CN115121515B - Brush piece formula wafer cleaning machine swing arm mechanism - Google Patents
Brush piece formula wafer cleaning machine swing arm mechanism Download PDFInfo
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- CN115121515B CN115121515B CN202211044536.4A CN202211044536A CN115121515B CN 115121515 B CN115121515 B CN 115121515B CN 202211044536 A CN202211044536 A CN 202211044536A CN 115121515 B CN115121515 B CN 115121515B
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- 230000007246 mechanism Effects 0.000 title claims abstract description 58
- 238000004140 cleaning Methods 0.000 title claims abstract description 40
- 230000033001 locomotion Effects 0.000 claims abstract description 10
- 230000005540 biological transmission Effects 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 25
- 230000008569 process Effects 0.000 claims description 21
- 238000009434 installation Methods 0.000 claims description 19
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 2
- 230000003028 elevating effect Effects 0.000 description 10
- 230000006872 improvement Effects 0.000 description 9
- 230000000903 blocking effect Effects 0.000 description 8
- 230000006378 damage Effects 0.000 description 7
- 230000001154 acute effect Effects 0.000 description 2
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- 239000012535 impurity Substances 0.000 description 2
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- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 238000005201 scrubbing Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 208000014674 injury Diseases 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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Abstract
The invention provides a brush piece type wafer cleaning machine swing arm mechanism which comprises a main lifting mechanism and an adjusting mechanism, wherein the adjusting mechanism drives the main lifting mechanism to perform rotary motion and lifting motion, the main lifting mechanism comprises a lifting arm used for connecting a brush head and a first driving device used for driving the lifting arm to move along the vertical direction, the adjusting mechanism comprises a rotating device and a fine adjustment device, the rotating device drives the first driving device to pivot in a plane parallel to a wafer so as to drive the lifting arm to rotate in the plane parallel to the wafer, and the fine adjustment device drives the rotating device and the first driving device to synchronously lift in a preset range along the vertical direction so as to drive the lifting arm to lift in the preset range. The invention solves the problem that in the prior art, the lifting of the brush head is directly controlled by devices such as a linear motor and the like, and the relative position between the brush head and a wafer is difficult to finely adjust due to the high descending speed of the brush head, so that the surface of the wafer is damaged by contact.
Description
Technical Field
The invention relates to the field of wafer cleaning, in particular to a brush piece type wafer cleaning machine swing arm mechanism.
Background
In the course of each wafer process, the wafer is contacted with various pollutants such as organic matters, particles and metal impurities, so that the pollutants are attached to the wafer, and therefore, the wafer needs to be cleaned. Wafer cleaning is an important process step in the wafer manufacturing process, and requires effective use of chemical solutions or gases to remove impurities remaining on the wafer surface without damaging the wafer surface characteristics and electrical characteristics. In order to improve the wafer cleaning efficiency, in the brush sheet type wafer cleaning machine in the prior art, a liquid medicine spray head of wafer cleaning equipment sprays liquid medicine on the surface of a wafer, then a brush head is adopted to clean the wafer, a layer of water film exists between the brush head and the wafer in the whole cleaning process, namely the brush head and the wafer are not in direct contact so as to avoid damage to the surface of the wafer.
Connect the brush head in the wafer cleaning machine through swing arm mechanism among the prior art, thereby swing arm mechanism controls its position in vertical side through the lift of control brush head to distance between control brush head and the wafer, after the position between brush head and the wafer reaches the needs of scrubbing, swing arm mechanism drives the swing of brush head, and brush head self is rotatory simultaneously, reaches the effect of scrubbing the wafer.
Swing arm mechanism uses devices such as linear motor to realize when control brush head goes up and down among the prior art usually, because wafer texture is fragile and the structure is accurate itself, and the speed is very fast when devices such as linear motor control brush head goes up and down, has the possibility of taking place contact damage between wafer, causes the damage to the wafer surface, leads to the emergence of defective products condition.
In view of the above, there is a need for an improved swing arm mechanism in the prior art to solve the above problems.
Disclosure of Invention
The invention aims to disclose a swing arm mechanism of a brush wafer cleaning machine, which is used for solving the problem that in the prior art, the lifting of a brush head is directly controlled by a linear motor and other devices, and the relative position between the brush head and a wafer is difficult to finely adjust due to the high descending speed of the brush head, so that the surface of the wafer is damaged by contact.
In order to achieve the purpose, the invention provides a brush wafer cleaning machine swing arm mechanism, which comprises a main lifting mechanism and an adjusting mechanism, wherein the adjusting mechanism drives the main lifting mechanism to perform rotary motion and lifting motion;
the first driving device comprises a lifting plate used for being connected with the lifting arm and a driving cylinder, the driving end of the driving cylinder drives the lifting arm to move, and the lifting plate is connected with the rotating device.
The rotating device comprises a connecting seat and a transmission shaft, the transmission shaft is perpendicular to the plane of the wafer, the transmission shaft is fixedly provided with an installation block along the axial direction, the installation block is fixedly connected with the lifting plate, and the transmission shaft and the installation block rotate synchronously;
the fine setting device includes the mount pad, with mount pad fixed connection's elevator motor and with the coaxial fixed drive shaft of elevator motor, the transmission shaft sets up along same axial with the drive shaft, elevator motor drives the drive shaft and rotates, the drive shaft penetrates the connecting seat and drives the connecting seat through screw-thread fit and goes up and down, the connecting seat slides with the mount pad and is connected.
As a further improvement of the invention, the rotating device further comprises a rotating motor fixedly connected with the connecting seat, the rotating motor is coaxially fixed with the transmission shaft, the rotating motor drives the transmission shaft and the mounting block to synchronously rotate, and the mounting directions of the lifting motor and the rotating motor are opposite.
As a further improvement of the invention, the mounting seat comprises a first side plate and a first bottom plate vertically connected to the first side plate, the lifting motor is mounted on the lower surface of the first bottom plate, and the driving end of the lifting motor is connected with the driving shaft after penetrating through the first bottom plate;
the connecting seat comprises a second side plate, a top plate and a connecting plate, the top plate is vertically connected to the top end of the second side plate, one side, far away from the top plate, of the second side plate is in sliding fit with the first side plate through a sliding rail, the connecting plate is arranged below the top plate in parallel and fixed with one side, far away from the first side plate, of the second side plate, and the driving shaft penetrates through the connecting plate and is in threaded fit with the connecting plate;
the rotating motor is installed on the top surface of the top plate, the driving end of the rotating motor penetrates through the top plate and then is connected with the transmission shaft, and the installation block is arranged between the top plate and the connecting plate and coaxially fixed with the transmission shaft.
As a further improvement of the invention, one end of the transmission shaft, which is far away from the rotating motor, is provided with a abdicating groove for inserting the driving shaft, one side of the connecting plate, which is close to the lifting motor, is connected with a limiting block, and the driving shaft axially penetrates through the limiting block and is in rotating fit with the limiting block.
As a further improvement of the invention, the lifting arm comprises a mounting plate, a link mechanism and a drive plate, the link mechanism pivots along a rotating surface formed by the rotation of the mounting plate at a position close to two ends of the length direction of the mounting plate and perpendicular to the rotation of the mounting plate and is respectively connected with the brush head and the drive plate, one side of the drive plate is rotationally connected with the link mechanism, the other side of the drive plate is connected with the driving end of a drive cylinder, and the drive plate is connected with the lifting plate in a sliding manner through a guide rail;
the mounting plate is connected with the guide assembly, the lifting plate is provided with a guide hole in sliding fit with the guide assembly, the driving cylinder drives the guide assembly to move along the guide hole in the displacement process of the driving plate, and the axis direction of the mounting plate is parallel to the plane of the wafer when the guide assembly moves to the top end of the guide hole.
As a further improvement of the invention, the guide hole comprises a section of vertical hole and a section of arc-shaped hole, and the arc-shaped hole and the vertical hole are in smooth transition.
As a further improvement of the invention, the guide assembly comprises a guide plate and a guide wheel connected to the guide plate, the guide plate is fixedly connected with the mounting plate, a rotating shaft of the guide wheel is fixed with the guide plate, and the guide wheel is inserted into the guide hole and is in sliding fit with the guide plate.
As a further improvement of the invention, the connecting plate is connected with a first support, a plurality of first sensors are distributed on the upper surface of the first support in an arc shape, the mounting block is connected with an arc-shaped baffle, and the arc-shaped baffle sequentially passes through the sensing area of each first sensor in the rotating process of the mounting block.
As a further improvement of the invention, the first side plate is connected with a second bracket, the second bracket is distributed with a plurality of second sensors along the height direction of the first side plate, the second side plate is connected with a vertical baffle, and the vertical baffle sequentially passes through the sensing area of each second sensor in the lifting process of the second side plate.
As a further improvement of the invention, the first side plate is positioned above the first bottom plate and is vertically connected with the second bottom plate, and the bottom end of the driving shaft penetrates through the lower surface of the second bottom plate and is connected with a first coupler between the driving shaft and the lifting motor;
the second side plate is positioned between the top plate and the connecting plate and is vertically connected with the positioning plate, and the top end of the transmission shaft penetrates through the positioning plate and is connected with a second coupler between the transmission shaft and the rotating motor.
Compared with the prior art, the invention has the beneficial effects that:
firstly, through the main elevating system and the adjusting mechanism composed of the rotating device and the fine adjustment device, the height of the brush head is greatly adjusted by the main elevating system, when the main elevating system drives the brush head to move to reach a preset height value between the brush head and the wafer, the fine adjustment device is started to drive the main elevating system to integrally lower the brush head to reach the height required by cleaning between the brush head and the wafer within the preset height, the speed of the fine adjustment device driving the main elevating system to ascend and descend is obviously lower than the speed of the main elevating system driving the brush head to move, and the height range for adjusting the brush head is smaller, so that the requirement of fine adjustment on the height range of the brush head is realized, and the condition of damaging the surface of the wafer is effectively avoided to avoid the occurrence of defective products. After the fine adjustment device drives the brush head to move to the designated position, the rotation device is started to enable the brush head and the wafer to move relatively, and the effect of cleaning the wafer is achieved.
Then, the transmission shaft is connected with the lifting plate through the mounting block, so that the transmission shaft can drive the lifting arm connected with the lifting plate to synchronously rotate in the process of starting the rotating motor, and the surface of the wafer can be brushed. After driving actuating cylinder and driving the lifing arm and drop to predetermineeing the height, start elevator motor so that the drive shaft rotates, because drive shaft and connecting seat screw-thread fit, and slide between connecting seat and the mount pad and be connected, consequently can drive lifter plate downstream certain distance at drive shaft pivoted in-process so that the brush head drops to the cleaning operation height, because be screw-thread fit between connecting seat and the drive shaft, can make the connecting seat have lower displacement speed, thereby avoid the wafer to take place the possibility of damaging. Because the driving shaft and the transmission shaft are coaxially arranged, the device has necessary functions and more compact structure.
Finally, distribute in the setting of the first sensor of first support and cowl through the arc to and distribute in the setting of the second sensor of second support and vertical baffle, at the in-process that the connecting seat goes up and down and lifter plate pivoted in-process, when cowl or vertical baffle move to the first sensor or the second sensor of edge, be promptly for reaching the rotation or the lift maximum range of connecting seat and lifter plate, thereby guarantee to the abluent accuracy of wafer and avoid resulting in the possibility that the wafer surface takes place to damage.
Drawings
FIG. 1 is an overall view of the invention used to embody a lifting arm connected to a brush head and the device as a whole in an inoperative condition;
FIG. 2 is a schematic view of the present invention showing the lifting arm in a horizontal position and not connected to a brush head;
FIG. 3 is a schematic sectional view taken along line G-G of FIG. 2;
FIG. 4 is an enlarged view of portion A of FIG. 2;
FIG. 5 is an enlarged view of portion B of FIG. 3;
FIG. 6 is an enlarged view of portion C of FIG. 3;
FIG. 7 is a schematic structural view of the present invention for embodying the lift arm and the first driving device;
FIG. 8 is an enlarged view of portion D of FIG. 3;
fig. 9 is an exploded view of the present invention for showing the structure of each part of the lifting part and the matching relationship with the lifting plate.
Detailed Description
The present invention is described in detail with reference to the embodiments shown in the drawings, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should understand that functional, methodological, or structural equivalents or substitutions made by these embodiments are within the scope of the present invention.
In particular, in the following embodiments, the term "longitudinal" refers to a direction perpendicular to the horizontal plane or the horizontal plane. The term "lateral" refers to a direction parallel to the horizon or horizontal.
Referring to fig. 1 to 9, in a swing arm mechanism of a brush wafer cleaning machine, compared to a conventional swing arm mechanism of a wafer cleaning machine, a main lifting mechanism 1 composed of a lifting arm 11 and a first driving device 12 is used to perform a displacement control of a brush head 3 connected to the lifting arm 11 in a vertical direction to place a wafer to be cleaned and replace the cleaned wafer, an adjusting mechanism 2 composed of a rotating device 21 and a fine tuning device 22 is used to control a circumferential rotation of the brush head 3, so as to perform a cleaning operation from a circle center to an edge on the wafer placed on a worktable of the wafer cleaning machine and rotated, when the first driving device 12 drives the brush head 3 to descend to a specified height, that is, after a specified distance exists between the brush head 3 and the wafer, the fine tuning device 22 further adjusts the height of the brush head 3 to make the distance between the brush head 3 and the wafer at a height required for cleaning, and when the brush head 3 descends to the specified height, the fine tuning device 22 can effectively increase the fine tuning speed of the fine tuning device 3 to increase the surface of the brush head 3 to prevent the wafer from being damaged by impact on the wafer surface of the brush head 3 during the wafer production process, thereby preventing the wafer from damaging the wafer due to the wafer.
Referring to fig. 1 to 9, in the present embodiment, the swing arm mechanism of the brush wafer cleaning machine (hereinafter, referred to as the swing arm mechanism) includes: main elevating system 1 and adjustment mechanism 2, main elevating system 1 is including the first drive arrangement 12 that is used for connecting the lifing arm 11 of brush head 3 and drives lifing arm 11 along the displacement of vertical direction, adjustment mechanism 2 links to each other with first drive arrangement 12, adjustment mechanism 2 includes rotating device 21 and micromatic setting 22, rotating device 21 drives first drive arrangement 12 and pivots in the plane that is on a parallel with the wafer, micromatic setting 22 drives rotating device 21 and first drive arrangement 12 and goes up and down at predetermineeing the within range along vertical direction in step.
When a wafer is to be cleaned, the wafer is firstly placed into the wafer cleaning machine, at this time, the lifting arm 11 and the brush head 3 connected with the lifting arm are in a standby state and are located at a high point, at this time, the first driving device 12 drives the lifting arm 11 to descend to a preset height along the Z-axis direction shown in fig. 2 towards the position close to the wafer, at this time, a certain distance still exists between the brush head 3 and the working height, at this time, the fine adjustment device 22 is started, and the fine adjustment device 22 drives the first driving device 12 to integrally move downwards along the Z-axis direction by a small distance so that the brush head 3 reaches the working height for cleaning the wafer. Because there need exist one deck water film in order to avoid causing the injury to the wafer surface between brush head 3 and the wafer, consequently there need exist the clearance between the operating height of brush head 3 and the wafer, finely tune first drive arrangement 12's height through micromatic setting 22 to carry out accurate control to the operating position of brush head 3, thereby avoid being difficult to control brush head 3 and directly drop to operating height and exist and take place the contact between the wafer and lead to the emergence of contact damage, guarantee the yields of wafer. Then, the rotating device 21 is started, the rotating device 21 drives the first driving device 12 and the lifting arm 11 to rotate from the center of the wafer to the edge of the wafer, and the wafer is placed in the wafer cleaning machine and simultaneously rotates, so that the whole cleaning process of the wafer is completed.
Referring to fig. 2 to 6, the first driving device 12 includes a lifting plate 121 for connecting the lifting arm 11 and a driving cylinder 122, and a driving end of the driving cylinder 122 drives the lifting arm 11 to displace; the rotating device 21 comprises a connecting seat 211, a rotating motor 212 fixedly connected with the connecting seat 211 and a transmission shaft 213 coaxially fixed with the rotating motor 212, the transmission shaft 213 is arranged perpendicular to the plane where the wafer is located, the transmission shaft 213 is fixedly assembled with an installation block 214 along the axial direction, the installation block 214 is fixedly connected with the lifting plate 121, and the rotating motor 212 drives the transmission shaft 213 and the installation block 214 to synchronously rotate; the fine adjustment device 22 comprises a mounting seat 221, a lifting motor 222 fixedly connected with the mounting seat 221 and a driving shaft 223 coaxially fixed with the lifting motor 222, the mounting directions of the lifting motor 222 and the rotating motor 212 are opposite, the transmission shaft 213 and the driving shaft 223 are arranged along the same axial direction, the lifting motor 222 drives the driving shaft 223 to rotate, the driving shaft 223 penetrates through the connecting seat 211 and drives the connecting seat 211 to lift through threaded fit, and the connecting seat 211 is connected with the mounting seat 221 in a sliding mode.
Referring to fig. 2 to 6, the mounting base 221 includes a first side plate 2211 and a first bottom plate 2212 vertically connected to the first side plate 2211, the lifting motor 222 is mounted on the lower surface of the first bottom plate 2212, and the driving end of the lifting motor is connected to the driving shaft 223 after passing through the first bottom plate 2212; the connecting seat 211 comprises a second side plate 2111, a top plate 2112 and a connecting plate 2113, the top plate 2112 is vertically connected to the top end of the second side plate 2111, one side of the second side plate 2111, which is far away from the top plate 2112, is in sliding fit with the first side plate 2211 through a sliding rail 2213, the connecting plate 2113 is arranged below the top plate 2112 in parallel and is fixed with one side of the second side plate 2111, which is far away from the first side plate 2211, and a driving shaft 223 penetrates through the connecting plate 2113 and is in threaded fit with the connecting plate 2113; the rotating motor 212 is installed on the top surface of the top plate 2112, the driving end of the rotating motor passes through the top plate 2112 and then is connected with the transmission shaft 213, and the installation block 214 is arranged between the top plate 2112 and the connection plate 2113 and is coaxially fixed with the transmission shaft 213. An abdicating groove 2131 for inserting the driving shaft 223 is formed at one end of the driving shaft 213 far away from the rotating motor 212, one side of the connecting plate 2113 close to the lifting motor 222 is connected with a limiting block 2117, and the driving shaft 223 axially penetrates through the center of the limiting block 2117 and is in rotating fit with the same.
Referring to fig. 5 and 6, the first side plate 2211 is vertically connected to the second bottom plate 2214 above the first bottom plate 2212, and the bottom end of the driving shaft 223 penetrates through the lower surface of the second bottom plate 2214 and is connected to the first coupling 2215 between the driving shaft and the lifting motor 222; the second side plate 2111 is positioned between the top plate 2112 and the connecting plate 2113 and is vertically connected with the positioning plate 2115, and the top end of the transmission shaft 213 passes through the positioning plate 2115 and is connected with a second coupling 2116 between the transmission shaft and the rotating motor 212.
The second side plates 2111 and the connecting plates 2113 vertically fixed with the second side plates are distributed in an L shape, the top ends of the second side plates 2111 far away from the connecting plates 2113 are vertically fixed with top plates 2112, the rotating motor 212 is fixed on the top plates 2112, the rotor of the rotating motor 212 vertically penetrates through the top plates 2112 downwards to be connected with the transmission shaft 213, the first side plates 2111 are positioned below the top plates 2112 and vertically fixed with positioning plates 2115, the connecting sections 2131 formed at the top ends of the transmission shafts 213 are connected with the rotating motor 212 through second couplers 2116 after penetrating through the positioning plates 2115, and the diameter of the connecting sections 2131 is smaller than that of the main shaft sections 2132 of the transmission shafts 213. The bottom end of the main shaft section 2132 of the transmission shaft 213 is inserted into the connection plate 2113 and is rotationally connected with the connection plate 2113 through the bearing 24, the main shaft section 2132 is positioned between the connection plate 2113 and the positioning plate 2115 to form a coaxial fixed installation block 214, the periphery of the main shaft section 2132 extends in the radial direction to form a limiting section 2133, the top surface of the limiting section 2133 is attached to the bottom surface of the positioning plate 2115, the bottom surface of the limiting section 2113 is attached to the top surface of the installation block 214, the side surface of the installation block 214 is fixed to the lifting plate 121, when the rotating motor 212 is started, the transmission shaft 213 connected with the rotor of the rotating motor 212 through the second coupler 2116 rotates synchronously, the installation block 214 coaxially fixed with the transmission shaft 213 drives the lifting plate 121 to rotate together, and the brush head 3 rotates together with the lifting plate 121 as the lifting arm 11 is connected with the lifting plate 121 and the lifting arm 11 is connected with the brush head 3, so that the brush head 3 rotates together with the lifting plate 121.
The first side plate 2211 and the first bottom plate 2212 vertically fixed to the first side plate 2211 are distributed in an L shape, slide rails 2213 are distributed along the height direction on one side of the first side plate 2211 close to the second side plate 2111, and slide blocks (not labeled in the figure) matched with the slide rails 2213 are fixedly connected to one side of the first side plate 2111 close to the second side plate 2111. The elevating motor 222 is fixed to the lower surface of the first base plate 2212 and the rotor of the elevating motor 222 vertically passes through the first base plate 2212 and is connected to the driving shaft 223. The first side plate 2211 is positioned above the first bottom plate 2212 and is vertically fixed with a second bottom plate 2214, a connecting section 2233 is formed at the bottom end of the driving shaft 223, the connecting section 2233 is connected with the main shaft section 2231 of the driving shaft 223 through a rotating section 2235, the diameters of the main shaft section 2231, the rotating section 2235 and the connecting section 2233 are sequentially tapered, the connecting section 2233 is coaxially fixed with a rotor of the lifting motor 222 through a first coupler 2215 after the rotating section 2235 passes through the second bottom plate 2214, the rotating section 2235 is rotationally connected with the second bottom plate 2214 through a bearing 23, the top end of the main shaft section 2231 passes through the connecting plate 2113 and a threaded section 2232 is formed on the side surface of the main shaft section 2231, and the threaded section 2232 is in threaded fit with an internal thread (not marked in the figure) formed on the connecting plate 2113. Because the driving shaft 223 and the transmission shaft 213 are distributed along the same axial direction, the bottom of the transmission shaft 213 is provided with an abdicating groove 2131 for inserting one end of the driving shaft 223 far away from the connecting section 2233, and the top end of the driving shaft 223 rotates in the abdicating groove 2131.
After the lifting motor 222 is started, the driving shaft 223 coaxially fixed with the rotor of the lifting motor 222 starts to rotate, because the connecting plate 2113 is in threaded fit with the driving shaft 223, and the second side plate 2111 is in sliding fit with the sliding rail 2213 formed on the first side plate 2211 through a sliding block (not labeled in the figure), the whole rotating device 21 moves up or down along the rotating direction of the driving shaft 223, and then the lifting plate 121 connected with the transmission shaft 213 through the mounting block 214 is lifted and lowered along with the rotating device 21, when the driving shaft 223 drives the rotating device 21 to descend, the brush head 3 is adjusted to the working height, and because the driving shaft 223 is in threaded fit with the connecting plate 2113, the descending speed of the brush head 3 is effectively reduced compared with the driving cylinder 122, when the bottom surface of the 211limiting block 7 is located at the bottom dead center I shown in fig. 1, the height of the brush head 3 reaches the working position at the same time, the purpose of fine adjustment of the position of the brush head 3 is achieved, the working gap existing between the wafer and the brush head 3 is ensured, thereby avoiding the contact damage on the wafer surface.
The height range of the fine adjustment device 22 driving the first driving device 12 to ascend and descend is within the range of 1.5cm-3.5cm, namely, the height difference between the bottom surface of the limiting block 2117 moving to the top dead center H or the bottom dead center I, in this embodiment, the height range of the fine adjustment device 22 driving the first driving device 12 to ascend and descend is 2cm, the height of the brush head 3 is finely adjusted, the moving speed of the brush head 3 is guaranteed, and the cleaning efficiency of the wafer is further guaranteed. The driving shaft 223 penetrates through the center of a limiting block 2117 connected to the lower surface of the connecting plate 2113 and is rotatably connected through a sleeve (not labeled in the figure), the limiting block 2117 is matched with the second bottom plate 2214 to keep the vertical state of the driving shaft 223, and the situation that the position of the driving shaft 223 deviates to cause the thread matching failure with the connecting plate 2113 is effectively avoided.
Referring to fig. 2 to 6, the connection plate 2113 is connected to the first bracket 2114, a plurality of first sensors 2118 are distributed on the upper surface of the first bracket 2114 in an arc shape, the mounting block 214 is connected to the arc-shaped baffle 2141, and the arc-shaped baffle 2141 sequentially passes through the sensing area of each first sensor 2118 during the rotation of the mounting block 214. The first side plate 2211 is connected with the second support 2218, the second support 2218 is provided with a plurality of second sensors 2216 along the height direction of the first side plate 2211, the second side plate 2111 is connected with the vertical baffle 2142, and the vertical baffle 2142 sequentially passes through the sensing area of each second sensor 2216 in the lifting process of the second side plate 2111.
In the process that the lifting motor 222 is started, and the driving shaft 223 drives the connecting plate 2113 and the rotating device 21 to integrally lift, two blocking pieces (not labeled in the figure) are formed at one side, close to the first side plate 2211, of the vertical blocking plate 2142 connected to the second side plate 2111, in this embodiment, three second sensors 2216 are uniformly distributed in the second support 2218 from top to bottom, when the vertical blocking plate 2142 moves to the position, where the brush head 3 is located at the working height, along with the second side plate 2111, the two blocking pieces (not labeled in the figure) are respectively inserted into the sensing areas of the second and third second sensors 2216 from top to bottom, in this embodiment, the second sensor 2216 is an infrared sensor, at this time, the bottom surface of the limiting block 2117 is located at the height of the bottom dead center I, at this time, the circuit controls the rotor of the lifting motor 222 to stop rotating, and the rotating motor 212 is started to enable the brush head 3 to clean the surface of the wafer.
As shown in fig. 4, the arc baffle 2141 is formed by splicing two arc plates (not labeled in the figure) which are separated from each other, wherein the two arc plates are screwed and fixed by a plug bolt (not shown in the figure) between a waist-shaped hole and a screw hole (not labeled in the figure), and two blocking pieces (not labeled in the figure) are formed on one side of the two arc plates away from the mounting block 214. The first brackets 2114 are uniformly formed with a plurality of mounting holes (not labeled), the number of the first sensors 2118 is three, and each first sensor 2118 is detachably connected between two mounting holes. When a wafer with a larger size is cleaned, a bolt penetrates through the left edge of the kidney-shaped hole and then is screwed into the screw hole, at this time, the arc-shaped baffle 2141 formed by the two arc-shaped plates has the largest surface area, the two first sensors 2118 at two ends are respectively installed at the installation hole at the most edge of the first support 2114, the included angle between the two first sensors 2118 distributed at the edge is 110 degrees, the included angle between the first sensor 2118 arranged in the middle and the other two first sensors 2118 is 55 degrees, in this state, the cleaning range of the wafer with the largest size can be covered, in the process that the arc-shaped baffle 2141 rotates along with the installation block, when the two blocking pieces are inserted into the induction areas of the first and second first sensors 2118 counted from left to right, the brush head 3 is shown to have moved to the edge of the wafer, at this time, the rotor of the rotating motor 212 is rotated to the state that the two blocking pieces of the arc-shaped baffle 2141 are inserted into the induction areas of the first and second first sensors 2118 counted from right, which shows that the wafer cleaning is completed, and the rotating motor 212 stops working.
When the wafer size is smaller than the maximum size, the bolt gradually moves to the right in the waist-shaped hole, the position of the first sensor 2118 is adjusted as required, and when the bolt is located at the rightmost end of the waist-shaped hole, the swing arm mechanism is matched with the minimum wafer size capable of being cleaned. Then, the lifting motor 222 is started to rotate the rotor in the direction opposite to the direction of driving the brush head 3 to descend, when the second side plate 2111 is lifted until the two blocking pieces are inserted into the sensing areas of the first and second sensors 2216 from top to bottom, the fine adjustment device 22 drives the swing arm mechanism to integrally ascend to the height of the bottom surface of the limiting block 2117 at the top dead center H, the lifting motor 222 is stopped to move, and the driving cylinder 122 is started to drive the lifting arm 11 and the brush head 3 to ascend to the non-working height.
As shown in fig. 7 to 9, the lifting arm 11 includes a mounting plate 111, a link mechanism 112 and a driving plate 113, the link mechanism 112 penetrates through the mounting plate 111 from the position near the two ends in the length direction and is respectively connected to the brush head 3 and the driving plate 113, one side of the driving plate 113 is rotatably connected to the link mechanism 112, the other side is connected to the driving end of the driving cylinder 122, and the driving plate 113 is slidably connected to the lifting plate 121 through a guide rail 1211; the mounting plate 111 is connected with the guide assembly 13, the lifting plate 121 is provided with a guide hole 1212 in sliding fit with the guide assembly 13, the drive cylinder 122 drives the guide assembly 13 to move along the guide hole 1212 in the displacement process of the drive plate 113, and the axial direction of the mounting plate 111 is parallel to the plane of the wafer when the guide assembly 13 moves to the position where the guide hole 1212 is shown as 7. The guide hole 1212 includes a vertical hole 1214 and an arc hole 1213, the vertical hole 1214 is connected to the bottom end of the arc hole 1213, and the arc hole 1213 is smoothly transited to the vertical hole 1211214, wherein the bottom end of the vertical hole 1214 is the bottom dead point F of the movement of the guide assembly 13, and the position of the arc hole 1213 is the top dead point E of the movement of the guide assembly 13 as shown in fig. 7. The guide assembly 13 comprises a guide plate 131 and a guide wheel 132 connected to the guide plate 131, the guide plate 131 is fixedly connected to the mounting plate 111, a rotating shaft of the guide wheel 132 is fixed to the guide plate 131, and the guide wheel 132 is inserted into the guide hole 1212 and slidably engaged therewith.
As shown in fig. 7 to 9, the link mechanism 112 includes a first rotating shaft 1123, a first rotating wheel 1121, a first cam 1122, a second rotating shaft 1126, a second rotating wheel 1124, a second cam 1125 and a connecting rod 1127, the mounting plate 111 is located at two ends in the length direction to form a first accommodating cavity 14 for mounting the first rotating wheel 1121 and the first cam 1122 and a second accommodating cavity 15 for mounting the second rotating wheel 1124 and the second cam 1125, one end of the first rotating shaft 1123 is coaxially fixed with the first rotating wheel 1121 along a mounting shaft l shown in fig. 9, the other end of the first rotating shaft passes through the mounting plate 111 along the mounting shaft l and is rotatably connected with the driving plate 113, the lifting plate 121 forms a guide rail 1211 parallel to the lifting direction, one side of the driving plate 113 far away from the first rotating wheel 1121 is fixedly connected with a guide block (not marked in the figures) in sliding fit with the guide rail 1211, the first cam 1122 is fixed at the center of the first rotating wheel, and the end of the first cam 1122 protrudes from the edge of the first rotating wheel 1121;
one end of the second rotating shaft 1126 is coaxially fixed with the second rotating wheel 1124 along the assembly axis l 'as shown in fig. 9, the other end passes through the mounting plate 111 along the assembly axis l' and is fixedly connected with the brush head 3, the second cam 1125 is fixed at the center of the second rotating wheel 1124, the end of the second cam 1125 extends from the edge of the second rotating wheel 1124, the second cam 1125 is parallel to the first cam 1124, the two ends of the connecting rod 1127 are respectively and rotatably connected with the first cam 1122 and the position where the second cam 1125 extends from the edges of the first rotating wheel 1121 and the second rotating wheel 1124, the connecting rod 1127 is arranged parallel to the length direction of the mounting plate 111, and the side of the mounting plate 111 far away from the brush head 3 covers the housing 114.
Referring to fig. 1, in an initial state, the guide wheel 132 is located at the bottom dead center F of the guide hole 1212, the driving plate 113 is located at the bottom end of the guide rail 1211, the lifting arm 11 forms an acute angle with a plane defined by the X/Y axis shown in fig. 7, and a large distance exists between the brush head 3 and the wafer, so that the wafer to be cleaned can be put into the wafer cleaning machine. After the cleaned wafer is placed, the driving cylinder 122 drives the driving plate 113 to rise along the guide rail 1211, the first rotating shaft 1123 in rotation fit with the driving plate 113 drives the first rotating wheel 1121 and the first cam 1122 to rotate synchronously, an included angle between the first cam 1122 and the connecting rod 1127 is increased in the rotation process of the first cam 1122, the second cam 1125 connected to the other end of the connecting rod 1127 drives the second rotating wheel 1124 and the second rotating shaft 1126 to rotate synchronously, the second cam 1125 is always parallel to the first cam 1122 in the rotation process, the brush head 3 connected to the second rotating shaft 1126 rotates synchronously along with the first rotating shaft 1123, and the brush head 3 is always in a vertical downward state in the rotation process.
In the process that the lifting arm 11 gradually rotates in an acute angle state with a plane enclosed by an X/Y axis, the guide wheel 132 moves from a lower dead point F of the guide hole 1212 to an upper dead point E of the guide hole 1212, the guide hole 1212 is formed by an arc-shaped hole 1213 and a vertical hole 1214, the occupied space in the lifting motion process of the lifting arm 11 is effectively reduced, the guide wheel 132 is matched to provide an effective supporting effect on the whole lifting arm 11, the lifting process is more stable, and the central angle of the arc-shaped hole 1213 is 20 degrees in the embodiment. At this time, the driving end of the driving cylinder 122 moves to the top end, the driving plate 113 stops the lifting motion along the lifting plate 121, the top surface of the lifting arm 11 is parallel to the X/Y axis plane, and the distance between the brush head 3 and the driving cylinder 122 is the maximum. Then, the lifting motor 222 is started to make the main lifting mechanism 1 wholly and slightly descend until the brush head 3 is at the lower dead point I, at the moment, the brush head 3 is at the working position, and then the rotating motor 212 is started to make the brush head 3 clean the wafer. The lifting process of the lifting arm 11 is consistent with the above principle, and will not be described herein.
The above-listed detailed description is merely a detailed description of possible embodiments of the present invention, and it is not intended to limit the scope of the invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention are intended to be included within the scope of the present invention.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it is to be understood that all embodiments may be combined as appropriate by one of ordinary skill in the art to form other embodiments as will be apparent to those of skill in the art from the description herein.
Claims (10)
1. The utility model provides a brush piece formula wafer cleaning machine swing arm mechanism which characterized in that includes: the adjusting mechanism drives the main lifting mechanism to perform rotary motion and lifting motion, the main lifting mechanism comprises a lifting arm used for connecting a brush head and a first driving device used for driving the lifting arm to move along the vertical direction, the adjusting mechanism comprises a rotating device and a fine adjusting device, the rotating device drives the first driving device to pivot in a plane parallel to a wafer so as to drive the lifting arm to rotate in the plane parallel to the wafer, and the fine adjusting device drives the rotating device and the first driving device to synchronously lift within a preset range along the vertical direction so as to drive the lifting arm to lift within the preset range;
the first driving device comprises a lifting plate and a driving cylinder, the lifting plate is used for being connected with the lifting arm, the driving end of the driving cylinder drives the lifting arm to move, and the lifting plate is connected with the rotating device;
the rotating device comprises a connecting seat and a transmission shaft, the transmission shaft is perpendicular to the plane of the wafer, the transmission shaft is fixedly provided with an installation block along the axial direction, the installation block is fixedly connected with the lifting plate, and the transmission shaft and the installation block rotate synchronously;
the fine setting device includes the mount pad, with mount pad fixed connection's elevator motor and with the coaxial fixed drive shaft of elevator motor, the transmission shaft sets up along same axial with the drive shaft, elevator motor drives the drive shaft and rotates, the drive shaft penetrates the connecting seat and drives the connecting seat through screw-thread fit and goes up and down, the connecting seat slides with the mount pad and is connected.
2. The oscillating arm mechanism of a brush wafer cleaning machine according to claim 1, wherein the rotating device further comprises a rotating motor fixedly connected with the connecting seat, the rotating motor is coaxially fixed with the transmission shaft, the rotating motor drives the transmission shaft and the mounting block to rotate synchronously, and the installation direction of the lifting motor is opposite to that of the rotating motor.
3. The swing arm mechanism of the brush wafer cleaning machine of claim 2, wherein the mounting base comprises a first side plate and a first bottom plate vertically connected to the first side plate, the lifting motor is mounted on the lower surface of the first bottom plate, and the driving end of the lifting motor is connected with the driving shaft after the first bottom plate penetrates through the lifting motor;
the connecting seat comprises a second side plate, a top plate and a connecting plate, the top plate is vertically connected to the top end of the second side plate, one side, far away from the top plate, of the second side plate is in sliding fit with the first side plate through a sliding rail, the connecting plate is arranged below the top plate in parallel and fixed with one side, far away from the first side plate, of the second side plate, and the driving shaft penetrates through the connecting plate and is in threaded fit with the connecting plate;
the rotating motor is installed on the top surface of the top plate, the driving end of the rotating motor penetrates through the top plate and then is connected with the transmission shaft, and the installation block is arranged between the top plate and the connecting plate and coaxially fixed with the transmission shaft.
4. The swing arm mechanism of a brush wafer cleaning machine according to claim 3, wherein a receding slot for inserting the driving shaft is formed at one end of the transmission shaft away from the rotating motor, a limiting block is connected to one side of the connecting plate close to the lifting motor, and the driving shaft passes through the limiting block along the axial direction and is in rotating fit with the limiting block.
5. The swing arm mechanism of a brush wafer cleaning machine according to claim 2, wherein the lifting arm comprises a mounting plate, a link mechanism and a driving plate, the link mechanism pivots along a rotation plane formed by the rotation of the mounting plate at a position close to two ends of the mounting plate in the length direction and is perpendicular to the mounting plate and is respectively connected with the brush head and the driving plate, one side of the driving plate is rotatably connected with the link mechanism, the other side of the driving plate is connected with the driving end of a driving cylinder, and the driving plate is connected with the lifting plate in a sliding manner through a guide rail;
the mounting plate is connected with the guide assembly, the lifting plate is provided with a guide hole in sliding fit with the guide assembly, the driving cylinder drives the guide assembly to move along the guide hole in the displacement process of the driving plate, and the axis direction of the mounting plate is parallel to the plane of the wafer when the guide assembly moves to the top end of the guide hole.
6. The oscillating arm mechanism of brush wafer cleaning machine as claimed in claim 5, wherein the guiding holes comprise vertical holes and arc holes, and the arc holes and the vertical holes are in smooth transition.
7. The oscillating arm mechanism of a brush wafer cleaning machine according to claim 5, wherein the guide assembly comprises a guide plate and a guide wheel connected to the guide plate, the guide plate is fixedly connected with the mounting plate, a rotating shaft of the guide wheel is fixed with the guide plate, and the guide wheel is inserted into the guide hole and is in sliding fit with the guide hole.
8. The swing arm mechanism of the brush wafer cleaning machine of claim 3, wherein the connecting plate is connected with a first bracket, the upper surface of the first bracket is distributed with a plurality of first sensors in an arc shape, the mounting block is connected with an arc-shaped baffle, and the arc-shaped baffle sequentially passes through the sensing area of each first sensor in the rotation process of the mounting block.
9. The swing arm mechanism of the brush wafer cleaning machine of claim 3, wherein the first side plate is connected with a second bracket, the second bracket is distributed with a plurality of second sensors along the height direction of the first side plate, the second side plate is connected with a vertical baffle, and the vertical baffle passes through the sensing area of each second sensor in sequence in the lifting process of the second side plate.
10. The swing arm mechanism of the brush wafer cleaning machine of claim 3, wherein the first side plate is positioned above the first bottom plate and vertically connected with a second bottom plate, and the bottom end of the driving shaft penetrates through the lower surface of the second bottom plate and then is connected with a first coupling between the driving shaft and the lifting motor;
the second side plate is positioned between the top plate and the connecting plate and is vertically connected with the positioning plate, and the top end of the transmission shaft penetrates through the positioning plate and then is connected with the rotating motor through a second coupler.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211044536.4A CN115121515B (en) | 2022-08-30 | 2022-08-30 | Brush piece formula wafer cleaning machine swing arm mechanism |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211044536.4A CN115121515B (en) | 2022-08-30 | 2022-08-30 | Brush piece formula wafer cleaning machine swing arm mechanism |
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| CN115121515B true CN115121515B (en) | 2022-12-16 |
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| CN104810310A (en) * | 2015-04-28 | 2015-07-29 | 中国电子科技集团公司第四十五研究所 | Wafer scanning and cleaning swing arm device |
| TWI645467B (en) * | 2017-12-20 | 2018-12-21 | 弘塑科技股份有限公司 | Wafer cleaning equipment and method of controlling a brush of the wafer cleaning equipment |
| CN210497568U (en) * | 2019-06-19 | 2020-05-12 | 彩虹（合肥）液晶玻璃有限公司 | Glass substrate sprays belt cleaning device |
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| CN113458063A (en) * | 2021-08-19 | 2021-10-01 | 苏州科技大学 | Multi-megasonic focusing spraying cleaning device and using method thereof |
| CN115106315A (en) * | 2022-08-30 | 2022-09-27 | 智程半导体设备科技(昆山)有限公司 | Brush head mechanism of brush sheet type wafer cleaning machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114260217A (en) * | 2021-12-13 | 2022-04-01 | 上海提牛机电设备有限公司 | Wafer cleaning system |
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2022
- 2022-08-30 CN CN202211044536.4A patent/CN115121515B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104810310A (en) * | 2015-04-28 | 2015-07-29 | 中国电子科技集团公司第四十五研究所 | Wafer scanning and cleaning swing arm device |
| TWI645467B (en) * | 2017-12-20 | 2018-12-21 | 弘塑科技股份有限公司 | Wafer cleaning equipment and method of controlling a brush of the wafer cleaning equipment |
| CN210497568U (en) * | 2019-06-19 | 2020-05-12 | 彩虹（合肥）液晶玻璃有限公司 | Glass substrate sprays belt cleaning device |
| CN112735992A (en) * | 2021-03-31 | 2021-04-30 | 亚电科技南京有限公司 | Waterproof mark semiconductor wafer cleaning device based on inert gas and using method |
| CN113458063A (en) * | 2021-08-19 | 2021-10-01 | 苏州科技大学 | Multi-megasonic focusing spraying cleaning device and using method thereof |
| CN115106315A (en) * | 2022-08-30 | 2022-09-27 | 智程半导体设备科技(昆山)有限公司 | Brush head mechanism of brush sheet type wafer cleaning machine |
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| CN115121515A (en) | 2022-09-30 |
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Address after: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd. |
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