CN104810310A - Wafer scanning and cleaning swing arm device - Google Patents
Wafer scanning and cleaning swing arm device Download PDFInfo
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- CN104810310A CN104810310A CN201510207442.8A CN201510207442A CN104810310A CN 104810310 A CN104810310 A CN 104810310A CN 201510207442 A CN201510207442 A CN 201510207442A CN 104810310 A CN104810310 A CN 104810310A
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- swing arm
- wafer
- belt wheel
- scanning
- nozzle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to a wafer scanning and cleaning swing arm device. The wafer scanning and cleaning swing arm device comprises a swing arm part, a nozzle, a lifting part, a swing part and a shell, wherein the swing arm part is provided with a swing arm shaft, the nozzle is mounted on the swing arm part and can rotate around the swing arm part, the lifting part is used for driving the swing arm part to move along the vertical direction, the swing part is used for driving the swing arm shaft of the swing arm part to rotate, and the shell is used for mounting the swing arm part, the lifting part and the swing part. The nozzle is mounted on the swing arm part and can rotate round the swing arm part, so that spraying angle of the nozzle to wafers can be conveniently adjusted; by the aid of the swing part, the swing arm shaft of the swing arm part is driven to rotate, and scanning swing of the swing arm part is realized. By the lifting part, the swing arm part is driven to move along the vertical direction, so that the problems that wafer cleaning effect is poor and cleaning dead corners possibly exist due to the fact that a conventional swing arm part only swing to one direction for scanning are solved.
Description
Technical field
The invention belongs to the wafer cleaning technical field in the semiconductor crystal wafer course of processing, particularly relate to a kind of scanning cleaning swinging arm device realizing that crystal column surface is cleaned.
Background technology
In semiconductor wafer manufacturing technique process, wafer needs through cleaning step repeatedly.Critical size due to device technology technology constantly reduces and the introducing of new material, makes surface cleaning process in front procedure (FEOL, ront end of line) even more important.Critical dimension reduction makes the process window cleaned narrow, and meet wafer cleaning efficiency and accomplish that as far as possible few crystal column surface carves damage and structural failure becomes difficulty further simultaneously.
Wafer wet cleaning is divided into slot type to clean and Single-Wafer Cleaning two kinds of modes.Single-Wafer Cleaning can reduce the risk of cross pollution in cleaning process, improves rate of finished products.By the rate of finished products using single-wafer technology effectively can improve 100 nm and following technique thereof.For 300 mm and above large-size ultra-thin wafer, the cost of wafer is too high, is the cleaning way avoiding the damage of slot type cleaning process wafer can only adopt single-wafer.
In existing Single-Wafer Cleaning device, generally adopt a kind of swinging arm device, by driven by motor, swinging arm device is provided with nozzle, scanning cleaning is carried out, to reach the object improving cleaning performance to the wafer rotated.In addition, swinging arm device often needs the load that million sound shower nozzles or high-pressure nozzle etc. are heavier, with the special technological requirement met.The swinging arm device of tradition wafer cleaning device, only possesses scanning oscillating function, and be not enough to drive with heavier load flusher steadily, move rapidly.Along with the development of cleaning, in order to improve cleaning performance, avoid exist cleaning dead angle, swinging arm device not only requirement can do scanning swing, and need in the vertical direction dynamic conditioning nozzle to the distance of wafer.
Summary of the invention
The invention provides a kind of wafer-scanning cleaning swinging arm device, technical problem to be solved is that the swinging arm device of traditional wafer cleaning device only possesses scanning oscillating function, and when cleaning wafer, cleaning performance is poor, may there is cleaning dead angle.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of wafer-scanning cleaning swinging arm device, and it comprises:
Swing arm parts, described swing arm parts are provided with arm shaft;
Nozzle, described nozzle is arranged on described swing arm parts, can rotate around swing arm parts;
Lift Part, vertically moves for driving described swing arm parts;
Tilting member, rotates for driving the arm shaft of described swing arm parts;
Housing, for installing described swing arm parts, Lift Part and tilting member.
The present invention's wafer-scanning cleaning as above swinging arm device, further, described swing arm parts are also provided with:
Swing arm cross bar, one end of described swing arm cross bar is connected with described arm shaft is vertical;
Nozzle mount pad, described nozzle mount pad is arranged on the other end of described swing arm cross bar, and can rotate around swing arm cross bar; Described nozzle is arranged on described nozzle mount pad.
The present invention's wafer-scanning cleaning as above swinging arm device, further, described Lift Part comprises:
Lifting motor, described lifting motor is fixed in described housing;
Leading screw, one end of described leading screw is connected with the motor shaft of described lifting motor;
Feed screw nut, described feed screw nut is connected with arm shaft, and feed screw nut is arranged in leading screw;
First control piece, runs for controlling described lifting motor or stops.
The present invention's wafer-scanning cleaning as above swinging arm device, further, described first control piece comprises:
Baffle ring, is arranged on described arm shaft;
First origin sensor, be arranged in described housing, position is corresponding with described baffle ring, for responding to the position of baffle ring and the first origin sensor;
First drive plate, is arranged in described housing, receives the signal of the first origin sensor and controls lifting motor operation or stop.
The present invention's wafer-scanning cleaning as above swinging arm device, further, described tilting member comprises:
Pillar, described protective pipe sleeve is outside at described leading screw, and one end of pillar is connected with feed screw nut;
Deceleration component, rotates along pillar axle for driving described pillar;
Oscillating motor, described oscillating motor is fixed in described housing, for driving described deceleration component;
Second control piece, runs for controlling described oscillating motor or stops.
The present invention's wafer-scanning cleaning as above swinging arm device, further, described deceleration component comprises:
First belt wheel, is arranged in the rotating shaft of described oscillating motor;
Two ends connect the driving member of the second belt wheel and the 3rd belt wheel respectively;
4th belt wheel, rotates for driving described pillar;
First Timing Belt, connects described first belt wheel and the second belt wheel;
Second Timing Belt, connects described 3rd belt wheel and the 4th belt wheel;
The diameter of described first belt wheel is less than the second belt wheel, and the diameter of the 3rd belt wheel is less than the 4th belt wheel.
The present invention's wafer-scanning cleaning as above swinging arm device, further, described driving member comprises rolling bearing units and power transmission shaft; Described rolling bearing units are fixed in described housing, and described power transmission shaft is arranged on described rolling bearing units.
The present invention's wafer-scanning cleaning as above swinging arm device, further, described second control piece comprises:
Catch, is arranged on described pillar;
Second origin sensor, be arranged in described housing, position is corresponding with described catch, for responding to the position of catch and the second origin sensor;
Second drive plate, is arranged in described housing, receives the signal of the second origin sensor and controls oscillating motor operation or stop.
The present invention's wafer-scanning cleaning as above swinging arm device, further, also comprise outer side guard plate, described outer side guard plate is arranged on outside described housing.
The invention has the beneficial effects as follows:
1, the present invention is provided with lifting motor and oscillating motor etc., constitutes Lift Part and tilting member respectively.Can according to process requirements, Control Nozzle to the height of wafer and nozzle to the distance of crystal circle center, to reach best cleaning performance.
2, the present invention is provided with nozzle, nozzle mount pad, clip and swing arm cross bar.Nozzle is arranged on nozzle mount pad, and nozzle mount pad is connected with swing arm cross bar by clip.Nozzle mount pad opposed swing arms cross bar can rotate around its axis, thus can adjust the angle of nozzle ejection liquid, to reach best cleaning performance.
3, the present invention is provided with rolling bearing units, the first belt wheel ~ the 4th belt wheel and Timing Belt composition double reduction mechanism, and oscillating motor drives pillar by this two-step mechanism.When nozzle mount pad is provided with million sound shower nozzles or multiple nozzle, the load of swing arm parts increases, and now needs larger moment of torsion, does scanning motion to drive swing arm parts.Adopt double reduction mechanism, the moment of torsion of swing arm parts can be increased, scanning motion can be done by reliable, stable driving swing arm parts.Meanwhile, relative to the reductor of equal mechanical property, adopt this double reduction mechanism, compact conformation, speed reducing ratio are large.
4, the present invention is provided with drive plate, and is installed on base.Origin sensor, lifting motor are connected on it with oscillating motor Electric Wires & Cables.Scanning cleaning swinging arm device involved in the present invention and the electrical connection of ancillary equipment only need power supply and the communications cable, decrease the electrical connection with ancillary equipment, enhance the independence of this device, improve the reliability and stability of this device.Need multiple scanning cleaning swinging arm device at ancillary equipment, during to realize specific cleaning object, adopt said structure, greatly strengthen the extensibility of this device.
5, the present invention is provided with outer guard plate and protective cover, can prevent cleaning liquid from entering in housing, can play effective protection to inner member.
In the use procedure of wafer-scanning cleaning swinging arm device of the present invention, nozzle is utilized to carry out scanning cleaning to the wafer rotated to be cleaned.Because nozzle is arranged on described swing arm parts, can rotate around swing arm parts, nozzle can be regulated easily to the spray angle of wafer.Utilize tilting member to drive the arm shaft of described swing arm parts to rotate, the scanning realizing swing arm parts swings.Utilize Lift Part to drive described swing arm parts vertically to move, solve traditional swing arm parts and only have scanning swing direction motion, when cleaning wafer, cleaning performance is poor, may there is the problem at cleaning dead angle.
Accompanying drawing explanation
The profile of a kind of wafer-scanning cleaning swinging arm device that Fig. 1 provides for the embodiment of the present invention;
Fig. 2 is the close-up schematic view of Fig. 1;
The end view of a kind of wafer-scanning cleaning swinging arm device that Fig. 3 provides for the embodiment of the present invention;
The axonometric drawing of a kind of wafer-scanning cleaning swinging arm device that Fig. 4 provides for the embodiment of the present invention.
In accompanying drawing, the portion's list of parts representated by each label is as follows:
1, base, 2, second drive plate, 3, oscillating motor, 4, lifting motor, 5, first drive plate, 6, housing, 7, first central dividing plate, 8, shaft coupling, 9, second central dividing plate, 10, 4th belt wheel, 11, pillar, 12, leading screw, 13, feed screw nut, 14, connector, 15, upper fagging, 16, sliding sleeve, 17, arm shaft, 18, protective cover, 19, nozzle, 20, nozzle mount pad, 21, joint, 22, clip, 23, swing arm cross bar, 24, first origin sensor, 25, baffle ring, 26, second Timing Belt, 27, 3rd belt wheel, 28, catch, 29, second origin sensor, 30, rolling bearing units, 31, power transmission shaft, 32, second belt wheel, 33, first Timing Belt, 34, first belt wheel, 35, outer side guard plate, 36, outer side guard plate, 100, swing arm parts, 200, Lift Part, 300, tilting member.
Embodiment
Be described principle of the present invention and feature below in conjunction with accompanying drawing, example, only for explaining the present invention, is not intended to limit scope of the present invention.
The embodiment of the present invention needs the swinging arm device solving traditional wafer cleaning device only to possess scanning oscillating function, and when cleaning wafer, cleaning performance is poor, may there is the problem at cleaning dead angle.
As shown in Figure 3, a kind of wafer-scanning provided for the embodiment of the present invention cleans the end view of swinging arm device.This wafer-scanning cleaning swinging arm device comprises:
Swing arm parts 100, described swing arm parts are provided with arm shaft 17;
Nozzle 19, described nozzle 19 is arranged on described swing arm parts 100, can rotate around swing arm parts 100;
Lift Part 200, vertically moves for driving described swing arm parts 100;
Tilting member 300, rotates for driving the arm shaft 17 of described swing arm parts;
Housing 6, for installing described swing arm parts 100, Lift Part 200 and tilting member 300.In specific implementation process, housing 6 comprises base 1.
In the use procedure of the wafer-scanning cleaning swinging arm device of the above embodiment of the present invention, nozzle is utilized to carry out scanning cleaning to the wafer rotated to be cleaned.Because nozzle is arranged on described swing arm parts, can rotate around swing arm parts, nozzle can be regulated easily to the spray angle of wafer.Utilize tilting member to drive the arm shaft of described swing arm parts to rotate, the scanning realizing swing arm parts swings.Utilize Lift Part to drive described swing arm parts vertically to move, solve traditional swing arm parts and only have scanning swing direction motion, when cleaning wafer, cleaning performance is poor, may there is the problem at cleaning dead angle.
In the specific implementation process of above-described embodiment wafer-scanning cleaning swinging arm device, as depicted in figs. 1 and 2, described swing arm parts 100 are also provided with:
Swing arm cross bar 23, one end of described swing arm cross bar 23 is connected with described arm shaft 17 is vertical;
Nozzle mount pad 20, described nozzle mount pad 20 is arranged on the other end of described swing arm cross bar 23, and can rotate around swing arm cross bar 23; Described nozzle 19 is arranged on described nozzle mount pad 20, and nozzle 19 is connected with the joint 21 of transport cleaning liquid.In specific implementation process, nozzle mount pad 20 is connected by clip 22 with swing arm cross bar 23.More having in the embodiment of choosing, arm shaft 17 outside is also provided with the protective cover 18 with protective effect.
In the specific implementation process of above-described embodiment wafer-scanning cleaning swinging arm device, as depicted in figs. 1 and 2, described Lift Part 200 comprises:
Lifting motor 4, described lifting motor 4 is fixed in described housing 6; In the particular embodiment, lifting motor 4 is arranged on and is positioned on the first central dividing plate 7 of housing.
Leading screw 12, one end of described leading screw 12 is connected with the motor shaft of described lifting motor 4; In specific implementation process, leading screw 12 is connected by 8 shaft couplings with motor shaft.
Feed screw nut 13, described feed screw nut 13 is connected with arm shaft 17, and feed screw nut 13 is arranged in leading screw 12; In specific implementation process, arm shaft 17 is connected with feed screw nut 13 by connector 14.
First control piece, runs for controlling described lifting motor 4 or stops.
In specific implementation process, the top of described housing is provided with fagging 15, and upper fagging 15 is provided with sliding sleeve 16, slides for arm shaft 17.
In a preferred embodiment, described first control piece comprises:
Baffle ring 25, is arranged on described arm shaft 17; Or be arranged on connector 14.
First origin sensor 24, be arranged in described housing 6, position is corresponding with described baffle ring 25, for responding to the position of baffle ring and the first origin sensor; First origin sensor 24 is connected with the first drive plate 5 signal;
First drive plate 5, is arranged in described housing 6, receives the signal of the first origin sensor 24 and controls lifting motor 4 and run or stop.First drive plate 5 is electrically connected with lifting motor 4.
In the specific implementation process of above-described embodiment wafer-scanning cleaning swinging arm device, as depicted in figs. 1 and 2, described tilting member 300 comprises:
Pillar 11, it is outside that described pillar 11 is enclosed within described leading screw 12, and one end of pillar 11 is connected with feed screw nut 13;
Deceleration component, rotates along pillar axle for driving described pillar 11;
Oscillating motor 3, described oscillating motor 3 is fixed in described housing 6, for driving described deceleration component; In the particular embodiment, oscillating motor 3 is arranged on and is positioned on the first central dividing plate 7 of housing.
Second control piece, runs for controlling described oscillating motor 3 or stops.
In a kind of embodiment of above-described embodiment wafer-scanning cleaning swinging arm device, as depicted in figs. 1 and 2, described deceleration component comprises:
First belt wheel 34, is arranged in the rotating shaft of described oscillating motor 3;
Two ends connect the driving member of the second belt wheel 32 and the 3rd belt wheel 27 respectively; Described driving member comprises rolling bearing units 30 and power transmission shaft 31; Described rolling bearing units 30 are fixed in described housing 6, and described power transmission shaft 31 is arranged on described rolling bearing units 30.In the particular embodiment, rolling bearing units 30 are arranged on and are positioned on the second central dividing plate 9 of housing 6.Second central dividing plate 9 is positioned at the top of the first central dividing plate 7.
4th belt wheel 10, rotates for driving described pillar 11; In a kind of specific implementation process, pillar 11 outer wall is provided with fastener, correspondingly with the draw-in groove of the 4th belt wheel 10 connects.
First Timing Belt 33, connects described first belt wheel 34 and the second belt wheel 32;
Second Timing Belt 26, connects described 3rd belt wheel 27 and the 4th belt wheel 10;
The diameter that the diameter of described first belt wheel 34 is less than the second belt wheel the 32, three belt wheel 27 is less than the 4th belt wheel 10.
In a preferred embodiment, described second control piece comprises:
Catch 28, is arranged on described pillar 11;
Second origin sensor 29, be arranged in described housing 6, position is corresponding with described catch 28, for responding to the position of catch and the second origin sensor; Second origin sensor 29 is connected with the second drive plate 2 signal;
Second drive plate 2, is arranged in described housing 6, receives the signal of the second origin sensor 29 and controls oscillating motor 3 and run or stop.Second drive plate 2 is electrically connected with oscillating motor 3.
In the specific implementation process of above-described embodiment wafer-scanning cleaning swinging arm device, also comprise outer side guard plate 35,36, described outer side guard plate is arranged on outside described housing.Outer side guard plate makes the scanning Lift Part, tilting member, electric-controlled product etc. cleaned in swinging arm device be in an airtight environment, plays the effect of protection.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. a wafer-scanning cleaning swinging arm device, is characterized in that, comprising:
Swing arm parts, described swing arm parts are provided with arm shaft;
Nozzle, described nozzle is arranged on described swing arm parts, can rotate around swing arm parts;
Lift Part, vertically moves for driving described swing arm parts;
Tilting member, rotates for driving the arm shaft of described swing arm parts;
Housing, for installing described swing arm parts, Lift Part and tilting member.
2. wafer-scanning cleaning swinging arm device according to claim 1, it is characterized in that, described swing arm parts are also provided with:
Swing arm cross bar, one end of described swing arm cross bar is connected with described arm shaft is vertical;
Nozzle mount pad, described nozzle mount pad is arranged on the other end of described swing arm cross bar, and can rotate around swing arm cross bar; Described nozzle is arranged on described nozzle mount pad.
3. wafer-scanning cleaning swinging arm device according to claim 1 and 2, it is characterized in that, described Lift Part comprises:
Lifting motor, described lifting motor is fixed in described housing;
Leading screw, one end of described leading screw is connected with the motor shaft of described lifting motor;
Feed screw nut, described feed screw nut is connected with arm shaft, and feed screw nut is arranged in leading screw;
First control piece, runs for controlling described lifting motor or stops.
4. wafer-scanning cleaning swinging arm device according to claim 3, it is characterized in that, described first control piece comprises:
Baffle ring, is arranged on described arm shaft;
First origin sensor, be arranged in described housing, position is corresponding with described baffle ring, for responding to the position of baffle ring and the first origin sensor;
First drive plate, is arranged in described housing, receives the signal of the first origin sensor and controls lifting motor operation or stop.
5. wafer-scanning cleaning swinging arm device according to claim 3, it is characterized in that, described tilting member comprises:
Pillar, described protective pipe sleeve is outside at described leading screw, and one end of pillar is connected with feed screw nut;
Deceleration component, rotates along pillar axle for driving described pillar;
Oscillating motor, described oscillating motor is fixed in described housing, for driving described deceleration component;
Second control piece, runs for controlling described oscillating motor or stops.
6. wafer-scanning cleaning swinging arm device according to claim 5, it is characterized in that, described deceleration component comprises:
First belt wheel, is arranged in the rotating shaft of described oscillating motor;
Two ends connect the driving member of the second belt wheel and the 3rd belt wheel respectively;
4th belt wheel, rotates for driving described pillar;
First Timing Belt, connects described first belt wheel and the second belt wheel;
Second Timing Belt, connects described 3rd belt wheel and the 4th belt wheel;
The diameter of described first belt wheel is less than the second belt wheel, and the diameter of the 3rd belt wheel is less than the 4th belt wheel.
7. wafer-scanning cleaning swinging arm device according to claim 6, it is characterized in that, described driving member comprises rolling bearing units and power transmission shaft; Described rolling bearing units are fixed in described housing, and described power transmission shaft is arranged on described rolling bearing units.
8. wafer-scanning cleaning swinging arm device according to claim 5, it is characterized in that, described second control piece comprises:
Catch, is arranged on described pillar;
Second origin sensor, be arranged in described housing, position is corresponding with described catch, for responding to the position of catch and the second origin sensor;
Second drive plate, is arranged in described housing, receives the signal of the second origin sensor and controls oscillating motor operation or stop.
9. wafer-scanning cleaning swinging arm device according to claim 1, it is characterized in that, also comprise outer side guard plate, described outer side guard plate is arranged on outside described housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510207442.8A CN104810310B (en) | 2015-04-28 | 2015-04-28 | A kind of wafer-scanning cleans swinging arm device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510207442.8A CN104810310B (en) | 2015-04-28 | 2015-04-28 | A kind of wafer-scanning cleans swinging arm device |
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| Publication Number | Publication Date |
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| CN104810310A true CN104810310A (en) | 2015-07-29 |
| CN104810310B CN104810310B (en) | 2017-09-19 |
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| CN201510207442.8A Active CN104810310B (en) | 2015-04-28 | 2015-04-28 | A kind of wafer-scanning cleans swinging arm device |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105957821A (en) * | 2016-04-28 | 2016-09-21 | 中国电子科技集团公司第四十五研究所 | Wafer brushing swing arm device |
| CN106312780A (en) * | 2016-09-28 | 2017-01-11 | 天津华海清科机电科技有限公司 | Polishing equipment |
| CN106783683A (en) * | 2016-12-19 | 2017-05-31 | 安徽天裕汽车零部件制造有限公司 | A kind of wafer-scanning cleans swinging arm device |
| CN108177089A (en) * | 2018-01-02 | 2018-06-19 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Polishing fluid supply arm and polishing liquid supplying device |
| CN108677368A (en) * | 2018-05-31 | 2018-10-19 | 吉林省德盟欧纺织机械有限公司 | A kind of oscillating arm mechanisms |
| CN109047092A (en) * | 2018-09-30 | 2018-12-21 | 宁波润华全芯微电子设备有限公司 | It is a kind of for cleaning the swing arm cleaning device of reticle |
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| CN110707022A (en) * | 2019-09-06 | 2020-01-17 | 长江存储科技有限责任公司 | Wafer cleaning device |
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| CN111341690A (en) * | 2018-12-19 | 2020-06-26 | 北京北方华创微电子装备有限公司 | Spraying structure and reaction chamber |
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| CN114226317A (en) * | 2021-12-13 | 2022-03-25 | 上海提牛机电设备有限公司 | Wafer cleaning device |
| CN115106315A (en) * | 2022-08-30 | 2022-09-27 | 智程半导体设备科技(昆山)有限公司 | Brush head mechanism of brush sheet type wafer cleaning machine |
| CN115121515A (en) * | 2022-08-30 | 2022-09-30 | 智程半导体设备科技(昆山)有限公司 | Brush piece formula wafer cleaning machine swing arm mechanism |
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| CN105957821A (en) * | 2016-04-28 | 2016-09-21 | 中国电子科技集团公司第四十五研究所 | Wafer brushing swing arm device |
| CN105957821B (en) * | 2016-04-28 | 2018-08-24 | 中国电子科技集团公司第四十五研究所 | A kind of wafer scrub swinging arm device |
| CN106312780B (en) * | 2016-09-28 | 2019-04-02 | 清华大学 | Polissoir |
| CN106312780A (en) * | 2016-09-28 | 2017-01-11 | 天津华海清科机电科技有限公司 | Polishing equipment |
| CN106783683B (en) * | 2016-12-19 | 2019-08-09 | 安徽天裕汽车零部件制造有限公司 | A kind of wafer-scanning cleaning swinging arm device |
| CN106783683A (en) * | 2016-12-19 | 2017-05-31 | 安徽天裕汽车零部件制造有限公司 | A kind of wafer-scanning cleans swinging arm device |
| CN108177089A (en) * | 2018-01-02 | 2018-06-19 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Polishing fluid supply arm and polishing liquid supplying device |
| CN108677368A (en) * | 2018-05-31 | 2018-10-19 | 吉林省德盟欧纺织机械有限公司 | A kind of oscillating arm mechanisms |
| CN108677368B (en) * | 2018-05-31 | 2019-09-06 | 吉林省德盟欧纺织机械有限公司 | A kind of oscillating arm mechanisms |
| CN109047092A (en) * | 2018-09-30 | 2018-12-21 | 宁波润华全芯微电子设备有限公司 | It is a kind of for cleaning the swing arm cleaning device of reticle |
| CN109482538A (en) * | 2018-12-10 | 2019-03-19 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer washing and brushing device |
| CN111319970B (en) * | 2018-12-13 | 2021-11-02 | 北京华文永康科技有限公司 | Sucking disc bowl taking device |
| CN111319970A (en) * | 2018-12-13 | 2020-06-23 | 北京华文永康科技有限公司 | Sucking disc bowl taking device |
| CN111341690A (en) * | 2018-12-19 | 2020-06-26 | 北京北方华创微电子装备有限公司 | Spraying structure and reaction chamber |
| CN111341690B (en) * | 2018-12-19 | 2023-12-22 | 北京北方华创微电子装备有限公司 | Spraying structure and reaction chamber |
| CN109772803A (en) * | 2018-12-29 | 2019-05-21 | 深圳朗特智能控制股份有限公司 | A kind of multi-function washing machine |
| CN110707022A (en) * | 2019-09-06 | 2020-01-17 | 长江存储科技有限责任公司 | Wafer cleaning device |
| CN113118099A (en) * | 2019-12-31 | 2021-07-16 | 盛美半导体设备(上海)股份有限公司 | Rotary spray head, cleaning equipment and cleaning method |
| CN112693228B (en) * | 2020-12-30 | 2022-04-19 | 大族激光科技产业集团股份有限公司 | Rotary liquid injection device and laser processing device |
| CN112693228A (en) * | 2020-12-30 | 2021-04-23 | 大族激光科技产业集团股份有限公司 | Rotary liquid injection device and laser processing device |
| CN114226317A (en) * | 2021-12-13 | 2022-03-25 | 上海提牛机电设备有限公司 | Wafer cleaning device |
| CN115106315A (en) * | 2022-08-30 | 2022-09-27 | 智程半导体设备科技(昆山)有限公司 | Brush head mechanism of brush sheet type wafer cleaning machine |
| CN115121515A (en) * | 2022-08-30 | 2022-09-30 | 智程半导体设备科技(昆山)有限公司 | Brush piece formula wafer cleaning machine swing arm mechanism |
| CN115106315B (en) * | 2022-08-30 | 2022-11-18 | 智程半导体设备科技(昆山)有限公司 | Brush head mechanism of brush sheet type wafer cleaning machine |
| CN115121515B (en) * | 2022-08-30 | 2022-12-16 | 智程半导体设备科技(昆山)有限公司 | Brush piece formula wafer cleaning machine swing arm mechanism |
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