CN216389269U - Tin stripping device for semiconductor - Google Patents
Tin stripping device for semiconductor Download PDFInfo
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- CN216389269U CN216389269U CN202122253616.8U CN202122253616U CN216389269U CN 216389269 U CN216389269 U CN 216389269U CN 202122253616 U CN202122253616 U CN 202122253616U CN 216389269 U CN216389269 U CN 216389269U
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Abstract
The application provides a back tin device for semiconductor includes: the processing case, one side surface of processing case is provided with a motor box, the inside of processing case is provided with washs the case and moves back the tin case, it sets up in one side of moving back the tin case to wash the case, the inside of processing case is provided with coupling mechanism. According to the tin stripping device for the semiconductor, the tin stripping mechanism can rapidly strip tin for the semiconductor, the first motor and the electric telescopic rod are matched for use through the tin stripping liquid, the electric telescopic rod, the lead screw transmission device and the fixing clamp, the fixing clamp drives the semiconductor to move from the tin stripping box to the cleaning box, the tin stripping liquid strips tin for the semiconductor, and the second motor drives the semiconductor to rotate in the tin stripping liquid, so that the tin stripping efficiency of the semiconductor is improved, the tin stripping device is convenient for people to use, the structure of the whole device is simple, the operation is convenient, and the practicability of the whole tin stripping device is improved.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a tin stripping device for a semiconductor.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has application in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device made of the semiconductor;
after the plastic package process of the semiconductor package product is completed, the exposed central heat dissipation pad and the pins need to be electroplated with a tin layer, and the tin layer has two functions: on one hand, the solderability of the packaging component can be improved, so that the subsequent solderability with other parts is better; on the other hand, the bare metal pin is protected, the thickness of the tin layer is usually 7-25 um, in the actual production, the quality abnormity of the large area of the electroplated tin layer inevitably occurs, such as the thickness exceeds the specification range, especially the thickness of the tin layer is too thin, the plastic package material remains on the surface of the metal pin in the previous procedure, the scratch of the tin layer of the material caused by improper operation in the process technology after electroplating causes the copper layer of the pin to be bare, the tin layer to be polluted and the like, at this time, the tin layer needs to be stripped and removed, and electroplating is carried out again to ensure the product quality;
the existing tin stripping device has certain defects when being used, the existing tin stripping device adopts an artificial mode when being used, defective products are placed in a loading jig, the loading jig is soaked in a cleaning reagent, the surface of the defective products is manually cleaned, the tin stripping efficiency is low, and the requirements of people cannot be met.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a tin stripping device for a semiconductor, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the utility model adopts the technical scheme that:
a tin stripping device for a semiconductor comprises:
the processing box is characterized in that a first motor box is arranged on the outer surface of one side of the processing box, a cleaning box and a tin stripping box are arranged inside the processing box, the cleaning box is arranged on one side of the tin stripping box, and a connecting mechanism is arranged inside the processing box; and
move back tin mechanism, move back tin mechanism and set up the inside at the processing case, move back tin mechanism and include moving back tin liquid, electric telescopic handle, two sets of screw drive and a plurality of fixation clamp of group, move back the tin liquid setting in the inside of moving back the tin case, screw drive sets up on the inner wall of processing case, the last fixed plate that is provided with of screw drive, electric telescopic handle's one end is provided with the turning block, the turning block sets up the bottom surface at the fixed plate, the top surface of fixed plate is provided with No. two motor boxes, electric telescopic handle keeps away from the one end of turning block and is provided with the connecting plate, the fixation clamp sets up on the connecting plate.
Preferably, the inside of a motor box is provided with two sets of motors that match with screw drive, the inside of a motor box is provided with the motor of No. two that is connected with the turning block.
Thereby the motor drives lead screw transmission and removes and drive the fixation clamp and remove different positions, and No. two motors drive electric telescopic handle and rotate to drive the fixation clamp and rotate, make the semiconductor main part rotate in the tin liquid that moves back for the semiconductor main part moves back tin.
Preferably, a plurality of groups all are provided with the connection rope on the fixation clamp, the bottom surface of connecting plate is provided with the mounting that a plurality of groups and connection rope are connected, be provided with the semiconductor main part on the fixation clamp.
The fixing clip can start to fix the semiconductor body, so that batch stripping of the tin of the semiconductor body can be carried out at one time.
Preferably, a blower is arranged on the inner wall of the processing box and is arranged on one side of the cleaning box.
Preferably, the connecting mechanism comprises two groups of connecting seats, two groups of connecting blocks and two groups of connecting rods, the two groups of connecting seats are respectively arranged on the two groups of screw rod transmission devices, the connecting blocks and the connecting rods are arranged on the connecting seats, and a connecting piece connected with the connecting seats is arranged on the outer surface of one side, away from the connecting seats, of each connecting block.
Preferably, a connecting groove is formed in the connecting seat, a connecting block is arranged in the connecting groove, the connecting block is arranged in the connecting groove, a connecting groove is formed in the outer surface of one side, away from the connecting piece, of the connecting block, and the connecting block is arranged in the connecting groove.
Preferably, the outer surface of one side of No. two connecting blocks and the outer surface of one side of a connecting block all are provided with the connecting hole, the one end of connecting rod runs through the outer surface of one side of connecting seat to set up in the connecting hole.
Preferably, the two sides of the outer surface of the processing box are provided with box doors, and the box doors are arranged below the first motor box.
The two groups of box doors are convenient for workers to fix the semiconductor main body to be subjected to tin stripping on the fixing clamp or take down the semiconductor subjected to tin stripping from the fixing clamp.
Compared with the prior art, the utility model has the following beneficial effects:
1. the tin stripping mechanism can rapidly strip tin for the semiconductor, the first motor and the electric telescopic rod are matched for use through the tin stripping liquid, the electric telescopic rod, the lead screw transmission device and the fixing clamp, the fixing clamp drives the semiconductor to move from the tin stripping box to the cleaning box, the tin stripping liquid strips tin for the semiconductor, and the second motor drives the semiconductor to rotate in the tin stripping liquid, so that the tin stripping efficiency of the semiconductor is improved, convenience is brought to people for use, the whole device is simple in structure and convenient to operate, and the practicability of the whole tin stripping device is improved;
2. through the coupling mechanism who sets up, coupling mechanism can be connected fixed plate and screw drive device fast, through the connecting seat that sets up, a connecting block, connecting rod and No. two connecting blocks, a connecting block and No. two connecting block are connected and can be connected fixed plate and connecting seat, the connection of connecting rod and No. two connecting blocks can increase the connection stability between connecting seat and the connecting block, and make things convenient for the staff to maintain the device, make things convenient for people to use, whole device simple structure, and convenient for operation, the suitability of whole tin device that moves back has been increased.
Drawings
FIG. 1 is a schematic diagram of a solder stripping apparatus for semiconductor according to the present invention;
FIG. 2 is a partial structural view of a tin stripping mechanism in a tin stripping device for a semiconductor according to the present invention;
FIG. 3 is an enlarged view of the structure A in FIG. 2 in a tin stripping apparatus for semiconductor according to the present invention;
FIG. 4 is a partial structural view of a connection mechanism in a tin stripping device for a semiconductor according to the present invention;
FIG. 5 is an enlarged view of a structure B in FIG. 4 of a tin stripping apparatus for semiconductor according to the present invention;
FIG. 6 is a partial structure view of a first connection block of a solder stripping apparatus for semiconductor according to the present invention;
FIG. 7 is a top view of a connecting socket of the solder stripping apparatus for semiconductor of the present invention;
FIG. 8 is a partial view of a connection socket of the solder stripping apparatus for semiconductor according to the present invention;
FIG. 9 is a partial structural view of a connection board in a tin stripping device for a semiconductor according to the present invention.
In the figure: 1. a processing box; 2. a first motor box; 3. a cleaning tank; 4. a tin stripping box; 5. removing tin liquid; 6. an electric telescopic rod; 7. a lead screw drive; 8. a fixing clip; 9. a fixing plate; 10. rotating the block; 11. a second motor box; 12. a connecting plate; 13. a semiconductor body; 14. a blower; 15. a connecting seat; 16. a first connecting block; 17. a connecting rod; 18. and a second connecting block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. In addition, for the convenience of description, the terms "upper", "lower", "left" and "right" are used to refer to the same direction as the upper, lower, left, right, etc. of the drawings, and the terms "first", "second", etc. are used for descriptive distinction and have no special meaning.
Example 1
Referring to fig. 1 to 9, a tin stripping apparatus for a semiconductor includes: the processing box comprises a processing box 1, wherein a first motor box 2 is arranged on the outer surface of one side of the processing box 1, a cleaning box 3 and a tin stripping box 4 are arranged inside the processing box 1, the cleaning box 3 is arranged on one side of the tin stripping box 4, and a connecting mechanism is arranged inside the processing box 1; and
move back tin mechanism, move back tin mechanism and set up the inside at processing case 1, move back tin mechanism and include moving back tin liquid 5, electric telescopic handle 6, two sets of screw drive 7 and a plurality of fixation clamp 8 of organizing, move back tin liquid 5 and set up the inside at moving back tin case 4, screw drive 7 sets up on processing case 1's inner wall, be provided with fixed plate 9 on the screw drive 7, electric telescopic handle 6's one end is provided with turning block 10, turning block 10 sets up the bottom surface at fixed plate 9, the top surface of fixed plate 9 is provided with No. two motor boxes 11, electric telescopic handle 6 keeps away from the one end of turning block 10 and is provided with connecting plate 12, fixation clamp 8 sets up on connecting plate 12.
Two sets of first motors matched with the screw transmission device 7 are arranged in the first motor box 2, and a second motor connected with the rotating block 10 is arranged in the second motor box 11.
The output shaft of the second motor penetrates through the outer surface of the bottom end of the fixed plate 9 and is connected with the rotating shaft of the rotating block 10.
Radiating holes are formed in two sides of the outer surface of the first motor box 2.
All be provided with on a plurality of groups fixation clamp 8 and connect the rope, the bottom surface of connecting plate 12 is provided with a plurality of groups and connects the mounting of being connected of rope, is provided with semiconductor body 13 on the fixation clamp 8.
The inner wall of the processing tank 1 is provided with a blower 14, and the blower 14 is provided at one side of the washing tank 3.
The outer surface both sides of processing case 1 all are provided with the chamber door, and the chamber door sets up the below at a motor box 2.
An observation window is arranged on the outer surface of the front end of the processing box 1.
Starting a tin stripping mechanism, fixing a semiconductor main body 13 on a fixing clamp 8, starting a first motor, driving one end of a lead screw transmission device 7 to drive a fixing plate 9 to move, starting an electric telescopic rod 6 to drive a connecting plate 12 to move to a tin stripping position after the fixing plate 9 moves to the upper part of a tin stripping box 4, immersing the semiconductor main body 13 in tin stripping liquid 5, starting a second motor, driving a rotating block 10 to rotate, driving the electric telescopic rod 6 to rotate, driving the connecting plate 12 to rotate, driving a connecting rope to rotate, driving the fixing clamp 8 to rotate, driving the semiconductor main body 13 to rotate, and carrying out tin stripping treatment on the semiconductor main body 13;
after tin stripping is finished, starting a first motor, moving the semiconductor body 13 to the position above the cleaning box 3, starting the electric telescopic rod 6, immersing the semiconductor body 13 in cleaning liquid for cleaning, driving the semiconductor body 13 to move to an air drying position by the electric telescopic rod 6 after cleaning is finished, and starting the air blower 14 to air-dry the semiconductor body 13;
move back tin mechanism through setting up, move back tin mechanism and can move back tin to the semiconductor fast, move back tin liquid 5 through setting up, electric telescopic handle 6, screw drive 7 and fixation clamp 8, a motor and electric telescopic handle 6 cooperation are used, fixation clamp 8 drives semiconductor main part 13 and removes in wasing case 3 from moving back tin case 4, move back tin liquid 5 and move back tin to semiconductor main part 13 and handle, No. two motors drive semiconductor main part 13 and rotate in moving back tin liquid 5, improve semiconductor's tin efficiency that moves back, make things convenient for people to use, whole device simple structure, and convenient for operation has increased the practicality of whole tin device that moves back.
Example 2
Referring to fig. 1 to 9, the present embodiment is a semiconductor tin stripping apparatus, which is compared with embodiment 1, and further includes the following structure:
the connecting mechanism comprises two groups of connecting seats 15, two groups of connecting blocks 16 and two groups of connecting rods 17, the two groups of connecting seats 15 are respectively arranged on the two groups of screw transmission devices 7, the connecting blocks 16 and the connecting rods 17 are both arranged on the connecting seats 15, and the outer surface of one side, away from the connecting seats 15, of each connecting block 16 is provided with a connecting piece connected with the connecting seats 15.
Connecting seat 15 is last to have seted up the spread groove No. one, is provided with No. two connecting blocks 18 in the spread groove, and a connecting block 16 sets up in the spread groove No. one, and No. two spread grooves have been seted up to a connecting block 16 one side surface of keeping away from the connecting piece, and No. two connecting blocks 18 set up in No. two spread grooves.
The outer surface of one side of No. two connecting blocks 18 and the outer surface of one side of No. one connecting block 16 all are provided with the connecting hole, and the one end of connecting rod 17 runs through the outer surface of one side of connecting seat 15 to set up in the connecting hole.
Adjusting the connecting mechanism, drawing the connecting rod 17 out of the connecting hole, removing the first connecting block 16 from the first connecting groove, removing the second connecting block 18 from the second connecting groove, separating the fixing plate 9 from the connecting seat 15, and performing quick maintenance on the device;
through the coupling mechanism who sets up, coupling mechanism can couple together fixed plate 9 and screw drive 7 fast, connecting seat 15 through setting up, connecting block 16, connecting rod 17 and No. two connecting blocks 18, connecting block 16 and No. two connecting blocks 18 are connected and can be connected fixed plate 9 and connecting seat 15, connecting rod 17 and No. two connecting blocks 18's connection can increase the connection stability between connecting seat 15 and connecting block 16, and make things convenient for the staff to maintain the device, whole device simple structure, high durability and convenient operation, the suitability of whole tin device that moves back has been increased.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (8)
1. A tin stripping device for a semiconductor is characterized by comprising:
the tin removing machine comprises a processing box (1), wherein a first motor box (2) is arranged on the outer surface of one side of the processing box (1), a cleaning box (3) and a tin removing box (4) are arranged inside the processing box (1), the cleaning box (3) is arranged on one side of the tin removing box (4), and a connecting mechanism is arranged inside the processing box (1); and
the tin stripping mechanism is arranged inside the processing box (1), and comprises tin stripping liquid (5), an electric telescopic rod (6), two groups of lead screw transmission devices (7) and a plurality of groups of fixing clamps (8), the tin stripping liquid (5) is arranged inside the tin stripping box (4), the lead screw transmission device (7) is arranged on the inner wall of the processing box (1), a fixed plate (9) is arranged on the lead screw transmission device (7), a rotating block (10) is arranged at one end of the electric telescopic rod (6), the rotating block (10) is arranged on the outer surface of the bottom end of the fixed plate (9), the outer surface of the top end of the fixed plate (9) is provided with a second motor box (11), one end, far away from the rotating block (10), of the electric telescopic rod (6) is provided with a connecting plate (12), and the fixing clamp (8) is arranged on the connecting plate (12).
2. The tin stripping device for the semiconductor according to claim 1, characterized in that: the inside of a motor box (2) is provided with two sets of motors matched with the screw rod transmission device (7), and the inside of a motor box (11) is provided with a motor connected with the rotating block (10).
3. The tin stripping device for the semiconductor according to claim 1, characterized in that: the semiconductor connecting device is characterized in that a plurality of groups of connecting ropes are arranged on the fixing clamps (8), a plurality of groups of fixing pieces connected with the connecting ropes are arranged on the outer surfaces of the bottoms of the connecting plates (12), and semiconductor bodies (13) are arranged on the fixing clamps (8).
4. The tin stripping device for the semiconductor according to claim 1, characterized in that: the inner wall of the processing box (1) is provided with a blower (14), and the blower (14) is arranged on one side of the cleaning box (3).
5. The tin stripping device for the semiconductor according to claim 1, characterized in that: the connecting mechanism comprises two groups of connecting seats (15), two groups of connecting blocks (16) and two groups of connecting rods (17), the connecting seats (15) are arranged on the two groups of screw rod transmission devices (7) respectively, the connecting blocks (16) and the connecting rods (17) are arranged on the connecting seats (15), and a connecting piece connected with the connecting seats (15) is arranged on the outer surface of one side, away from the connecting seats (15), of each connecting block (16).
6. The tin stripping device for the semiconductor according to claim 5, characterized in that: the connecting device is characterized in that a connecting groove is formed in the connecting seat (15), a connecting block (18) is arranged in the connecting groove, the connecting block (16) is arranged in the connecting groove, the outer surface of one side, away from the connecting piece, of the connecting block (16) is provided with a connecting groove, and the connecting block (18) is arranged in the connecting groove.
7. The tin stripping device for the semiconductor according to claim 6, characterized in that: the outer surface of one side of No. two connecting blocks (18) and the outer surface of one side of connecting block (16) all are provided with the connecting hole, the one end of connecting rod (17) runs through the outer surface of one side of connecting seat (15) to set up in the connecting hole.
8. The tin stripping device for the semiconductor according to claim 1, characterized in that: and the two sides of the outer surface of the processing box (1) are provided with box doors, and the box doors are arranged below the first motor box (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122253616.8U CN216389269U (en) | 2021-09-17 | 2021-09-17 | Tin stripping device for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122253616.8U CN216389269U (en) | 2021-09-17 | 2021-09-17 | Tin stripping device for semiconductor |
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| Publication Number | Publication Date |
|---|---|
| CN216389269U true CN216389269U (en) | 2022-04-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122253616.8U Active CN216389269U (en) | 2021-09-17 | 2021-09-17 | Tin stripping device for semiconductor |
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| CN (1) | CN216389269U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117545183A (en) * | 2023-11-17 | 2024-02-09 | 恩平冠铨电子有限公司 | Solder stripping device for PCB production and manufacture |
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2021
- 2021-09-17 CN CN202122253616.8U patent/CN216389269U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117545183A (en) * | 2023-11-17 | 2024-02-09 | 恩平冠铨电子有限公司 | Solder stripping device for PCB production and manufacture |
| CN117545183B (en) * | 2023-11-17 | 2024-04-02 | 恩平冠铨电子有限公司 | Solder stripping device for PCB production and manufacture |
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