CN215696111U - Cleaning device for semiconductor processing - Google Patents

Cleaning device for semiconductor processing Download PDF

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Publication number
CN215696111U
CN215696111U CN202122359719.2U CN202122359719U CN215696111U CN 215696111 U CN215696111 U CN 215696111U CN 202122359719 U CN202122359719 U CN 202122359719U CN 215696111 U CN215696111 U CN 215696111U
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CN
China
Prior art keywords
semiconductor
fixedly connected
cleaning
semiconductor processing
cleaning apparatus
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Expired - Fee Related
Application number
CN202122359719.2U
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Chinese (zh)
Inventor
翁晓升
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Nantong Jiejing Semiconductor Technology Co ltd
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Nantong Jiejing Semiconductor Technology Co ltd
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Priority to CN202122359719.2U priority Critical patent/CN215696111U/en
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Publication of CN215696111U publication Critical patent/CN215696111U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a cleaning device for semiconductor treatment, which comprises a cleaning box and a box cover, wherein an ultrasonic generator is arranged on one side of the cleaning box, a motor is fixedly connected to the bottom of the cleaning box, a rotating rod is arranged at the output end of the motor, a placing table is arranged at the other end of the rotating rod, a plurality of semiconductor placing grooves are formed in the surface of the placing table, mounting frames are fixedly connected to two sides of the cleaning box, two sliding blocks are connected to the inner wall of each mounting frame in a sliding manner, sliding rods are fixedly connected to the side walls of the two sliding blocks, and semiconductor scrubbers are sleeved on the surfaces of the sliding rods through positioning keys; according to the technical scheme provided by the utility model, the semiconductor can be cleaned simultaneously through the ultrasonic generator and the semiconductor scrubber, so that the cleaning efficiency is greatly improved; set up a plurality of standing grooves through placing the platform surface, attached together causes the not thorough condition of washing when avoiding semiconductor to wash in batches.

Description

Cleaning device for semiconductor processing
Technical Field
The utility model relates to the technical field of semiconductor cleaning, in particular to a cleaning device for semiconductor processing.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has application in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like; the importance of semiconductors is enormous, both from a technological and economic point of view. Semiconductor products can be contaminated by various pollutants in the environment in the manufacturing process, and the pollutants adhered to the surfaces of the semiconductor products can seriously affect the performance, reliability and yield of devices, so that the semiconductor products are generally cleaned after each process of semiconductor manufacturing is finished, and the quality of the semiconductor products is ensured.
The existing semiconductor cleaning device cannot clean thoroughly at one time, so that particles still adhere to the surface of a semiconductor after cleaning, the semiconductor is damaged or even scrapped when being installed, and the cleaning efficiency is greatly reduced by repeated cleaning; meanwhile, when the number of the semiconductors to be cleaned is large, the size of the semiconductors is small, and large-scale and batch cleaning of the wafers is difficult, the wafers are placed into the ultrasonic cleaning tank in batches, so that the placing and taking out are troublesome, and the batch wafers are adhered together in the cleaning tank, so that incomplete cleaning is easily caused.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects in the prior art and provide a cleaning device for semiconductor processing so as to solve the problems in the background art.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a belt cleaning device for semiconductor processing, is including wasing case and case lid, it is provided with supersonic generator to wash case one side, the bottom fixedly connected with motor of washing the case, the motor output is provided with the dwang, the other end of dwang is provided with places the platform, it is provided with a plurality of semiconductor standing grooves to place the platform surface, wash case both sides fixedly connected with mounting bracket, mounting bracket inner wall sliding connection has two sliding blocks, the equal fixed connection slide bar of two sliding block lateral walls, the semiconductor scrubber has been cup jointed through the navigation key on the slide bar surface.
Optionally, the two-way pneumatic cylinder of fixedly connected with in the middle of the mounting bracket, two sliding block fixed connection be in the both ends of two-way pneumatic cylinder, the mounting bracket lateral wall is provided with two spacing holes, the slide bar passes through spacing hole and sliding block fixed connection.
Optionally, the bottom of the cleaning box is fixedly connected with a waterproof cover, and the motor is located inside the waterproof cover.
Optionally, the placing table is of a circular structure, and an anticorrosive layer is arranged on the surface of the placing table.
Optionally, the semiconductor scrubber comprises a round rod, a fixed block and a hairbrush, a through hole is formed in the round rod, a plurality of grooves are formed in the surface of the round rod, springs are fixedly connected to the bottoms of the grooves, the fixed block is fixedly connected to the other ends of the springs, and the hairbrush is arranged at the top end of the fixed block.
Optionally, two sides of the fixing block are provided with protruding blocks.
Optionally, the brushes are detachably connected with the fixed block, and the brushes are arranged on the surface of the round rod in a staggered mode.
Optionally, the semiconductor scrubber is located at both ends of the placing table.
Compared with the prior art, the cleaning device for semiconductor processing provided by the utility model has the following beneficial effects:
according to the utility model, the ultrasonic generator arranged on the outer side of the cleaning box is connected with an external power supply, so that the semiconductor can be cleaned by ultrasonic waves, and the semiconductor scrubbers arranged at two ends of the placing table in the cleaning box can clean the front and back surfaces of the semiconductor, so that secondary cleaning is realized, and the cleaning efficiency is greatly improved; according to the utility model, the conductor placing table is arranged in the cleaning box, the surface of the conductor placing table is provided with the plurality of placing grooves for placing the semiconductors, incomplete cleaning caused by adhesion of the conductors in the cleaning box during batch cleaning of the semiconductors is avoided, meanwhile, the placing table is connected with the motor through the rotating rod to realize rotation, and the semiconductor scrubber is matched to realize comprehensive cleaning of the placed semiconductors.
The utility model realizes the height adjustment of the semiconductor scrubber and the placing table through arranging the bidirectional hydraulic cylinder in the mounting rack to act on the surface of the sliding rod fixedly connected with the side walls of the sliding blocks at the two ends through the positioning key, and the semiconductor scrubber can be adjusted to be attached to the upper surface and the lower surface of the semiconductor for cleaning according to different specifications of the semiconductor to be cleaned; meanwhile, a brush in the semiconductor scrubber is detachably connected to the top end of the fixed block, and the bottom end of the fixed block is fixedly connected with a spring, so that the brush can be attached to the surface of a semiconductor well due to the telescopic function; the staggered arrangement of the semiconductors on the surface of the round rod can completely clean the upper surface and the lower surface of the semiconductor.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of a semiconductor scrubber of the present invention;
FIG. 3 is a schematic view of a structural holding table of the present invention;
fig. 4 is a cross-sectional view of a structural mount of the present invention.
In the figure: 1. a cleaning tank; 2. an ultrasonic generator; 3. a bidirectional hydraulic cylinder; 4. a motor; 5. rotating the rod; 6. a waterproof cover; 7. a placing table; 8. a placement groove; 9. a mounting frame; 10. a slide bar; 11. a round bar; 12. a fixed block; 13. a brush; 14. a raised block; 15. a groove; 16. a spring; 17. a through hole; 18. a slider; 19. a limiting hole; 20. and a box cover.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be further noted that, unless otherwise specifically stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, connected through an intermediate medium, or connected through the insides of two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1-4, in this embodiment: a cleaning device for semiconductor processing comprises a cleaning box 1 and a box cover 20, wherein an ultrasonic generator 2 is arranged on one side of the cleaning box 1, a motor 4 is fixedly connected to the bottom of the cleaning box 1, a rotating rod 5 is arranged at the output end of the motor 4, a placing table 7 is arranged at the other end of the rotating rod 5, a plurality of semiconductor placing grooves 8 are formed in the surface of the placing table 7, mounting frames 9 are fixedly connected to two sides of the cleaning box 1, two sliding blocks 18 are connected to the inner wall of each mounting frame 9 in a sliding mode, sliding rods 10 are fixedly connected to the side walls of the two sliding blocks 18, and semiconductor scrubbers are sleeved on the surfaces of the sliding rods 10 through positioning keys; the ultrasonic generator 2 is arranged on one side of the cleaning box 1, and the semiconductor scrubber is arranged in the cleaning box, so that the secondary cleaning of the semiconductor is realized, the semiconductor is cleaned more cleanly and thoroughly, and the cleaning efficiency is greatly improved; the placing table 7 is connected with the output end of the motor 4 through the rotating rod 5, and when the motor 4 is started to work, the placing table 7 is driven to rotate, so that semiconductors placed on the upper surface of the placing table can be fully contacted with the semiconductor scrubber to realize comprehensive cleaning; the situation that cleaning is not thorough due to the fact that the semiconductor placing grooves 8 are attached together in the cleaning box 1 when batch semiconductor cleaning is carried out is avoided by arranging the plurality of semiconductor placing grooves 8 on the surface of the placing table 7.
Further, the middle of the mounting frame 9 is fixedly connected with a bidirectional hydraulic cylinder 3, two sliding blocks 18 are fixedly connected to two ends of the bidirectional hydraulic cylinder 3, two limiting holes 19 are formed in the side wall of the mounting frame 9, and the sliding rod 10 is fixedly connected with the sliding blocks 18 through the limiting holes 19; the height of the semiconductor scrubber and the height of the placing table 7 are adjusted by arranging the bidirectional hydraulic cylinder 3, and the semiconductor scrubber can be attached to the upper surface and the lower surface of a semiconductor to be cleaned through adjustment according to different cleaned semiconductors.
Further, the bottom of the cleaning box 1 is fixedly connected with a waterproof cover 6, and the motor 4 is positioned inside the waterproof cover 6; the motor 4 can be protected by arranging the waterproof cover 6, and the motor 4 can be used when cleaning liquid is injected into the cleaning tank 1.
Further, the placing table 7 is of a circular structure, and an anticorrosive layer is arranged on the surface of the placing table 7; the placing table 7 is arranged into a circular structure, and a plurality of semiconductor placing grooves 8 can be fully arranged on the surface of the placing table; the provision of the surface anticorrosive layer can prevent the placing table 7 from being corroded by the chemical agent in the cleaning liquid.
Further, the semiconductor scrubber comprises a round rod 11, a fixed block 12 and a brush 13, wherein a through hole 17 is formed in the round rod 11, a plurality of grooves 15 are formed in the surface of the round rod 11, the bottom ends of the grooves 15 are fixedly connected with springs 16, the fixed block 12 is fixedly connected to the other ends of the springs 16, and the brush 13 is arranged at the top end of the fixed block 12; set up spring 16 fixed connection in fixed block 12 bottom, and brush 13 sets up on fixed block 12 top to realize the attached on semiconductor surface that the telescopic function of brush 13 is better through the effect of spring 16.
Furthermore, two sides of the fixed block 12 are provided with convex blocks 14; the convex block 14 is arranged to limit the movement of the fixing block 12 in the groove 15.
Further, the brush 13 is detachably connected with the fixed block 12, and the brush 13 is arranged on the surface of the round rod 11 in a staggered manner; the detachable connection of the brush 13 to the fixed block 12 allows the brush 13 to be replaced when damaged, while the staggered arrangement of the brush 13 allows the semiconductor surface to be cleaned in its entirety.
Further, the semiconductor scrubber is positioned at two ends of the placing table 7; set up the semiconductor scrubber simultaneously and wash the semiconductor top and bottom placing 7 both ends of platform, thereby cooperate supersonic generator 2 to realize the secondary cleaning simultaneously, thereby make the abluent more thorough improvement cleaning efficiency of semiconductor.
The working principle and the using process of the utility model are as follows: when the cleaning device for semiconductor processing is used, a semiconductor to be cleaned is placed in a placing groove 8 arranged on the surface of a placing table 7, cleaning liquid is injected into a cleaning box 1, and a box cover 20 is closed; simultaneously starting an ultrasonic generator 2 arranged at one side of the cleaning box 1 and a motor 4 fixedly connected with the bottom of the cleaning box 1, wherein a waterproof cover 6 is arranged outside the motor 4 for protecting the motor 4; when the motor 4 is started, the rotating rod 5 arranged at the output end of the motor can be driven, and the other end of the rotating rod 5 is connected with the placing table 7, so that the placing table 7 can rotate; the semiconductor cleaning devices are arranged on two sides of the placing table 7, the brush 13 in the semiconductor cleaning device is detachably connected to the top end of the fixed block 12, and the spring 16 is fixedly connected to the bottom end of the fixed block 12, so that the brush 13 can be attached to the surface of a semiconductor in a telescopic function better under the action of the spring 16, and the brush 13 can clean the upper surface and the lower surface of the semiconductor when the placing table 7 rotates; the semiconductor cleaner and the ultrasonic generator 2 work together to thoroughly clean the semiconductor, so that the cleaning efficiency is greatly improved; the semiconductor cleaner is sleeved on the surface of the sliding rod 10 through a positioning key, the sliding rod 10 is fixedly connected with the side wall of the sliding block 18 through a limiting hole 19, the sliding block 18 is fixedly connected with the two ends of the two-way hydraulic cylinder 3 in the middle of the mounting frame 9, so that the height of the semiconductor cleaner and the height of the placing table 7 are adjusted through the two-way hydraulic cylinder 3, and the semiconductor cleaner is attached to the upper surface and the lower surface of the semiconductor to be cleaned through adjustment of different accessible of the cleaned semiconductor.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (8)

1. A cleaning apparatus for semiconductor processing, comprising a cleaning tank (1) and a tank cover (20), characterized in that: wash case (1) one side and be provided with supersonic generator (2), the bottom fixedly connected with motor (4) of washing case (1), motor (4) output is provided with dwang (5), the other end of dwang (5) is provided with places platform (7), it is provided with a plurality of semiconductor standing grooves (8) to place platform (7) surface, wash case (1) both sides fixedly connected with mounting bracket (9), mounting bracket (9) inner wall sliding connection has two sliding blocks (18), the equal fixed connection slide bar (10) of two sliding blocks (18) lateral wall, the semiconductor scrubber has been cup jointed through the navigation key on slide bar (10) surface.
2. A cleaning apparatus for semiconductor processing according to claim 1, wherein: two-way pneumatic cylinder (3) of fixedly connected with in the middle of mounting bracket (9), two sliding block (18) fixed connection be in the both ends of two-way pneumatic cylinder (3), mounting bracket (9) lateral wall is provided with two spacing holes (19), slide bar (10) are passed through spacing hole (19) and sliding block (18) fixed connection.
3. A cleaning apparatus for semiconductor processing according to claim 1, wherein: wash case (1) bottom fixed connection buckler (6), just motor (4) are located inside buckler (6).
4. A cleaning apparatus for semiconductor processing according to claim 1, wherein: the placing table (7) is of a circular structure, and an anti-corrosion layer is arranged on the surface of the placing table (7).
5. A cleaning apparatus for semiconductor processing according to claim 1, wherein: semiconductor scrubber includes round bar (11), fixed block (12) and brush (13), through-hole (17) have been seted up to round bar (11) inside, a plurality of recesses (15) have been seted up on round bar (11) surface, recess (15) bottom fixedly connected with spring (16), fixed block (12) fixed connection is at the other end of spring (16), brush (13) set up on fixed block (12) top.
6. A cleaning apparatus for semiconductor processing according to claim 5, wherein: and the two sides of the fixed block (12) are provided with convex blocks (14).
7. A cleaning apparatus for semiconductor processing according to claim 5, wherein: the hairbrush (13) is detachably connected with the fixed block (12), and the hairbrush (13) is arranged on the surface of the round rod (11) in a staggered mode.
8. A cleaning apparatus for semiconductor processing according to claim 1, wherein: the semiconductor scrubber is positioned at two ends of the placing table (7).
CN202122359719.2U 2021-09-28 2021-09-28 Cleaning device for semiconductor processing Expired - Fee Related CN215696111U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122359719.2U CN215696111U (en) 2021-09-28 2021-09-28 Cleaning device for semiconductor processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122359719.2U CN215696111U (en) 2021-09-28 2021-09-28 Cleaning device for semiconductor processing

Publications (1)

Publication Number Publication Date
CN215696111U true CN215696111U (en) 2022-02-01

Family

ID=80025695

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122359719.2U Expired - Fee Related CN215696111U (en) 2021-09-28 2021-09-28 Cleaning device for semiconductor processing

Country Status (1)

Country Link
CN (1) CN215696111U (en)

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Granted publication date: 20220201