CN214022286U - Cleaning device for quartz wafer production - Google Patents
Cleaning device for quartz wafer production Download PDFInfo
- Publication number
- CN214022286U CN214022286U CN202022425495.6U CN202022425495U CN214022286U CN 214022286 U CN214022286 U CN 214022286U CN 202022425495 U CN202022425495 U CN 202022425495U CN 214022286 U CN214022286 U CN 214022286U
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- CN
- China
- Prior art keywords
- cotton
- wafer
- cleaning
- quartz wafer
- quartz
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 80
- 239000010453 quartz Substances 0.000 title claims abstract description 67
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 229920000742 Cotton Polymers 0.000 claims abstract description 64
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 230000006835 compression Effects 0.000 claims abstract description 14
- 238000007906 compression Methods 0.000 claims abstract description 14
- 238000009434 installation Methods 0.000 claims abstract description 14
- 238000005406 washing Methods 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 239000013078 crystal Substances 0.000 claims description 8
- 238000010030 laminating Methods 0.000 abstract description 10
- 239000000428 dust Substances 0.000 abstract description 4
- 239000012535 impurity Substances 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 62
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The utility model relates to a quartz wafer production technical field discloses a belt cleaning device is used in quartz wafer production, including wafer washing tank and quartz wafer, still include hydraulic pressure lift rotation laminating wiper mechanism, the inner chamber of wafer washing tank is provided with quartz wafer, quartz wafer and the rotatory laminating wiper mechanism swing joint of hydraulic pressure lift, the rotatory laminating wiper mechanism setting of hydraulic pressure lift is at the inner chamber and the top position of wafer washing tank, the rotatory laminating wiper mechanism of hydraulic pressure lift includes hydraulic pump, gear motor, output pivot, installation commentaries on classics board, firm connecting rod, washing cotton mounting panel, compression washing cotton, side ring baffle, places cotton and brace table, the bottom fixed mounting of hydraulic pump has gear motor, gear motor's bottom center through-hole department swing joint has the output pivot. The utility model discloses can not bump under the damaged condition between the quartz wafer to the convenient high-efficient washing of dust and the impurity memorability of its surface get rid of the work.
Description
Technical Field
The utility model relates to a quartz wafer produces technical field, specifically is a belt cleaning device is used in quartz wafer production.
Background
Before the quartz wafers for electronic materials are produced and processed, dust and impurities adhered to the outer surfaces of the quartz wafers need to be effectively removed, the quartz wafers can be generally washed by water, and due to the problem of large number of the quartz wafers, if the quartz wafers are washed one by one, much time is wasted, the production efficiency is reduced, but if the quartz wafers are mixed together for centralized washing, water flow can cause mutual contact friction between the crystals, and the outer surfaces of the side parts of the quartz wafers are abraded.
SUMMERY OF THE UTILITY MODEL
The utility model provides a belt cleaning device is used in quartz wafer production, this belt cleaning device is used in quartz wafer production has solved because quartz wafer's the problem that quantity is big, if carry out abluent many times that can waste one by one, and production efficiency slows down, nevertheless mixes quartz wafer and concentrates abluent together, and rivers probably lead to touching the friction each other between the crystal, cause the problem of wearing and tearing to quartz wafer's lateral part surface.
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a cleaning device for quartz wafer production comprises a wafer cleaning tank, a quartz wafer and a hydraulic lifting rotary laminating cleaning mechanism, wherein the quartz wafer is arranged in an inner cavity of the wafer cleaning tank and movably connected with the hydraulic lifting rotary laminating cleaning mechanism;
the hydraulic lifting rotary joint cleaning mechanism comprises a hydraulic pump, a speed reducing motor, an output rotating shaft, an installation rotating plate, a stable connecting rod, a cleaning cotton installation plate, compressed cleaning cotton, a side ring baffle, placing cotton and a support table;
the bottom fixed mounting of hydraulic pump has gear motor, gear motor's bottom center through-hole department swing joint has the output pivot, the bottom fixed mounting of output pivot has the installation to change the board, the bottom fixed mounting of installation commentaries on classics board has firm connecting rod, the bottom fixed connection of firm connecting rod washs the cotton mounting panel, the bottom fixed mounting who washs the cotton mounting panel has the compression to wash cotton, the lateral part fixed surface who washs the cotton mounting panel installs side limit ring baffle, the compression washs the inboard that the cotton setting was at side limit ring baffle, the cotton is placed to the bottom swing joint that the cotton was washd in the compression, quartz wafer sets up and washs the cotton and place cotton junction in the compression, place cotton fixed mounting at a supporting bench's top.
Preferably, the bottom of the supporting table is fixedly provided with a supporting rod, and the supporting rod is fixedly arranged at the top of the base.
Preferably, a drain pipe is fixedly installed at a hole formed in the bottom of one side of the wafer cleaning tank, and a water pump is fixedly installed on the outer surface of the drain pipe.
Preferably, one side and the bottom of the water pump are respectively and fixedly connected with one side of the wafer cleaning tank and the top of the base.
Preferably, the bottom of the wafer cleaning tank is fixedly connected with the top of the base.
Preferably, two sides of the hydraulic pump are fixedly connected with two sides of the top of the base through the supporting frame.
Borrow by above-mentioned technical scheme, the utility model provides a belt cleaning device is used in quartz chip production. The method at least has the following beneficial effects:
(1) the cleaning device for quartz wafer production uses a hydraulic lifting rotary joint cleaning mechanism, firstly quartz wafers are placed on placing cotton on a supporting platform at intervals, a hydraulic pump is started to push compressed cleaning cotton at the bottom of a cleaning cotton mounting plate to contact and joint with the quartz wafers and the placing cotton, but ensures that the cleaning cotton mounting plate does not touch the quartz wafer to prevent the cleaning cotton mounting plate and the quartz wafer from rubbing, then, a cleaning water source is injected into the wafer cleaning tank to make the water source cover the quartz wafer, the speed reducing motor is started, the output rotating shaft drives the cleaning cotton mounting plate connected with the bottom of the mounting rotating plate through the stable connecting rod to rotate, the compressed cleaning cotton at the bottom rotates along with the placing cotton to wrap the quartz wafer and perform friction cleaning on the quartz wafer, the dust and impurity recording performance on the outer surface of the quartz wafer can be conveniently and efficiently cleaned and removed under the condition that collision and damage between the quartz wafers are avoided.
(2) This belt cleaning device is used in quartz wafer production through the setting of drain pipe and water pump, opens the water pump, gets rid of the quality of change work in order to ensure follow-up cleaning work through the muddy water source in the drain pipe after wasing in to the wafer washing tank.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application:
fig. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1 according to the present invention;
fig. 3 is a schematic perspective view of the joint between the cotton and the quartz wafer in fig. 1 according to the present invention.
In the figure: 1, a wafer cleaning tank, 2 quartz wafers, 3 hydraulic lifting, rotating, laminating and cleaning mechanisms, 31 hydraulic pumps, 32 speed reducing motors, 33 output rotating shafts, 34 installation rotating plates, 35 stable connecting rods, 36 cleaning cotton installation plates, 37 compression cleaning cotton, 38 side ring baffles, 39 cotton placing and 310 supporting tables;
4 bracing pieces, 5 drain pipes, 6 water pumps, 7 bases, 8 support frames.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, the present invention provides a technical solution: a cleaning device for quartz wafer production comprises a wafer cleaning tank 1, a quartz wafer 2 and a hydraulic lifting rotary laminating cleaning mechanism 3, wherein the quartz wafer 2 is arranged in the inner cavity of the wafer cleaning tank 1, the quartz wafer 2 is movably connected with the hydraulic lifting rotary laminating cleaning mechanism 3, and the hydraulic lifting rotary laminating cleaning mechanism 3 is arranged in the inner cavity and the top of the wafer cleaning tank 1;
the hydraulic lifting rotary joint cleaning mechanism 3 comprises a hydraulic pump 31, a speed reducing motor 32, an output rotating shaft 33, an installation rotating plate 34, a stable connecting rod 35, a cleaning cotton installation plate 36, compressed cleaning cotton 37, a side ring baffle 38, placing cotton 39 and a support platform 310;
the bottom fixed mounting of hydraulic pump 31 has gear motor 32, gear motor 32's bottom center through-hole department swing joint has output pivot 33, the bottom fixed mounting of output pivot 33 has installation commentaries on classics board 34, the bottom fixed mounting of installation commentaries on classics board 34 has firm connecting rod 35, the bottom fixed connection of firm connecting rod 35 washs cotton mounting panel 36, the bottom fixed mounting who washs cotton mounting panel 36 has compression washing cotton 37, wash the lateral part external surface fixed mounting of cotton mounting panel 36 has side ring baffle 38, compression washing cotton 37 sets up the inboard at side ring baffle 38, cotton 39 is placed to the bottom swing joint of compression washing cotton 37, quartz wafer 2 sets up in the compression washing cotton 37 and places the junction of cotton 39, place cotton 39 fixed mounting at the top of brace table 310.
The bottom fixed mounting of a supporting bench 310 has the bracing piece 4, and bracing piece 4 fixed mounting is at the top of base 7, and bracing piece 4 uses the top of base 7 as the strong point to support a supporting bench 310.
The water drain pipe 5 is fixedly installed at the position of a hole formed in the bottom of one side of the wafer cleaning tank 1, the water pump 6 is fixedly installed on the outer surface of the water drain pipe 5, the water pump 6 is started, and the quality of the subsequent cleaning work is guaranteed by removing and replacing the turbid water source after cleaning in the wafer cleaning tank 1 through the water drain pipe 5.
One side and the bottom of water pump 6 respectively with one side of wafer washing tank 1 and the top fixed connection of base 7, ensure water pump 6's stability.
The bottom of the wafer cleaning tank 1 is fixedly connected with the top of the base 7, and the top of the base 7 provides a stable placing position for the wafer cleaning tank 1.
The both sides of hydraulic pump 31 are through the top both sides fixed connection of support frame 8 and base 7, and support frame 8 uses the top both sides of base 7 to carry out the fixed stay to hydraulic pump 31 as the support base point.
In use, the quartz wafer 2 is firstly placed on the placing cotton 39 on the supporting platform 310 at intervals, the hydraulic pump 31 is started to push the compressed cleaning cotton 37 at the bottom of the cleaning cotton mounting plate 36 to be contacted and jointed with the quartz wafer 2 and the placing cotton 39, but ensures that the cleaning cotton mounting plate 36 does not touch the quartz wafer 2, so as to prevent the cleaning cotton mounting plate 36 and the quartz wafer 2 from rubbing, then, a cleaning water source is injected into the wafer cleaning tank 1 to make the water source cover the quartz wafer 2, the speed reducing motor 32 is started, the output rotating shaft 33 drives the cleaning cotton mounting plate 36 connected with the bottom of the mounting rotating plate through the stable connecting rod 35 to rotate, the compressed cleaning cotton 37 at the bottom of the quartz crystal plate rotates along with the placing cotton to wrap the quartz crystal plate 2 and perform friction cleaning on the quartz crystal plate, the dust and impurity recording performance on the outer surface of the quartz wafer can be conveniently and efficiently cleaned and removed under the condition that collision and damage between the quartz wafers are avoided.
The above details are provided for the cleaning device for quartz wafer production provided by the present invention. The utility model discloses it is right to have used specific individual example the utility model discloses a principle and implementation have been elucidated, and the explanation of above embodiment is only used for helping understanding the utility model discloses a method and core thought thereof. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.
Claims (6)
1. A cleaning device for quartz wafer production comprises a wafer cleaning tank (1) and a quartz wafer (2), and is characterized in that: the quartz crystal cleaning tank is characterized by further comprising a hydraulic lifting rotary joint cleaning mechanism (3), wherein a quartz crystal plate (2) is arranged in the inner cavity of the wafer cleaning tank (1), the quartz crystal plate (2) is movably connected with the hydraulic lifting rotary joint cleaning mechanism (3), and the hydraulic lifting rotary joint cleaning mechanism (3) is arranged in the inner cavity and the top of the wafer cleaning tank (1);
the hydraulic lifting rotary joint cleaning mechanism (3) comprises a hydraulic pump (31), a speed reducing motor (32), an output rotating shaft (33), an installation rotating plate (34), a stable connecting rod (35), a cleaning cotton installation plate (36), compressed cleaning cotton (37), a side ring baffle plate (38), placing cotton (39) and a support table (310);
the bottom fixed mounting of hydraulic pump (31) has gear motor (32), the bottom center through-hole department swing joint of gear motor (32) has output pivot (33), the bottom fixed mounting of output pivot (33) changes board (34), the bottom fixed mounting that the installation changes board (34) has firm connecting rod (35), the bottom fixed connection that stabilizes connecting rod (35) has the washing cotton mounting panel (36), the bottom fixed mounting that washs cotton mounting panel (36) has the compression to wash cotton (37), the lateral part external surface fixed mounting that washs cotton mounting panel (36) has side limit ring baffle (38), the compression washs cotton (37) and sets up the inboard at side limit ring baffle (38), the bottom swing joint that the compression washs cotton (37) has places cotton (39), quartz wafer (2) set up and wash cotton (37) and place the junction of cotton (39) in the compression, the placing cotton (39) is fixedly arranged on the top of the supporting platform (310).
2. A cleaning apparatus for quartz wafer production according to claim 1, characterized in that: the bottom of the supporting table (310) is fixedly provided with a supporting rod (4), and the supporting rod (4) is fixedly arranged at the top of the base (7).
3. A cleaning apparatus for quartz wafer production according to claim 1, characterized in that: a drain pipe (5) is fixedly installed at a hole formed in the bottom of one side of the wafer cleaning tank (1), and a water pump (6) is fixedly installed on the outer surface of the drain pipe (5).
4. A cleaning apparatus for quartz wafer production according to claim 3, characterized in that: one side and the bottom of the water pump (6) are respectively and fixedly connected with one side of the wafer cleaning tank (1) and the top of the base (7).
5. The cleaning apparatus for quartz wafer production according to claim 4, wherein: the bottom of the wafer cleaning tank (1) is fixedly connected with the top of the base (7).
6. The cleaning apparatus for quartz wafer production according to claim 5, wherein: the two sides of the hydraulic pump (31) are fixedly connected with the two sides of the top of the base (7) through the supporting frame (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022425495.6U CN214022286U (en) | 2020-10-28 | 2020-10-28 | Cleaning device for quartz wafer production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022425495.6U CN214022286U (en) | 2020-10-28 | 2020-10-28 | Cleaning device for quartz wafer production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214022286U true CN214022286U (en) | 2021-08-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022425495.6U Expired - Fee Related CN214022286U (en) | 2020-10-28 | 2020-10-28 | Cleaning device for quartz wafer production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214022286U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114999960A (en) * | 2022-06-02 | 2022-09-02 | 智程半导体设备科技(昆山)有限公司 | Single wafer cleaning equipment |
-
2020
- 2020-10-28 CN CN202022425495.6U patent/CN214022286U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114999960A (en) * | 2022-06-02 | 2022-09-02 | 智程半导体设备科技(昆山)有限公司 | Single wafer cleaning equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210824 |