CN112735992A - Waterproof mark semiconductor wafer cleaning device based on inert gas and using method - Google Patents
Waterproof mark semiconductor wafer cleaning device based on inert gas and using method Download PDFInfo
- Publication number
- CN112735992A CN112735992A CN202110344474.8A CN202110344474A CN112735992A CN 112735992 A CN112735992 A CN 112735992A CN 202110344474 A CN202110344474 A CN 202110344474A CN 112735992 A CN112735992 A CN 112735992A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 117
- 239000011261 inert gas Substances 0.000 title claims abstract description 25
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000005406 washing Methods 0.000 claims abstract description 30
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 58
- 239000007788 liquid Substances 0.000 claims description 11
- 238000011010 flushing procedure Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 6
- 230000006835 compression Effects 0.000 claims description 5
- 238000007906 compression Methods 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000002146 bilateral effect Effects 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract 1
- 210000004907 gland Anatomy 0.000 description 9
- 239000007921 spray Substances 0.000 description 5
- 239000003344 environmental pollutant Substances 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002352 surface water Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
Abstract
The invention relates to the technical field of wafer cleaning, in particular to a waterproof mark semiconductor wafer cleaning device based on inert gas and a using method thereof. It includes wiper mechanism, at least, include the support arm in the wiper mechanism, the support arm lateral wall is close to the position fixedly connected with mount pad at top, the fixed slot has all been seted up on the surface at both ends about the mount pad, the spacing screw with the fixed slot intercommunication is seted up on mount pad lateral wall surface, equal fixed mounting has the cleaning arm in two fixed slots, cleaning arm one end fixedly connected with rotating base, the altitude mixture control hole has been seted up to the rotating base upper surface, rotating base passes through the dead lever at the mount pad internal rotation, realize the rotation regulation to cleaning arm, conveniently carry out the independent washing of single face to the wafer, realized under the prerequisite of two-sided abluent demand, be suitable for different wafer anchor clamps, realize selectively wasing wafer single face or two-sided, and need not change wiper mechanism.
Description
Technical Field
The invention relates to the technical field of wafer cleaning, in particular to a waterproof mark semiconductor wafer cleaning device based on inert gas and a using method thereof.
Background
After etching, a wafer needs to be washed by deionized water, the wafer is placed in a tank body and washed by a spray head above the tank body in the conventional method, after the wafer is washed by the ionized water, inert gas needs to be sprayed on the surface of the wafer for drying, pollutant residues and water stains are further cleaned, water stains are prevented from being generated, and further drying of the wafer is assisted by centrifugal force generated by rotation of the wafer.
The existing wafer cleaning mechanism can only independently clean one side of the wafer, and after the etching of the wafer is finished, the front side and the back side of the wafer can have pollutant residues, therefore, a cleaning mechanism capable of performing double-sided cleaning on a wafer is needed to meet the requirement of double-sided cleaning on the wafer, however, the requirement of the double-sided cleaning mechanism for the wafer clamp is limited, and the double-sided cleaning mechanism is not suitable for different wafer clamps, so that different cleaning mechanisms are required to be selected when the single-sided or double-sided selective cleaning is performed on the wafer, thereby increasing the cost of enterprises, therefore, the invention aims to provide a semiconductor wafer cleaning device and a use method thereof based on inert gas, which can ensure that the cleaning device can clean the two sides of the wafer on the premise of meeting the requirement of cleaning the two sides of the wafer, the cleaning device is suitable for different wafer clamps, and can be used for selectively cleaning one side or two sides of a wafer without replacing a cleaning mechanism according to the wafer clamps.
Disclosure of Invention
The invention aims to provide a waterproof mark semiconductor wafer cleaning device based on inert gas and a using method thereof, so as to solve the problem of double-side cleaning requirement of a wafer.
In order to achieve the above object, the present invention provides an inert gas-based semiconductor wafer cleaning apparatus for preventing water mark, comprising a worktable, a cleaning mechanism and a wafer holder, wherein the cleaning mechanism and the wafer holder are mounted on the worktable;
the cleaning mechanism at least comprises a supporting arm, a mounting seat is fixedly connected to the position, close to the top, of the side wall of the supporting arm, fixing grooves are formed in the surfaces of the upper end and the lower end of the mounting seat, limiting screw holes communicated with the fixing grooves are formed in the surface of the side wall of the mounting seat, locking nuts are connected in the limiting screw holes in a threaded mode, the fixing rods are locked by tightly propping the nesting rods through the locking nuts, cleaning arms are fixedly mounted in the two fixing grooves, grooves penetrating through the lower surface are formed in the upper surface of each cleaning arm, limiting sliding grooves are formed in the two sides of the inner wall of each groove, flushing parts are mounted in the grooves in a clamping mode through the limiting sliding grooves, cleaning parts are fixedly mounted on the surface of the side wall at one end of each cleaning arm, a rotating base is fixedly, a fixed rod is clamped and mounted in the height adjusting hole;
the wiper mechanism of this embodiment is when specifically using, supplies with the washing liquid for the basin through the water guide hose to spray by the wafer surface of washing nozzle pairing rotation, realize washing to wafer surface spot, wash and finish, stop supplying water, carry inert gas through the air duct, and wash by the wafer surface of washing nozzle pairing rotation, wash the liquid that sprays to the wafer edge, and through rotatory centrifugal force that produces, throw away water stain from wafer surface, prevent the production of water mark.
The wafer clamping piece at least comprises a fixing ring, bearing arms are symmetrically arranged on two sides of the side wall of the fixing ring, one end of the side wall of the fixing ring is fixedly connected with a gear mounting seat, a motor is fixedly arranged on the lower surface of the gear mounting seat, a rotating groove is formed in the surface of the inner side wall of the fixing ring, an embedding groove is formed in the upper surface of the inner wall of the rotating groove, a clamping ring is embedded in the rotating groove, and clamping arc plates for clamping a wafer are symmetrically arranged at two ends of the inner side wall of the clamping ring;
when the wafer clamping piece is used specifically, a wafer is placed in the center of the clamping ring, the screw rods on the two sides are rotated simultaneously, the upper wedge block moves downwards, meanwhile, the lower wedge block is pushed to move towards one side of the clamping arc plate, the clamping arc plates on the two sides clamp the wafer simultaneously, and the wafer is clamped fixedly.
As a further improvement of the technical scheme, the rinsing part at least comprises a water tank, one end of the water tank is fixedly communicated with a water guide hose, the interior of the water tank is designed to be a cavity structure, the water guide hose is communicated with the cavity, the cavity is communicated with the rinsing nozzles, so that the rinsing liquid conveyed by the water guide hose is sprayed out of the rinsing nozzles to rinse the wafer, the rinsing nozzles are fixedly mounted on the lower surface of the water tank, the limiting sliding blocks are symmetrically arranged on two sides of the side wall of the water tank, and the water tank is connected with the limiting sliding grooves in a sliding manner through the limiting sliding blocks.
As a further improvement of the technical proposal, the bottom end of the fixed rod is fixedly connected with an embedded rod which is clamped and fixed with the fixed groove, the embedded rod can rotate in the fixed groove, a connecting groove is arranged between the embedded rod and the fixed rod, the connecting groove is clamped and fixed with the opening of the fixed groove, the connecting groove ensures the stability of the embedded rod in the fixed groove, the side wall of the fixed rod is symmetrically provided with limiting clamping blocks, the top of the fixed rod is in threaded connection with a compression nut, the outer side wall of the fixed rod close to the top end is provided with a thread for being in threaded connection with the compression nut, through rotating the gland nut, the gland nut compresses the rotary base, and the rotary base moves downwards along the compression of the gland nut, so that the height of the cleaning arm is adjusted.
As a further improvement of the technical scheme, the lower surface of the rotating base is provided with a spring hole communicated with the height adjusting hole, a first spring is fixedly arranged in the spring hole, the top end of the first spring is fixedly connected with the upper surface of the spring hole, the lower surface of the first spring is fixedly connected with the upper surface of the mounting seat, the aperture of the spring hole is larger than that of the height adjusting hole, the first spring is nested on the outer side wall of the fixed rod, the size of the first spring is matched with the outer diameter of the fixed rod, the first spring is ensured not to be influenced when the limiting clamping block moves up and down, the first spring is used for supporting the cleaning arm, the side wall of the height adjusting hole is symmetrically provided with limiting clamping grooves, the limiting clamping block is clamped and fixed with the limiting clamping grooves, and the length of the limiting clamping block is larger than that of, the limiting clamping block is connected with the limiting clamping groove in a clamped mode, and the cleaning arm cannot be rotated along the side wall of the fixing rod.
As a further improvement of this technical scheme, at least, include the air duct in the washing piece, air duct bottom fixed mounting has the washing nozzle, the washing nozzle with the air duct intercommunication, the guarantee is followed inert gas that the air duct carried is followed the washing nozzle discharges, realizes the washing to wafer surface water stain through inert gas's injection, the washing nozzle pass through the fixing base with wash arm lateral wall fixed connection, fixing base lateral wall fixed surface is connected with the connecting rod, the fixing base passes through the connecting rod with wash arm lateral wall fixed connection, it is preferred, the washing nozzle slope sets up, the nozzle that sprays of washing nozzle inclines to wafer edge, is convenient for blow the spot to wafer edge to throw away the spot through the rotatory centrifugal force of wafer.
As a further improvement of the technical scheme, the clamping ring is provided with teeth along the edge of the outer wall, the upper surface of the clamping ring is close to the upper edge wall of the fixedly connected with of the edge of the outer wall, the two ends of the side wall of the upper edge wall are symmetrically provided with limit lugs, the clamping ring is clamped with the embedded groove through the upper edge wall, the second groove is in embedded connection with the balls, the clamping ring is rotated in the rotating groove under the assistance of the balls, the surface of the inner side wall of the clamping ring is provided with an adjusting groove, a limit baffle is fixedly installed at the position close to the edge in the adjusting groove, a support rod is embedded and installed on the limit baffle, one end of the support rod is fixedly connected with the clamping arc plate, when the jacking piece rotates downwards, the upper wedge block moves downwards, the upper wedge block pushes the lower wedge block to move towards the left side, and clamping adjustment of the clamping arc plate is, adjust both sides simultaneously the centre gripping arc board can realize the centre gripping to the wafer, the wedge under the bracing piece other end fixedly connected with, it has a piece to laminate on the wedge hypotenuse down, down the wedge with nested connection has the second spring between the limit stop, the second spring is used for ensuring go up the wedge with the wedge is closely laminated down, the second recess has been seted up near outer wall edge to the grip ring lower surface.
As a further improvement of the technical scheme, a gear cavity is formed in the gear mounting seat, the gear cavity is communicated with the rotary groove, an embedded groove is formed in the upper surface of the inner wall of the rotary groove, a first groove is formed in the lower surface of the rotary groove, a plurality of balls are embedded in the first groove and used for assisting the clamping ring to slide, a driving wheel is fixedly mounted in the gear cavity through a fixing shaft, the driving wheel is in meshing transmission with the teeth, and the fixing shaft is coaxially connected with the motor output shaft.
As a further improvement of the technical scheme, at least a screw rod is included in the jacking piece, an opening is formed in the lower surface of the screw rod, a limiting groove hole is formed in the top of the opening, the screw rod is in threaded connection with the adjusting groove along the wall, a wedge block is fixedly connected to one end of the screw rod, a connecting rod is fixedly connected to the upper surface of the wedge block, a limiting cap is fixedly mounted at the top of the connecting rod, the screw rod rotates, the limiting cap is fixed and unchanged, and the screw rod pushes the upper wedge block to move downwards.
As a further improvement of the technical scheme, the size of the adjusting groove is matched with the size of the lower wedge block, the inner diameter of the limiting groove hole is larger than the inner diameter of the opening, the limiting cap is fixedly connected with the limiting groove hole in a clamping manner, so that the upper wedge block is fixed and can be always tightly attached to the lower wedge block when the screw rod rotates.
Another object of the present invention is to provide a method for cleaning a semiconductor wafer with water mark prevention based on inert gas, which includes any one of the above-mentioned apparatuses for cleaning a semiconductor wafer with water mark prevention based on inert gas, and includes the following steps:
fixing and clamping a semiconductor wafer:
s1, placing the wafer at the center of the clamping ring, rotating the screws at the two sides simultaneously, so that the upper wedge block moves downwards and pushes the lower wedge block to move towards one side of the clamping arc plate, and the clamping arc plates at the two sides simultaneously clamp the wafer to realize fixed clamping of the wafer;
(II) cleaning the wafer:
s2, turning on a motor, driving the clamping ring to rotate in the rotating groove by the driving wheel, and rotating the wafer along with the clamping ring;
s3, supplying cleaning liquid to the water tank through the water guide hose, and spraying the cleaning liquid to the surface of the rotating wafer through the cleaning nozzle to clean stains on the surface of the wafer;
and S4, stopping supplying water after the washing, conveying inert gas through the gas guide pipe, washing the surface of the wafer rotated by the washing nozzle, washing the sprayed liquid to the edge of the wafer, and throwing water stains away from the surface of the wafer by centrifugal force generated by the rotation to prevent water marks.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the waterproof mark semiconductor wafer cleaning device based on the inert gas and the using method, the upper cleaning arm and the lower cleaning arm are arranged on the cleaning mechanism through the arranged cleaning arms, so that the upper surface and the lower surface of the wafer are synchronously cleaned, and the wafer is cleaned through the cooperation of the cleaning piece and the cleaning piece, so that the requirement of double-side cleaning of the wafer is met, and meanwhile, stain residue and water marks can be effectively prevented.
2. According to the waterproof mark semiconductor wafer cleaning device based on the inert gas and the use method, through the arranged wafer clamping piece, the wafer clamping piece achieves suspension clamping of the clamping piece through the bearing arms on the two sides, the clamping requirement when double-side cleaning is conducted on the wafer is met, the motor drives the clamping ring to enable the wafer to rotate through gear transmission, the centrifugal force generated by rotation of the wafer throws away pollutants and water stains, and drying of the wafer and cleaning of the pollutants are further assisted.
3. According to the waterproof mark semiconductor wafer cleaning device based on the inert gas and the use method, the rotating base is matched with the mounting base in a clamping mode, the rotating base rotates in the mounting base through the fixing rod, the cleaning arm is rotated and adjusted, single-side independent cleaning is conveniently conducted on the wafer, different wafer clamps are suitable on the premise that double-side cleaning is needed, single-side or double-side cleaning of the wafer is achieved, and the cleaning mechanism does not need to be replaced according to the wafer clamps.
Drawings
FIG. 1 is a schematic view of the entire structure of embodiment 1;
FIG. 2 is a schematic view of the entire structure of a cleaning mechanism according to embodiment 1;
FIG. 3 is a schematic view of the structure of a cleaning arm according to embodiment 1;
FIG. 4 is a schematic view of the structure of a support arm according to embodiment 1;
FIG. 5 is a partial structural view of a cleaning arm according to embodiment 1;
FIG. 6 is a schematic view of the flushing member of embodiment 1;
FIG. 7 is a schematic view of the structure of a cleaning member in embodiment 1;
FIG. 8 is a schematic view of the structure of the fixing ring according to embodiment 1;
FIG. 9 is a schematic view of a clip mounting structure of embodiment 1;
FIG. 10 is a partial sectional view of the fixing ring according to embodiment 1;
FIG. 11 is an enlarged view of structure A in example 1;
FIG. 12 is a schematic view of a clamp ring structure of embodiment 1;
FIG. 13 is a partial sectional view of the retainer ring according to embodiment 1;
FIG. 14 is an enlarged schematic view of structure B of example 1;
FIG. 15 is a partial sectional view of the tightening member according to embodiment 1;
FIG. 16 is a schematic view showing a single-sided cleaning state of a wafer according to example 1;
FIG. 17 is a schematic view showing a single-sided cleaning state of a wafer according to example 1;
FIG. 18 is a schematic sectional view showing the structure of a wash arm according to embodiment 1;
FIG. 19 is a sectional view showing the structure of the mount of embodiment 1;
FIG. 20 is a schematic view showing the structure of a fixing bar according to example 1;
fig. 21 is a schematic view of the fixing rod and wash arm mounting structure of embodiment 1.
The various reference numbers in the figures mean:
1. a work table;
2. a cleaning mechanism;
201. a support arm; 2011. a mounting seat; 2012. fixing grooves; 2013. a limiting screw hole;
202. cleaning the arm; 2021. grooving; 2022. a limiting chute; 2023. rotating the base; 20231. a height adjustment hole; 20232. a spring hole; 2024. a limiting clamping groove;
203. a flushing member; 2031. a water tank; 20311. a limiting slide block; 2032. flushing the nozzle; 2033. a water guide hose;
204. cleaning the workpiece; 2041. an air duct; 2042. cleaning the nozzle; 2043. a fixed seat; 2044. a first connecting rod;
205. fixing the rod; 2051. embedding a sleeve rod; 2052. a limiting clamping block; 2053. a compression nut; 2054. a first spring; 2055. a joining groove;
3. a wafer holder;
301. a fixing ring; 3011. a gear mounting seat; 30111. a gear cavity; 30112. a driving wheel; 30113. a fixed shaft; 3012. a load-bearing arm; 3013. a motor; 3014. a rotating tank; 30141. a first groove; 30142. a ball bearing; 3015. embedding a sleeve groove;
302. a clamp ring; 3021. teeth; 3022. clamping the arc plate; 3023. an upper edge wall; 30231. a limiting bump; 3024. an adjustment groove; 30241. a limit baffle; 3025. a support bar; 30251. a second spring; 30252. a lower wedge block;
3026. a top tightening member; 30261. a screw; 30262. opening a hole; 30263. limiting slotted holes; 30264. an upper wedge block; 30265. a second connecting rod; 30266. a limiting cap;
3027. a second groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Example 1
Referring to fig. 1-15, the present embodiment provides an apparatus for cleaning a semiconductor wafer with water mark prevention based on inert gas and a method for using the same, comprising a worktable 1, a cleaning mechanism 2 and a wafer holder 3, which are mounted on the worktable 1;
the cleaning mechanism 2 at least comprises a supporting arm 201, a mounting seat 2011 is fixedly connected to the position, close to the top, of the side wall of the supporting arm 201, fixing grooves 2012 are formed in the surfaces of the upper end and the lower end of the mounting seat 2011, a limiting screw hole 2013 communicated with the fixing grooves 2012 is formed in the surface of the side wall of the mounting seat 2011, a locking nut is connected with the limiting screw hole 2013 in a threaded manner, the fixing rod 205 is locked by tightly jacking the embedded rod 2051 through the locking nut, cleaning arms 202 are fixedly installed in the two fixing grooves 2012, namely two cleaning arms 202 which are symmetrical up and down are fixedly installed on the mounting seat 2011, a notch 2021 which penetrates through the lower surface is formed in the upper surface of each cleaning arm 202, limiting sliding grooves 2022 are formed in the two sides of the inner wall of the notch 2021, a flushing part 203 is clamped and installed in the notch 2021 through the limiting sliding, a height adjusting hole 20231 is formed in the upper surface of the rotating base 2023, and a fixing rod 205 is installed in the height adjusting hole 20231 in a clamping manner;
when the cleaning mechanism 2 of this embodiment is used specifically, a cleaning liquid is supplied to the water tank 2031 through the water guide hose 2033, and the washing nozzle 2032 sprays the surface of the wafer rotating, so as to wash the stains on the surface of the wafer, after the washing is completed, the water supply is stopped, the inert gas is conveyed through the air duct 2041, the surface of the wafer rotating is washed by the cleaning nozzle 2042, the sprayed liquid is washed to the edge of the wafer, and the water stains are thrown away from the surface of the wafer through the centrifugal force generated by the rotation, thereby preventing the generation of water marks.
The wafer clamping piece 3 at least comprises a fixing ring 301, bearing arms 3012 are symmetrically arranged on two sides of the side wall of the fixing ring 301, one end of the side wall of the fixing ring 301 is fixedly connected with a gear mounting seat 3011, a motor 3013 is fixedly arranged on the lower surface of the gear mounting seat 3011, a rotating groove 3014 is formed in the surface of the inner side wall of the fixing ring 301, a nesting groove 3015 is formed in the upper surface of the inner wall of the rotating groove 3014, a clamping ring 302 is nested in the rotating groove 3014, and clamping arc plates 3022 used for clamping a wafer are symmetrically arranged at two ends of;
when the wafer clamping member 3 of the embodiment is used specifically, a wafer is placed at the center of the clamping ring 302, and the screws 30261 on both sides are rotated at the same time, so that the upper wedge 30264 moves downward and simultaneously pushes the lower wedge 30252 to move toward the clamping arc 3022, so that the clamping arc 3022 on both sides simultaneously clamp the wafer, thereby realizing the fixed clamping of the wafer.
The inside of the rinsing part 203 at least comprises a water tank 2031, one end of the water tank 2031 is fixedly communicated with a water guide hose 2033, the inside of the water tank 2031 is designed into a cavity structure, the water guide hose 2033 is communicated with the cavity, the cavity is communicated with the rinsing nozzles 2032, the cleaning liquid conveyed from the water guide hose 2033 is guaranteed to be sprayed out from the rinsing nozzles 2032, the wafer is rinsed, the plurality of rinsing nozzles 2032 are fixedly arranged on the lower surface of the water tank 2031, the limiting sliders 20311 are symmetrically arranged on two sides of the side wall of the water tank 2031, and the water tank 2031 is slidably connected with the limiting chutes 2022 through the limiting sliders;
the cleaning part 204 at least comprises an air duct 2041, a cleaning nozzle 2042 is fixedly installed at the bottom of the air duct 2041, the cleaning nozzle 2042 is communicated with the air duct 2041 to ensure that inert gas conveyed from the air duct 2041 is discharged from the cleaning nozzle 2042, water stains on the surface of a wafer are cleaned by the injection of the inert gas, the cleaning nozzle 2042 is fixedly connected with the side wall of the cleaning arm 202 through a fixed seat 2043, a first connecting rod 2044 is fixedly connected with the surface of the side wall of the fixed seat 2043, the fixed seat 2043 is fixedly connected with the side wall of the cleaning arm 202 through the first connecting rod 2044, preferably, the cleaning nozzle 2042 is obliquely arranged, a spraying port of the cleaning nozzle 2042 is inclined towards the edge of the wafer, so that the stains can be conveniently blown to the edge of the wafer, and the;
a gear cavity 30111 is formed in the gear mounting seat 3011, the gear cavity 30111 is communicated with the rotary groove 3014, a nesting groove 3015 is formed in the upper surface of the inner wall of the rotary groove 3014, a first groove 30141 is formed in the lower surface of the rotary groove 3014, a plurality of balls 30142 are nested in the first groove 30141, the balls 30142 are used for assisting the clamping ring 302 to slide, a transmission wheel 30112 is fixedly mounted in the gear cavity 30111 through a fixed shaft 30113, the transmission wheel 30112 is in meshing transmission with the teeth 3021, and the fixed shaft 30113 is coaxially connected with an output shaft of the motor 3013;
in addition, the edge of the outer wall of the clamp ring 302 is provided with teeth 3021, the edge of the outer wall of the upper surface of the clamp ring 302 near the outer wall is fixedly connected with an upper edge wall 3023, two ends of the side wall of the upper edge wall 3023 are symmetrically provided with limit protrusions 30231, the clamp ring 302 is clamped with a nesting groove 3015 through the upper edge wall 3023, a second groove 3027 is nested with a ball 30142, the ball 30142 assists the clamp ring 302 to rotate in the rotation groove 3014, the inner side wall of the clamp ring 302 is provided with an adjustment groove 3024, a limit baffle 30241 is fixedly installed in the adjustment groove 3024 near the edge, a support rod 3025 is nested in the limit baffle 30241, one end of the support rod 3025 is fixedly connected with the clamping arc 3022, when the tightening member 3026 rotates downward, the upper wedge 30264 moves downward, the upper wedge 30264 pushes the lower wedge 30252 to move leftward, so as to realize clamping adjustment of the clamping arc 3022, and at the same time, clamping arc 3022 on both sides can, the other end of the supporting rod 3025 is fixedly connected with a lower wedge 30252, a tightening member 3026 is attached to the inclined edge of the lower wedge 30252, a second spring 30251 is connected between the lower wedge 30252 and the limit baffle 30241 in a nested manner, the second spring 30251 is used for ensuring that the upper wedge 30264 is tightly attached to the lower wedge 30252, and a second groove 3027 is formed in the lower surface of the clamping ring 302 near the edge of the outer wall;
in addition, the tightening member 3026 at least comprises a screw 30261, the lower surface of the screw 30261 is provided with an opening 30262, the top of the opening 30262 is provided with a limit slot hole 30263, the screw 30261 is in threaded connection with the upper edge of the adjusting groove 3024, one end of the screw 30261 is fixedly connected with an upper wedge 30264, the upper surface of the upper wedge 30264 is fixedly connected with a second connecting rod 30265, the top of the second connecting rod 30265 is fixedly provided with a limit cap 30266, by rotating the screw 30261, the screw 30261 rotates, and the limit cap 30266 is fixed, so that the screw 30261 pushes the upper wedge 30264 to move downward;
furthermore, the size of the adjusting groove 3024 is matched with the size of the lower wedge 30252, the inner diameter of the limiting groove hole 30263 is larger than the inner diameter of the opening 30262, the limiting cap 30266 is fixedly connected with the limiting groove hole 30263 in a clamping manner, so that the upper wedge 30264 is fixed and the upper wedge 30264 and the lower wedge 30252 can be tightly attached to each other all the time when the screw 30261 rotates;
example 2
In order to satisfy the condition that the cleaning arm realizes single-side independent washing of the wafer, the following improvements are made on the basis of the embodiment 1:
referring to fig. 16-20, the top end of the first spring 2054 is fixedly connected to the upper surface of the spring hole 20232, the lower surface of the first spring 2054 is fixedly connected to the upper surface of the mounting seat 2011, the aperture of the spring hole 20232 is larger than that of the height adjusting hole 20231, the first spring 2054 is embedded on the outer side wall of the fixing rod 205, the side wall of the height adjusting hole 20231 is symmetrically provided with the position-limiting clamping grooves 2024, and the position-limiting clamping blocks 2052 are clamped and fixed to the position-limiting clamping grooves 2024;
when the cleaning arm 202 is used, according to the requirement of independent washing of a single surface of a wafer, the locking nut at the position of the limiting screw hole 2013 is screwed and loosened, the cleaning arm 202 on the upper surface or the lower surface of the wafer is independently rotated, the cleaning arm 202 is clamped with the fixing rod 205 through the limiting clamping block 2052, namely when the cleaning arm 202 rotates, the cleaning arm 202 drives the fixing rod 205 to rotate together, further, the nesting rod 2051 is clamped with the fixing groove 2012, the fixing rod 205 rotates in the fixing groove 2012 through the nesting rod 2051, the cleaning arm 202 on the upper surface or the lower surface of the wafer is rotated to a position far away from the wafer, independent washing of the upper surface or the lower surface of the wafer is realized, the locking nut at the position of the limiting screw hole 2013 is screwed, and the nesting rod 2051 is tightly pressed by the locking nut.
Specifically, the length of the limiting clamping block 2052 is greater than that of the limiting clamping groove 2024, and the limiting clamping block 2052 is clamped with the limiting clamping groove 2024, so that the cleaning arm 202 cannot rotate along the side wall of the fixing rod 205.
Example 3
In order to meet the requirement of fine adjustment of the height of the cleaning arm during wafer rinsing, the following improvements are made on the basis of the embodiment 1:
referring to fig. 21, a nesting rod 2051 is fixedly connected to the bottom end of the fixing rod 205, the nesting rod 2051 is fixed to a fixing groove 2012 in a clamping manner, the nesting rod 2051 can rotate in the fixing groove 2012, a connecting groove 2055 is formed between the nesting rod 2051 and the fixing rod 205, the connecting groove 2055 is fixed to an opening of the fixing groove 2012 in a clamping manner, the connecting groove 2055 ensures the stability of the nesting rod 2051 in the fixing groove 2012, limit clamping blocks 2052 are symmetrically arranged on the side wall of the fixing rod 205, a pressing nut 2053 is connected to the top of the fixing rod 205 through a thread, a spring hole 20232 communicated with the height adjusting hole 20231 is formed in the lower surface of the rotating base 2023, and a first spring 2054 is fixedly installed in;
during the use, gland nut 2053 is rotated downwards, because the elastic support of first spring 2054, rotating base 2023 upper surface laminates with gland nut 2053 all the time, when gland nut 2053 rotatory downward movement, gland nut 2053 compresses tightly rotating base 2023 and makes cleaning arm 202 move down along dead lever 205, make washing nozzle 2032 and cleaning nozzle 2042 press close to the wafer surface, realize the fine setting to cleaning arm 202 height, on the contrary, when gland nut 2053 upwards rotates, because first spring 2054 kick-backs, make cleaning arm 202 top tight gland nut 2053 and upward movement, make washing nozzle 2032 and cleaning nozzle 2042 keep away from the wafer surface, simultaneously, to the regulation of cleaning arm 202 height, realized the regulation to wafer washing dynamics, be favorable to clearing up stubborn dirt.
Specifically, the size of the first spring 2054 is matched with the outer diameter of the fixing rod 205, so that the first spring 2054 is not affected when the limiting clamping block 2052 moves up and down, and the first spring 2054 is used for supporting the cleaning arm 202.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. Waterproof trace semiconductor wafer belt cleaning device based on inert gas, its characterized in that: comprises a workbench (1), a cleaning mechanism (2) and a wafer clamping piece (3) which are arranged on the workbench (1);
the cleaning mechanism (2) at least comprises a supporting arm (201), the position of the side wall of the supporting arm (201) close to the top is fixedly connected with a mounting seat (2011), fixing grooves (2012) are respectively formed in the surfaces of the upper end and the lower end of the mounting seat (2011), a limiting screw hole (2013) communicated with the fixing grooves (2012) is formed in the surface of the side wall of the mounting seat (2011), two cleaning arms (202) are fixedly mounted in the fixing grooves (2012), a groove (2021) penetrating through the lower surface is formed in the upper surface of each cleaning arm (202), limiting sliding grooves (2022) are formed in the two sides of the inner wall of each groove (2021), a flushing part (203) is clamped in each groove (2021) through the limiting sliding grooves (2022), a cleaning part (204) is fixedly mounted on the surface of the side wall at one end of each cleaning arm (202), and a rotating base (202, a height adjusting hole (20231) is formed in the upper surface of the rotating base (2023), and a fixing rod (205) is installed in the height adjusting hole (20231) in a clamping manner;
including solid fixed ring (301) at least in wafer holder (3), gu fixed ring (301) lateral wall bilateral symmetry is provided with bearing arm (3012), gu fixed ring (301) lateral wall one end fixedly connected with gear mount pad (3011), fixed surface mounting has motor (3013) under gear mount pad (3011), gu fixed ring (301) inside wall surface has seted up swivelling chute (3014), nested groove (3015) have been seted up to swivelling chute (3014) inner wall upper surface, grip ring (302) are installed to the nestification in swivelling chute (3014), grip ring (302) inside wall both ends symmetry are installed and are used for centre gripping wafer centre gripping arc board (3022).
2. The apparatus of claim 1, wherein the apparatus further comprises: the washing part (203) at least comprises a water tank (2031), one end of the water tank (2031) is fixedly communicated with a water guide hose (2033), a plurality of washing nozzles (2032) are fixedly mounted on the lower surface of the water tank (2031), limiting sliding blocks (20311) are symmetrically arranged on two sides of the side wall of the water tank (2031), and the water tank (2031) is in sliding connection with the limiting sliding grooves (2022) through the limiting sliding blocks (20311).
3. The apparatus of claim 1, wherein the apparatus further comprises: the bottom end of the fixing rod (205) is fixedly connected with an embedded rod (2051), a connecting groove (2055) is formed between the embedded rod (2051) and the fixing rod (205), limiting clamping blocks (2052) are symmetrically arranged on the side wall of the fixing rod (205), and a compression nut (2053) is in threaded connection with the top of the fixing rod (205).
4. The apparatus of claim 3, wherein the apparatus further comprises: the lower surface of the rotating base (2023) is provided with a spring hole (20232) communicated with the height adjusting hole (20231), a first spring (2054) is fixedly installed in the spring hole (20232), the top end of the first spring (2054) is fixedly connected with the upper surface of the spring hole (20232), the lower surface of the first spring (2054) is fixedly connected with the upper surface of the mounting seat (2011), the aperture of the spring hole (20232) is larger than that of the height adjusting hole (20231), the first spring (2054) is embedded in the outer side wall of the fixing rod (205), the side wall of the height adjusting hole (20231) is symmetrically provided with a limiting clamping groove (2024), and the limiting clamping block (2052) is clamped and fixed with the limiting clamping groove (2024).
5. The apparatus of claim 1, wherein the apparatus further comprises: wash including air duct (2041) at least in the piece (204), air duct (2041) bottom fixed mounting has washing nozzle (2042), washing nozzle (2042) through fixing base (2043) with wash arm (202) lateral wall fixed connection.
6. The apparatus of claim 1, wherein the apparatus further comprises: the utility model discloses a clamp ring, including centre gripping ring (302), edge of outer wall edge and edge of outer wall edge, the edge of outer wall edge fixedly connected with is provided with tooth (3021) along centre gripping ring (302), adjustment tank (3024) have been seted up on centre gripping ring (302) inside wall surface, be close to edge fixed mounting in adjustment tank (3024) have limit stop (30241), nested installation has bracing piece (3025) on limit stop (30241), bracing piece (3025) one end with centre gripping arc board (3022) fixed connection, wedge (30252) under bracing piece (3025) other end fixedly connected with, it has top fastener (3026) to laminate on wedge (30252) hypotenuse down, wedge (30252) down with nested connection has second spring (30251) between limit stop (30241), second recess (3027) have been seted up near outer wall edge to centre gripping ring (302) lower surface.
7. The apparatus of claim 6, wherein the apparatus comprises: gear chamber (30111) have been seted up in gear mount pad (3011), gear chamber (30111) with swivelling chute (3014) intercommunication, nested groove (3015) have been seted up to swivelling chute (3014) inner wall upper surface, first recess (30141) have been seted up to swivelling chute (3014) lower surface, a plurality of balls (30142) have been installed to nested in first recess (30141), there are drive wheel (30112) through fixed axle (30113) fixed mounting in gear chamber (30111), drive wheel (30112) with tooth (3021) meshing transmission, fixed axle (30113) with motor (3013) output shaft coaxial coupling.
8. The apparatus of claim 7, wherein: the adjustable screw rod is characterized by at least comprising a screw rod (30261) in the jacking piece (3026), wherein an opening hole (30262) is formed in the lower surface of the screw rod (30261), a limiting slotted hole (30263) is formed in the top of the opening hole (30262), the screw rod (30261) is in threaded connection with the adjusting groove (3024) along the wall, one end of the screw rod (30261) is fixedly connected with an upper wedge block (30264), the upper surface of the upper wedge block (30264) is fixedly connected with a second connecting rod (30265), and a limiting cap (30266) is fixedly mounted at the top of the second connecting rod (30265).
9. The apparatus of claim 8, wherein the apparatus further comprises: the size of the adjusting groove (3024) is matched with that of the lower wedge block (30252), the inner diameter of the limiting groove hole (30263) is larger than that of the opening hole (30262), and the limiting cap (30266) is clamped and fixed with the limiting groove hole (30263).
10. A method for cleaning a semiconductor wafer having water marks based on an inert gas, using the apparatus for cleaning a semiconductor wafer having water marks based on an inert gas according to any one of claims 1 to 9, characterized in that: the method comprises the following steps:
fixing and clamping a semiconductor wafer:
s1, placing the wafer at the center of the clamping ring (302), rotating the screws (30261) at the two sides simultaneously, so that the upper wedge block (30264) moves downwards and simultaneously pushes the lower wedge block (30252) to move towards one side of the clamping arc plate (3022), so that the clamping arc plates (3022) at the two sides simultaneously clamp the wafer, and the wafer is fixedly clamped;
(II) cleaning the wafer:
s2, turning on a motor (3013), driving a clamping ring (302) to rotate in a rotating groove (3014) by a driving wheel (30112), and enabling the wafer to rotate along with the clamping ring (302);
s3, supplying cleaning liquid to the water tank (2031) through the water guide hose (2033), and spraying the rotating wafer surface through the washing nozzle (2032) to wash the stains on the wafer surface;
and S4, stopping supplying water after the rinsing is finished, conveying inert gas through the gas guide pipe (2041), cleaning the surface of the rotating wafer through the cleaning nozzle (2042), flushing the sprayed liquid to the edge of the wafer, and throwing water stains away from the surface of the wafer through centrifugal force generated by the rotation to prevent water marks.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114038939A (en) * | 2021-10-13 | 2022-02-11 | 泰州君之华新能源科技有限公司 | High-efficient etching machine of new forms of energy photovoltaic wafer |
| CN114433444A (en) * | 2022-04-11 | 2022-05-06 | 四川上特科技有限公司 | Material containing and transferring device for coating glass powder on wafer |
| CN114562874A (en) * | 2022-03-02 | 2022-05-31 | 浙江光特科技有限公司 | Drying treatment device used after wafer cleaning |
| CN114914182A (en) * | 2022-07-18 | 2022-08-16 | 浙江晶睿电子科技有限公司 | Silicon chip processing device for semiconductor packaging processing |
| CN114999960A (en) * | 2022-06-02 | 2022-09-02 | 智程半导体设备科技(昆山)有限公司 | Single wafer cleaning equipment |
| CN115121515A (en) * | 2022-08-30 | 2022-09-30 | 智程半导体设备科技(昆山)有限公司 | Brush piece formula wafer cleaning machine swing arm mechanism |
| CN115954262A (en) * | 2022-01-30 | 2023-04-11 | 江苏亚电科技有限公司 | Wafer cleaning method |
| CN117276142A (en) * | 2023-11-15 | 2023-12-22 | 拓思精工科技(苏州)有限公司 | Double-sided brushing device for wafer processing |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010042559A1 (en) * | 1997-09-24 | 2001-11-22 | Paul Mertens | Method and apparatus for removing a liquid from a surface of a rotating substrate |
| CN1761038A (en) * | 2004-10-14 | 2006-04-19 | 宋国隆 | Method for etching wafer accurately |
| CN1833314A (en) * | 2003-08-07 | 2006-09-13 | 株式会社荏原制作所 | Substrate processing apparatus, substrate processing method, and substrate holding apparatus |
| CN101930184A (en) * | 2005-08-03 | 2010-12-29 | 东京毅力科创株式会社 | Development processing apparatus |
| CN209986481U (en) * | 2019-03-18 | 2020-01-24 | 江苏新智达新能源设备有限公司 | Automatic mounting device for wafer |
-
2021
- 2021-03-31 CN CN202110344474.8A patent/CN112735992B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010042559A1 (en) * | 1997-09-24 | 2001-11-22 | Paul Mertens | Method and apparatus for removing a liquid from a surface of a rotating substrate |
| CN1833314A (en) * | 2003-08-07 | 2006-09-13 | 株式会社荏原制作所 | Substrate processing apparatus, substrate processing method, and substrate holding apparatus |
| CN1761038A (en) * | 2004-10-14 | 2006-04-19 | 宋国隆 | Method for etching wafer accurately |
| CN101930184A (en) * | 2005-08-03 | 2010-12-29 | 东京毅力科创株式会社 | Development processing apparatus |
| CN209986481U (en) * | 2019-03-18 | 2020-01-24 | 江苏新智达新能源设备有限公司 | Automatic mounting device for wafer |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114038939A (en) * | 2021-10-13 | 2022-02-11 | 泰州君之华新能源科技有限公司 | High-efficient etching machine of new forms of energy photovoltaic wafer |
| CN114038939B (en) * | 2021-10-13 | 2022-11-25 | 泰州君之华新能源科技有限公司 | High-efficient etching machine of new forms of energy photovoltaic wafer |
| CN115954262A (en) * | 2022-01-30 | 2023-04-11 | 江苏亚电科技有限公司 | Wafer cleaning method |
| CN115954262B (en) * | 2022-01-30 | 2024-04-02 | 江苏亚电科技股份有限公司 | Wafer cleaning method |
| CN114562874A (en) * | 2022-03-02 | 2022-05-31 | 浙江光特科技有限公司 | Drying treatment device used after wafer cleaning |
| CN114433444A (en) * | 2022-04-11 | 2022-05-06 | 四川上特科技有限公司 | Material containing and transferring device for coating glass powder on wafer |
| CN114999960A (en) * | 2022-06-02 | 2022-09-02 | 智程半导体设备科技(昆山)有限公司 | Single wafer cleaning equipment |
| CN114914182A (en) * | 2022-07-18 | 2022-08-16 | 浙江晶睿电子科技有限公司 | Silicon chip processing device for semiconductor packaging processing |
| CN115121515A (en) * | 2022-08-30 | 2022-09-30 | 智程半导体设备科技(昆山)有限公司 | Brush piece formula wafer cleaning machine swing arm mechanism |
| CN115121515B (en) * | 2022-08-30 | 2022-12-16 | 智程半导体设备科技(昆山)有限公司 | Brush piece formula wafer cleaning machine swing arm mechanism |
| CN117276142A (en) * | 2023-11-15 | 2023-12-22 | 拓思精工科技(苏州)有限公司 | Double-sided brushing device for wafer processing |
| CN117276142B (en) * | 2023-11-15 | 2024-02-09 | 拓思精工科技(苏州)有限公司 | Double-sided brushing device for wafer processing |
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Effective date of registration: 20220801 Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 210000 room 605-7, Tongxi building, 1347 Shuanglong Avenue, Jiangning District, Nanjing City, Jiangsu Province (Jiangning Development Zone) Patentee before: Yadian Technology Nanjing Co.,Ltd. Patentee before: Jiangsu Yadian Technology Co.,Ltd. |
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Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee before: Jiangsu Yadian Technology Co.,Ltd. |