JPH1158226A - Chuck wheel mechanism for workpiece, polishing device, and cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the draft generated in the rotation flow in the specified direction. SOLUTION: In a device, a plurality of arms 11 are radially projected from a rotational driving shaft 10, and a semiconductor wafer wf is turned by gripping the outer periphery by chuck parts 13 respectively provided on the arms 11. The arms 11 and the chuck parts 13 are formed into such a profile as to generate the down flow in which the draft to be generated in turning of the arms 11 is sucked from the outside of a chuck wheel mechanism to the rotational center side through the chuck parts 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chuck wheel mechanism for a work such as a semiconductor wafer, a polishing apparatus and a cleaning apparatus.

[0002]

2. Description of the Related Art In a manufacturing process of a semiconductor wafer, a polishing apparatus for mirror-finishing the surface of the semiconductor wafer is used.

The polishing apparatus has a polishing section and a cleaning section. The semiconductor wafer polished in the polishing section is cleaned in the cleaning section, dried and taken out.

[0004] As a semiconductor wafer cleaning machine installed in a cleaning section, as shown in FIG. 8, a pencil type 90 is provided on a chuck wheel mechanism 90 having a plurality of arms 93 radially protruding from a rotary drive shaft 91. Some are provided with a cleaning member 100 installed.

That is, in this cleaning machine, the outer periphery of the disk-shaped semiconductor wafer wf is gripped by the chuck portions 95 provided at the ends of the arms 93, and the outer periphery of the semiconductor wafer wf is turned in the direction of arrow A. The whole of the pencil-type cleaning member 100 is lowered in the direction of the arrow C while rotating the sponge 103 at the tip of 100 in the direction of the arrow B, so that the sponge 103 abuts on the semiconductor wafer wf, and the sponge 10
The sponge 103 is rubbed over the entire surface of the semiconductor wafer wf by swinging the arm 105 that supports the sponge 3 in the direction of arrow D, thereby cleaning the semiconductor wafer wf. At the time of cleaning, the cleaning liquid is supplied from the cleaning liquid supply nozzle 107.

[0006] When the cleaning is completed, the entire pencil-type cleaning member 100 is lifted up in the direction C to separate from the semiconductor wafer wf, and is moved out of the upper surface of the semiconductor wafer wf by swinging the arm 105. Semiconductor wafer w
f is a chuck unit 9 by a robot hand (not shown).
5 and transferred to the next dryer.

In the dryer, a chuck wheel mechanism 90 similar to that shown in FIG. 8 is provided, and the semiconductor wafer wf chucked by the chuck wheel mechanism 90 is rotated at high speed to spin dry.

[0008]

However, the chuck wheel mechanism 90 used in the above-mentioned conventional washing machine and drying machine is used.
Since the cross section of the arm 93 is rectangular, the lower side of the semiconductor wafer wf is rotated when the semiconductor wafer wf is rotated, as shown in the schematic side sectional view of the chuck wheel mechanism 90 shown in FIG. The turbulence of the airflow as shown by the arrow E occurs.

The semiconductor wafer manufacturing facility is designed to increase the cleanliness of the air in the room by down-flowing clean air from the ceiling to the floor, but if the airflow is disrupted as described above, For example, as shown by an arrow F, air with low cleanliness on the lower side of the spin dryer 90 is rolled up, and particles contained in the air may adhere to the semiconductor wafer wf. There was a problem that the flow could not be used effectively.

The present invention has been made in view of the above points, and an object of the present invention is to provide a workpiece chuck wheel mechanism, a polishing apparatus, and a cleaning apparatus capable of directing an airflow generated during rotation in a predetermined constant direction. It is in.

[0011]

According to the present invention, a plurality of arms are radially protruded from a rotary drive shaft, and workpieces are gripped and rotated by chuck portions provided on the respective arms. In a chuck wheel mechanism having a structure, at least one of the plurality of arms is formed into a shape in which an airflow generated when the arm is turned causes a downward flow downward through the arm.
Further, the present invention provides a chuck wheel mechanism having a structure in which a plurality of arms are radially projected from a rotary drive shaft and a workpiece is gripped and rotated by chuck sections provided on each of the arms. One of them is formed in such a shape that an air flow generated when the arm is turned is sucked from the outside of the chuck wheel mechanism to the rotation center side through the chuck portion. The present invention also provides a top ring for holding at least a work, a turntable having a polished surface for polishing the surface of the work held on the top ring, a washing machine for washing the polished work while rotating, A spin dryer that spin-drys by rotating the work,
The work chuck wheel mechanism according to the present invention is used as a means for supporting and rotating the work of the washing machine and / or the spin dryer. The present invention also provides a cleaning apparatus comprising: a washing machine for washing while rotating a work; and a spin dryer for spin-drying by rotating the washed work. The work chuck wheel mechanism according to the present invention is used as means for supporting and rotating the work.

[0012]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 6 is a schematic plan view showing the internal structure of the entire polishing apparatus to which the present invention is applied. As shown in the figure, the polishing apparatus includes a polishing unit 130 and a cleaning unit 150.

The polishing section 130 is a turntable 1
A polishing unit 137 having a top ring 135 attached to both sides of a 33, a dressing unit 141 having a dressing tool 139 attached thereto, and a work delivery device 143 are further provided.

The cleaning unit 150 has two transfer robots 151 and 153 movable in the direction of arrow Z in the center, and has a primary cleaner 50, a secondary cleaner 55, and a spin dryer with a cleaning function on one side. The machine 60 is installed in parallel, and two work reversing machines 161 and 163 are installed in parallel on the other side.

FIGS. 1 to 5 show the secondary washing machine 55.
FIG. 1 is a view showing a chuck wheel mechanism of a work according to the present invention used for both a spin dryer 60 having a cleaning function and a spin dryer 60 having a cleaning function. FIG. 1 is a schematic sectional side view (a sectional view taken along the line XX of FIG. 2). 2 is a schematic plan view, FIG. 3 is an enlarged sectional view taken along the line HH in FIG. 1, FIG. 4 is an enlarged sectional view taken along the line JJ in FIG. 1, and FIG.
FIG. 2 is an enlarged perspective view of a main part of a portion 1 and a chuck portion 13.

As shown in FIGS. 1 and 2, the chuck wheel mechanism for a work projects six rod-shaped arm holders 10-1 radially at equal intervals from the upper end of a rotary drive shaft 10. -1, the arms 11 are attached so as to protrude radially, a chuck portion 13 is provided at the end of each arm 11, and between the pulley 15 attached to the lower part of the rotary drive shaft 10 and the pulley 19 attached to the motor 17 The belt 21 is wound around.

The rotary drive shaft 10 is rotatably supported in the cylinder 23 by ball bearings 25 and 27. A cylindrical liquid scattering prevention cover 29 is provided around the arm 11 so as to surround the same. Have been. The liquid scattering prevention cover 29 is at a lowered position (shown by a solid line in FIG. 1) for carrying the work in and out of the chuck portion 13.
In addition, at the time of cleaning, a lifting mechanism (not shown) can be used to move up and down to a raised position (indicated by a dashed line in FIG. 1) for preventing the cleaning liquid from scattering outside.

Although the rotary drive shaft 10 and the cylinder 23 are all constructed by assembling a plurality of members, they are omitted in the figure and are described as an integral unit.

In the present invention, as shown in FIG. 3, the cross-sectional shape and the inclination angle of the arm 11 are determined when the arm 11 turns, that is, when the arm 11 moves in the direction of arrow K in FIG. The angle θh formed between the direction St of the airflow formed downstream of the air flow 11 and the vertical direction h is θh <90.
°. That is, it is formed in a wing shape such that an airflow (downflow) directed downward from the moving direction K is generated.

As shown in FIG. 5, the arm 11 is attached to an arm swinging shaft 11-1 penetrating therethrough, and one end of the arm swinging shaft 11-1 is attached to the arm holder 1.
The other end penetrates the chuck base 13-1 and the tip is fixed by a nut 13-9. To adjust the swing angle of the arm 11 about the arm swing shaft 11-1, loosen the nut 13-9 and adjust the arm holder 1
This is performed by swinging the arm 11 with respect to 0-1 and the chuck base 13-1. The arm swing shaft 11-1 and the nut 13-9 adjust the swing angle of the arm 11 to adjust the arm 1
This is an airflow adjusting means for adjusting the direction of the airflow generated during one turn.

As shown in FIG. 5, the chuck portion 13 has a blade-shaped chuck body 13 on the upper surface of the chuck base 13-1.
-2 is rotatably supported by a chuck body swinging shaft 13-3 attached vertically upward from the chuck base 13-1 and also stands upright on the upper surface of the chuck body 13-2.
A grip 13-4 is attached to a rotating shaft 13-5 fixed between the holders 13-6.

In a state where the chuck body 13-2 is swung at a predetermined angle about the chuck body swinging shaft 13-3 as a rotation center axis, a lock nut 13-7 is attached to the upper end of the chuck body swinging shaft 13-3. It is fixed by screwing. The chuck body swing shaft 13-3 and the lock nut 13-7 adjust the swing angle of the chuck body 13-2 to adjust the chuck 13
This is an airflow adjusting means for adjusting the direction of the airflow generated at the time of turning.

The gripping claw 13-4 is rotated around a rotation shaft 13-5 by a mechanism (not shown) to grip and fix the outer periphery of the semiconductor wafer wf described below or to release it.

As shown in FIG. 4, the cross-sectional shape and the inclination angle of the chuck body 13-2 are different from those of the chuck body 13-2.
At the time of turning, that is, when the chuck body 13-2 moves (rotates) in the direction of the arrow L in FIG.
The angle θc formed between the direction St of the airflow formed downstream of 3-2 and the rotation center direction r is formed so that θc <90 °. That is, the rotation center direction r is larger than the rotation direction L.
It is formed in a wing shape and an inclination angle such that an airflow toward the side is generated.

In this embodiment, all the arms 11 and the chuck portion 13 (chuck body 13-2) are formed in a wing shape, and the wings are arranged so as to face in the same direction.

If a pencil-type cleaning member 100 having a structure shown in FIG. 8 (a cleaning member having another structure may be used) is installed above the chuck wheel mechanism of the work, a secondary cleaning machine 55 shown in FIG. 6 is constituted. FIG. 6 shows a liquid jet cleaning nozzle 120 (for example, a cleaning nozzle having a structure for jetting a cleaning liquid as described later) as shown by a dotted line in FIG. 1 above the chuck wheel mechanism of the work. A spin dryer 60 with a washing function is configured.

The operation of the polishing apparatus having the above construction will be described. First, as shown in FIG. 6, when a cassette 165 containing semiconductor wafers W before polishing is set at a position shown in FIG. The semiconductor wafers wf are taken out one by one and transferred to the work reversing machine 163 to reverse the semiconductor wafers wf. Further, the semiconductor wafer wf is transferred from the work reversing machine 163 to the transfer robot 151 and transferred to the work transfer device 143 of the polishing unit 130.

Semiconductor wafer w on work delivery device 143
f is held on the lower surface of the top ring 135 of the polishing unit 137 that rotates as shown by the arrow P, is moved on the turntable 133, is polished on the rotating polishing surface 134, and is then returned to the workpiece transfer device 143 again. .

Then, the semiconductor wafer wf is transferred to the work reversing machine 161 by the transfer robot 151 and turned over. Then, the semiconductor wafer wf is transferred to the primary cleaning machine 50, and a roll type brush cleaning (not shown) installed in the primary cleaning machine 50 It is cleaned by the member.

Next, the semiconductor wafer wf after cleaning is transferred to the secondary cleaning machine 55 by the transfer robot 151, and as shown in FIG. 1, between the gripping claws 13-4 of the chuck section 13 and the upper surface of the chuck body 13-2. Is chucked. Next, the liquid scattering prevention cover 29 is raised to the position shown by the dashed line in FIG. Next, a cleaning liquid is supplied onto the semiconductor wafer wf from the same nozzle 107 as shown in FIG.

When the motor 17 is driven in this state, the semiconductor wafer wf is driven to rotate together with the rotary drive shaft 10 and the arm 11.

At the same time, the surface of the semiconductor wafer wf is cleaned by the same pencil-type cleaning member 100 as shown in FIG.

At the time of the cleaning, dust and mist float in the space around the semiconductor wafer wf. According to the present invention, as described above, the arm 11 and the chuck body 13-2 of the chuck section 13 are desired. As shown in FIG. 7, the wings are turned so that the zipper 13 is moved from the outside of the chuck wheel mechanism to the zipper 13.
Through the arm 11, a uniform airflow is generated in the arm 11 such that the gas moves (downflows) from top to bottom through the arm 11, and flows down from the ceiling to the floor. Matches the air flow of clean air, and thereby, the cleaned semiconductor wafer wf
There is no danger of the dust and mist adhering to the surface.

Next, returning to FIG. 6, the semiconductor wafer wf cleaned by the secondary cleaning device 55 is transferred by the transfer robot 153 to the spin dryer 60 having a cleaning function. Since the work chuck wheel mechanism shown in FIGS. 1 to 5 is also used in the spin dryer 60 having the cleaning function as described above, the operation thereof will be briefly described. The semiconductor wafer wf is chucked by the chuck section 13. The cleaning liquid 120 which is driven to rotate and is simultaneously supplied with ultrasonic vibration energy from the liquid jet cleaning nozzle 120 (see FIG. 1) is jetted, or a cleaning liquid having cavitation is jetted, or a high-pressure cleaning liquid is jetted. As a result, the semiconductor wafer wf is cleaned, and after the cleaning, the semiconductor wafer wf is spin-dried by rotating the rotary drive shaft 10 at a higher speed.

In this washing and spin drying,
As in the case of the secondary cleaning machine 55, the semiconductor wafer wf
7, a uniform airflow from top to bottom as shown in FIG. 7, more specifically, is drawn downward from the outside of the chuck wheel mechanism to the center of rotation through the chuck portion 13 and then downward through the arm 11. Since the downflow occurs, the airflow matches the clean airflow that is downflowed from the ceiling to the floor, thereby eliminating the possibility that dust and mist adhere to the semiconductor wafer wf.

The spin-dried semiconductor wafer wf
Is returned to the original cassette 165 by the transfer robot 153 shown in FIG.

Although the embodiment of the present invention has been described in detail, the present invention is not limited to this, and various modifications such as the following are possible. The above embodiment shows an example in which the present invention is used as a cleaning device or a spin dryer of a polishing device. However, a chuck wheel mechanism for various other semiconductor manufacturing devices, or a chuck wheel for other various devices. Needless to say, it can be used as a mechanism. In this case, various workpieces other than the semiconductor wafer may be chucked.

In the above-described embodiment, the cross section of both the arm and the chuck portion is formed in a predetermined airflow generating shape. However, only one of them may be formed in a predetermined airflow generating shape. Alternatively, only one of the plurality of arms or only one of the plurality of chuck portions may be formed in a predetermined airflow generating shape.

In the above-described embodiment, the cross section of the arm and / or the chuck portion is formed to have a predetermined wing shape for generating an airflow. However, the wing shape is not necessarily required. It may be configured such that a predetermined airflow is generated by installation. Wing-shaped arm 11
A flap 80 that can swing up and down as shown in FIG. The same applies to the chuck body 13-2 of the chuck section 13.

In the above embodiment, the cross-sectional shape of the arm and / or the chuck portion is formed so that the flow of the air flow is directed uniformly downward. However, depending on the equipment to be attached, the air flow may be directed uniformly upward. The cross section of the arm and / or the chuck may be formed.

In the above embodiment, the arm and the chuck are provided with airflow adjusting means for swinging these blade-shaped portions. However, these may be omitted to fix the blades at a fixed angle.

In the above embodiment, the arm and the chuck themselves are formed in a wing shape. However, in order to obtain the same effect, a wing-shaped or plate-shaped air flow generation means may be provided in the vicinity of each of the arm and the chuck by a separate member. good.

[0043]

As described above in detail, according to the present invention, an airflow in a desired constant direction is generated at the time of rotational driving, thereby preventing the turbulence of the airflow due to the rotational driving and ensuring a uniform airflow. Therefore, for example, by generating an airflow in accordance with the downflow of air in the clean room, the downflow of air can be effectively used, and the quality of the chucked work can be improved. .

[Brief description of the drawings]

FIG. 1 is a schematic side sectional view of a chuck wheel mechanism for a work according to the present invention.

FIG. 2 is a schematic plan view of FIG.

FIG. 3 is an enlarged cross-sectional view taken along the line HH of FIG. 1;

FIG. 4 is an enlarged cross-sectional view taken along the line JJ of FIG. 1;

FIG. 5 is an enlarged perspective view of a main part of an arm 11 and a chuck 13;

FIG. 6 is a schematic plan view showing the internal structure of the entire polishing apparatus to which the present invention is applied.

FIG. 7 is a view showing an air flow of a chuck wheel mechanism for a work according to the present invention.

FIG. 8 is a perspective view of a main part showing a conventional washing machine.

FIG. 9 is a diagram showing a flow of airflow of a conventional spin dryer 90.

FIG. 10 is a sectional view of an arm 11 having another structure.

[Explanation of symbols]

 wf Semiconductor wafer (work) 10 Rotary drive shaft 11 Arm 13 Chuck unit 50 Primary cleaning unit 55 Secondary cleaning unit 60 Spin dryer with cleaning function 130 Polishing unit 133 Turntable 134 Polished surface 135 Top ring 150 Cleaning unit

Claims (4)

[Claims] 1. A chuck wheel mechanism having a structure in which a plurality of arms radially protrude from a rotary drive shaft and a workpiece is gripped and rotated by chuck portions provided on the respective arms, wherein at least one of the plurality of arms is provided. One is a chuck wheel mechanism for a workpiece, wherein an airflow generated when the arm is turned is formed in a shape that causes a downward flow through the arm downward. 2. A chuck wheel mechanism having a structure in which a plurality of arms protrude radially from a rotary drive shaft, and a workpiece is gripped and rotated by chuck sections provided on each of the arms, wherein at least one of the chuck sections is provided. One is a chuck wheel mechanism for a workpiece, wherein an airflow generated when the arm is turned is sucked from the outside of the chuck wheel mechanism to the rotation center side through the chuck section. 3. A top ring for holding at least a workpiece, a turntable having a polishing surface for polishing a surface of the workpiece held on the top ring, a washing machine for rotating and polishing the workpiece after polishing, 3. A polishing apparatus comprising: a spin dryer for spin-drying by rotating a workpiece, wherein the means for supporting and rotating the workpiece of the washing machine and / or the spin dryer includes: A polishing apparatus using a chuck wheel mechanism. 4. A cleaning apparatus comprising: a washing machine for washing while rotating a work; and a spin dryer for spin-drying by rotating the washed work, wherein the work of the washing machine and / or the spin dryer is provided. A cleaning apparatus, comprising: a work chuck wheel mechanism according to claim 1 as means for supporting and rotating the work.