TWI664661B - Water channel device of pre- cleaning machine, pre-cleaning machine and pre-cleaning method - Google Patents

Abstract

The invention provides a water channel device, a pre-cleaner and a pre-cleaning method for a pre-cleaning machine. The water channel device includes a water tank, and a water inlet and a water outlet provided on a side wall of the water tank. The side wall of the water tank parallel to the extending direction of the water tank or is provided on the side wall of the water tank perpendicular to the extending direction of the water tank. The water channel device for the pre-cleaning machine can reduce or even avoid the corrosion of the wafer by the polishing liquid. The pre-cleaner and the pre-cleaning method have similar advantages.

Description

Water channel device for pre-cleaning machine, pre-cleaning machine and pre-cleaning method

The present invention relates to the field of semiconductor technology, and in particular, to a water channel device, a pre-cleaner, and a pre-cleaning method.

The 12-inch silicon chip has reached the extreme requirements for particles. The particle performance of silicon wafers is divided into two types: light point defect (LPD) and light point defect-nonremovable (LPDN). LPD generally refers to raised particles that can be removed by cleaning, while LPDN refers to concave defects that cannot be removed. As the IC (Integrated Circuit) technology node has approached below 10nm, even a particle of about 20nm, whether it is LPD or LPDN, will be a component killer, causing a yield loss to the later IC process. Therefore, the particle performance of the bare wafer itself becomes particularly important.

The most important impact on particles is the two processes of final polish (FP) and pre-clean after polishing. Final polishing can effectively remove particles by polishing the front side of the wafer (ie, silicon wafer). The particles introduced during polishing, such as slurry residue, and silicon debris, can be effectively removed by pre-cleaning. However, in practice, there is a problem of the waiting time (Q-time) between final polishing and pre-cleaning. Because the polishing liquid used for final polishing is alkaline, if the polishing liquid remains on the wafer, if it is not removed in time, the polishing liquid will corrode the surface of the wafer, causing an increase in LPDN. Current washers are designed to increase throughput (throughtput) and are often designed with water Channel (water channel). The water channel is placed in a washing machine before cleaning the chemical liquid tank (wet batch), and is used to hold a box of wafers (lots, 25 wafers) that have not been put into the cleaning chemical liquid tank for the time being. Due to the limitation of the cleaning time of the cleaning tank, generally a group of wafers (that is, one batch, 50 wafers, and two slots) is allowed to be put in every 15 minutes, and the general water channel can hold 10 boxes of wafers. It means that the last set of wafers (that is, the last batch) needs to wait at least 4x15 = 60min before cleaning can be started. This increases the waiting time and causes potential corrosion of the wafer to the wafer.

Therefore, it is necessary to propose a water channel device, a pre-cleaner, and a pre-cleaning method for a pre-cleaner to at least partially solve the above problems.

A series of simplified forms of concepts are introduced in the summary section, which will be explained in further detail in the detailed description section. The summary of the present invention does not mean trying to define the key features and necessary technical features of the claimed technical solution, let alone trying to determine the protection scope of the claimed technical solution.

In view of the shortcomings of the prior art, the present invention proposes a water channel device, a pre-cleaner, and a pre-cleaning method for a pre-cleaner, which can reduce or even avoid the corrosion of the wafer by the polishing liquid.

In order to overcome the existing problems, an aspect of the present invention provides a water channel device for a pre-cleaning machine, which includes a water tank and a water inlet and a water outlet provided on a side wall of the water tank, and the water inlet and the water outlet are provided at The side wall of the water tank parallel to the extending direction of the water tank or provided on the side wall of the water tank perpendicular to the extending direction of the water tank.

Optionally, the water inlet and the water outlet are respectively disposed on two opposite side walls of the water tank.

Optionally, the water inlet and the water outlet are evenly disposed on a side wall of the water tank.

Another aspect of the present invention provides a water channel device for a pre-washing machine, including: a first water channel, the first water channel including a first water tank and a first water inlet provided on a side wall in the first water tank; A first water outlet, and the first water inlet and the first water outlet are respectively disposed on two side walls of the water tank parallel to the extending direction of the water tank; a second water channel, and the second water channel includes a second water tank And a second water inlet and a second water outlet provided on a side wall of the second water tank, and the second water inlet and the second water outlet are respectively provided in the water tank perpendicular to the direction in which the water tank extends On both side walls.

Optionally, the first water tank can accommodate two crystal boxes, and the second water tank can accommodate eight crystal boxes.

According to the water channel device for a pre-cleaner of the present invention, a water inlet and a water outlet are provided on a side wall of the water tank parallel or perpendicular to the extending direction of the water tank, so that the surface of the wafer can be placed parallel to the water inlet during cleaning. The direction of the connection between the water outlet and the water outlet, so that the water flow can flush the surface of the wafer, so as to better remove the remaining polishing liquid, reduce or even avoid the corrosion of the wafer by the polishing liquid.

According to another aspect of the present invention, a pre-cleaning machine is provided, which includes the water channel device described above and a cleaning liquid tank arranged adjacent to the water channel device.

According to another aspect of the present invention, a pre-cleaner is provided, including the water channel device described above and a cleaning liquid tank arranged adjacent to the second water channel device.

According to the pre-cleaner of the present invention, a water inlet and a water outlet are provided on a side wall of the water channel device that is parallel or perpendicular to the extending direction of the water channel device, so that the wafer surface can be placed parallel to the water inlet and the water outlet during cleaning. The direction of the connection of the water port, so that the water flow can wash the wafer surface, so as to better remove the remaining polishing liquid, reduce or even avoid the corrosion of the wafer by the polishing liquid.

Another aspect of the present invention provides a pre-cleaning method, which includes: sequentially placing a crystal case loaded with a wafer to be cleaned in the water channel device, and when the water inlet and the water outlet are provided in the water tank and the water tank. When the water tank extends on a side wall parallel to the extending direction, the crystal box is placed such that the surface of the wafer is perpendicular to the moving direction of the crystal box in the water tank; when the water inlet and the water outlet are provided in the water tank On the side wall perpendicular to the extending direction of the water tank, the crystal box is placed such that the surface of the wafer is parallel to the moving direction of the crystal box in the water tank; the water channel device is washed with water A wafer; sequentially placing the crystal box in the water channel device into a cleaning liquid tank at a set time interval; and cleaning the wafer in the cleaning liquid tank.

Yet another aspect of the present invention provides a pre-cleaning method, comprising: placing a crystal box loaded with a wafer to be cleaned in the first water channel, and making a surface of the wafer perpendicular to the crystal box at the first Moving direction in a water tank; cleaning the wafer in the first water channel; placing the crystal box in the first water channel into the second water channel, and making the surface of the wafer parallel In the moving direction of the crystal box in the second water tank; washing the wafer in the second water channel; and sequentially putting the wafer in the second water channel into a cleaning solution at a set time interval In the tank; cleaning the wafer in the cleaning liquid tank.

Optionally, the first water channel can accommodate 2 crystal boxes, and the second water channel can accommodate 8 crystal boxes.

According to the pre-cleaning method of the present invention, since the above-mentioned water channel device is adopted, the remaining polishing liquid can be better removed during pre-cleaning, thereby reducing or even avoiding the corrosion of the wafer by the polishing liquid.

100‧‧‧Pre-washer

101‧‧‧ Watercourse

102‧‧‧Cleaning liquid tank

11‧‧‧ Crystal Box

1010‧‧‧ Overflow inlet

200‧‧‧Pre-washer

202‧‧‧Water channel installation

202‧‧‧Cleaning liquid tank

2010‧‧‧Sink

2011‧‧‧Inlet

2012‧‧‧outlet

300‧‧‧Pre-washer

301‧‧‧watercourse device

302‧‧‧Cleaning liquid tank

3010‧‧‧Sink

3011‧‧‧Inlet

3012‧‧‧ Outlet

400‧‧‧Pre-washer

401‧‧‧First watercourse installation

402‧‧‧Second channel installation

403‧‧‧Cleaning liquid tank

4010‧‧‧First Sink

4011‧‧‧First water inlet

4012‧‧‧First Outlet

4020‧‧‧Second Sink

4021‧‧‧Second water inlet

4022‧‧‧Second Outlet

The following drawings of the present invention are used herein as a part of the present invention to understand the present invention. The drawings illustrate embodiments of the invention and their descriptions to explain the principles of the invention.

FIG. 1A shows a schematic top view of a pre-cleaner; FIG. 1B shows a schematic front view of the pre-cleaner shown in FIG. 1A; FIG. 1C shows a schematic left view of the crystal box in FIG. 1A; 1A is a schematic front view of a crystal box; FIG. 2A is a schematic top view of a pre-cleaner according to an embodiment of the present invention; FIG. 2B is a schematic diagram of water flowing through the crystal box when the pre-cleaner shown in FIG. 2A is used for cleaning; 2C shows a schematic front view of the water channel of the pre-cleaner shown in FIG. 2A; FIG. 2D shows the opening and closing of the water inlet / outlet port according to the input amount of the crystal box when cleaning using the pre-cleaner shown in FIG. 2A; 3A shows a schematic top view of a pre-cleaner according to another embodiment of the present invention; FIG. 3B shows a schematic view of water flowing through a crystal box when cleaning is performed using the pre-cleaner shown in FIG. 3A; FIG. 3C shows a pre-cleaner shown in FIG. 3A A schematic side view of the water channel of the washing machine; FIG. 3D shows a schematic diagram of the movement of the crystal box during cleaning using the prewashing machine shown in FIG. 3A; FIG. 4A shows a schematic top view of the prewashing machine according to another embodiment of the present invention; FIG. 4B shows the flow of water during cleaning using the pre-washer shown in FIG. 4A Schematic diagram of the crystal box; FIG. 4C is a schematic diagram illustrating a process of moving the crystal box when the pre-cleaner shown in FIG. 4A is used for cleaning.

In the following description, numerous specific details are given to provide a more thorough understanding of the present invention. However, it will be apparent to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features known in the art are not described.

It should be understood that the present invention can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals indicate the same elements throughout.

It should be understood that when an element or layer is referred to as being "on", "adjacent to", "connected to" or "coupled to" another element or layer, it can be directly on the other element or layer, and Are adjacent, connected or coupled to other elements or layers, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers present. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below can be represented as a second element, component, region, layer or section without departing from the teachings of the present invention.

Spatial relation terms such as "below", "below", "below", "below", "above", "above", etc. may be used herein for convenience of description It is used to describe the relationship between one element or feature and other elements or features shown in the figure. It should be understood that in addition to the orientation shown in the figures, the spatial relationship terminology is intended to include different orientations of the elements in use and operation. For example, if an element in the drawing is turned over, then an element or feature described as "below" or "beneath" other elements or features would then be oriented "above" the other element or feature. Thus, the exemplary terms "below" and "below" can include both an orientation of above and below. The elements may be otherwise oriented (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended as a limitation of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, determine the presence of stated features, integers, steps, operations, elements and / or components, but do not exclude one or more other The presence or addition of features, integers, steps, operations, elements, parts, and / or groups. As used herein, the term "and / or" includes any and all combinations of the associated listed items.

As mentioned earlier, during the pre-cleaning process after the final polishing, the waiting time may cause the problem of wafer corrosion due to the residual polishing solution. In order to overcome this problem, the common practice at present is to increase the overflow function in the water channel of the pre-cleaning machine. FIG. 1A and FIG. 1B show a pre-cleaner with overflow function. As shown in FIGS. 1A and 1B, the pre-washing machine 100 includes a water channel 101 and a cleaning liquid tank 102 arranged adjacent to the water channel 101. The water channel 101 can accommodate 10 crystal boxes, and each cleaning liquid tank 102 can accommodate 2 crystals. As shown in FIG. 1C and FIG. 1D, the wafer box with wafers loaded thereon. The wafer box 11 is an open structure, and each wafer box can support a certain number of wafers 10. The wafer 10 after the final polishing is loaded into the wafer box 11 and put into a pre-cleaner 100 for pre-cleaning. Specifically, first, the water is washed in deionized water in the water channel 101, and then washed in the cleaning liquid tank 102 using a cleaning liquid (for example, SC1, SC2). And further Ground, in the water channel 101, overflow inlets 1010 are provided at the bottom of the left and right side walls, and new deionized water (DIW) is continuously added to the water channel through the overflow inlet 1010 to reduce the concentration of the alkaline polishing solution in the water channel. And strive to take away the polishing liquid remaining on the wafer surface. However, due to the large area of the water channel, if the effect of overflow is to be guaranteed, a large flow of deionized water is often required. At the same time, because the wafer is only 1cm apart, the deionized water passing through the overflow inlet cannot be achieved only by diffusion. Effective scouring of wafer surface. Based on this, the present invention improves the water channel of the pre-cleaner to overcome these problems, thereby reducing or even avoiding the corrosion of the wafer by the polishing liquid.

In order to thoroughly understand the present invention, detailed structures and steps will be provided in the following description in order to explain the technical solution proposed by the present invention. The preferred embodiments of the present invention are described in detail below. However, in addition to these detailed descriptions, the present invention may have other embodiments.

Embodiment 1: FIG. 2A is a schematic top view of a pre-cleaner according to an embodiment of the present invention; FIG. 2B is a schematic view of water flowing through a crystal box during cleaning using the pre-cleaner shown in FIG. 2A; 2A is a schematic front view of the water channel of the pre-cleaner shown in FIG. 2A; FIG. 2D shows that the opening and closing of the water inlet / outlet port are controlled according to the input amount of the crystal box when the pre-cleaner shown in FIG. 2A is used for cleaning. The pre-cleaner according to an embodiment of the present invention is described below with reference to FIGS. 2A to 2D.

As shown in FIG. 2A, the pre-cleaning machine 200 according to an embodiment of the present invention includes a water channel device 201 and a cleaning liquid tank 202 disposed adjacent to the water channel device 201. Exemplarily, the water channel device 201 can accommodate 10 crystal cassettes 11, and the cleaning liquid tank 202 can accommodate 2 crystal cassettes 11, and each wafer cassette 11 is loaded with a plurality of wafers 10.

In this embodiment, the water channel device 201 includes a water tank 2010 and a water inlet 2011 and a water outlet 2012 respectively disposed on two opposite side walls of the water tank 2010. The water tank 2010 is in the shape of a rectangular parallelepiped. The water inlet 2011 and the water outlet 2012 are disposed on the side wall of the water tank 2010 parallel to the extending direction of the water tank 2010. on. For example, in FIG. 2A, the water tank 2010 extends horizontally (in the direction shown by the arrow), and the water inlet 2011 and the water outlet 2012 are respectively disposed on two side walls of the water tank 2010 parallel to the extending direction of the water tank 2010 (that is, provided on the front side arm and the rear On the side wall). The manner of setting the water inlet 2011 and the water outlet 2012 is shown in FIG. 2C. A plurality of water inlet / outlet openings are evenly arranged on the side wall of the water tank 2010. For example, for example, the water inlet / outlet covers two laterally extending water tank 2010 Sidewall. In this way, as the density of the inlet / outlet is increased, the flow capacity is also increased.

It should be noted that the extending direction of the water tank 2010 refers to the length direction of the water tank 2010 or the moving direction of the crystal box 11 in the water tank 2010.

When the wafer is cleaned by using the pre-cleaner shown in FIG. 2A, the crystal box 11 is put into the water channel device 201 so that the surface of the wafer is perpendicular to the crystal box moving direction / sink tank extending direction. The deionized water flowing out of the water outlet 2012 can flush the surface of each wafer 10 as shown in FIG. 2B, and take away the polishing liquid remaining on the wafer 10, thereby reducing or even avoiding the corrosion of the wafer by the polishing liquid. During the cleaning process, the crystal box 11 moves from left to right in the water channel device 201 in the direction shown by the arrow in FIG. 2A, and finally enters the cleaning liquid tank 202 for cleaning. More specifically, the first two crystal boxes in the water channel are moved into the cleaning liquid tank 202 every set time.

Further, in order to avoid wasting deionized water, when the wafer is cleaned by using the pre-cleaner shown in FIG. 2A, the number of opening / closing of the water inlet / outlet can be controlled according to the number of the inputted crystal cassettes 11. For example, as shown in FIG. 2D, when 8 crystal boxes are put into the water channel device 201, the water inlet / outlet port corresponding to the area where the crystal boxes are not put can be closed to save deionized water.

In this embodiment, a pre-cleaning method is also provided. The pre-cleaning method shown in FIG. 2A is used. The pre-cleaning method includes: Step S201: sequentially placing a wafer cassette loaded with wafers to be cleaned. It is placed in the water channel device, and the crystal box is placed so that the surface of the wafer is perpendicular to the moving direction of the crystal box in the water tank.

Specifically, the crystal box loaded with the wafer to be cleaned (for example, the wafer before the pre-cleaning after final polishing) is put into the water channel by a robot, for example, it is put into the water channel from right to left in order.

Step S202: Water washing the wafer in the water channel device. That is, the surface of each wafer is flushed with deionized water that flows in through the water inlet and flows out from the water outlet.

Step S203: Put the crystal box in the water channel device into a cleaning liquid tank in sequence at a set time interval. After cleaning for a predetermined time in the water channel device, the first two crystal boxes in the water channel are moved into the cleaning liquid tank by a robotic arm, and the rear crystal boxes in the water channel device are sequentially moved forward.

Step S204: cleaning the wafer in the cleaning liquid tank. The wafer is cleaned in a cleaning liquid tank, such as SC1, to remove particles such as residual polishing liquid and silicon debris from the wafer, thereby improving the particle performance of the wafer.

Embodiment 2: FIG. 3A is a schematic top view of a pre-cleaner according to another embodiment of the present invention; FIG. 3B is a schematic diagram of water flowing through a crystal box when cleaning is performed using the pre-cleaner shown in FIG. 3A; FIG. 3C shows FIG. 3A is a schematic side view of a water channel of the pre-cleaner; FIG. 3D is a schematic diagram of a crystal box moving process when the pre-cleaner shown in FIG. 3A is used for cleaning. The pre-cleaner according to an embodiment of the present invention is described below with reference to FIGS. 3A to 3D.

As shown in FIG. 3A, the pre-cleaning machine 300 according to an embodiment of the present invention includes a water channel device 301 and a cleaning liquid tank 302 disposed adjacent to the water channel device 301. Exemplarily, the water channel 301 can accommodate 10 crystal cassettes 11, and the cleaning liquid tank 302 can accommodate 2 crystal cassettes 11, and each wafer cassette 11 is loaded with a plurality of wafers 10.

In this embodiment, the water channel device 301 includes a water tank 3010 and a water inlet 3011 and a water outlet 3012 respectively disposed on two opposite side walls of the water tank 3010. The water tank 3010 is in the shape of a rectangular parallelepiped, and the water inlet 3011 and the water outlet 3012 are disposed on a side wall of the water tank 3010 that is perpendicular to the extending direction of the water tank 3010. For example, in FIG. 3A, the water tank 3010 extends horizontally (in the direction indicated by the arrow), and the water inlet 3011 and the water outlet 3012 are respectively disposed on two side walls of the water tank 3010 that are perpendicular to the extending direction of the water tank 3010 (that is, on the left and right side walls). . The arrangement of the water inlet 3011 and the water outlet 3012 is shown in FIG. 3C. A plurality of water inlet / outlet openings are evenly arranged on the sidewall of the water tank 3010. For example, the water inlet / outlet covers the left and right side walls of the water tank 3010. In this way, as the density of the inlet / outlet is increased, the flow capacity is also increased.

It should be noted that the extending direction of the water tank 3010 refers to the length direction of the water tank 3010 or the moving direction of the crystal box 11 in the water tank 3010.

When the wafer is cleaned by using the pre-cleaner shown in FIG. 3A, the wafer box 11 is put into the water channel device 301 so that the wafer surface is parallel to the wafer box moving direction / sink tank extending direction. The deionized water flowing out of the water outlet 3012 can scour the surface of each wafer 10 as shown in FIG. 3B and take away the polishing liquid remaining on the wafer 10, thereby reducing or even avoiding the corrosion of the wafer by the polishing liquid. During the cleaning process, the crystal box 11 moves from left to right in the water channel device 301 in the direction shown by the arrow in FIG. 3A, and finally enters the cleaning liquid tank 302 for cleaning. More specifically, as shown in FIG. 3D, the first two crystal boxes in the water channel are moved into the cleaning liquid tank 302 every set time, and the rear crystal boxes in the water channel device 301 are sequentially moved forward.

In this embodiment, a pre-cleaning method is also provided. The pre-cleaning method shown in FIG. 3A is used. The pre-cleaning method includes: Step S301: sequentially placing a wafer cassette loaded with a wafer to be cleaned. It is placed in the water channel, and the crystal box is placed such that the surface of the wafer is parallel to the moving direction of the crystal box in the water tank.

Specifically, the crystal box on which the wafer to be cleaned (for example, the wafer before pre-cleaning after final polishing) is loaded into the water channel device is placed by a robot, for example, from right to left in the water channel device.

Step S302: Wash the wafer in the water channel device. That is, the surface of each wafer is flushed with deionized water that flows in through the water inlet and flows out from the water outlet.

Step S303: Put the crystal box in the water channel device into a cleaning liquid tank in sequence at a set time interval. After the cleaning in the water channel device for a predetermined time, the first two crystal boxes in the water channel device are moved into the cleaning liquid tank by a mechanical hand, and the rear crystal boxes in the water channel device are sequentially moved forward. In addition, when the first two crystal boxes in the water channel device are moved into the cleaning liquid tank by the robot, the crystal boxes are rotated by 90 degrees as shown in FIG. 3D.

Step S304: cleaning the wafer in the cleaning liquid tank. The wafer is cleaned in a cleaning liquid tank, such as SC1, to remove particles such as residual polishing liquid and silicon debris from the wafer, thereby improving the particle performance of the wafer.

Embodiment 3: FIG. 4A is a schematic top view of a pre-cleaner according to another embodiment of the present invention; FIG. 4B is a schematic view of water flowing through a crystal box during cleaning using the pre-cleaner shown in FIG. 4A; FIG. 4C shows The schematic diagram of the movement of the crystal box during cleaning by using the pre-cleaner shown in FIG. 4A. The pre-cleaner according to an embodiment of the present invention is described below with reference to FIGS. 4A to 4C.

As shown in FIG. 4A, the pre-cleaner 400 according to an embodiment of the present invention includes a first water channel device 401, a second water channel device 402, and a cleaning liquid tank 403 disposed adjacent to the second water channel device 402. Exemplarily, the first water channel device 401 can accommodate two crystal boxes 11, the second water channel device 402 can accommodate eight crystal boxes 11, and the cleaning liquid tank 403 can accommodate two crystal boxes 11. Each crystal box 11 is loaded with several Wafer 10.

In this embodiment, the first water channel device 401 adopts a structure similar to the water channel disclosed in the first embodiment. Specifically, the first water channel device 401 includes a first water tank 4010 and a first water inlet 4011 and a first water outlet 4012 respectively disposed on two opposite side walls of the first water tank 4010. The first water tank 4010 has a rectangular parallelepiped shape. The first water inlet 4011 and the first water outlet 4012 are disposed on two opposite side walls of the first water tank 4010, for example, two front and rear side walls. The arrangement of the first water inlet 4011 and the first water outlet 4012 is similar to that shown in FIG. 3C. A plurality of water inlet / outlet openings are evenly arranged on the side wall of the first water tank 4010. For example, the water inlet / outlet openings are full. Front and rear side walls of the first water tank 4010. In this way, as the density of the inlet / outlet is increased, the flow capacity is also increased.

In this embodiment, the second water channel device 402 adopts a structure similar to the water channel disclosed in the second embodiment. Specifically, the second water channel device 402 includes a second water tank 4020 and a water inlet 4021 and a water outlet 4022 respectively disposed on two opposite side walls of the second water tank 4020. The second water tank 4020 has a rectangular parallelepiped shape. The second water inlet 4021 and the water outlet 4022 are disposed on a side wall of the second water tank 4020 that is perpendicular to the extending direction of the second water tank 4020. For example, in FIG. 4A, the second water tank 4020 extends in the lateral direction (the direction shown by the arrow), and the second water inlet 4021 and the second water outlet 4022 are respectively disposed at two of the second water tank 4020 that are perpendicular to the extending direction of the second water tank 4020. On the side walls (that is, on the left and right side walls). The manner of setting the second water inlet 4021 and the second water outlet 4022 is shown in FIG. 3C. A plurality of water inlet / outlet openings are evenly arranged on the side wall of the second water tank 4020. For example, for example, the water inlet / outlet is covered with the second water outlet. The left and right side walls of the water tank 4020. In this way, as the density of the inlet / outlet is increased, the flow capacity is also increased.

It should be noted that the extending direction of the second water tank 4020 refers to the length direction of the second water tank 4020 or the moving direction of the crystal box 11 in the second water tank 4020.

When the wafer is cleaned by using the pre-cleaner shown in FIG. 4A, the wafer box 11 is put into the first water channel device 401 such that the wafer surface is perpendicular to the wafer box moving direction / first water tank extension direction. The deionized water flowing in through the water outlet 4011 and flowing out from the first water outlet 4012 can flush the surface of each wafer 10 as shown in the left figure in FIG. 4B and take away the polishing liquid remaining on the wafer 10, thereby reducing or even Avoid the corrosion of the wafer by the polishing solution. After the crystal box 11 is cleaned in the first water channel device 401, as shown in FIG. 4C, the crystal box 11 is taken out by a robot and placed in the second water channel 402. When the crystal box 11 is placed in the second water channel device 402, it is rotated 90 degrees to make the wafer surface Parallel to the crystal box moving direction / second water tank extension direction, so that the deionized water flowing in through the second water inlet 4021 and flowing out from the second water outlet 4022 can flush the surface of each wafer 10 as shown in FIG. 4C. The polishing liquid remaining on the wafer 10 is further taken away, thereby reducing or even avoiding the corrosion of the wafer by the polishing liquid. During the cleaning process, the crystal box 11 moves from left to right in the second water channel device 402 in the direction shown by the arrow in FIG. 4A, and finally enters the cleaning liquid tank 403 for cleaning. More specifically, as shown in FIG. 4C, the first two crystal cassettes in the second water channel device 402 are moved into the cleaning liquid tank 403 every set time, and the rear crystal cassettes in the second water channel 402 are sequentially moved forward.

In this embodiment, a pre-cleaning method is also provided. The pre-cleaning method shown in FIG. 4A is used. The pre-cleaning method includes: Step S401: placing a crystal box loaded with a wafer to be cleaned in the first water channel device. And the surface of the wafer is perpendicular to the moving direction of the crystal box in the first water tank, that is, parallel to the connecting direction of the first water inlet and the first water outlet.

Specifically, the crystal box on which the wafer to be cleaned (for example, the wafer before the pre-cleaning after the final polishing) is loaded into the first water channel device is put into the first water channel from right to left in a sequential order by a robot arm. .

Step S402: cleaning the wafer in the first water channel device. That is, the surface of each wafer is flushed with deionized water that flows in through the first water inlet and flows out from the first water outlet.

Step S403: Place the crystal box in the first water channel device into the second water channel, and make the surface of the wafer parallel to the moving direction of the crystal box in the second water tank. After cleaning in the first water channel device for a predetermined time, the two crystal boxes in the first water channel are moved into the second water channel by the robot, and the crystal boxes in the front of the second water channel device are sequentially moved forward. In addition, when the two crystal boxes in the first water channel are moved into the second water channel by the robot, the crystal boxes are rotated by 90 degrees as shown in FIG. 4C.

Step S404: Wash the wafer in the second water channel device. That is, the surface of each wafer is flushed with deionized water flowing in through the second water inlet and flowing out through the second water outlet.

Step S405: Put the wafers in the second water channel device into a cleaning liquid tank in sequence at a set time interval. That is, after cleaning for a predetermined time in the second water channel device, the first two crystal boxes in the second water channel device are moved into the cleaning liquid tank by a robot, and the rear crystal boxes in the second water channel device are sequentially moved forward. In addition, when the first two crystal boxes in the second water channel device are moved into the cleaning liquid tank by the robot, the crystal boxes are rotated by 90 degrees as shown in FIG. 4C.

Step S406: cleaning the wafer in the cleaning liquid tank. The wafer is cleaned in a cleaning liquid tank, such as SC1, to remove particles such as residual polishing liquid and silicon debris from the wafer, thereby improving the particle performance of the wafer.

The present invention has been described through the above embodiments, but it should be understood that the above embodiments are only for the purpose of illustration and description, and are not intended to limit the present invention to the scope of the described embodiments. In addition, those skilled in the art can understand that the present invention is not limited to the above-mentioned embodiments. According to the teachings of the present invention, more variations and modifications can be made, and these variations and modifications all fall within the scope of protection of the present invention. Within range. The protection scope of the present invention is defined by the scope of the attached patent application and its equivalent scope.

Claims (5)

A water channel device for a pre-washing machine includes a first water channel, the first water channel including a first water tank and a first water inlet and a first water outlet provided on a side wall in the first water tank, and The first water inlet and the first water outlet are respectively disposed on two side walls of the first water tank parallel to the extending direction of the first water tank; a second water channel, the second water channel includes a second water tank and A second water inlet and a second water outlet provided on a side wall in the second water tank, and the second water inlet and the second water outlet are respectively provided in the second water tank and the second water tank The sink extends on two side walls that are perpendicular. The water channel device for a pre-washing machine according to claim 1, wherein the first water tank can accommodate two crystal boxes, and the second water tank can accommodate eight crystal boxes. A pre-cleaning machine includes the water channel device according to claim 1 and a cleaning liquid tank arranged adjacent to the second water channel. A pre-cleaning method using the pre-cleaning machine according to claim 3, comprising: placing a crystal box loaded with a wafer to be cleaned in the first water channel, and making a surface of the wafer perpendicular to the wafer The moving direction of the crystal box in the first water tank; cleaning the wafer in the first water channel; placing the crystal box in the first water channel into the second water channel, and The surface of the wafer is parallel to the moving direction of the crystal box in the second water tank; the wafer is washed in the second water channel; and the wafer in the second water channel is sequentially set at a set time interval. The wafer is placed in a cleaning liquid tank; the wafer is cleaned in the cleaning liquid tank. The pre-cleaning method according to claim 4, wherein the first water channel can accommodate two crystal boxes, and the second water channel can accommodate eight crystal boxes.