CN114999960A - Single wafer cleaning equipment - Google Patents
Single wafer cleaning equipment Download PDFInfo
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- CN114999960A CN114999960A CN202210624026.8A CN202210624026A CN114999960A CN 114999960 A CN114999960 A CN 114999960A CN 202210624026 A CN202210624026 A CN 202210624026A CN 114999960 A CN114999960 A CN 114999960A
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- cleaning
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- single wafer
- water guide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a single wafer cleaning device, which relates to the technical field of wafer cleaning, and comprises a single wafer, a cleaning mechanism connected with an actuating mechanism and a matching positioning mechanism, wherein the actuating mechanism comprises an inner spline shaft fixedly connected with an output shaft of an actuating motor, the inner spline shaft is matched with a spline of an outer spline barrel, the outer spline barrel slides along the axial direction of the inner spline shaft, the outer spline barrel is in spline fit with an actuating gear I, an actuating gear II is fixedly arranged on the outer spline barrel, the actuating gear II is matched with the matching positioning mechanism, the upper surface of the single wafer is cleaned and dried in a dead-angle-free rotating mode through the actuating gear II driving matching positioning mechanism, and the single wafer is positioned; the first execution gear is connected with the cleaning mechanism, and the cleaning mechanism is used for supporting different positions of the single wafer and cleaning and drying the lower surface of the single wafer without dead angles.
Description
Technical Field
The invention relates to the technical field of wafer cleaning, in particular to single wafer cleaning equipment.
Background
With the competition of each country in the semiconductor field, the semiconductor industry has been developed and perfected, especially in the wafer processing field. As a cleaning process throughout the whole wafer process, the cleaning effect of the wafer directly affects the quality of the final wafer product, and is a very important part of the wafer process. The wafer cleaning process is a wafer processing process for removing organic matters, metal ions, particle ash layers and the like remained on the surface of a wafer after other processing processes. The cleaning equipment in the market is roughly divided into a single-chip type cleaning machine and a groove type cleaning machine. The groove type cleaning machine has higher cleaning speed, but the pollution among wafers is easy to occur in the cleaning process, so that the single-chip type cleaning machine has better cleaning effect than the groove type cleaning machine.
In the single-chip wet method equipment, a large amount of developing solution or chemicals are often used for developing, cleaning and other process actions on a wafer, and a large amount of liquid can be left on the back of the wafer along the side wall, so that the back is contaminated or enters a vacuum system along a sucking disc, a vacuum pipeline is damaged by a motor and other parts, or the back of the wafer has special pattern defects due to inflow of cleaning solution, and the yield of the wafer is influenced.
The utility model discloses a chinese utility model patent that publication is CN211980560U discloses a be used for abluent cover that sprays of monolithic wafer, including circular roof, circular roof outer lane downwardly extending has annular dustcoat, circular roof's the centre of a circle and the mid point department of outer lane line are connected with vaporific nozzle, vaporific nozzle has 4 and is annular evenly distributed, be equipped with first direct current nozzle between the centre of a circle of centre of a circle roof and the vaporific nozzle, first direct current nozzle slope sets up and the centre of a circle of its column rivers through the wafer of below, annular dustcoat inboard evenly is equipped with a plurality of second direct current nozzle, the outer side limit of spun column rivers process wafer in the second direct current nozzle, the centre of a circle department of circular roof upper surface and the output shaft of motor, the output shaft of fixed plate and lift cylinder is passed through to the bottom of motor. The first direct current nozzle is added, the circle center is obliquely washed, deionized water cannot be accumulated, the plurality of nozzles are uniformly distributed on the spraying cover, but the full-automatic all-directional washing and drying of the wafer cannot be realized, so that the single wafer washing equipment is provided.
Disclosure of Invention
The invention provides a single wafer cleaning device aiming at the defects in the prior art, and solves the problem that the full-automatic all-directional cleaning and drying of wafers cannot be realized in the prior art.
A single wafer cleaning device comprises a single wafer, a cleaning mechanism and a matching positioning mechanism, wherein the cleaning mechanism and the matching positioning mechanism are connected with an executing mechanism, the executing mechanism comprises an inner spline shaft fixedly connected with an output shaft of an executing motor, the inner spline shaft is matched with a spline of an outer spline barrel, the outer spline barrel slides along the axial direction of the inner spline shaft, the outer spline barrel is in spline matching with an executing gear I, an executing gear II is fixedly installed on the outer spline barrel, the executing gear II is matched with the matching positioning mechanism, the matching positioning mechanism is driven by the executing gear II to perform dead-angle-free rotary cleaning and drying on the upper surface of the single wafer, and the single wafer is positioned; the first execution gear is connected with the cleaning mechanism, and the cleaning mechanism is used for supporting different positions of the single wafer and cleaning and drying the lower surface of the single wafer without dead angles.
Furthermore, the cleaning mechanism comprises a cleaning outer gear ring which is meshed with the execution gear I, the cleaning outer gear ring is coaxially and fixedly connected with the outer cam, the outer cam is coaxially and fixedly connected with the inner cam, a gap communicated with the recovery bottom cylinder is arranged between the outer cam and the inner cam, and the recovery bottom cylinder is fixedly connected with the cleaning cylinder.
Furthermore, concave-convex surfaces are arranged on the outer cam and the inner cam, the concave-convex surfaces of the outer cam and the inner cam are respectively contacted with the first ends of the plurality of sliding water guide rods, each sliding water guide rod is respectively and slidably mounted in one cleaning sleeve, the cleaning sleeves and the sliding water guide rods are of hollow structures, the axial directions of the cleaning sleeves and the sliding water guide rods are consistent with the gravity direction, all the cleaning sleeves are communicated with a first water pump through a hollow water supply frame, and the first water pump is connected with a first cleaning liquid tank and a second cleaning liquid tank.
Furthermore, each sliding water guide rod is provided with a nozzle and a water guide port, the nozzle is located at the top end of the sliding water guide rod, when the first end of the sliding water guide rod is in contact with the highest horizontal section of the concave-convex surface of the outer cam or the inner cam, the water guide port is located above the cleaning sleeve, the cleaning sleeve is not communicated with the water guide port, when the sliding water guide rod slides on the cleaning sleeve, and the water guide port is completely located in the cleaning sleeve, the cleaning sleeve is communicated with the water guide port, and cleaning liquid is transmitted to the sliding water guide rod through the hollow water supply frame and the water guide port and is sprayed out through the nozzle.
Furthermore, the highest horizontal sections of the concave-convex surfaces of the inner cam and the outer cam are arranged in a plurality of numbers, the highest horizontal sections of all the outer cams and the inner cam are positioned on the same horizontal plane, all the sliding water guide rods are in contact with the highest horizontal section of the concave-convex surfaces of the outer cam or the inner cam in the initial position, the cleaning mechanism further comprises a drying assembly installed above the water pump I, the drying assembly is fixedly connected with the cleaning barrel, and the inner wall of the cleaning barrel is provided with materials made of anti-splashing materials.
Further, fixed mounting has the deflector on the wash bowl, be provided with outer spout, central spout on the deflector, outer spout, central spout are provided with two sets ofly and symmetric distribution in annular spout both sides, and outer spout, the central spout of annular spout both sides all communicate with annular spout, and outer spout, the central spout of every group are connected with a set of linkage subassembly respectively.
Further, the linkage assembly comprises an electromagnet four which is slidably mounted in an outer chute, two outer chutes and an electromagnet four are arranged in each linkage assembly, the electromagnet four is fixedly mounted on a semi-ring sliding seat, a positioning sliding rod is slidably mounted in the semi-ring sliding seat and is in sliding connection with the electromagnet four, the positioning sliding rod is in sliding connection with a central chute, the semi-ring sliding seat is coaxially and fixedly mounted with a matching semi-cylinder, matching semi-teeth are fixedly mounted on the matching semi-cylinder, and when the matching semi-cylinders in the two groups of linkage assemblies are attached, the two matching semi-teeth form a complete gear.
Further, a positioning plate is fixedly mounted on the positioning sliding rod, a first electromagnet is arranged on the positioning sliding rod, a second electromagnet is fixedly mounted at each of two ends of the lower surface of the guide plate, a third electromagnet is further arranged on the guide plate, the third electromagnet is located at the joint of the annular sliding groove and the outer sliding groove, and when the two matched half teeth form a complete gear, the positioning plate is positioned inside the cleaning barrel and attached to the side face of the single wafer to position the single wafer.
Further, the symmetry is provided with two annular guide slots on the wash bowl, every sliding mounting has two interior arc slider in the annular guide slot, and arc slider passes through a spring and wash bowl fixed connection in every, and fixed mounting has an oblique push pedal on the arc slider in every, is provided with the breach on the arc slider in every, and when the locating plate was in the inside side laminating with the monolithic wafer of wash bowl, two interior arc sliders in every annular guide slot keep laminating under the elastic action of spring, and the breach and the laminating of location slide bar on two interior arc sliders this moment make and retrieve the inside airtight formation of end section of thick bamboo.
Furthermore, a material box and a flow guide pipe are respectively arranged on each half matched cylinder, the flow guide pipe is positioned inside each half matched cylinder, and each half matched cylinder is provided with a linkage electromagnet.
Compared with the prior art, the invention has the beneficial effects that: (1) the lower surface of the wafer is supported by the cleaning mechanism, so that the lower surface of the wafer is cleaned in all directions, and the cleaning pollution is thorough; (2) the invention adopts the matching positioning mechanism to match with the cleaning mechanism to carry out omnibearing rotary cleaning on the upper surface of the wafer, so that the cleaning is more comprehensive; the steps of cleaning and drying are completed in the cleaning barrel, so that secondary pollution of the wafer caused by multiple processes is avoided, and the yield of the wafer is improved; (3) according to the invention, the wafer in the cleaning cylinder is positioned by arranging the matching positioning mechanism, so that the wafer is prevented from being deviated in the cleaning process to cause fragment breakage.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
FIG. 2 is a partial structural view of the actuator and the cleaning mechanism of the present invention.
FIG. 3 is a partial structural view of the cleaning mechanism of the present invention.
FIG. 4 is another perspective partial structure diagram of the cleaning mechanism of the present invention.
FIG. 5 is a schematic view of a partial structure of the cleaning mechanism and the positioning mechanism of the present invention.
FIG. 6 is a schematic view of a partial structure of the positioning mechanism of the present invention.
FIG. 7 is a schematic view of another angle partial structure of the positioning mechanism of the present invention.
FIG. 8 is a partial sectional structural view of the positioning mechanism of the present invention.
Reference numerals: 1-an actuator; 2-a cleaning mechanism; 3-matching a positioning mechanism; 4-single wafer; 101-an actuator motor; 102-a female spline shaft; 103-executing gear one; 104-an execution cylinder; 105-an externally splined barrel; 106-an execution collar; 107-executing gear two; 201-recovery bottom cylinder; 202-cleaning cylinder; 203-cleaning the outer gear ring; 204-an outer cam; 205-an inner cam; 206-cleaning liquid tank I; 207-cleaning liquid box II; 208-a first water pump; 209-cleaning the sleeve; 210-sliding water guide rod; 211-water guiding opening; 212-a nozzle; 213-hollow water supply rack; 214-a gas lance; 215-hollow drying rack; 216-gas box; 217-sliding seat; 301-a guide plate; 302-outer chute; 303-an annular chute; 304-electromagnet three; 305-a central chute; 306-electromagnet II; 307-mating half teeth; 308-a half-ring slide; 309-electromagnet four; 310-positioning the sliding bar; 311-a positioning plate; 312-a ganged electromagnet; 313-mating half cartridge; 314-a draft tube; 315-bin; 316-oblique push plate; 317-inner arc slide block; 318-a spring; 319-circular guide groove.
Detailed Description
In the following description of the present invention, it is to be noted that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the following description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; the connection may be direct or indirect via an intermediate medium, and the connection may be internal to the two components. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The invention will be further described with reference to the drawings and illustrative embodiments, which are provided herein to illustrate and not to limit the invention. In addition, if a detailed description of the known art is not necessary to show the features of the present invention, it is omitted.
Example (b): referring to fig. 1-8, a single wafer cleaning apparatus includes a single wafer 4, a cleaning mechanism 2 connected to an actuator 1, and a matching positioning mechanism 3, where the actuator 1 includes an internal spline shaft 102 fixedly connected to an output shaft of an actuator 101, the actuator 101 is fixedly mounted on a platform, the internal spline shaft 102 is spline-fitted to an external spline barrel 105, the external spline barrel 105 slides along an axial direction of the internal spline shaft 102, the external spline barrel 105 is spline-fitted to an actuator gear one 103, the actuator gear one 103 is rotatably mounted on a sliding seat 217, the sliding seat 217 is fixedly mounted on a recovery bottom barrel 201, the external spline barrel 105 is fixedly mounted with an actuator collar 106, the actuator collar 106 is fixedly connected to a piston rod of the actuator cylinder 104, the actuator cylinder 104 is fixedly mounted on the actuator gear one 103, the external spline barrel 105 is fixedly mounted with an actuator gear two 107, the actuator gear two 107 is matched with the matching positioning mechanism 3, the second execution gear 107 drives the positioning mechanism 3 to perform dead-angle-free rotary cleaning and drying on the upper surface of the single wafer 4, and the single wafer 4 is positioned; the first execution gear 103 is connected with the cleaning mechanism 2, and the cleaning mechanism 2 is used for supporting different positions of the single wafer 4 and cleaning and drying the lower surface of the single wafer 4 without dead angles.
The cleaning mechanism 2 comprises a cleaning outer gear ring 203 which is meshed with the execution gear I103, the cleaning outer gear ring 203 is rotatably installed on a recovery bottom cylinder 201, the recovery bottom cylinder 201 is fixedly installed on a platform, a water outlet is formed in the recovery bottom cylinder 201, a gap communicated with the interior of the recovery bottom cylinder 201 is formed in the recovery bottom cylinder 201 and the cleaning outer gear ring 203, liquid falling on the inner wall of the cleaning outer gear ring 203 and the recovery bottom cylinder 201 can flow to the bottom of the recovery bottom cylinder 201, the cleaning outer gear ring 203 is fixedly connected with an outer cam 204 in a coaxial mode, the outer cam 204 is fixedly connected with an inner cam 205 in a coaxial mode, a gap communicated with the recovery bottom cylinder 201 is formed between the outer cam 204 and the inner cam 205, and the recovery bottom cylinder 201 is fixedly connected with the cleaning cylinder 202.
The outer cam 204 and the inner cam 205 are provided with concave-convex surfaces, the concave-convex surfaces of the outer cam 204 and the inner cam 205 are respectively contacted with first ends of a plurality of sliding water guide rods 210, each sliding water guide rod 210 is respectively and slidably mounted in a cleaning sleeve 209, the cleaning sleeves 209 and the sliding water guide rods 210 are of a hollow structure, the cleaning sleeves 209 and the sliding water guide rods 210 are consistent in axial direction and gravity direction, the cleaning sleeves 209 are fixedly mounted on a hollow water supply frame 213, the hollow water supply frame 213 is internally of a hollow structure, the hollow water supply frame 213 is fixedly connected with a water pump one 208, all the cleaning sleeves 209 are communicated with a water pump one 208 through the hollow water supply frame 213, a pipeline is arranged on the water pump one 208, the water pump one 208 is connected with a cleaning solution tank one 206 and a cleaning solution tank two 207 through the pipeline, and the cleaning solution tank one 206 and the cleaning solution tank two 207 are fixedly mounted at the bottom of the recovery bottom cylinder 201.
Each sliding water guide rod 210 is provided with a nozzle 212 and a water guide port 211, the nozzle 212 is located at the top end of the sliding water guide rod 210, when the first end of the sliding water guide rod 210 is in contact with the highest horizontal section of the concave-convex surface of the outer cam 204 or the inner cam 205, the water guide port 211 is located above the cleaning sleeve 209, the cleaning sleeve 209 is not communicated with the water guide port 211, when the sliding water guide rod 210 slides on the cleaning sleeve 209, and the water guide port 211 is completely located in the cleaning sleeve 209, the cleaning sleeve 209 is communicated with the water guide port 211, and cleaning liquid is transmitted to the sliding water guide rod 210 through the hollow water supply frame 213 and the water guide port 211 and is sprayed out through the nozzle 212.
The highest horizontal segment of the concave-convex surface of the inner cam 205 and the outer cam 204 is provided with a plurality of horizontal segments, the highest horizontal segments of all the outer cams 204 and the inner cam 205 are positioned on the same horizontal plane, in the initial position, all the sliding water guide rods 210 are in contact with the highest horizontal segment of the concave-convex surface of the outer cam 204 or the inner cam 205, the cleaning mechanism 2 further comprises a drying assembly arranged above the first water pump 208, the drying assembly is fixedly connected with the cleaning barrel 202, and the inner wall of the cleaning barrel 202 is provided with a material made of a splash-proof material.
The drying component comprises a hollow drying rack 215 fixedly mounted on the inner wall of the cleaning barrel 202, the hollow drying rack 215 is of a hollow structure, a plurality of air injection pipes 214 are arranged on the hollow drying rack 215, the air injection pipes 214 are communicated with an air box 216 through the hollow drying rack 215, and the air box 216 is fixedly mounted on the hollow drying rack 215.
Fixed mounting has deflector 301 on the wash bowl 202, is provided with outer spout 302, central spout 305 on deflector 301, and outer spout 302, central spout 305 are provided with two sets ofly and symmetric distribution in annular spout 303 both sides, and outer spout 302, the central spout 305 of annular spout 303 both sides all communicate with annular spout 303, and outer spout 302, the central spout 305 of every group are connected with a set of linkage subassembly respectively.
The linkage assembly comprises four electromagnets 309 which are slidably mounted in the outer sliding grooves 302, two outer sliding grooves 302 and four electromagnets 309 are arranged in each linkage assembly, the four electromagnets 309 are fixedly mounted on a half-ring sliding seat 308, a positioning sliding rod 310 is slidably mounted in the half-ring sliding seat 308, the positioning sliding rod 310 is slidably connected with the four electromagnets 309, the positioning sliding rod 310 is slidably connected with a central sliding groove 305, the half-ring sliding seat 308 and a matching half cylinder 313 are coaxially and fixedly mounted, matching half teeth 307 are fixedly mounted on the matching half cylinder 313, and when the matching half cylinders 313 in the two groups of linkage assemblies are attached, the two matching half teeth 307 form a complete gear.
The positioning plate 311 is fixedly installed on the positioning sliding rod 310, the first electromagnet is arranged on the positioning sliding rod 310, the second electromagnet 306 is fixedly installed at each of two ends of the lower surface of the guide plate 301, the third electromagnet 304 is further arranged on the guide plate 301 and is located at the joint of the annular sliding groove 303 and the outer sliding groove 302, and when the two matched half teeth 307 form a complete gear, the positioning plate 311 is located inside the cleaning barrel 202 and attached to the side face of the single wafer 4 to position the single wafer 4.
Two annular guide grooves 319 are symmetrically arranged on the cleaning barrel 202, two inner arc-shaped sliding blocks 317 are arranged in each annular guide groove 319 in a sliding mode, each inner arc-shaped sliding block 317 is fixedly connected with the cleaning barrel 202 through a spring 318, an inclined push plate 316 is fixedly arranged on each inner arc-shaped sliding block 317, a notch is formed in each inner arc-shaped sliding block 317, when the positioning plate 311 is located inside the cleaning barrel 202 and is attached to the side face of a single wafer 4, the two inner arc-shaped sliding blocks 317 in each annular guide groove 319 are kept attached under the elastic force action of the spring 318, the notches in the two inner arc-shaped sliding blocks 317 are attached to the positioning sliding rod 310, and the inside of the recovery bottom barrel 201 is closed.
Each half matching cylinder 313 is provided with a material box 315 and a flow guide pipe 314 respectively, the flow guide pipe 314 is positioned inside the half matching cylinder 313, each half matching cylinder 313 is provided with a linkage electromagnet 312, one material box 315 is provided with cleaning liquid, the other material box 315 is provided with nitrogen, and the top of the half matching cylinder 313 is provided with an exhaust hole.
The working principle of the invention is as follows: at the initial position, two sets of linkage mechanisms are respectively arranged at two ends of the guide plate 301, at this time, the cleaning cylinder 202 is in an open state, an uncleaned single wafer 4 is placed on the sliding water guide rod 210 in the cleaning cylinder 202 through a sucker, the linkage electromagnets 312 on the two matching half cylinders 313 are electrified, the two matching half cylinders 313 are attracted through the magnetic force of the linkage electromagnets 312 and move synchronously towards the cleaning cylinder 202, the matching half cylinders 313 drive the electromagnets 309 to slide in the outer sliding grooves 302, the positioning sliding rods 310 are driven to slide in the central sliding grooves 305, the positioning sliding rods 310 drive the positioning plates 311 to move, each positioning plate 311 is respectively contacted with the two inclined push plates 316, the inclined push plates 316 are pushed to drive the inner arc-shaped slide blocks 317 to slide on the annular guide grooves 319, then the positioning plates 311 pass through the annular guide grooves 319 and enter the cleaning cylinder 202, at this time, the two inner arc-shaped slide blocks 317 in each annular guide groove 319 are kept attached under the elastic force of the springs 318, at the moment, the notches on the two inner arc-shaped sliding blocks 317 are attached to the positioning sliding rod 310, when the two matching half cylinders 313 are attached, the two matching half teeth 307 form a complete gear, so that the matching half cylinders 313 and the inside of the cleaning cylinder 202 form a seal, the four electromagnets 309 are arranged in the annular sliding groove 303, the two positioning plates 311 are arranged inside the cleaning cylinder 202 and attached to the side surfaces of the single wafers 4, the single wafers 4 are positioned, and the single wafers 4 are prevented from being deviated left and right in the cleaning process.
The starting external spline barrel 105 extends out of the piston rod to push the external spline barrel 105 to ascend, so that the second execution gear 107 is driven to move, the second execution gear 107 is in contact engagement with the matching half-tooth 307, the starting execution motor 101 drives the internal spline shaft 102 to rotate, and the internal spline shaft 102 drives the external spline barrel 105 to rotate, so that the first execution gear 103 and the second execution gear 107 are driven to rotate.
When the single wafer 4 needs to be cleaned, the first water pump 208 is started to pump cleaning liquid in the first cleaning liquid tank 206 or the second cleaning liquid tank 207 and transfer the cleaning liquid to the hollow water supply frame 213, the cleaning liquid is transferred to the plurality of cleaning sleeves 209 through the hollow water supply frame 213, the first execution gear 103 rotates to drive the cleaning outer gear ring 203 to rotate, the outer cam 204 and the inner cam 205 are driven to rotate, the sliding water guide rod 210 in contact with the outer cam 204 and the inner cam 205 is driven to slide on the cleaning sleeve 209, when the sliding water guide rod 210 in contact with the outer cam 204 slides on the cleaning sleeve 209, the sliding water guide rod 210 in contact with the inner cam 205 is positioned on the highest horizontal section of the concave-convex surface of the inner cam 205, the sliding water guide rod 210 in contact with the inner cam 205 is kept still in the vertical direction to support the single wafer 4, and when the sliding water guide rod 210 in contact with the inner cam 205 slides on the cleaning sleeve 209, the sliding water guide rod 210 in contact with the outer cam 204 is positioned on the highest horizontal section of the concave-convex surface of the outer cam 204, so that the sliding water guide rod 210 in contact with the outer cam 204 is kept still in the vertical direction to support the single wafers 4, and the single wafers 4 are alternately supported; when the sliding water guide rod 210 in contact with the outer cam 204 supports the single wafer 4, the sliding water guide rod 210 which is positioned on the inner cam 205 and does not have a supporting function vertically slides downwards along the cleaning sleeve 209, when the water guide port 211 on the sliding water guide rod 210 is completely positioned in the cleaning sleeve 209, the cleaning sleeve 209 is communicated with the water guide port 211, the cleaning liquid in the cleaning sleeve 209 is transferred to the nozzles 212 through the water guide port 211, the cleaning liquid is sprayed to the lower surface of the single wafer 4 through the nozzles 212, the spraying angle of each nozzle 212 is adjusted according to the radial distance from the sliding water guide rod 210 to the circle center of the single wafer 4, so that the lower surface of the single wafer 4 is completely cleaned, when the sliding water guide rod 210 in contact with the inner cam 205 supports the single wafer 4, in principle, the cleaning liquid is sprayed to the single wafer 4 through the nozzles 212 on the sliding water guide rod 210 which is positioned on the outer cam 204 and does not have a supporting function, the cleaning liquid is alternately sprayed to clean the lower surface of the single wafer 4 in all directions.
The two material boxes 315 are respectively provided with a second water pump and a second air pump, the second water pump is started to pump cleaning liquid in one material box 315 to be transferred to the flow guide pipe 314, the second execution gear 107 rotates to drive the matching half-tooth 307 to rotate and drive the matching half-cylinder 313 to rotate, the fourth electromagnet 309 is driven to rotate in the annular sliding groove 303, so that the cleaning liquid in the flow guide pipe 314 is sprayed out in a rotating mode and is uniformly sprayed on the upper surface of the single wafer 4 to clean the upper surface of the single wafer 4, a gap is reserved between the single wafer 4 and the cleaning cylinder 202, the cleaning liquid flows to the recovery bottom cylinder 201 through the gap between the single wafer 4 and the cleaning cylinder 202, and the cleaning liquid is recovered through a water outlet at the bottom of the recovery bottom cylinder 201.
When the single wafer 4 needs to be dried, the first water pump 208 and the second water pump stop working, the first water pump 208 stops supplying water to the sliding water guide rod 210, the sliding water guide rod 210 still has an alternate supporting effect, the first air pump is arranged on the air tank 216, nitrogen in the air tank 216 is pumped by the first air pump on the air tank 216, the nitrogen is conveyed into the plurality of air injection pipes 214 through the hollow drying rack 215, the lower surface of the single wafer 4 is subjected to all-dimensional air injection drying under the alternate supporting effect of the sliding water guide rod 210, and meanwhile, the second air pump is started to pump nitrogen in another material tank 315 to carry out rotary blowing drying on the upper surface of the single wafer 4.
When the single wafer 4 is dried, the execution motor 101 stops working, the execution cylinder 104 retracts the piston rod to drive the outer spline cylinder 105 and the execution gear two 107 to vertically move downwards, so that the execution gear two 107 is not contacted with the matching half-tooth 307, the linkage electromagnet 312 in the matching half-cylinder 313 is powered off, the electromagnet four 309 and the electromagnet three 304 are powered on, the electromagnet four 309 is driven to slide in the annular sliding groove 303 until the electromagnet four 309 is contacted with the electromagnet three 304, then the electromagnet four 309 and the electromagnet three 304 are powered off, the electromagnet one and the electromagnet two 306 on the positioning sliding rod 310 are powered on, the positioning sliding rod 310 drives the matching half-cylinder 313 to slide towards the electromagnet two 306, the electromagnet four 309 is driven to slide in the outer sliding groove 302, and the matching half-cylinder 313 returns to the initial position again.
In the process that the positioning sliding rod 310 slides towards the second electromagnet 306, the arc surface on the positioning plate 311 is driven to contact with the arc surface on the inner arc-shaped sliding block 317, the two inner arc-shaped sliding blocks 317 are pushed to slide towards two sides on the annular guide groove 319, so that the positioning plate 311 moves to the outside of the cleaning cylinder 202, and then the single wafer 4 in the cleaning cylinder 202 is taken out through the clean sucker.
It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and all such modifications and substitutions are intended to be included within the scope of the present invention as defined in the appended claims.
Claims (10)
1. A single wafer cleaning apparatus includes a single wafer (4), characterized in that: the cleaning mechanism (2) and the matching positioning mechanism (3) are connected with the executing mechanism (1), the executing mechanism (1) comprises an inner spline shaft (102) fixedly connected with an output shaft of an executing motor (101), the inner spline shaft (102) is in spline fit with an outer spline cylinder (105), the outer spline cylinder (105) slides along the axial direction of the inner spline shaft (102), the outer spline cylinder (105) is in spline fit with a first executing gear (103), a second executing gear (107) is fixedly installed on the outer spline cylinder (105), the second executing gear (107) is matched with the matching positioning mechanism (3), and the second executing gear (107) drives the matching positioning mechanism (3) to carry out dead-angle-free rotary cleaning and drying on the upper surface of the single wafer (4) and position the single wafer (4); the first execution gear (103) is connected with the cleaning mechanism (2), and the cleaning mechanism (2) is used for supporting different positions of the single wafer (4) and cleaning and drying the lower surface of the single wafer (4) in a dead angle-free manner.
2. The single wafer cleaning apparatus of claim 1, wherein: the cleaning mechanism (2) comprises a cleaning outer gear ring (203) which is meshed with the execution gear I (103), the cleaning outer gear ring (203) is fixedly connected with an outer cam (204) coaxially, the outer cam (204) is fixedly connected with an inner cam (205) coaxially, a gap communicated with the recycling bottom cylinder (201) is formed between the outer cam (204) and the inner cam (205), and the recycling bottom cylinder (201) is fixedly connected with the cleaning cylinder (202).
3. The single wafer cleaning apparatus as recited in claim 2, wherein: concave-convex surfaces are arranged on the outer cam (204) and the inner cam (205), the concave-convex surfaces of the outer cam (204) and the inner cam (205) are respectively contacted with first ends of a plurality of sliding water guide rods (210), each sliding water guide rod (210) is respectively installed in a cleaning sleeve (209) in a sliding mode, the cleaning sleeves (209) and the sliding water guide rods (210) are of hollow structures, the axial directions of the cleaning sleeves (209) and the sliding water guide rods (210) are consistent with the gravity direction, all the cleaning sleeves (209) are communicated with a first water pump (208) through a hollow water supply frame (213), and the first water pump (208) is connected with a first cleaning liquid tank (206) and a second cleaning liquid tank (207).
4. A single wafer cleaning apparatus as claimed in claim 3, wherein: each sliding water guide rod (210) is provided with a nozzle (212) and a water guide port (211), the nozzle (212) is located at the top end of the sliding water guide rod (210), when the first end of the sliding water guide rod (210) is in contact with the highest horizontal section of the concave-convex surface of the outer cam (204) or the inner cam (205), the water guide port (211) is located above the cleaning sleeve (209), the cleaning sleeve (209) is not communicated with the water guide port (211), when the sliding water guide rod (210) slides on the cleaning sleeve (209), and the water guide port (211) is completely located in the cleaning sleeve (209), the cleaning sleeve (209) is communicated with the water guide port (211), and cleaning liquid is transmitted into the sliding water guide rod (210) through the hollow water supply frame (213) and the water guide port (211) and is sprayed out through the nozzle (212).
5. The single wafer cleaning apparatus as recited in claim 4, wherein: the washing mechanism is characterized in that the highest horizontal sections of the concave-convex surfaces of the inner cam (205) and the outer cam (204) are arranged in a plurality of numbers, the highest horizontal sections of all the outer cam (204) and the inner cam (205) are located on the same horizontal plane, all the sliding water guide rods (210) are in contact with the highest horizontal sections of the concave-convex surfaces of the outer cam (204) or the inner cam (205) in the initial position, the washing mechanism (2) further comprises a drying assembly installed above the first water pump (208), the drying assembly is fixedly connected with the washing cylinder (202), and materials made of anti-splashing materials are arranged on the inner wall of the washing cylinder (202).
6. The single wafer cleaning apparatus as claimed in claim 5, wherein: fixed mounting has deflector (301) on wash bowl (202), be provided with outer spout (302), central spout (305) on deflector (301), outer spout (302), central spout (305) are provided with two sets ofly and symmetric distribution in annular spout (303) both sides, and outer spout (302), central spout (305) of annular spout (303) both sides all communicate with annular spout (303), and outer spout (302), central spout (305) of every group are connected with a set of linkage subassembly respectively.
7. The single wafer cleaning apparatus as claimed in claim 6, wherein: the linkage assembly comprises four electromagnets (309) which are slidably mounted in the outer sliding grooves (302), two outer sliding grooves (302) and four electromagnets (309) are arranged in each linkage assembly, the four electromagnets (309) are fixedly mounted on a semi-ring sliding seat (308), a positioning sliding rod (310) is slidably mounted in the semi-ring sliding seat (308), the positioning sliding rod (310) is slidably connected with the four electromagnets (309), the positioning sliding rod (310) is slidably connected with a central sliding groove (305), the semi-ring sliding seat (308) and a matching semi-cylinder (313) are coaxially and fixedly mounted, matching semi-teeth (307) are fixedly mounted on the matching semi-cylinder (313), and when the matching semi-cylinders (313) in the two groups of linkage assemblies are attached, the two matching semi-teeth (307) form a complete gear.
8. The single wafer cleaning apparatus as claimed in claim 7, wherein: fixed mounting has locating plate (311) on location slide bar (310), be provided with electro-magnet one on location slide bar (310), the both ends of the lower surface of deflector (301) are fixed mounting respectively and are had an electro-magnet two (306), still are provided with electro-magnet three (304) on deflector (301), electro-magnet three (304) are located the junction of annular spout (303) and outer spout (302), and when two cooperation half teeth (307) formed a complete gear, locating plate (311) are in the inside side laminating with monolithic wafer (4) of wash bowl (202), fix a position monolithic wafer (4).
9. The single wafer cleaning apparatus of claim 8, wherein: the cleaning barrel (202) is symmetrically provided with two annular guide grooves (319), each annular guide groove (319) is internally and slidably provided with two inner arc-shaped sliding blocks (317), each inner arc-shaped sliding block (317) is fixedly connected with the cleaning barrel (202) through one spring (318), each inner arc-shaped sliding block (317) is fixedly provided with one inclined push plate (316), each inner arc-shaped sliding block (317) is provided with a notch, when the positioning plate (311) is positioned inside the cleaning barrel (202) and is attached to the side face of the single wafer (4), the two inner arc-shaped sliding blocks (317) in each annular guide groove (319) are kept attached under the elastic force action of the spring (318), and at the moment, the notches on the two inner arc-shaped sliding blocks (317) are attached to the positioning sliding rod (310), so that the inside of the recovery bottom barrel (201) is sealed.
10. The single wafer cleaning apparatus as claimed in claim 7, wherein: each half barrel of cooperation (313) is last to be provided with workbin (315), honeycomb duct (314) respectively, and honeycomb duct (314) are in half barrel of cooperation (313) inside, every all be provided with linkage electro-magnet (312) on half barrel of cooperation (313).
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| CN202210624026.8A CN114999960B (en) | 2022-06-02 | 2022-06-02 | Single wafer cleaning equipment |
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| CN113097121A (en) * | 2021-03-30 | 2021-07-09 | 上海华力微电子有限公司 | Wafer cleaning device and cleaning method |
| CN214022286U (en) * | 2020-10-28 | 2021-08-24 | 晶智(上海)光学仪器设备有限公司 | Cleaning device for quartz wafer production |
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| JPH11307508A (en) * | 1998-04-22 | 1999-11-05 | Rohm Co Ltd | Washing/drying device of semiconductor wafer |
| CN107413690A (en) * | 2017-06-15 | 2017-12-01 | 江苏吉星新材料有限公司 | A kind of Sapphire wafer surface cleaning device and method for different roughness and size |
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Address after: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Applicant before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd. |
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