CN102522357A - Brushing device for wafer - Google Patents
Brushing device for wafer Download PDFInfo
- Publication number
- CN102522357A CN102522357A CN2011104488148A CN201110448814A CN102522357A CN 102522357 A CN102522357 A CN 102522357A CN 2011104488148 A CN2011104488148 A CN 2011104488148A CN 201110448814 A CN201110448814 A CN 201110448814A CN 102522357 A CN102522357 A CN 102522357A
- Authority
- CN
- China
- Prior art keywords
- wafer
- hairbrush
- brushing device
- roller
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a brushing device for a wafer. The brushing device for the wafer comprises a sealed box, a first door body, a strutting piece, a first hair brush and a second hair brush, wherein an accommodating cavity is defined in the sealed box; a wafer taking and placing hole is arranged on a side wall of the accommodating cavity; the first door body is arranged on the side wall and is used for opening and closing the wafer taking and placing hole; the strutting piece is arranged in the accommodating cavity and is used for rotatablely supporting the wafer which is oriented along the vertical direction; the first hair brush and the second hair brush are oppositely arranged in the accommodating cavity at an interval to be respectively used for brushing two surfaces of the wafer. When the wafer is brushed by utilizing the brushing device disclosed by the embodiment of the invention, the wafer can be prevented from being polluted by foreign dirt, so that the cleanliness of the wafer can be greatly improved.
Description
Technical field
The present invention relates to field of semiconductor manufacture, in particular to a kind of brushing device that is used for wafer.
Background technology
The CMP process of wafer (hereinafter to be referred as CMP technology) is acknowledged as the technology that effectively realizes overall planarization at present, is widely used in the chip manufacturing field.And after the wafer CMP technology, surface contaminants such as the residual organic compound of crystal column surface, particle and metal impurities, and surface contaminants will influence following one technology of wafer, and then the Performance And Reliability of grievous injury chip.For this reason, need after CMP technology, scrub to remove its surface contaminants wafer.
Summary of the invention
The present invention is intended to solve at least one of technical problem that exists in the prior art.
For this reason, one object of the present invention is to propose a kind of brushing device that is used for wafer that can scrub wafer better.
For realizing above-mentioned purpose, according to embodiments of the invention a kind of brushing device that is used for wafer is proposed, said brushing device comprises: stuffing box, be limited with container cavity in the said stuffing box, the sidewall of wherein said container cavity is provided with wafer and picks and places the hole; First body, said first body are located at and are used to open and close said wafer on the said sidewall and pick and place the hole; Strutting piece, said strutting piece are located at and are used for rotatably supporting vertically directed wafer in the said container cavity; With first hairbrush and second hairbrush, said first hairbrush and said second hairbrush relatively and are at interval turned up the soil and are located in the said container cavity to be respectively applied for two surfaces scrubbing said wafer.
Pick and place the hole according to the brushing device that is used for wafer of the embodiment of the invention through on the sidewall of the container cavity of said stuffing box, said wafer being set; Thereby can in manipulator picks and places the process of wafer, make said manipulator be in the side (rather than top of said wafer, said first hairbrush and said second hairbrush) of said wafer, said first hairbrush and said second hairbrush all the time, can avoid the particle on said manipulator and the drive unit (not shown) thereof to drop on said wafer, said first hairbrush and said second hairbrush and pollute said wafer, said first hairbrush and said second hairbrush like this with grinding away.Therefore, scrub said wafer, can avoid said wafer to receive the pollution of external dirt, thereby can improve the cleanliness factor of said wafer widely through utilizing said brushing device.
In addition, the brushing device that is used for wafer according to the above embodiment of the present invention can also have following additional technical characterictic:
According to one embodiment of present invention, the said brushing device that is used for wafer also comprises auxiliary supports, and said auxiliary supports is located at and is used in the said container cavity with said strutting piece in the vertical direction said wafer being positioned.Through said auxiliary supports is set; Said wafer more stably is supported on the said strutting piece; And can more said wafer be located in the vertical direction, thereby can scrub, improve widely the cleanliness factor of said wafer better to said wafer.
According to one embodiment of present invention; Said strutting piece comprises that first roller and second roller and said auxiliary supports are the 3rd roller, and said wafer and said wafer is vertically directed is supported in wherein said the 3rd roller and said first roller and the cooperation of second roller.
According to one embodiment of present invention, the said brushing device that is used for wafer also comprises frame, and said frame is located in the said container cavity, and wherein said strutting piece, said first hairbrush, said second hairbrush and said auxiliary supports are located on the said frame.Through said frame is set; Thereby said strutting piece, said first hairbrush, said second hairbrush and said auxiliary supports can be installed with being more prone to, simplify the structure of said brushing device so widely and reduced the manufacture difficulty of said brushing device widely.
According to one embodiment of present invention, said auxiliary supports can be located on the said frame up or down.
According to one embodiment of present invention, the said wafer of vicinity in said first roller and said second roller picks and places of hole and can be located at up or down on the said frame.Can be arranged on up or down on the said frame through the said wafer of vicinity in said first roller and said second roller being picked and placeed of hole, thereby can simplify the motion of said manipulator, improve the efficient that said manipulator picks and places said wafer.
According to one embodiment of present invention, the said brushing device that is used for wafer also comprises first actuator, and said first actuator is located on the said sidewall and links to each other with said first body and opens and closes said wafer and pick and place the hole so that drive said first body.Through said first actuator is set, thereby can pick and place the hole utilizing said manipulator to pick and place automatically to open and close said wafer in the process of said wafer, can improve the automaticity of said brushing device so widely.
According to one embodiment of present invention, a wall in the antetheca of said container cavity and the rear wall is provided with hairbrush and changes hole and second body that is used to open and close said hairbrush replacing hole.So not only can prolong the useful life of said brushing device widely, and can remain said first hairbrush and the cleaning of said second hairbrush, thereby can scrub, improve widely the cleanliness factor of said wafer better to said wafer.
According to one embodiment of present invention, the said brushing device that is used for wafer also comprises second actuator, and said second actuator is located on the said wall and links to each other with said second body and opens and closes said hairbrush and change the hole so that drive said second body.Through said second actuator is set, change the hole thereby can automatically open and close said hairbrush, can improve the automaticity of said brushing device so widely.
According to one embodiment of present invention, said first actuator and said second actuator are cylinder.
Additional aspect of the present invention and advantage part in the following description provide, and part will become obviously from the following description, or recognize through practice of the present invention.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage obviously with are easily understood becoming the description of embodiment from combining figs, wherein:
Fig. 1 is according to the structural representation of the brushing device that is used for wafer of the embodiment of the invention (during the manipulator grasping silicon wafer);
Fig. 2 is according to the structural representation of the brushing device that is used for wafer of the embodiment of the invention when grasping silicon wafer (manipulator not);
Fig. 3 is the partial structurtes sketch map that is used for the brushing device of wafer according to an embodiment of the invention; With
Fig. 4 is the partial structurtes sketch map of the brushing device that is used for wafer according to another embodiment of the invention.
Embodiment
Describe embodiments of the invention below in detail, the example of said embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Be exemplary through the embodiment that is described with reference to the drawings below, only be used to explain the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention; It will be appreciated that; Term " vertically ", " laterally ", " on ", the orientation of indications such as D score, " preceding ", " back ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward " or position relation be for based on orientation shown in the drawings or position relation; Only be to describe with simplifying for the ease of describing the present invention; Rather than the device or the element of indication or hint indication must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.
In addition, term " first ", " second " only are used to describe purpose, and can not be interpreted as indication or hint relative importance.
In description of the invention, unless otherwise prescribed and limit, need to prove; Term " installation ", " linking to each other ", " connection " should be done broad understanding, for example, can be mechanical connection or electrical connection; Also can be the connection of two element internals, can be directly to link to each other, and also can link to each other indirectly through intermediary; For those of ordinary skill in the art, can understand the concrete implication of above-mentioned term as the case may be.
With reference to Fig. 1-4 brushing device that is used for wafer 20 10 according to the embodiment of the invention is described below.Shown in Fig. 1-4, comprise stuffing box 100, first body (not shown), strutting piece 200, first hairbrush 300 and second hairbrush 400 according to the brushing device that is used for wafer 20 10 of the embodiment of the invention.
Be limited with container cavity 110 in the stuffing box 100, wherein the sidewall of container cavity 110 is provided with wafer and picks and places hole 120.Said first body is located at and is used to open and close wafer on the said sidewall and picks and places hole 120.Strutting piece 200 is located at and is used in the container cavity 110 rotatably supporting vertically (vertical direction B shown in the direction of arrow of Fig. 1 and Fig. 2, i.e. above-below direction) directed wafer 20.First hairbrush 300 and second hairbrush 400 relatively and are at interval turned up the soil and are located in the container cavity 110 to be respectively applied for two surfaces scrubbing wafer 20.
When utilization is scrubbed wafer 20 according to the brushing device that is used for wafer 20 10 of the embodiment of the invention; The wafer 20 that manipulator 30 will not scrubbed picks and places hole 120 from the wafer on the sidewall of container cavity 110 and is placed on the strutting piece 200, and the wafer after will scrubbing 20 picks and places hole 120 taking-ups from wafer.
Pick and place hole 120 according to the brushing device that is used for wafer 20 10 of the embodiment of the invention through on the sidewall of the container cavity 110 of stuffing box 100, wafer being set; Thereby can in manipulator 30 picks and places the process of wafer 20, make manipulator 30 be in the side (rather than top of wafer 20, first hairbrush 300 and second hairbrush 400) of wafer 20, first hairbrush 300 and second hairbrush 400 all the time, can avoid the particle on manipulator 30 and the drive unit (not shown) thereof to drop on wafer 20, first hairbrush 300 and second hairbrush 400 and polluting wafer 20, first hairbrush 300 and second hairbrush 400 like this with grinding away.Therefore, scrub wafer 20, can avoid wafer 20 to receive the pollution of external dirt, thereby can improve the cleanliness factor of wafer 20 widely through utilizing brushing device 10.
In addition; Because wafer 20 is vertically directed when scrubbing wafer 20; Therefore scrubbing the particle and the chemical agent that get off from wafer 20 can flow downward on the surface along wafer 20 along with cleaning fluid (for example deionized water) together vertically; And discharge from the bottom of stuffing box 100, can improve the cleanliness factor of wafer 20 so widely.
Wherein, the sidewall of the container cavity 110 of stuffing box 100 is meant the Zuo Bi of container cavity 110 and one (left and right directions A is shown in the direction of arrow among Fig. 1 and Fig. 2) in the right wall.When scrubbing wafer 20, said first body can be closed wafer and picked and placeed hole 120, thereby can prevent that cleaning fluid from spilling in container cavity 110.
Like Fig. 1, Fig. 2 and shown in Figure 4, in some embodiments of the invention, brushing device 10 can also comprise auxiliary supports, and said auxiliary supports can be located at and be used in the container cavity 110 with strutting piece 200 in the vertical directions wafer 20 being positioned.Through said auxiliary supports is set; Wafer 20 more stably is supported on the strutting piece 200; And can more accurately wafer 20 be located in the vertical directions, thereby can scrub, improve widely the cleanliness factor of wafer 20 better to wafer 20.In other words, through said auxiliary supports is set, can prevent that wafer 20 from departing from vertical direction in the process of scrubbing.
In one embodiment of the invention, like Fig. 1, Fig. 2 and shown in Figure 4, strutting piece 200 can comprise first roller 210 and second roller 220, and said auxiliary supports can be the 3rd roller 500.Wherein, the 3rd roller 500 and first roller 210 and second roller 220 supporting wafer 20 and wafer 20 is vertically directed of can cooperating.
Advantageously, brushing device 10 can also comprise the frame (not shown), and said frame can be located in the container cavity 110, and wherein strutting piece 200, first hairbrush 300, second hairbrush 400 and said auxiliary supports can be located on the said frame.Through said frame is set, thereby strutting piece 200, first hairbrush 300, second hairbrush 400 and said auxiliary supports can be installed with being more prone to, simplify the structure of brushing device 10 so widely and reduced the manufacture difficulty of brushing device 10 widely.
In examples more of the present invention, said auxiliary supports can be located on the said frame up or down.Advantageously, said auxiliary supports can vertically be located on the said frame movably, and promptly said auxiliary supports can vertically move.Picking and placeing hole 120 with wafer below, to be located on the right wall of container cavity 110 be the fetching process that example (as depicted in figs. 1 and 2) describes wafer 20 in detail.When placing wafer 20; At first said auxiliary supports can move up so that avoid wafer 20; Manipulator 30 carrying wafers 20 can be moved to the left earlier, move down so that wafer 20 is placed on the strutting piece 200 subsequently; Said subsequently auxiliary supports can be moved downward to contact with wafer 20 in case with first roller 210 and second roller, 220 cooperation supporting wafer 20 and wafer 20 is vertically directed, last manipulator 30 breaks away from wafers 20 and also shifts out container cavity 110.The process of taking out wafer 20 is opposite with the process of placing wafer 20, no longer describes in detail at this.
In an example of the present invention, the adjacent wafer in first roller 210 and second roller 220 picks and places of hole 120 and can be located at up or down on the said frame.Advantageously; Adjacent wafer in first roller 210 and second roller 220 picks and places of hole 120 and can vertically be located at movably on the said frame, and promptly the adjacent wafer in first roller 210 and second roller 220 picks and places of hole 120 and can vertically move.
In a concrete example of the present invention, as depicted in figs. 1 and 2, second roller 220 can be located on the said frame up or down.Second roller 220 can move down so that avoid wafer 20 when placing wafer 20 like this; 20 needs of manipulator 30 carrying wafers just are moved to the left and can wafer 20 be placed on first roller 210 and the said auxiliary supports subsequently, and promptly manipulator 30 does not need to move down again.Manipulator 30 is firmly grasped wafer 20 earlier when taking out wafer 20, and second roller 220 can move down so that break away from wafer 20 subsequently, and last manipulator 30 carrying wafers 20 move right and shift out container cavity 110.Therefore, can be arranged on up or down on the said frame, thereby can simplify the motion of manipulator 30, improve the efficient that manipulator 30 picks and places wafer 20 through the adjacent wafer in first roller 210 and second roller 220 being picked and placeed of hole 120.
As depicted in figs. 1 and 2; In some embodiments of the invention, can be provided with hairbrush on the wall in the antetheca of container cavity 110 and the rear wall (wherein fore-and-aft direction C is shown in the direction of arrow among Fig. 1 and Fig. 2) changes hole 130 and is used to open and close second body (not shown) that hairbrush is changed hole 130.Change hole 130 through hairbrush being set on one in the antetheca of container cavity 110 and rear wall, thereby can after first hairbrush 300 and 400 use a period of times of second hairbrush, keep in repair and change first hairbrush 300 and second hairbrush 400.So not only can prolong the useful life of brushing device 10 widely, and can remain first hairbrush 300 and 400 cleanings of second hairbrush, thereby can scrub, improve widely the cleanliness factor of wafer 20 better to wafer 20.
Advantageously, can be provided with hairbrush on the antetheca of container cavity 110 and change and also can be provided with hairbrush on the rear wall of hole 130 and container cavity 110 and change hole 130, thereby can keep in repair and change first hairbrush 300 and second hairbrush 400 with being more prone to.
In one embodiment of the invention; Brushing device 10 can also comprise the first actuator (not shown); Said first actuator can be located on the said sidewall (promptly being provided with the sidewall that wafer picks and places hole 120), and said first actuator can link to each other with said first body and opens and closes wafer and pick and place hole 120 so that drive said first body.Through said first actuator is set, thereby can pick and place hole 120 utilizing manipulator 30 to pick and place automatically to open and close wafer in the process of wafer 20, can improve the automaticity of brushing device 10 so widely.
In an example of the present invention; Brushing device 10 can also comprise the second actuator (not shown); Said second actuator can be located on the said wall (promptly being provided with the wall that hairbrush is changed hole 130), and said second actuator can link to each other with said second body so that drive said second body opening and closing hairbrush replacing hole 130.Through said second actuator is set, change hole 130 thereby can automatically open and close hairbrush, can improve the automaticity of brushing device 10 so widely.Particularly, said first actuator and said second actuator can be cylinders.
Scrub wafer 20 through utilizing according to the brushing device 10 of the embodiment of the invention, can avoid wafer 20 to receive the pollution of external dirt, thereby can improve the cleanliness factor of wafer 20 widely.
In the description of this specification, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means the concrete characteristic, structure, material or the characteristics that combine this embodiment or example to describe and is contained at least one embodiment of the present invention or the example.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete characteristic, structure, material or the characteristics of description can combine with suitable manner in any one or more embodiment or example.
Although illustrated and described embodiments of the invention; Those having ordinary skill in the art will appreciate that: under the situation that does not break away from principle of the present invention and aim, can carry out multiple variation, modification, replacement and modification to these embodiment, scope of the present invention is limited claim and equivalent thereof.
Claims (10)
1. a brushing device that is used for wafer is characterized in that, comprising:
Stuffing box is limited with container cavity in the said stuffing box, and the sidewall of wherein said container cavity is provided with wafer and picks and places the hole;
First body, said first body are located at and are used to open and close said wafer on the said sidewall and pick and place the hole;
Strutting piece, said strutting piece are located at and are used for rotatably supporting vertically directed wafer in the said container cavity; With
First hairbrush and second hairbrush, said first hairbrush and said second hairbrush relatively and are at interval turned up the soil and are located in the said container cavity to be respectively applied for two surfaces scrubbing said wafer.
2. the brushing device that is used for wafer according to claim 1 is characterized in that, also comprises auxiliary supports, and said auxiliary supports is located at and is used in the said container cavity with said strutting piece in the vertical direction said wafer being positioned.
3. the brushing device that is used for wafer according to claim 2; It is characterized in that; Said strutting piece comprises that first roller and second roller and said auxiliary supports are the 3rd roller, and said wafer and said wafer is vertically directed is supported in wherein said the 3rd roller and said first roller and the cooperation of second roller.
4. the brushing device that is used for wafer according to claim 2; It is characterized in that; Also comprise frame, said frame is located in the said container cavity, and wherein said strutting piece, said first hairbrush, said second hairbrush and said auxiliary supports are located on the said frame.
5. the brushing device that is used for wafer according to claim 4 is characterized in that, said auxiliary supports can be located on the said frame up or down.
6. the brushing device that is used for wafer according to claim 4 is characterized in that, the said wafer of vicinity in said first roller and said second roller picks and places of hole and can be located at up or down on the said frame.
7. the brushing device that is used for wafer according to claim 1; It is characterized in that; Also comprise first actuator, said first actuator is located on the said sidewall and links to each other with said first body and opens and closes said wafer and pick and place the hole so that drive said first body.
8. the brushing device that is used for wafer according to claim 7 is characterized in that, a wall in the antetheca of said container cavity and the rear wall is provided with hairbrush and changes the hole and be used to open and close second body that said hairbrush is changed the hole.
9. the brushing device that is used for wafer according to claim 8; It is characterized in that; Also comprise second actuator, said second actuator is located on the said wall and links to each other with said second body and opens and closes said hairbrush and change the hole so that drive said second body.
10. the brushing device that is used for wafer according to claim 9 is characterized in that, said first actuator and said second actuator are cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104488148A CN102522357A (en) | 2011-12-28 | 2011-12-28 | Brushing device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104488148A CN102522357A (en) | 2011-12-28 | 2011-12-28 | Brushing device for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102522357A true CN102522357A (en) | 2012-06-27 |
Family
ID=46293233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104488148A Pending CN102522357A (en) | 2011-12-28 | 2011-12-28 | Brushing device for wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102522357A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103231303A (en) * | 2013-05-15 | 2013-08-07 | 清华大学 | Chemical mechanical polishing device |
| CN103252705A (en) * | 2013-05-15 | 2013-08-21 | 清华大学 | Chemical mechanical polishing device |
| CN106733764A (en) * | 2016-11-16 | 2017-05-31 | 上海云鱼智能科技有限公司 | Active optical equipment decontamination apparatus |
| CN111036616A (en) * | 2019-12-09 | 2020-04-21 | 北京华卓精科科技股份有限公司 | Device and method for removing particles on surface of wafer |
| CN112371591A (en) * | 2020-10-26 | 2021-02-19 | 华海清科(北京)科技有限公司 | Wafer cleaning device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001237209A (en) * | 2000-02-22 | 2001-08-31 | Nisso Engineering Co Ltd | Scrub cleaning device |
| JP2002326062A (en) * | 2001-05-07 | 2002-11-12 | Tokyo Electron Ltd | Cleaning apparatus, cleaning system, and cleaning method |
| US20040200409A1 (en) * | 2002-12-16 | 2004-10-14 | Applied Materials, Inc. | Scrubber with integrated vertical marangoni drying |
| US20050109371A1 (en) * | 2003-10-27 | 2005-05-26 | Applied Materials, Inc. | Post CMP scrubbing of substrates |
| JP2006196636A (en) * | 2005-01-13 | 2006-07-27 | Elpida Memory Inc | Wafer cleaning apparatus and cleaning method |
| US20070006405A1 (en) * | 2005-07-07 | 2007-01-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for wafer cleaning |
| CN201946573U (en) * | 2010-09-03 | 2011-08-24 | 清华大学 | Brushing device for wafer |
-
2011
- 2011-12-28 CN CN2011104488148A patent/CN102522357A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001237209A (en) * | 2000-02-22 | 2001-08-31 | Nisso Engineering Co Ltd | Scrub cleaning device |
| JP2002326062A (en) * | 2001-05-07 | 2002-11-12 | Tokyo Electron Ltd | Cleaning apparatus, cleaning system, and cleaning method |
| US20040200409A1 (en) * | 2002-12-16 | 2004-10-14 | Applied Materials, Inc. | Scrubber with integrated vertical marangoni drying |
| US20050109371A1 (en) * | 2003-10-27 | 2005-05-26 | Applied Materials, Inc. | Post CMP scrubbing of substrates |
| JP2006196636A (en) * | 2005-01-13 | 2006-07-27 | Elpida Memory Inc | Wafer cleaning apparatus and cleaning method |
| US20070006405A1 (en) * | 2005-07-07 | 2007-01-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for wafer cleaning |
| CN201946573U (en) * | 2010-09-03 | 2011-08-24 | 清华大学 | Brushing device for wafer |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103231303A (en) * | 2013-05-15 | 2013-08-07 | 清华大学 | Chemical mechanical polishing device |
| CN103252705A (en) * | 2013-05-15 | 2013-08-21 | 清华大学 | Chemical mechanical polishing device |
| CN103231303B (en) * | 2013-05-15 | 2016-02-24 | 清华大学 | Chemical-mechanical polisher |
| CN106733764A (en) * | 2016-11-16 | 2017-05-31 | 上海云鱼智能科技有限公司 | Active optical equipment decontamination apparatus |
| CN111036616A (en) * | 2019-12-09 | 2020-04-21 | 北京华卓精科科技股份有限公司 | Device and method for removing particles on surface of wafer |
| CN112371591A (en) * | 2020-10-26 | 2021-02-19 | 华海清科(北京)科技有限公司 | Wafer cleaning device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102522357A (en) | Brushing device for wafer | |
| CN103231303B (en) | Chemical-mechanical polisher | |
| CN102513301A (en) | Megasonic cleaning device for wafer | |
| CN108389813B (en) | Silicon wafer cleaning and drying integrated device and cleaning method thereof | |
| CN102856162B (en) | The equipment for the treatment of substrate and the method for discharge supercritical fluid | |
| CN103252705A (en) | Chemical mechanical polishing device | |
| CN203250724U (en) | Wafer cleaning device | |
| CN100428406C (en) | Processing method for the semiconductor pipe core assembly crystal surface | |
| CN103567860A (en) | Workpiece transport device | |
| US20110272871A1 (en) | Wafer Spin Chuck and an Etcher Using the Same | |
| KR101163553B1 (en) | Method of processing a wafer, wafer transfer robot used for performing the same and apparatus for performing the same | |
| CN102332538B (en) | Cleaning device | |
| CN108511372B (en) | Toughened glass cleaning equipment for solar cell packaging | |
| CN101017772A (en) | The cleaning method for removing the impure ion from the semiconductor pipe core assembly | |
| US9211568B2 (en) | Clean function for semiconductor wafer scrubber | |
| CN110323164B (en) | Silicon wafer cleaning device and silicon wafer cleaning method | |
| TWI517234B (en) | Liquid processing device, liquid processing method, and storage medium | |
| CN105097438B (en) | A kind of chip back surface cleaning device | |
| CN102768974A (en) | Wafer cleaning equipment | |
| KR101111492B1 (en) | Dryer for Solar Wafer Cleaner | |
| CN206349341U (en) | A kind of New Polycrystalline silicon chip cleaning machine | |
| CN210092034U (en) | Substrate post-processing device | |
| CN206763465U (en) | A kind of silicon wafer turnover flusher | |
| CN203921990U (en) | A kind of input and output material equipment | |
| TWI664661B (en) | Water channel device of pre- cleaning machine, pre-cleaning machine and pre-cleaning method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120627 |