 are contracted, so that the cleaning brush 20 and the cleaning nozzle 30 are rotated.
From above, to prevent interference with the transfer robot.

Next, the motor 10 starts rotating, and the substrate W held on the turntable 12 is driven to rotate in the forward direction (second step). In the present embodiment, the positive direction indicates one of the clockwise direction and the counterclockwise direction.

Thereafter, substrate cleaning using the cleaning brush 20 and the cleaning nozzle 30 is started (third step). That is, the cleaning brush 20 sweeps out contaminants while spraying pure water from the cleaning nozzle 30 to the main surface of the substrate W. At this time, the cleaning brush 20 linearly sweeps out contaminants such as particles from the rotation center of the substrate W toward the peripheral edge thereof in a state where the cleaning brush 20 is in contact with the substrate W. In the separated state, the operation of linearly moving from the peripheral edge of the substrate W toward the center of rotation, descending again, and contacting the substrate W is repeated. On the other hand, the cleaning nozzle 30 performs a linear reciprocating movement between the rotation center of the substrate W and the peripheral edge while injecting pure water.

When the cleaning of the substrate by the cleaning brush 20 and the cleaning nozzle 30 for a predetermined time is completed, the supply of the pure water from the cleaning nozzle 30 is stopped, and the cleaning brush 20 is separated from the substrate W and retracted (fourth and fifth). Process). Then, after stopping the rotation of the substrate W in the forward direction, the substrate W is driven to rotate in the direction opposite to the forward direction (sixth and seventh steps).

Thereafter, substrate cleaning using the cleaning brush 20 and the cleaning nozzle 30 is started again (eighth step). At this time, the cleaning brush 20 and the cleaning nozzle 30
Is the same as the above-described operation during the normal rotation of the substrate W.

Cleaning brush 2 when substrate W is rotated in reverse
When the cleaning of the substrate by the cleaning nozzle 30 for a predetermined time is completed, the supply of the pure water from the cleaning nozzle 30 is stopped, and the cleaning brush 20 is separated from the substrate W and retracted (ninth and tenth steps).

Next, by increasing the number of rotations of the motor 10,
The rotation speed of the substrate W is increased, the pure water adhering to the substrate W is shaken off by the centrifugal force of the substrate rotation, and the substrate W is dried (eleventh step).

The substrate W after the drying process is received from the turntable 12 by the transfer robot, carried out of the cleaning device, and a series of cleaning processes is completed (twelfth step). At this time, the brush brush 25 and the cleaning nozzle 30 are retracted from above the turntable 12 by the contraction of the brush arm 25 and the nozzle arm 35,
Interference with the transfer robot is prevented.

As described above, since the direction of rotation of the substrate is reversed in the intermediate stage of the series of cleaning treatments and the substrate W rotating in each of the forward and reverse directions is cleaned, the substrate having unevenness is obtained. Can be sufficiently cleaned. This will be further described with reference to FIG. As described above, the substrate W
May be formed with irregularities. In the example of FIG.
A convex portion P1 and a concave portion P2 are formed on the surface of the substrate W. Here, in the related art (see FIG. 7), the portions S that are the shadows of the concave portion P2 and the convex portion P1 when viewed from the cleaning brush 90 in the direction opposite to the rotation direction (arrow A7) of the substrate W
1, S2 cannot be sufficiently cleaned.
In the above-described embodiment, since the substrate W rotates in both directions (arrow A4), there is no shaded portion of the concave portion P2 and the convex portion P1 when viewed from the cleaning brush 20 as a whole of the series of cleaning processes. The part P1 can also be sufficiently cleaned. The same effect can be obtained for the cleaning process using the cleaning nozzle 30.

In the present embodiment, the cleaning brush 20 and the cleaning nozzle 30 move along a straight line passing through the center of rotation of the substrate W in parallel with the main surface of the substrate W. In other words,
Even when the substrate W is rotating in either the forward or reverse direction, the cleaning brush 20 and the cleaning nozzle 30 always move in a direction perpendicular to the rotation direction of the substrate W. Therefore, the force acting on the contaminant existing at an arbitrary position on the substrate W from the cleaning brush 20 and the liquid pressure from the cleaning nozzle 30 are equal between the forward rotation and the reverse rotation. As a result, the ability to remove the contaminant becomes the same between when rotating forward and when rotating backward, and stable cleaning can be performed.

The cleaning brush 20 and the cleaning nozzle 3
Since 0 moves along a straight line passing through the rotation center of the substrate W, their movement trajectory becomes the shortest straight line, and the cleaning efficiency can be increased as compared with the case where a conventional arc-shaped movement trajectory is drawn. it can.

Further, conventionally, when the arm (including both the brush arm and the nozzle arm) is rotated to be retracted from above the substrate, it is necessary to provide a retreat space at least for the length of the arm in the apparatus. However, in the present embodiment, the cleaning brush 20 and the cleaning nozzle 30 can be easily retracted from above the substrate by contracting the brush arm 25 and the nozzle arm 35, and the entire cleaning apparatus can be made compact. can do.

<2. Second Embodiment> Next, a second embodiment of the present invention will be described. The brush arm 25 and the nozzle arm 35 of the first embodiment are telescopic arms whose lengths are made variable by a telescopic operation. However, in the second embodiment, the cleaning brush 20 and the cleaning nozzle 30 are bent and stretched. It is a bending and stretching arm that moves linearly. Note that points other than the brush arm and the nozzle arm are the same as those in the first embodiment, and a description thereof will be omitted.

FIG. 5 is a diagram for explaining the operation of the brush arm 55, and FIG. 6 is a schematic diagram for explaining the operation mechanism of the brush arm 55. The brush arm 55 includes the same cleaning brush 20 as the first embodiment,
A first arm 55a for rotatably supporting the first arm 55a in a horizontal plane;
A second arm for rotatably supporting the first arm 55a in a horizontal plane;
An arm 55b and a rotation drive unit 51 for rotating the second arm 55b in a horizontal plane are configured.

The first pulley 5 is provided inside the second arm 55b.
The second pulley 53 and the second pulley 53 are rotatably supported and provided. The diameter of the first pulley 52 and the diameter of the second pulley 53 are set to 2: 1, and a first belt 58 is hung between the first pulley 52 and the second pulley 53. On the other hand, inside the first arm 55a, the third pulley 56 and the fourth
A pulley 57 is provided so as to be rotatably supported. The diameter of the third pulley 56 and the diameter of the fourth pulley 57 are set to 1: 2.
And a second belt 59 is hung between them.

One end of the second arm 55b (the first pulley 5
2) is fixedly connected to a motor (not shown) inside the rotation drive unit 51. Also, the second
The second pulley 53 in the arm 55b and the third pulley 56 in the first arm 55a are fixedly connected. Further, the fourth pulley 57 in the first arm 55a is fixedly connected to the cleaning brush 20. And the first pulley 5
2 to the rotation axis of the second pulley 53 (the third pulley 5).
6) and the distance from the rotation axis of the third pulley 56 to the rotation axis of the fourth pulley 57 are set to the same length R. With such a structure, the brush arm 55 of the second embodiment can move the cleaning brush 20 linearly by bending and extending the brush arm 55. This will be described with reference to FIG.

It is assumed that the rotation drive unit 51 rotates the second arm 55b counterclockwise by the angle α. Since the diameter of the first pulley 52 and the diameter of the second pulley 53 are two to one,
The second arm 55b moves the first arm 55a through the first belt 58 and the second pulley 53 to an angle β twice the angle α.
Only rotate clockwise. Thereby, the first arm 5
The cleaning brush 20 provided at the tip of 5a moves linearly. Here, since the diameter of the third pulley 56 and the diameter of the fourth pulley 57 are 1: 2, the first arm 55a
Causes the cleaning brush 20 to rotate counterclockwise through the second belt 59 and the fourth pulley 57 by the angle γ equal to the angle α, but the first arm 55a itself rotates, resulting in the rotation. In addition, the cleaning brush 20 moves linearly while maintaining a constant posture.

As described above, also in the second embodiment, the brush arm 55 includes the first arm 55a and the second arm 55.
The cleaning brush 20 is moved in parallel with the main surface of the substrate W by changing the relative bending state with respect to the substrate W.
It has a function as a driving means for moving along a straight line passing through the center of rotation of. The same applies to the configuration and operation of the nozzle arm of the cleaning nozzle 30. Further, the mechanism for changing the relative bending state between the first arm 55a and the second arm 55b is not limited to a mechanical mechanism using a pulley and a belt. It may be a mechanism that performs dynamic control.

In the above-described manner, the cleaning brush 20 and the cleaning nozzle 30 move along a straight line passing through the center of rotation of the substrate W in parallel with the main surface of the substrate W. The effect of can be obtained. That is, the ability to remove contaminants is the same between the forward rotation and the reverse rotation of the substrate W, so that stable cleaning can be performed and the movement trajectory becomes the shortest straight line, and the conventional arc-shaped movement The cleaning efficiency can be increased as compared with the case of drawing a trajectory. Further, by bending the brush arm 55 and the nozzle arm, the cleaning brush 20 and the cleaning nozzle 30 can be easily retracted from above the substrate, and the entire cleaning apparatus can be made compact.

Although the embodiment of the present invention has been described above, the present invention is not limited to the above-described example.
For example, in the first embodiment, the expansion and contraction operation of the brush arm 25 is performed by changing the storage state of the two arms. However, this operation is performed by providing more multi-stage arms and changing the storage state of these arms. Is also good.

In the second embodiment, the bending and stretching operation of the brush arm 55 may be realized by a pantograph structure.

[0056]

As described above, according to the first aspect of the present invention, there is provided the rotating means for rotating the substrate in the first direction and the second direction opposite to the first direction. ,
Even in the case of a substrate having irregularities, there is no portion that is shaded by the irregularities when viewed from the cleaning means in the entire cleaning process, and the irregularities can be sufficiently cleaned.

According to the second aspect of the present invention, since the driving means for moving the cleaning means along a straight line passing through the center of rotation of the substrate in parallel with the main surface of the substrate is provided, the cleaning means for cleaning the contaminants is provided. The removal ability becomes the same at the time of forward rotation and at the time of reverse rotation, and stable cleaning can be performed. Also, the movement trajectory of the cleaning means is the shortest straight line,
The cleaning efficiency can be increased as compared with the case where a conventional arc-shaped movement locus is drawn.

According to the third and fourth aspects of the present invention, since the driving means is provided with the telescopic arm whose cleaning means is connected to one end and whose length can be changed by the telescopic operation, the telescopic arm is provided. , The cleaning means can be easily retracted from above the substrate, and the entire cleaning apparatus can be made compact.

According to the fifth and sixth aspects of the present invention, the driving means is provided with the bending / extension arm which connects the cleaning means to one end and moves the cleaning means along a straight line by bending / extending operation. By bending the arm,
The cleaning means can be easily retracted from above the substrate,
The entire cleaning device can be made compact.

According to a seventh aspect of the present invention, the cleaning means includes a cleaning brush for cleaning the substrate in contact with the main surface of the substrate or in proximity to the substrate at a predetermined distance. Can be used to remove contaminants attached to the uneven portions of the substrate.

According to the eighth aspect of the present invention, the cleaning means includes a cleaning nozzle for discharging the cleaning liquid onto the main surface of the substrate to clean the substrate. Adhered contaminants can be removed.

According to a ninth aspect of the present invention, there is provided a first rotating step of rotating a substrate held in a substantially horizontal attitude in a first direction, and a cleaning process performed by a cleaning unit on the substrate rotating in the first direction. A second cleaning step of rotating the substrate in a second direction opposite to the first direction, and a second cleaning step of cleaning the substrate rotating in the second direction by a cleaning unit. 2 cleaning step, even if the substrate has irregularities, there is no shadow of the irregularities as viewed from the cleaning means in the entire cleaning process, and the irregularities are sufficiently cleaned. It can be performed.

Further, since the invention of claim 10 includes a step of moving the cleaning means along a straight line passing through the center of rotation of the substrate, the ability to remove contaminants from the cleaning means is opposite to that of the normal rotation. This is the same as when rotating, and stable cleaning can be performed. Further, the moving trajectory of the cleaning means becomes the shortest straight line, and the cleaning efficiency can be increased as compared with the case where a conventional arc-shaped moving trajectory is drawn.

In the eleventh aspect of the present invention, the cleaning means
Abut on the main surface of the substrate or in close proximity with a predetermined interval,
Since a cleaning brush for cleaning the substrate is included, contaminants attached to the uneven portions of the substrate can be removed using the cleaning brush.

Further, according to the twelfth aspect of the present invention, the cleaning means
Since the main surface of the substrate is provided with a cleaning nozzle for discharging the cleaning liquid to clean the substrate, the cleaning nozzle can be used to remove contaminants attached to the uneven portions of the substrate.

[Brief description of the drawings]

FIG. 1 is a front view showing an example of a substrate cleaning apparatus according to the present invention.

FIG. 2 is a plan view of the substrate cleaning apparatus of FIG.

FIG. 3 is a plan view illustrating a structure of a brush arm of the substrate cleaning apparatus of FIG. 1;

FIG. 4 is a view for explaining a state of substrate cleaning in the substrate cleaning apparatus of FIG. 1;

FIG. 5 is a diagram for explaining an operation of a brush arm according to a second embodiment.

FIG. 6 is a schematic diagram for explaining an operation mechanism of a brush arm according to a second embodiment.

FIG. 7 is a view for explaining a state of conventional substrate cleaning.

[Explanation of symbols]

 Reference Signs List 10 motor 20 cleaning brush 25, 55 brush arm 25a, 55a first arm 25b, 55b second arm 30 cleaning nozzle 35 nozzle arm W substrate

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Shuji Shibata 322 Hashinashi Furukawa-cho, Fushimi-ku, Kyoto Dainichi Screen Manufacturing Co., Ltd. F-term (reference) in the Rakusai Office 3B116 AA03 AB03 AB44 BA23 BA33 BB22 BB44 CC01 3B201 AA03 AB03 AB44 BA23 BA33 BB22 BB44 BB93 CB12 CB25 CC01 CC13

Claims (12)

[Claims] 1. A substrate cleaning apparatus for performing a cleaning process while rotating a substrate, comprising: (a) moving a substrate held in a substantially horizontal posture in a first direction and a direction opposite to the first direction; 2. A substrate cleaning apparatus comprising: a rotating unit for rotating the substrate in two directions; and (b) a cleaning unit for cleaning a surface of the substrate. 2. The substrate cleaning apparatus according to claim 1, further comprising a driving unit configured to move the cleaning unit along a straight line passing through a rotation center of the substrate in parallel with a main surface of the substrate. Substrate cleaning equipment. 3. The substrate cleaning apparatus according to claim 2, wherein the driving unit includes an extendable arm connected to the one end of the cleaning unit, the length of which is variable by an extension / contraction operation. apparatus. 4. The substrate cleaning apparatus according to claim 3, wherein the extendable arm has a first arm having the cleaning means connected to one end, and a second arm capable of storing the first arm. The substrate cleaning apparatus according to claim 1, wherein the expansion / contraction operation is performed by changing a storage state of the first arm in the second arm. 5. The substrate cleaning apparatus according to claim 2, wherein the driving unit includes a bending and stretching arm that connects the cleaning unit to one end and moves the cleaning unit along the straight line by a bending and stretching operation. Substrate cleaning device. 6. The substrate cleaning apparatus according to claim 5, wherein the bending / extending arm has a first arm having the cleaning means connected to one end, and a second arm having the first arm connected to one end. A substrate cleaning apparatus, wherein the bending operation is performed by changing a relative bending state of the first arm and the second arm. 7. The substrate cleaning apparatus according to claim 1, wherein the cleaning unit abuts on the main surface of the substrate or approaches the main surface of the substrate at a predetermined interval to clean the substrate. A substrate cleaning apparatus, comprising: a cleaning brush for cleaning a substrate. 8. The substrate cleaning apparatus according to claim 1, wherein the cleaning unit includes a cleaning nozzle that discharges a cleaning liquid onto a main surface of the substrate to clean the substrate. Characteristic substrate cleaning equipment. 9. A substrate cleaning method for performing a cleaning process while rotating a substrate, comprising: (a) a first rotating step of rotating a substrate held in a substantially horizontal posture in a first direction; A first cleaning step of performing a cleaning process by a cleaning unit on the substrate rotating in the first direction; and (c) a second rotation of the substrate in a second direction opposite to the first direction. A substrate cleaning method, comprising: a rotating step; and (d) a second cleaning step of performing a cleaning process by the cleaning unit on the substrate rotating in the second direction. 10. The substrate cleaning method according to claim 9, further comprising the step of: moving the cleaning unit along a straight line passing through a rotation center of the substrate. 11. The substrate cleaning method according to claim 9, wherein the cleaning unit is configured to contact the main surface of the substrate or to approach the main surface of the substrate at a predetermined distance to clean the substrate. A method for cleaning a substrate, comprising: 12. The substrate cleaning method according to claim 9, wherein the cleaning unit includes a cleaning nozzle that discharges a cleaning liquid onto a main surface of the substrate to clean the substrate. Cleaning method.