JP4755348B2 - Substrate spin cleaning / drying apparatus and cleaning / drying method - Google Patents

Substrate spin cleaning / drying apparatus and cleaning / drying method Download PDF

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JP4755348B2
JP4755348B2 JP2001028948A JP2001028948A JP4755348B2 JP 4755348 B2 JP4755348 B2 JP 4755348B2 JP 2001028948 A JP2001028948 A JP 2001028948A JP 2001028948 A JP2001028948 A JP 2001028948A JP 4755348 B2 JP4755348 B2 JP 4755348B2
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修二 竹田
三郎 関田
一雄 小林
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株式会社岡本工作機械製作所
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Description

【０００１】
【発明の属する技術分野】
本発明は、半導体基板、ガラス基板、磁気ディスク基板等の製造過程において、研削された基板あるいは研磨された基板を洗浄して基板表面より残砥粒や研削、研磨屑をスクラブ洗浄し、ついで基板をスピン乾燥させることが１台の装置で可能な洗浄・乾燥装置に関する。
【０００２】
【従来の技術】
基板をスクラブ洗浄し、ついでスピン乾燥をなす洗浄・乾燥方法としては、例えば次ぎの方法が知られており、かつ、実用化されている。
▲１▼一台の洗浄・乾燥装置を用い、回転軸に軸承されたポ−ラスセラミック置台上に基板を載せ、回転軸を回転させることにより回転する基板の上面または基板の下面をブラシでスクラブ洗浄し、ついで乾燥空気を基板表面に吹き付けてスピン乾燥させる方法（特開平７−１１５０７８号、特開２０００−１８８２７４号、同２０００−２０８４６１号）。
【０００３】
▲２▼図１０で示す両面スクラブ洗浄装置（月刊 Semiconductor World １９９７年３月号：８９−９１頁）を用い、端面に当接して基板を保持しつつ回転することができ、回転駆動源によって駆動される駆動ロ−ラを少なくとも１つ含む３つの保持ロ−ラを含む基板保持手段に端面を保持された基板の上面および下面に洗浄液を供給しつつ、回転するブラシを基板の上下面に当接して基板をスクラブ洗浄し、ついでブラシを基板面より後退させ、搬送ロボットで基板をスピン乾燥装置に移送し、端面を保持された基板の上下面に乾燥空気を吹き付けながら基板をスピン乾燥する２台の装置を用いる方法。
【０００４】
▲３▼上記▲２▼の方法において、両面スクラブ洗浄装置とスピン乾燥装置の間に第２の基板表面洗浄装置を設け、両面スクラブ洗浄装置で基板両面をスクラブ洗浄した後、基板を第２の基板表面洗浄装置のスピンチャッグに移送し、保持させて基板上面をスクラブ洗浄し、ついで基板をスピン乾燥装置に移送して基板をスピン乾燥する３台の装置を用いる方法（特開平１０−３０３１７０号）。
【０００５】
上記▲１▼の方法は、一台の洗浄・乾燥装置を用いるので、フットプリント(FootPrint）が狭くできる利点を有するが、ポ−ラスセラミック置台に接していた基板部分の洗浄、乾燥が充分でない欠点がある。
【０００６】
両面スクラブ洗浄装置とスピン乾燥装置を併用する上記▲２▼および▲３▼の方法は、洗浄効果よく、かつ、スピン乾燥時間が短い利点を有するが、２台以上の装置を並設するため、フットプリント(Foot Print）を広くとる欠点がある。
【０００７】
【発明が解決しようとする課題】
両面スクラブ洗浄装置とスピン乾燥装置が一体化した洗浄・スピン装置であるとフットプリント(Foot Print）を狭くすることができる。しかし、従来の両面スクラブ洗浄装置に空気吹き付けノズルを付属させるのでは、基板スピン乾燥時の基板のスピン（回転）が基板端面に当接する保持ロ−ラの駆動回転数が３０ｍｉｎ−１と遅い故に、スピン乾燥時間が長くなる。
本発明は、スピン乾燥時間が短くて済む両面スクラブ洗浄装置とスピン乾燥装置が一体化した洗浄・スピン装置の提供を目的とする。
【０００８】
【課題を解決するための手段】
本発明の請求項１は、 基板のスピン洗浄・乾燥装置（１）の中央に設けられた水平方向にサーボモータ（４）により回転可能でシリンダ（５）で上下方向に昇降可能な回転軸（３）、
該回転軸（３）の頭頂部（３ｂ）に設けられた３本のア−ム（７１，７１，７１）を有する治具（７０）の前記ア−ム先端に起立して設けられた把持具（７２，７２，７２）に基板（ｗ）の少なくとも３箇所の端面を当接させて基板を前記ア−ム（７１，７１，７１）より浮かして保持する第２基板保持手段（７）、
基板（ｗ）の端面に当接して基板を保持しつつ回転することができ、回転駆動源によって駆動される一対の駆動ロ−ラ（８１，８１）と、一対の遊転抑えロ−ラ（８２，８２）と、基板の中心点とロ−ラ（８３，８３）間を結ぶ直線の中間点とを結ぶ直線上を移動できる一対の遊転抑えロ−ラ（８３，８３）よりなる保持ロ−ラ（８１，８１，８２，８２，８３，８３）を含む第１基板保持手段（８）、
前記第１基板保持手段（８）に端面を保持された基板（ｗ）の上面および下面をスクラブ洗浄する両面洗浄手段（９）、
前記両面洗浄手段（９）の一対の回転ブラシ（９ｃ，９ｃ）を基板面に移動および基板面より後退させる移動手段、
前記第１基板保持手段（８）に端面を保持された基板（ｗ）の上面および下面に洗浄液を供給する一対（１０ａ，１０ｂ）の洗浄液供給機構（１０）、
および、
前記第２基板保持手段（７）に端面を保持された基板（ｗ）の上面および下面に気体を供給する乾燥気体供給機構（１１）、
を備える基板のスピン洗浄・乾燥装置（１）であって、
前記第２基板保持手段（７）の３本のア−ム（７１，７１，７１）を有する治具（７０）を上下に昇降させた際、治具（７０）に固定された複数のア−ム（７１，７１，７１）は、第１基板保持手段（８）の保持ロ−ラ（８１，８１，８２，８２，８３，８３）に衝突しない空間を通過するものであり、
また、前記第１基板保持手段（８）の保持ロ−ラ（８１，８１，８２，８２，８３，８３）の各中心点は、前記回転軸（３）の軸心を中心点とする円の同一円周上位置に在り、駆動ロ−ラ（８１，８１）間を結ぶ直線の中間点、遊転抑えロ−ラ（８２，８２）間を結ぶ直線の中間点、および、遊転抑えロ−ラ（８３，８３）間を結ぶ直線の中間点の、これら３つの中間点を結んだ仮想直線はこれら３つの中間点を頂点とする正三角形を示す、
ことを特徴とする、基板のスピン洗浄・乾燥装置（１）を提供するものである。
【０００９】
両面スクラブ洗浄時は第１基板保持手段に保持されていた基板を、第２基板保持手段を上昇させることにより第２基板保持手段の把持具で保持し、これを回転軸を回転（回転数は１０００〜６０００ｍｉｎ−１）させることにより基板のスピン乾燥時間が短縮できる。
【００１１】
第１基板保持手段の一対の遊転抑えロ−ラを基板の端面より１〜１０ｍｍ後退させて抑えロ−ラにより基板の拘束を開放することにより、第２基板保持手段の把持具による基板の保持を容易とすることができる。
【００１２】
本発明の請求項２は、前記請求項１に記載の基板のスピン洗浄・乾燥装置（１）を用い、次ぎの１）から４）の工程を経て基板（ｗ）を洗浄、ついで基板を乾燥する方法を提供するものである。
１）第１基板保持手段（８）に端面を保持され、水平方向に回転されている基板（ｗ）の上面および下面に洗浄液供給機構（１０）より洗浄液を供給しつつ回転するブラシ（９ｃ，９ｃ）を当接して基板（ｗ）をスクラブ洗浄する。
２）洗浄液の供給および基板の回転を止め、ブラシ（９ｃ，９ｃ）を基板面より後退させた後、保持ロ−ラの一部（８３，８３）を後退させて基板端面の保持ロ−ラ（８１，８１，８２，８２，８３，８３）による抑えを開放する。
３）第２基板保持手段（７）を上昇させ、治具（７０）に固定されているア−ム（７１，７１，７１）先端に起立している把持具（７２，７２，７２）に基板の端面を当接させて基板を前記ア−ム（７１，７１，７１）より浮かして保持する。
４）回転軸（３）を回転させることにより第２基板保持手段（７）の把持具（７２，７２，７２）に保持された基板を回転させ、回転している基板の上面および下面に乾燥気体供給機構（１１）より気体を供給して基板をスピン乾燥させる。
【００１３】
１台のスピン洗浄・乾燥装置で基板の両面スクラブ洗浄、スピン乾燥を行うことができ、基板の研削または研磨における洗浄・乾燥工程のスル−プット時間を短縮することができる。
【００１４】
【発明の実施の形態】
【実施例】
以下、図面を用いて本発明のスピン洗浄・乾燥装置を詳細に説明する。
図１は、スピン洗浄・乾燥装置の平面図、図２は図１におけるＩ−Ｉ断面図、図３は第２基板保持手段の部分拡大断面図、図４は、第１基板保持手段の駆動ロ−ラ頭部部分の断面図、図５は第１基板保持手段の駆動ロ−ラ駆動部分の断面図、図６は第１基板保持手段の一対の遊転抑えロ−ラの平面図、図７はその遊転抑えロ−ラ頭部部分の断面図、図８はその遊転抑えロ−ラの移動手段の断面図、図９は移動手段の一構成要素であるピコテ−ブルの平面図である。
【００１５】
図１、図２および図３に示すスピン洗浄・乾燥装置１おいて、２はスピン洗浄・乾燥装置が据え付けられるベ−スで、図示されていない研削盤または研磨盤もこのベ−スに据え付けられる。
３はスピン洗浄・乾燥装置１の中央に設けられた回転軸、３ａは筒状の回転軸カバ−、４はサ−ボモ−タで前記回転軸３を水平方向に回転させる。４ａはブレ−キである。
【００１６】
５はエアシリンダで、固定プレ−ト５ａにシャフト５ｂを介して固定され、ロッド５ｂにボルトで固定された移動プレ−ト５ｃの昇降により移動プレ−ト５ｃにボルト固定されたシャフト５ｄを昇降（実線部分は上昇位置を、仮想線部分は待機時の下降位置を示す）させることにより前記回転軸３を上下方向に昇降させる。５ｆはスライダ機構で、ブラケット５ｇに固定されている。
シャフト５ｄは略円板状のトッププレ−ト５ｈに固定され、トッププレ−ト５ｈを突き抜けた頭部５ｉは筒状の外套上部６ａを支持板５ｊで固定し、外套上部６ａも昇降可能となっている。この外套上部６ａの下端部は前記トッププレ−ト５ｈにボルト５ｋで固定された支持板５ｌに固定される円筒状の下部固定外套６ｂ内に嵌る構造となっている。
【００１７】
７は第２基板保持手段で、前記回転軸３の頭頂部３ｂにフランジ３ｃとトップカバ−３ｄにより固定された３個の支持ア−ム７１，７１，７１を有する治具７０の前記支持ア−ム先端に円筒状の基台７３を起立し、その上に設けられた把持具７２，７２，７２に基板の少なくとも３箇所の端面を当接させて基板（図１で円板状の仮想線で示されるｗ、図２で仮想線で示されるｗ''）をア−ム７１，７１，７１より浮かして保持する。３ｅはベアリングである。
【００１８】
８は第１基板保持手段で、基板端面に当接して基板（図１で円板状の仮想線で示されるｗ、図２で仮想線で示されるｗ'）を保持しつつ、回転駆動源によって駆動される駆動ロ−ラ８１，８１と、一対の遊転抑えロ−ラ８２，８２と、基板の中心点とロ−ラ８３，８３間を結ぶ直線の中間点を結ぶ線上を移動できる一対の遊転抑えロ−ラ８３，８３を含む。
図１に示すように、前記第１基板保持手段８の保持ロ−ラ８１，８１，８２，８２，８３，８３の各中心点は、回転軸３の軸心を中心点とする円の同一円周上位置に在り、駆動ロ−ラ８１，８１間を結ぶ直線の中間点、遊転抑えロ−ラ８２，８２間を結ぶ直線の中間点、および、遊転抑えロ−ラ８３，８３間を結ぶ直線の中間点の３つの中間点を結んだ仮想直線はこれら中間点を頂点とする正三角形を示す。
前記第２基板保持手段７の複数のア−ムを有する治具７０を上下に昇降させた際、治具の複数のア−ム７１，７１，７１は、第１基板保持手段８の保持ロ−ラ８１，８２，８３に衝突しない空間を通過するような位置に第１基板保持手段は設けられる。
【００１９】
９は基板両面スクラブ洗浄手段（図１では仮想線で示す）で、図１０に示すブラシ９ｃ，９ｃを装着する把持部９ａ，９ａとブラシを回転させるモ−タ９ｂ，９ｂと基板両面スクラブ洗浄手段のブラシを基板上下面に移動もしくは上下面より後退させる移動手段（図示されていない）を備える。
ブラシの移動は、前後方向移動であっても振り子状揺動であってもよい。
ブラシ素材としてはポリビニルアルコ−ルスポンジ、ウレタン発泡スポンジ等が使用できる。
【００２０】
１０は洗浄液供給ノズルで、基板の上面に洗浄液を供給する上ノズル１０ａと、基板の下面に洗浄液を供給する下ノズル１０ｂよりなる。上ノズル１０ａ、下ノズル１０ｂとも複数個設けてもよい。
洗浄液としては、純水が一般に使用される。
洗浄液供給ノズルに切り替え弁を付属させ、フッ酸水やアルカリ水の薬剤を基板に供給して薬剤洗浄した後、弁を切り替えて純水を基板に供給し、基板をリンス洗浄してもよい。また、複数のノズルを使用し、薬液洗浄と純水によるリンス洗浄を振り分けてもよい。
【００２１】
１１は気体供給ノズルで、基板の上面に気体を吹き付ける上ノズル１１ａと、基板の下面に気体を吹き付ける下ノズル１１ｂよりなる。上ノズル１１ａ、下ノズル１１ｂとも複数個設けてもよい。
気体は、ベ−ス２を刳り貫いた空所に設けられた配管１１ｅにメイルコネクタ１１ｄを介して結合されたパイプ１１ｃより供給される。配管１１ｅの先は、図示されていないコンプレッサに接続され、圧縮気体が供給され、基板の乾燥を促進する。
気体は、空気、ヘリウム、アルゴン、窒素ガス、炭酸ガス等が使用でき、一般には安価な空気が使用される。
【００２２】
前記第１基板保持手段８の一対の駆動ロ−ラ８１，８１は、基板の端面に当接して基板に水平方向の回転力を付与するもので、図４および図５に示すように基板の端面に当接する円柱部８１ａとこの円柱部を支える台形錘状部８１ｂを有し、このロ−ラ８１，８１の台形錘状部８１ｂ中央は、ロ−ラ軸８１１，８１１に支持され、ロ−ラ軸８１１の下部には歯車８１２，８１２が装着され、歯車８１２，８１２にはシャフト８１３上部に備え付けられた駆動歯車８１４が噛み合わされている。これら歯車８１２，８１２，８１４はギヤボックス８１５内に収納されている。
シャフト８１３は円筒状シャフトカバ−８１７に保護され、シャフト８１３下部はカップリング材８１８を介してレバ−シブルモ−タ８１９の駆動軸８１９ａに接続されている。
レバ−シブルモ−タ８１９の駆動力をシャフト８１３に装着された駆動歯車８１４を介して歯車８１２，８１２に伝達し、駆動ロ−ラ８１，８１は回転し、基板を水平方向に回転させる。
【００２３】
前記第１基板保持手段８の基板の中心点と一対の遊転抑えロ−ラ８３，８３間を直線で結んだ直線の中間点とを結ぶ線上を移動できる一対の遊転抑えロ−ラ８３，８３は、上記一対の駆動ロ−ラ８１，８１の駆動により回転する基板の回転力を受けて連れ回りするもので、図６，図７，図８および図９に示すように基板の端面に当接する円柱部８３ａとこの円柱部を支える台形錘状部８３ｂを有し、このロ−ラ８３，８３の台形錘状部８３ｂ中央は、ボルト８３１，８３１によりロ−ラア−ム８３２，８３２に固定され、ロ−ラア−ム８３２，８３２はボルト８３３，８３３を介してブラケット８３４に固定されている。
【００２４】
このブラケット８３４の端部の底面は鉛直方向に起立する固定シャフト８３５の上端部に固定され、固定シャフト８３５の下端部はブラケット８３６を介してＮＯＫエフテック株式会社販売のピコテ−ブル８３７に固定される。
ピコテ−ブル８３７は、小型エアシリンダ８３９を備えたアクチュエ−タで小型リニアガイド８３８上を１〜１５ｍｍ程度スライドする構造を採る。
８３６ａはカバ−である。
【００２５】
前記ブラケット８３４の端部からは引張バネ８４０を固定するポスト８４１，８４１を起立して設け、引張バネ８４０の端部を固定する。引張バネ８４０の一方の端部はロ−ラア−ム８３２，８３２の端部に設けたＨ型窪みの上部に設けた孔８４２に引っ掛けて固定する。ロ−ラア−ム８３２，８３２はボルト８３３，８３３を支点として円弧状に移動でき、それ故、ロ−ラ８３，８３の中心点は図６でｒで示す円弧上を移動できる。
引っ張りバネ６４０によりロ−ラア−ム８３２，８３２は装置の中心に向く力を受けるので、基板は円柱部の端面に当接する。
基板の端面をロ−ラ８３，８３の端面より離れさすには、ピコテ−ブル８３７をリニアガイド上に１〜１５ｍｍ、好ましくは引っ張りバネの張力の影響を受けない５〜１０ｍｍ程度装置の中心より遠ざかる方向に移動させる。
【００２６】
他の遊転抑えロ−ラ８２，８２は、上記遊転抑えロ−ラ８３，８３において、ピコテ−ブルと引っ張りバネによる移動機構を設けない外は同様な構造を採るので詳細な説明を省く。
【００２７】
かかる本発明のを用いて、研削または研磨処理された基板を洗浄・乾燥させるには、次ぎの１）から４）の工程を経て行う。
【００２８】
１）図示されていない搬送ロボットにより、洗浄・乾燥装置１の基板保持手段８のロ−ラ８１，８１，８２，８２，８３，８３の台形錐上に基板を搬送し、載せ、ピコテ−ブル８３８を装置１の中心部方向にスライドさせて基板ｗ端面をロ−ラ８１，８１，８２，８２，８３，８３の円柱部に当接させてることにより保持する。
ついで、レバ−シブルモ−タ８１９を駆動させて駆動ロ−ラ８１を回転させることにより基板を水平方向に回転させ、この基板の上面および下面に洗浄液をノズル１０ａ，１０ｂより供給しつつ回転するブラシ９ｃ，９ｃを基板に当接して基板両面をスクラブ洗浄する。
【００２９】
２）洗浄液の供給および基板の回転を止め、ブラシを基板面より後退させた後、ピコテ−ブル８３８を装置１の中心部から遠ざかる方向にスライドさせることによりロ−ラ８３，８３を後退させて基板ｗ端面をロ−ラ８３，８３より引き離し、基板端面の保持ロ−ラによる抑えを開放する。
【００３０】
３）第２基板保持手段７をシリンダ５により上昇させ、治具７０のア−ム７１，７１，７１先端に起立している把持具７２，７２，７２に基板の端面を当接させて基板をア−ムより浮かして保持する。
【００３１】
４）サ−ボモ−タ４を駆動し、回転軸３を回転させることにより第２基板保持手段７の把持具７２，７２，７２に保持された基板を回転させ、回転している基板の上面および下面に乾燥気体供給ノズル１１ａ，１１ｂより気体を供給して基板をスピン乾燥させる。
【００３２】
以上により洗浄、乾燥の行われた後、サ−ボモ−タ４の駆動を停止し、図示されていないアンロ−ド搬送ロボッドにより基板は次ぎの工程（例えばエッチング工程、研磨工程あるいは、ダイシング工程）に搬送、または収納カセット内に搬入される。
第２基板保持手段７をシリンダ５により図２に仮想線Ｗ０で示す位置まで下降させ、次ぎの新しい基板の搬入を待つ。
【００３３】
【発明の効果】
本発明の基板の洗浄・乾燥装置１は、１台の装置で基板の両面スクラブ洗浄、スピン乾燥を行うことができるので、フットプリントをコンパクトにすることができる。また、基板のスピン乾燥は、従来のスピンチャックをモ−タで１０００〜６０００ｍｉｎ−１で回転させるスピン乾燥装置と同様の回転数で回転させて短時間で行うことができる。
【図面の簡単な説明】
【図１】 スピン洗浄・乾燥装置の平面図である。
【図２】 図１におけるＩ−Ｉ断面図である。
【図３】 第２基板保持手段の部分拡大断面図である。
【図４】 第１基板保持手段の駆動ロ−ラ頭部部分の断面図である。
【図５】 第１基板保持手段の駆動ロ−ラ駆動部分の断面図である。
【図６】 第１基板保持手段の一対の遊転抑えロ−ラの平面図である。
【図７】 遊転抑えロ−ラ頭部部分の断面図である。
【図８】 遊転抑えロ−ラの移動手段の断面図である。
【図９】 移動手段の一構成要素であるピコテ−ブルの平面図である。
【図１０】 公知の基板両面スクラブ洗浄装置の部分斜視図である。
【符号の説明】
１ スクラブ洗浄・スピン乾燥装置
３ 回転軸
４ モ−タ
５ エアシリンダ
７ 第２基板保持手段
７０ 治具
７１ ア−ム
７２ 把持具
８ 第１基板保持手段
８１ 駆動ロ−ラ
８２ 遊転ロ−ラ
８３ 遊転ロ−ラ
８１９ リバ−シブルモ−タ
８３８ ピコテ−ブル（スライダ）[0001]
BACKGROUND OF THE INVENTION
In the manufacturing process of a semiconductor substrate, a glass substrate, a magnetic disk substrate, etc., the present invention cleans a ground substrate or a polished substrate, scrubs and removes residual abrasive grains, grinding, and polishing debris from the substrate surface. The present invention relates to a cleaning / drying apparatus capable of spin-drying with a single apparatus.
[0002]
[Prior art]
As a cleaning / drying method for scrub cleaning a substrate and then spin drying, for example, the following method is known and put into practical use.
(1) Using a single cleaning / drying device, place a substrate on a porous ceramic table supported by a rotating shaft, and scrub the upper surface of the rotating substrate or the lower surface of the substrate with a brush by rotating the rotating shaft. A method of washing and then spin-drying by blowing dry air onto the substrate surface (Japanese Patent Laid-Open Nos. 7-1150878, 2000-188274, 2000-208461).
[0003]
(2) Using the double-side scrub cleaning device (Monthly Semiconductor World March 1997 issue: pages 89-91) shown in FIG. 10, the substrate can be rotated while being in contact with the end surface and driven by a rotational drive source. The cleaning brush is supplied to the upper and lower surfaces of the substrate whose end surfaces are held by the substrate holding means including three holding rollers including at least one driven roller, and a rotating brush is applied to the upper and lower surfaces of the substrate. The substrate is scrubbed and cleaned, then the brush is retracted from the substrate surface, the substrate is transferred to the spin drying device by the transfer robot, and the substrate is spin-dried while blowing dry air onto the upper and lower surfaces of the substrate holding the end surfaces. Using a single device.
[0004]
(3) In the method of (2) above, a second substrate surface cleaning device is provided between the double-sided scrub cleaning device and the spin drying device, and after scrubbing both surfaces of the substrate with the double-sided scrub cleaning device, the substrate is A method using three apparatuses that transfer to a spin chuck of a substrate surface cleaning apparatus and hold it to scrub clean the upper surface of the substrate and then transfer the substrate to a spin drying apparatus and spin dry the substrate (Japanese Patent Laid-Open No. 10-303170) .
[0005]
The above method (1) has the advantage that the footprint (FootPrint) can be narrowed because a single cleaning / drying apparatus is used, but the substrate part in contact with the porous ceramic table is not sufficiently cleaned and dried. There are drawbacks.
[0006]
The above methods (2) and (3) using a double-sided scrub cleaning device and a spin drying device have the advantages of good cleaning effect and short spin drying time. However, since two or more devices are arranged in parallel, There is a drawback of taking a wide footprint (Foot Print).
[0007]
[Problems to be solved by the invention]
If the double-side scrub cleaning device and the spin drying device are integrated, the footprint can be narrowed. However, if an air blowing nozzle is attached to the conventional double-side scrub cleaning device, the spin (rotation) of the substrate at the time of substrate spin drying has a slow drive rotation speed of 30 min −1 that abuts the substrate end surface. , Spin drying time will be longer.
It is an object of the present invention to provide a cleaning / spinning device in which a double-sided scrub cleaning device and a spin drying device that require a short spin drying time are integrated.
[0008]
[Means for Solving the Problems]
Claim 1 of the present invention is a rotating shaft ( rotating shaft ( 5) that can be rotated by a servo motor (4) in the horizontal direction and vertically moved by a cylinder (5) provided in the center of the substrate spin cleaning and drying apparatus (1). 3)
Grip provided upright at the tip of the arm of a jig (70) having three arms (71, 71, 71) provided at the top (3b ) of the rotating shaft (3). Second substrate holding means (7) for holding the substrate floating above the arm (71, 71, 71) by bringing the end faces of the substrate (w) into contact with the tool (72, 72, 72 ). ,
The end face of the substrate (w) in contact can be rotated while holding the substrate, a pair of drive B that is driven by the rotary drive source - and La (81), a pair of idler suppressed Russia - La ( and 82), the center point of the substrate and Russia - consisting of La (83) - a pair of idler suppressed b can move straight line connecting the point between inside of a straight line connecting between La (83) First substrate holding means (8) including holding rollers (81, 81, 82, 82, 83, 83 ) ;
Sided cleaning means for scrubbing the top surface and the bottom surface of the substrate (w) of the end surface held by the first substrate holding means (8) (9),
Moving means for retracting from the mobile and the substrate surface a pair of rotary brushes (9c, 9c) to the substrate surface of the double-sided cleaning means (9),
Said first pair (10a, 10b) for supplying the upper surface and the cleaning liquid to the lower surface of the substrate held to the end face of the substrate holding means (8) (w) of the cleaning liquid supply mechanism (10),
and,
The second substrate holding means (7) to hold the end surface substrates (w) of the top surface and dry gas supply mechanism for supplying gas to the lower surface (11),
A substrate spin cleaning and drying apparatus (1) comprising:
When the jig (70) having the three arms (71, 71, 71) of the second substrate holding means (7) is moved up and down, a plurality of arms fixed to the jig (70) are provided. The medium (71, 71, 71) passes through a space that does not collide with the holding rollers (81, 81, 82, 82, 83, 83) of the first substrate holding means (8) ;
The center points of the holding rollers (81, 81, 82, 82, 83, 83) of the first substrate holding means (8) are circles centered on the axis of the rotating shaft (3). Are located on the same circumference, and the intermediate point of the straight line connecting the drive rollers (81, 81), the intermediate point of the straight line connecting the anti-rolling rollers (82, 82), and the anti-spinning The virtual straight line connecting these three intermediate points of the intermediate point of the straight line connecting the rollers (83, 83) represents an equilateral triangle having these three intermediate points as vertices.
The present invention provides a substrate spin cleaning / drying apparatus (1).
[0009]
At the time of double-side scrub cleaning, the substrate held by the first substrate holding means is held by the gripping tool of the second substrate holding means by raising the second substrate holding means, and this is rotated on the rotating shaft (the rotation speed is 1000 to 6000 min −1 ), the spin drying time of the substrate can be shortened.
[0011]
The pair of anti-spinning rollers of the first substrate holding means are retracted by 1 to 10 mm from the end surface of the substrate and the restraining rollers are released to release the restraint of the substrate. Holding can be facilitated.
[0012]
Claim 2 of the present invention uses the substrate spin cleaning / drying apparatus (1) according to claim 1 to wash the substrate (w) through the following steps 1) to 4), and then dry the substrate. It provides a way to
1) Brushes (9c, 9), which rotate while supplying the cleaning liquid from the cleaning liquid supply mechanism (10) to the upper and lower surfaces of the substrate (w) which is held in the first substrate holding means (8) and is rotated in the horizontal direction . The substrate (w) is scrubbed by contacting 9c) .
2) Stopping the supply of the cleaning liquid and the rotation of the substrate and retracting the brushes (9c, 9c) from the substrate surface, and then retracting part of the holding rollers (83, 83) to hold the substrate end surface The restraint by (81, 81, 82, 82, 83, 83) is released .
3) Raise the second substrate holding means (7) and hold it on the gripping tool (72, 72, 72) standing at the tip of the arm (71, 71, 71) fixed to the jig (70). It is brought into contact with the end surface of the substrate by the substrate a - holding floated from beam (71, 71, 71).
4) The substrate held by the gripping tool (72, 72, 72) of the second substrate holding means (7 ) is rotated by rotating the rotating shaft (3) , and dried on the upper and lower surfaces of the rotating substrate. A gas is supplied from a gas supply mechanism (11) to spin dry the substrate.
[0013]
The single-sided spin cleaning / drying apparatus can perform double-side scrub cleaning and spin drying of the substrate, and can shorten the throughput time of the cleaning / drying step in grinding or polishing the substrate.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
【Example】
Hereinafter, the spin cleaning / drying apparatus of the present invention will be described in detail with reference to the drawings.
1 is a plan view of a spin cleaning / drying apparatus, FIG. 2 is a cross-sectional view taken along line II in FIG. 1, FIG. 3 is a partially enlarged cross-sectional view of a second substrate holding means, and FIG. FIG. 5 is a sectional view of a driving roller driving portion of the first substrate holding means, FIG. 6 is a plan view of a pair of anti-rotation rollers of the first substrate holding means, 7 is a cross-sectional view of the head portion of the anti-rolling roller, FIG. 8 is a cross-sectional view of moving means of the anti-rolling roller, and FIG. 9 is a plan view of a picotable which is a component of the moving means. FIG.
[0015]
In the spin cleaning / drying apparatus 1 shown in FIGS. 1, 2 and 3, reference numeral 2 denotes a base on which the spin cleaning / drying apparatus is installed, and a grinder or polishing machine (not shown) is also installed on this base. It is done.
Reference numeral 3 denotes a rotary shaft provided in the center of the spin cleaning / drying apparatus 1, 3a denotes a cylindrical rotary shaft cover, and 4 denotes a servo motor that rotates the rotary shaft 3 in the horizontal direction. 4a is a brake.
[0016]
An air cylinder 5 is fixed to the fixed plate 5a via the shaft 5b, and the shaft 5d bolted to the moving plate 5c is moved up and down by moving the moving plate 5c fixed to the rod 5b with bolts. (The solid line portion indicates the ascending position, and the phantom line portion indicates the descending position during standby) to raise and lower the rotary shaft 3 in the vertical direction. Reference numeral 5f denotes a slider mechanism which is fixed to the bracket 5g.
The shaft 5d is fixed to a substantially disc-shaped top plate 5h, the head 5i that has penetrated the top plate 5h has a cylindrical outer canopy upper portion 6a fixed to the support plate 5j, and the outer mantle upper portion 6a can also be raised and lowered. It has become. The lower end portion of the outer canopy upper portion 6a is structured to fit into a cylindrical lower fixed outer mantle 6b fixed to a support plate 5l fixed to the top plate 5h with bolts 5k.
[0017]
Reference numeral 7 denotes a second substrate holding means, and the support arm of the jig 70 having three support arms 71, 71, 71 fixed to the top 3b of the rotary shaft 3 by a flange 3c and a top cover-3d. A cylindrical base 73 is erected at the tip of the substrate, and at least three end surfaces of the substrate are brought into contact with gripping tools 72, 72, 72 provided thereon, and the substrate (disc-like virtual in FIG. W indicated by a line and w ″) indicated by a virtual line in FIG. 2 are floated and held from the arms 71, 71, 71. 3e is a bearing.
[0018]
Reference numeral 8 denotes first substrate holding means, which is in contact with the end surface of the substrate and holds the substrate (w indicated by a disk-like imaginary line in FIG. 1, w ′ indicated by an imaginary line in FIG. 2), driven driven Russia by - moving the line connecting between points in a straight line connecting between La 83, 83 - a la 81, a pair of idler suppressed Russia - a la 82, the center point of the substrate and b A pair of anti-rolling rollers 83 and 83 that can be formed is included.
As shown in FIG. 1, the center points of the holding rollers 81, 81, 82, 82, 83, 83 of the first substrate holding means 8 are the same as a circle centered on the axis of the rotating shaft 3. An intermediate point of a straight line connecting the drive rollers 81, 81, an intermediate point of a straight line connecting the anti-rolling rollers 82, 82, and the anti-rolling rollers 83, 83 at the circumferential position. An imaginary straight line connecting three intermediate points of the intermediate points of the straight lines connecting each other shows an equilateral triangle having these intermediate points as vertices.
When the jig 70 having the plurality of arms of the second substrate holding means 7 is moved up and down, the plurality of arms 71, 71, 71 of the jigs are held by the first substrate holding means 8. The first substrate holding means is provided at a position that passes through a space that does not collide with the rollers 81, 82, and 83.
[0019]
Reference numeral 9 denotes a substrate double-side scrub cleaning means (indicated by phantom lines in FIG. 1). The gripping portions 9a and 9a for mounting the brushes 9c and 9c shown in FIG. 10, motors 9b and 9b for rotating the brush, and substrate double-side scrub cleaning. Moving means (not shown) for moving the brush of the means to the upper and lower surfaces of the substrate or retracting from the upper and lower surfaces is provided.
The movement of the brush may be a back-and-forth movement or a pendulum swing.
As the brush material, polyvinyl alcohol sponge, urethane foam sponge or the like can be used.
[0020]
A cleaning liquid supply nozzle 10 includes an upper nozzle 10a for supplying a cleaning liquid to the upper surface of the substrate and a lower nozzle 10b for supplying the cleaning liquid to the lower surface of the substrate. A plurality of upper nozzles 10a and lower nozzles 10b may be provided.
As the cleaning liquid, pure water is generally used.
It is also possible to attach a switching valve to the cleaning liquid supply nozzle, supply chemicals of hydrofluoric acid or alkaline water to the substrate and clean the chemicals, then switch the valve to supply pure water to the substrate and rinse the substrate. In addition, a plurality of nozzles may be used to distribute chemical cleaning and rinsing with pure water.
[0021]
A gas supply nozzle 11 includes an upper nozzle 11a that blows gas onto the upper surface of the substrate and a lower nozzle 11b that blows gas onto the lower surface of the substrate. A plurality of upper nozzles 11a and lower nozzles 11b may be provided.
The gas is supplied from a pipe 11c coupled to a pipe 11e provided in a space penetrating the base 2 via a mail connector 11d. The tip of the pipe 11e is connected to a compressor (not shown), supplied with compressed gas, and promotes drying of the substrate.
As the gas, air, helium, argon, nitrogen gas, carbon dioxide gas or the like can be used, and generally inexpensive air is used.
[0022]
A pair of drive B of the first substrate holding means 8 - La 81, 81, those on the end face of the substrate in contact for imparting a rotational force in the horizontal direction to the substrate, the substrate as shown in FIGS. 4 and 5 A cylindrical portion 81a that abuts the end surface and a trapezoidal weight-like portion 81b that supports the cylindrical portion. The center of the trapezoidal weight-like portion 81b of the rollers 81 and 81 is supported by the roller shafts 811 and 811. -Gears 812 and 812 are attached to the lower part of the roller shaft 811, and a driving gear 814 provided on the upper part of the shaft 813 is engaged with the gears 812 and 812. These gears 812, 812, and 814 are accommodated in a gear box 815.
The shaft 813 is protected by a cylindrical shaft cover 817, and the lower portion of the shaft 813 is connected to a drive shaft 819 a of a reversible motor 819 via a coupling material 818.
The driving force of the reversible motor 819 is transmitted to the gears 812 and 812 via the driving gear 814 mounted on the shaft 813, and the driving rollers 81 and 81 rotate to rotate the substrate in the horizontal direction.
[0023]
The first center point and a pair of idler of substrates of the substrate holding means 8 suppresses Russia - a pair of idler that between La 83 and 83 can be moved on a line connecting the point between inside of a straight line connecting a linear suppressed Russia - La Reference numerals 83 and 83 follow the rotational force of the substrate rotated by the driving of the pair of drive rollers 81 and 81. As shown in FIG. 6, FIG. 7, FIG. 8, and FIG. A cylindrical portion 83a that abuts on the end surface and a trapezoidal weight-like portion 83b that supports this cylindrical portion, and the center of the trapezoidal weight-like portion 83b of the rollers 83 and 83 is a roller arm 832 by bolts 831 and 831. The roller arms 832 and 832 are fixed to the bracket 834 via bolts 833 and 833.
[0024]
The bottom surface of the end portion of the bracket 834 is fixed to the upper end portion of a fixed shaft 835 standing in the vertical direction, and the lower end portion of the fixed shaft 835 is fixed to a picotable 837 sold by NOK F-Tech Co., Ltd. via a bracket 836. .
The picotable 837 is an actuator provided with a small air cylinder 839 and has a structure that slides on the small linear guide 838 by about 1 to 15 mm.
836a is a cover.
[0025]
Posts 841 and 841 for fixing the tension spring 840 are provided upright from the end of the bracket 834, and the end of the tension spring 840 is fixed. One end of the tension spring 840 is hooked and fixed in a hole 842 provided in the upper part of the H-shaped recess provided in the end of the roller arms 832 and 832. The roller arms 832 and 832 can move in an arc shape with the bolts 833 and 833 as fulcrums, and therefore the center point of the rollers 83 and 83 can move on the arc indicated by r in FIG.
Since the roller arms 832 and 832 receive the force toward the center of the apparatus by the tension spring 640, the substrate comes into contact with the end surface of the cylindrical portion.
In order to move the end face of the substrate away from the end faces of the rollers 83, 83, the picotable 837 is placed on the linear guide 1-15 mm, preferably about 5-10 mm not affected by the tension of the tension spring. Move it away.
[0026]
The other anti-rolling rollers 82 and 82 have the same structure except that the anti-spinning rollers 83 and 83 are not provided with a moving mechanism using a picotable and a tension spring, and thus detailed description thereof is omitted. .
[0027]
In order to clean and dry the ground or polished substrate using the present invention, the following steps 1) to 4) are performed.
[0028]
1) A substrate is transported on a trapezoidal cone of rollers 81, 81, 82, 82, 83, 83 of the substrate holding means 8 of the cleaning / drying apparatus 1 by a transfer robot (not shown), and is placed on the pico table. 838 is slid in the direction of the center of the apparatus 1 to hold the end face of the substrate w in contact with the cylindrical portions of the rollers 81, 81, 82, 82, 83, 83.
Next, the reversible motor 819 is driven to rotate the drive roller 81 to rotate the substrate in the horizontal direction, and the brush rotates while supplying the cleaning liquid to the upper and lower surfaces of the substrate from the nozzles 10a and 10b. The both surfaces of the substrate are scrubbed by contacting the substrates 9c and 9c with the substrate.
[0029]
2) After stopping the supply of the cleaning liquid and the rotation of the substrate and retracting the brush from the substrate surface, the rollers 83 and 83 are retracted by sliding the picotable 838 away from the center of the apparatus 1. The end face of the substrate w is separated from the rollers 83, 83, and the suppression of the end face of the substrate by the holding roller is released.
[0030]
3) The second substrate holding means 7 is raised by the cylinder 5, and the substrate end surface is brought into contact with the grippers 72, 72, 72 standing at the tips of the arms 71, 71, 71 of the jig 70. Is kept floating above the arm.
[0031]
4) The servo motor 4 is driven and the rotating shaft 3 is rotated to rotate the substrate held by the grippers 72, 72, 72 of the second substrate holding means 7, and the upper surface of the rotating substrate is rotated. Then, gas is supplied from the dry gas supply nozzles 11a and 11b to the lower surface to spin dry the substrate.
[0032]
After the cleaning and drying are performed as described above, the driving of the servo motor 4 is stopped, and the substrate is moved to the next process (for example, an etching process, a polishing process, or a dicing process) by an unload transfer robot (not shown). Or is carried into a storage cassette.
The second substrate holding means 7 is lowered by the cylinder 5 to the position shown in phantom W 0 in FIG. 2, and waits for the next new substrate loading of.
[0033]
【The invention's effect】
Since the substrate cleaning / drying apparatus 1 of the present invention can perform double-side scrub cleaning and spin drying of a substrate with one apparatus, the footprint can be made compact. The substrate can be spin-dried in a short time by rotating the conventional spin chuck with a motor at a rotation speed similar to that of a spin-drying device rotating at 1000 to 6000 min −1 .
[Brief description of the drawings]
FIG. 1 is a plan view of a spin cleaning / drying apparatus.
FIG. 2 is a cross-sectional view taken along the line II in FIG.
FIG. 3 is a partially enlarged cross-sectional view of a second substrate holding means.
FIG. 4 is a sectional view of a driving roller head portion of the first substrate holding means.
FIG. 5 is a cross-sectional view of a driving roller driving portion of the first substrate holding means.
FIG. 6 is a plan view of a pair of anti-rotation rollers of the first substrate holding means.
FIG. 7 is a cross-sectional view of a free-rolling suppression roller head portion.
FIG. 8 is a cross-sectional view of a means for moving the anti-rolling roller.
FIG. 9 is a plan view of a picotable, which is a component of moving means.
FIG. 10 is a partial perspective view of a known substrate double-side scrub cleaning apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Scrub washing | cleaning / spin drying apparatus 3 Rotating shaft 4 Motor 5 Air cylinder 7 2nd board | substrate holding means 70 Jig 71 Arm 72 Holding tool 8 1st board | substrate holding means 81 Driving roller 82 Rolling roller 83 Rotating roller 819 Reversible motor 838 Pictable (slider)

Claims (2)

基板のスピン洗浄・乾燥装置（１）の中央に設けられた水平方向にサーボモータ（４）により回転可能でシリンダ（５）で上下方向に昇降可能な回転軸（３）、
該回転軸（３）の頭頂部（３ｂ）に設けられた３本のア−ム（７１，７１，７１）を有する治具（７０）の前記ア−ム先端に起立して設けられた把持具（７２，７２，７２）に基板（ｗ）の少なくとも３箇所の端面を当接させて基板を前記ア−ム（７１，７１，７１）より浮かして保持する第２基板保持手段（７）、
基板（ｗ）の端面に当接して基板を保持しつつ回転することができ、回転駆動源によって駆動される一対の駆動ロ−ラ（８１，８１）と、一対の遊転抑えロ−ラ（８２，８２）と、基板の中心点とロ−ラ（８３，８３）間を結ぶ直線の中間点とを結ぶ直線上を移動できる一対の遊転抑えロ−ラ（８３，８３）よりなる保持ロ−ラ（８１，８１，８２，８２，８３，８３）を含む第１基板保持手段（８）、
前記第１基板保持手段（８）に端面を保持された基板（ｗ）の上面および下面をスクラブ洗浄する両面洗浄手段（９）、
前記両面洗浄手段（９）の一対の回転ブラシ（９ｃ，９ｃ）を基板面に移動および基板面より後退させる移動手段、
前記第１基板保持手段（８）に端面を保持された基板（ｗ）の上面および下面に洗浄液を供給する一対（１０ａ，１０ｂ）の洗浄液供給機構（１０）、
および、
前記第２基板保持手段（７）に端面を保持された基板（ｗ）の上面および下面に気体を供給する乾燥気体供給機構（１１）、
を備える基板のスピン洗浄・乾燥装置（１）であって、
前記第２基板保持手段（７）の３本のア−ム（７１，７１，７１）を有する治具（７０）を上下に昇降させた際、治具（７０）に固定された複数のア−ム（７１，７１，７１）は、第１基板保持手段（８）の保持ロ−ラ（８１，８１，８２，８２，８３，８３）に衝突しない空間を通過するものであり、
また、前記第１基板保持手段（８）の保持ロ−ラ（８１，８１，８２，８２，８３，８３）の各中心点は、回転軸（３）の軸心を中心点とする円の同一円周上位置に在り、駆動ロ−ラ（８１，８１）間を結ぶ直線の中間点、遊転抑えロ−ラ（８２，８２）間を結ぶ直線の中間点、および、遊転抑えロ−ラ（８３，８３）間を結ぶ直線の中間点の、これら３つの中間点を結んだ仮想直線はこれら３つの中間点を頂点とする正三角形を示す、
ことを特徴とする、基板のスピン洗浄・乾燥装置（１）。 A rotating shaft (3) which can be rotated by a servo motor (4) in the horizontal direction and can be moved up and down by a cylinder (5) provided in the center of the substrate spin cleaning and drying apparatus (1 ) ;
Grip provided upright at the tip of the arm of a jig (70) having three arms (71, 71, 71) provided at the top (3b ) of the rotating shaft (3). Second substrate holding means (7) for holding the substrate floating above the arm (71, 71, 71) by bringing the end faces of the substrate (w) into contact with the tool (72, 72, 72 ). ,
The end face of the substrate (w) in contact can be rotated while holding the substrate, a pair of drive B that is driven by the rotary drive source - and La (81), a pair of idler suppressed Russia - La ( and 82), the center point of the substrate and Russia - consisting of La (83) - a pair of idler suppressed b can move straight line connecting the point between inside of a straight line connecting between La (83) First substrate holding means (8) including holding rollers (81, 81, 82, 82, 83, 83 ) ;
Sided cleaning means for scrubbing the top surface and the bottom surface of the substrate (w) of the end surface held by the first substrate holding means (8) (9),
Moving means for retracting from the mobile and the substrate surface a pair of rotary brushes (9c, 9c) to the substrate surface of the double-sided cleaning means (9),
Said first pair (10a, 10b) for supplying the upper surface and the cleaning liquid to the lower surface of the substrate held to the end face of the substrate holding means (8) (w) of the cleaning liquid supply mechanism (10),
and,
The second substrate holding means (7) to hold the end surface substrates (w) of the top surface and dry gas supply mechanism for supplying gas to the lower surface (11),
A substrate spin cleaning and drying apparatus (1) comprising:
When the jig (70) having the three arms (71, 71, 71) of the second substrate holding means (7) is moved up and down, a plurality of arms fixed to the jig (70) are provided. The medium (71, 71, 71) passes through a space that does not collide with the holding rollers (81, 81, 82, 82, 83, 83) of the first substrate holding means (8) ;
Each center point of the holding rollers (81, 81, 82, 82, 83, 83) of the first substrate holding means (8) is a circle centered on the axis of the rotating shaft (3). At the same circumferential position, the midpoint of the straight line connecting the drive rollers (81, 81), the midpoint of the straight line connecting the anti-rolling rollers (82, 82), and the anti-spinning roller -The virtual straight line connecting these three intermediate points of the intermediate point of the straight line connecting La (83, 83) indicates an equilateral triangle having these three intermediate points as vertices.
A substrate spin cleaning / drying apparatus (1) characterized in that: 請求項１に記載の基板のスピン洗浄・乾燥装置（１）を用い、次ぎの１）から４）の工程を経て基板（ｗ）を洗浄、ついで基板を乾燥する方法。
１）第１基板保持手段（８）に端面を保持され、水平方向に回転されている基板（ｗ）の上面および下面に洗浄液供給機構（１０）より洗浄液を供給しつつ回転するブラシ（９ｃ，９ｃ）を当接して基板（ｗ）をスクラブ洗浄する。
２）洗浄液の供給および基板の回転を止め、ブラシ（９ｃ，９ｃ）を基板面より後退させた後、保持ロ−ラの一部（８３，８３）を後退させて基板端面の保持ロ−ラ（８１，８１，８２，８２，８３，８３）による抑えを開放する。
３）第２基板保持手段（７）を上昇させ、治具（７０）に固定されているア−ム（７１，７１，７１）先端に起立している把持具（７２，７２，７２）に基板の端面を当接させて基板を前記ア−ム（７１，７１，７１）より浮かして保持する。
４）回転軸（３）を回転させることにより第２基板保持手段（７）の把持具（７２，７２，７２）に保持された基板を回転させ、回転している基板の上面および下面に乾燥気体供給機構（１１）より気体を供給して基板をスピン乾燥させる。 請 Motomeko 1 using a spin cleaning and drying apparatus of substrate according (1), the following 1) cleaning the substrate through the steps of 4) (w) from, and then a method of drying the substrate.
1) Brushes (9c, 9), which rotate while supplying the cleaning liquid from the cleaning liquid supply mechanism (10) to the upper and lower surfaces of the substrate (w) which is held in the first substrate holding means (8) and is rotated in the horizontal direction . The substrate (w) is scrubbed by contacting 9c) .
2) Stop supplying the cleaning liquid and rotating the substrate, and after the brushes (9c, 9c) are retracted from the substrate surface, a part of the holding rollers (83, 83) are retracted to hold the substrate end surface. The restraint by (81, 81, 82, 82, 83, 83) is released .
3) Raise the second substrate holding means (7) and hold it on the gripping tool (72, 72, 72) standing at the tip of the arm (71, 71, 71) fixed to the jig (70). It is brought into contact with the end surface of the substrate by the substrate a - holding floated from beam (71, 71, 71).
4) The substrate held by the gripping tool (72, 72, 72) of the second substrate holding means (7 ) is rotated by rotating the rotating shaft (3) , and dried on the upper and lower surfaces of the rotating substrate. A gas is supplied from a gas supply mechanism (11) to spin dry the substrate.
JP2001028948A 2001-02-06 2001-02-06 Substrate spin cleaning / drying apparatus and cleaning / drying method Expired - Fee Related JP4755348B2 (en)

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