TWI690979B - Substrate processing device and cleaning method of substrate processing device - Google Patents

Substrate processing device and cleaning method of substrate processing device Download PDF

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TWI690979B
TWI690979B TW107137195A TW107137195A TWI690979B TW I690979 B TWI690979 B TW I690979B TW 107137195 A TW107137195 A TW 107137195A TW 107137195 A TW107137195 A TW 107137195A TW I690979 B TWI690979 B TW I690979B
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杉岡真治
岸田拓也
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日商斯庫林集團股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • B01D35/02—Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

本發明的基板處理裝置包括：處理槽，貯存處理液，並使基板浸漬；處理液供給部件，將所述處理液供給至所述處理槽；排液配管，作為使所述處理液自所述處理槽朝裝置外進行排液時的流路；循環配管，具備過濾所述處理液的過濾器，且至少一端與所述處理槽連通；旁通配管，作為將所述循環配管與所述排液配管連通，使經所述過濾器過濾的所述處理液不返回至所述處理槽而進行排液時的流路；開閉閥，切換自所述處理槽排出的所述處理液的流路；以及控制部件，控制所述開閉閥。The substrate processing apparatus of the present invention includes: a processing tank that stores a processing liquid and immerses the substrate; a processing liquid supply member that supplies the processing liquid to the processing tank; and a liquid discharge pipe as the processing liquid from the A flow path when the treatment tank discharges liquid out of the device; a circulation pipe equipped with a filter for filtering the treatment liquid, and at least one end communicates with the treatment tank; a bypass pipe serves as the circulation pipe and the drain Liquid piping communicates so that the treatment liquid filtered by the filter does not return to the treatment tank and drains the flow path; opens and closes the valve to switch the flow path of the treatment liquid discharged from the treatment tank ; And a control component that controls the on-off valve.

Description

基板處理裝置、基板處理裝置的洗淨方法Substrate processing device and cleaning method of substrate processing device

本發明是有關於一種使用處理液對基板進行處理的基板處理裝置及基板處理方法，更具體而言，是有關於一種對基板進行利用處理液的處理後，對處理槽、配管、過濾器、泵等接觸了處理液的裝置各部進行洗淨的技術。再者，本說明書中所說的基板中例如包含：半導體晶圓、液晶顯示器用基板、電漿顯示器用基板、有機電致發光（electroluminescence，EL）用基板、光碟用基板、磁碟用基板、磁光碟用基板、光罩基板、陶瓷基板、太陽能電池用基板等。The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate using a processing liquid, and more specifically, to a processing tank, piping, filter, etc. The technique of washing each part of the device such as a pump that has been in contact with the treatment liquid In addition, the substrates mentioned in this specification include, for example, semiconductor wafers, substrates for liquid crystal displays, substrates for plasma displays, substrates for organic electroluminescence (EL), substrates for optical discs, substrates for magnetic discs, Substrates for magneto-optical discs, photomask substrates, ceramic substrates, substrates for solar cells, etc.

在使用藥液、純水等處理液進行基板的處理的此種裝置中，將處理液貯存於處理槽，並使處理液於處理液循環用的配管與處理槽之間循環，從而進行基板的處理。而且，於所述的循環用的配管中，配置有壓送處理液的泵、去除混入至處理液中的金屬等顆粒（particle）的過濾器、處理液的溫度調節用的加熱器等。In such a device that uses a processing solution such as a chemical liquid or pure water to process a substrate, the processing liquid is stored in the processing tank, and the processing liquid is circulated between the piping for circulating the processing liquid and the processing tank to perform substrate processing. deal with. In addition, the circulation piping described above is provided with a pump that pressurizes the treatment liquid, a filter that removes particles such as metals mixed into the treatment liquid, a heater for adjusting the temperature of the treatment liquid, and the like.

於使用如所述般的構成的裝置進行基板處理的情況下，將處理液排出後，於處理槽內或配管內（特別是過濾器、泵等）會殘留顆粒、或包含顆粒的處理液。In the case of performing substrate processing using an apparatus configured as described above, after the processing liquid is discharged, particles or a processing liquid containing particles may remain in the processing tank or piping (especially filters, pumps, etc.).

因此，先前以來，於基板處理後，使用純水對處理槽內、配管內進行清掃。例如，記載有如下技術：專利文獻1記載的基板處理裝置包括：處理槽，包含內槽與外槽；循環配管，將內槽與外槽連通連接，且用以使處理液循環；純水供給部，對所述外槽供給純水；排液配管，將貯存於所述內槽的純水排出，且自所述純水供給部將純水供給至外槽，利用所述循環配管將貯存於所述外槽的純水輸送至所述內槽，並將貯存於所述內槽的純水排出至所述排液配管，藉由同時且連續地執行所述供給、所述輸送、所述排出的全部或所述步驟中的至少兩個，使純水於所述內槽、所述外槽、所述循環配管中流通的同時來進行洗淨，經過規定的洗淨時間後或供給了規定量的純水後，使來自所述純水供給部的純水的供給停止。Therefore, in the past, after the substrate processing, the inside of the processing tank and the piping was cleaned with pure water. For example, the following technology is described: the substrate processing apparatus described in Patent Document 1 includes: a processing tank including an inner tank and an outer tank; a circulation pipe that connects the inner tank and the outer tank and is used to circulate the processing liquid; pure water supply The unit supplies pure water to the outer tank; the drain pipe discharges the pure water stored in the inner tank, and the pure water is supplied to the outer tank from the pure water supply unit, and the storage is stored by the circulation pipe The pure water in the outer tank is transported to the inner tank, and the pure water stored in the inner tank is discharged to the drain pipe, and the supply, the transport, and the All of the discharge or at least two of the steps, the pure water is circulated through the inner tank, the outer tank, and the circulation piping for washing, and after a predetermined washing time or supply After a predetermined amount of pure water is supplied, the supply of pure water from the pure water supply unit is stopped.

藉由此種構成，自純水供給部供給的純水於包含外槽、循環配管、內槽、排液配管的成為一條通道的路徑流通，故能夠一邊使純水流通一邊利用純水對各部進行洗淨。With such a configuration, the pure water supplied from the pure water supply unit circulates through a path including an outer tank, a circulation pipe, an inner tank, and a drain pipe, so that the pure water can be used for each part while circulating the pure water Perform washing.

但是，根據所述般的構成，因於配管內流通的純水暫時經由處理槽而進行排液，故殘留於配管內（特別是過濾器）的顆粒會藉由用以洗淨的純水而被運送至處理槽內。因此，存在無法完全去除處理槽內的顆粒的課題。However, according to the above-mentioned configuration, since the pure water flowing in the piping is temporarily drained through the treatment tank, the particles remaining in the piping (especially the filter) are removed by the pure water used for washing It is transported to the treatment tank. Therefore, there is a problem that particles in the treatment tank cannot be completely removed.

另外，當使用純水進行洗淨時，純水會殘留於處理槽及配管內。如此當為殘留有純水的狀態時，藉此，下一次會稀釋用於基板處理的藥液，故於嚴格要求藥液的濃度管理的情況下，就會存在難以使用純水對處理槽及配管內進行洗淨的情況。In addition, when pure water is used for washing, pure water will remain in the treatment tank and piping. In this way, when pure water remains, the chemical solution used for substrate processing will be diluted next time. Therefore, when strict concentration control of the chemical solution is required, it may be difficult to use pure water for the treatment tank and Washing in piping.

因此，考慮使用潔淨的藥液（以下，亦稱為新液）代替純水來進行處理槽及配管內洗淨，但於使用藥液的情況下無法與純水同樣地進行排液。即，為了防止使用後的藥液（以下，亦稱為廢液）因廢棄而對環境造成的不良影響，需要進行規定的處理，但於進行所述處理的設備中無法輸送剛剛進行基板處理後的高溫的廢液。因此，需要將用於基板處理的經加熱的廢液暫時回收至冷卻罐，並冷卻至規定溫度後輸送至之後的工序。Therefore, it is considered to use a clean chemical solution (hereinafter, also referred to as a new solution) instead of pure water for washing in the treatment tank and piping, but when using the chemical solution, it is not possible to perform drainage in the same way as pure water. That is, in order to prevent the adverse effect of the used chemical solution (hereinafter also referred to as waste solution) on the environment due to disposal, a predetermined treatment is required, but the equipment that performs the treatment cannot be transported immediately after the substrate treatment High temperature waste liquid. Therefore, it is necessary to temporarily collect the heated waste liquid used for substrate processing in a cooling tank, cool it to a predetermined temperature, and then transport it to a subsequent process.

因此，若冷卻罐中不存在空閒容量，則無法對藥液進行排液，特別是剛剛進行基板處理後，為於冷卻罐中收容有大量的高溫的廢液的狀態，故不可能為了處理槽及配管內的洗淨將大量的藥液一次進行流通·排液。 [現有技術文獻] [專利文獻]Therefore, if there is no free capacity in the cooling tank, the chemical liquid cannot be drained. Especially after the substrate processing, a large amount of high-temperature waste liquid is contained in the cooling tank, so it is impossible to treat the tank And the washing in the piping circulates and drains a large amount of chemical solution at once. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利特開2016-63204號公報[Patent Document 1] Japanese Patent Laid-Open No. 2016-63204

[發明所欲解決之課題] 本發明鑒於所述般的問題，目的在於提供一種於使用處理液對進行基板處理的基板處理裝置的處理槽及配管內進行洗淨的情況下，將對所述配管內洗淨後的洗淨液不經由處理槽而進行排液的技術。 [解決課題之手段][Problems to be Solved by the Invention] In view of the above-mentioned problems, the present invention aims to provide a method for cleaning the processing tank and piping of a substrate processing apparatus that performs substrate processing using a processing liquid. The technique of draining the washing liquid after washing in the piping without going through the treatment tank. [Means to solve the problem]

為了達成所述目的，本發明採用以下的構成。In order to achieve the above object, the present invention adopts the following configuration.

本發明的基板處理裝置是利用處理液對基板進行處理的基板處理裝置，其包括：處理槽，貯存所述處理液，並使基板浸漬；處理液供給部件，將所述處理液供給至所述處理槽；排液配管，作為使所述處理液自所述處理槽朝裝置外進行排液時的流路；循環配管，具備過濾所述處理液的過濾器，且至少一端與所述處理槽連通；旁通配管，作為將所述循環配管與所述排液配管連通，使經所述過濾器過濾的所述處理液不返回至所述處理槽而進行排液時的流路；開閉閥，切換自所述處理槽排出的所述處理液的流路；以及控制部件，控制所述開閉閥。The substrate processing apparatus of the present invention is a substrate processing apparatus that processes a substrate using a processing liquid, and includes: a processing tank that stores the processing liquid and immerses the substrate; and a processing liquid supply member that supplies the processing liquid to the Treatment tank; liquid discharge pipe as a flow path for discharging the treatment liquid from the treatment tank toward the outside of the device; circulation pipe, equipped with a filter for filtering the treatment liquid, and at least one end and the treatment tank Communication; bypass piping as a flow path when the circulation piping and the drain piping are connected, so that the treatment liquid filtered by the filter does not return to the treatment tank for draining; opening and closing the valve To switch the flow path of the processing liquid discharged from the processing tank; and a control part to control the on-off valve.

根據所述般的構成，藉由使用開閉閥來切換處理液的流路，能夠使自處理槽排出、且通過循環配管的處理液不返回至處理槽而經由旁通配管進行排液。因此，於使用處理液對配管內進行洗淨的情況下，能夠使殘留於包含過濾器的配管內的廢液及顆粒不返回至處理槽，而對配管內進行洗淨。According to the general configuration described above, by switching the flow path of the processing liquid using the on-off valve, the processing liquid discharged from the processing tank and passing through the circulation piping can be discharged through the bypass piping without returning to the processing tank. Therefore, when the inside of the piping is washed with the processing liquid, the waste liquid and particles remaining in the piping including the filter can be washed in the piping without returning to the processing tank.

另外，亦可為：所述循環配管的一端連接於所述處理槽，另一端連接於排液配管，於所述開閉閥中，包含單通排液閥，所述單通排液閥切換使自所述處理槽排出的所述處理液僅通過所述排液配管而進行排液的流路、與使自所述處理槽排出的所述處理液自所述排液配管朝所述循環配管流動的流路，於使自所述處理槽排出的所述處理液自所述排液配管朝所述循環配管流動的情況下，所述循環配管可形成與所述處理槽之間使所述處理液能夠循環的流路。藉由所述構成，於使處理液循環時，能夠將排液配管活用作用於循環的流路的一部分。Alternatively, one end of the circulation pipe may be connected to the processing tank, and the other end may be connected to a drain pipe. The on-off valve may include a single-pass drain valve, and the single-pass drain valve may be switched The treatment liquid discharged from the treatment tank discharges only through the drainage pipe, and the flow path for discharging the treatment liquid from the treatment tank from the drainage pipe toward the circulation pipe The flow channel is such that when the treatment liquid discharged from the treatment tank flows from the drainage pipe toward the circulation pipe, the circulation pipe may be formed between the treatment tank and the treatment tank. The flow path through which the treatment liquid can circulate. With the above-described configuration, when the processing liquid is circulated, the drain pipe can be used as a part of the flow path for circulation.

另外，亦可為：所述排液配管的一端連接於所述處理槽，且所述排液配管於該配管內的上游處具備切換是否自所述處理槽排出所述處理液的處理槽排液閥，所述循環配管的一端與所述處理槽連通，另一端連接於所述排液配管的較所述處理槽排液閥更靠下游處，且所述循環配管包括位於所述過濾器與所述處理槽之間的處理槽循環閥，所述旁通配管的一端於所述過濾器與所述處理槽循環閥之間與所述循環配管連接，另一端於較連接有所述循環配管的位置更靠下游處與所述排液配管連接，且所述旁通配管包括對所述旁通配管內的流路進行開閉的循環排液閥，所述控制部件可藉由對所述處理槽排液閥、單通排液閥、處理槽循環閥、循環排液閥的各閥進行開閉控制，進行使自所述處理槽排出的所述處理液於所述循環配管的一部分及所述旁通配管內流通，且不返回至所述處理槽而進行排液的循環排液處理。Alternatively, one end of the drainage pipe may be connected to the treatment tank, and the drainage pipe may have a treatment tank row for switching whether to discharge the treatment liquid from the treatment tank upstream of the pipe. A liquid valve, one end of the circulation pipe communicates with the treatment tank, and the other end is connected to the drainage pipe more downstream of the treatment tank drainage valve, and the circulation pipe includes a filter located on the filter A processing tank circulation valve between the processing tank, one end of the bypass piping is connected to the circulation piping between the filter and the processing tank circulation valve, and the other end is connected to the circulation The position of the piping is further downstream connected to the drain piping, and the bypass piping includes a circulation drain valve that opens and closes the flow path in the bypass piping. Each valve of the treatment tank drain valve, one-way drain valve, treatment tank circulation valve, and circulation drain valve is controlled to open and close, and the treatment liquid discharged from the treatment tank is allowed to flow through a part of the circulation piping and The bypass piping circulates, and does not return to the processing tank to perform a circular drainage process of draining.

若為所述般的構成，則可簡單地構成配管及閥的組合。另外，針對各閥即便不個別地進行開閉指示，亦能夠藉由控制部件進行的處理，使處理液不返回至處理槽，而進行配管內的洗淨。再者，於本說明書中，所謂上游、下游是將排液配管的處理槽排液閥側設為上遊，按照自處理槽排出的處理液的流動來定義。With the above-described configuration, the combination of piping and valve can be easily configured. In addition, even if each valve is not individually instructed to open and close, it is possible to perform cleaning in the piping without returning the processing liquid to the processing tank by the processing performed by the control member. In addition, in this specification, the term "upstream" and "downstream" refers to the upstream side of the processing tank discharge valve of the liquid discharge pipe, and is defined according to the flow of the processing liquid discharged from the processing tank.

另外，亦可為：更具有回收自所述處理槽排出的處理液的廢液回收罐，所述排液配管的一端連接於所述處理槽，另一端連接於所述廢液回收罐，所述控制部件獲取所述廢液回收罐的剩餘容量的資訊，於所述廢液回收罐中存在規定的剩餘容量的情況下，將該規定的剩餘容量以下的處理液自所述處理槽排出，來進行所述循環排液處理。Alternatively, it may be a waste liquid recovery tank that recovers the treatment liquid discharged from the treatment tank. One end of the drainage pipe is connected to the treatment tank, and the other end is connected to the waste liquid recovery tank. The control unit acquires information on the remaining capacity of the waste liquid recovery tank, and when there is a predetermined remaining capacity in the waste liquid recovery tank, discharges the processing liquid having a predetermined remaining capacity or less from the processing tank, To perform the circulating drainage treatment.

若為所述構成，則可於廢液回收罐中存在空間的情況下，使用藥液對配管內進行洗淨。藉此，於下一次的基板處理時，不會因殘留於處理槽及配管內的純水而稀釋藥液的濃度，而能夠對配管內進行處理。According to the above configuration, when there is space in the waste liquid recovery tank, the inside of the piping can be washed with the chemical liquid. Thereby, in the next substrate processing, the concentration of the chemical solution is not diluted by the pure water remaining in the processing tank and the piping, and the processing in the piping can be performed.

再者，若配管內一次通液的液量過少，則會對配管內進行有效洗淨產生障礙，故為了對配管內進行有效洗淨，宜規定必要的每次通液量的下限。所述下限的量可根據裝置的規格、被處理的基板的種類、被處理的基板的片數、所使用的處理液的種類等條件，藉由實驗或模擬來規定。In addition, if the amount of liquid in the pipe is too small, it will cause an obstacle to effective cleaning in the pipe. Therefore, in order to effectively clean the pipe, it is advisable to specify the necessary lower limit of each liquid flow. The amount of the lower limit can be determined by experiment or simulation according to conditions such as the specifications of the device, the type of substrate to be processed, the number of substrates to be processed, and the type of processing liquid used.

另外，亦可為：所述處理槽包括使基板浸漬的內槽、及以包圍內槽的周圍的方式配置的外槽，所述排液配管包括與所述內槽連接的內槽排液配管部、及與所述外槽連接的外槽排液配管部，且所述廢液回收罐的規定的剩餘容量被設定為所述外槽的容積以上，所述控制部件獲取所述廢液回收罐的剩餘容量的資訊，於所述廢液回收罐中存在規定的剩餘容量的情況下，將貯存於所述外槽的處理液全部排出，來進行所述循環排液處理。In addition, the processing tank may include an inner tank in which the substrate is immersed, and an outer tank disposed so as to surround the periphery of the inner tank, and the drain pipe may include an inner tank drain pipe connected to the inner tank And an outer tank drain piping connected to the outer tank, and the predetermined remaining capacity of the waste liquid recovery tank is set to be equal to or larger than the volume of the outer tank, and the control unit acquires the waste liquid recovery Information on the remaining capacity of the tank, when there is a predetermined remaining capacity in the waste liquid recovery tank, all the processing liquid stored in the outer tank is discharged to perform the circulating liquid discharge process.

若為所述般的構成，則可以將外槽的容積設為限度的量來管理一次的通液量，從而能夠抑制無需供給及排出多的處理液，故結果能夠提高基板的處理效率，亦可進行處理液的節約。With the above-described configuration, the volume of the outer tank can be controlled to a limited amount to control the amount of liquid passing through, and it is possible to suppress the need to supply and discharge a large amount of processing liquid. As a result, the processing efficiency of the substrate can be improved. The treatment liquid can be saved.

另外，亦可為：所述處理液供給部件以將處理液供給至所述內槽的方式配置，所述處理槽為使自所述內槽溢出的處理液貯存於所述外槽的構成，處理液朝所述外槽的供給經由所述內槽來進行。In addition, the processing liquid supply member may be arranged to supply the processing liquid to the inner tank, and the processing tank is configured to store the processing liquid overflowing from the inner tank in the outer tank. The treatment liquid is supplied to the outer tank through the inner tank.

若為所述般的構成，則於進行配管內的洗淨時，可進行內槽及外側均不漏出的洗淨。進而，處理槽及配管內的洗淨完成後，成為內槽被處理液充滿的狀態，故而可迅速執行下一個基板處理。即，用於配管內洗淨的處理液的供給可兼用作下一個基板處理的準備。According to the above-described configuration, when washing in the piping, washing can be performed without leakage from the inner tank and the outside. Furthermore, after the cleaning in the processing tank and piping is completed, the inner tank is filled with the processing liquid, so that the next substrate processing can be quickly performed. That is, the supply of the processing liquid for cleaning in the piping can also be used as preparation for the next substrate processing.

另外，亦可為：所述廢液回收罐具備將回收至罐內的處理液排出的流路及開閉該流路的廢液閥，所述控制部件獲取回收至所述廢液回收罐的處理液的溫度資訊，於所述廢液回收罐內不存在規定的剩餘容量的情況下，只要所述廢液回收罐內的處理液的溫度為規定的溫度以下，則藉由進行所述廢液閥的開閉控制而自所述廢液回收罐排出所述處理液，並對所述廢液回收罐確保規定的剩餘容量後，進行所述循環排液處理。In addition, the waste liquid recovery tank may include a flow path that discharges the treatment liquid recovered into the tank and a waste liquid valve that opens and closes the flow path, and the control unit may acquire the treatment recovered in the waste liquid recovery tank Temperature information of the liquid, when there is no predetermined remaining capacity in the waste liquid recovery tank, as long as the temperature of the processing liquid in the waste liquid recovery tank is below the specified temperature, the waste liquid The valve is controlled to open and close to discharge the treatment liquid from the waste liquid recovery tank, and after the predetermined residual capacity is secured for the waste liquid recovery tank, the circulation liquid drainage process is performed.

若為所述般的構成，則與廢液回收罐的剩餘容量無關，可藉由控制部件自動地執行用於進行配管內洗淨的必要的處理，故沒有等待操作員的操作（指示）的時間，而可提高裝置的利用率。With the above-mentioned configuration, regardless of the remaining capacity of the waste liquid recovery tank, the necessary processing for washing in the piping can be automatically performed by the control unit, so there is no need to wait for the operator's operation (instruction) Time, and can improve the utilization rate of the device.

另外，亦可為：所述控制部件獲取執行利用所述處理液的基板的處理的次數及進行所述循環排液處理的次數的資訊，每次完成規定次數的基板處理後，重覆進行規定次數的所述循環排液處理。In addition, the control unit may obtain information on the number of times the substrate processing using the processing liquid is executed and the number of times the circulating liquid discharge processing is performed, and each time a predetermined number of substrate processings are completed, the control is repeated. The number of times of said circular drainage treatment.

若為所述般的構成，則可於適於洗淨的任意時機，以達成適當的殘留顆粒的去除率的次數，自動地進行用於配管內洗淨的處理。再者，所述次數可根據裝置的規格、被處理的基板的種類、被處理的基板的片數、所使用的處理液的種類等條件，藉由實驗或模擬來規定。With the above-described configuration, the treatment for washing in the piping can be automatically performed at any timing suitable for washing, at a number of times to achieve an appropriate removal rate of residual particles. Furthermore, the number of times may be determined by experiment or simulation according to conditions such as the specifications of the device, the type of substrate to be processed, the number of substrates to be processed, and the type of processing liquid used.

另外，本發明的基板處理裝置的洗淨方法是具有如下構件的基板處理裝置的洗淨方法，所述基板處理裝置包括：處理槽，具備貯存處理液且進行基板的浸漬處理的內槽及貯存自該內槽溢出的所述處理液的外槽；排液配管，自所述處理槽排出所述處理液；循環配管，連接於所述排液配管，並將所述內槽與所述排液配管連通；以及旁通配管，連接於所述循環配管及所述排液配管，形成自所述循環配管避開處理槽的流路，且所述基板處理裝置的洗淨方法包括：洗淨準備步驟，將用於所述浸漬處理的使用完的處理液自所述處理槽排出；處理槽洗淨步驟，將潔淨的處理液供給至所述內槽，進而經由所述內槽將處理液供給至所述外槽；配管洗淨步驟，將所述潔淨的處理液僅自外槽排出，並經由所述排液配管、所述循環配管、及旁通配管而進行排液。In addition, the cleaning method of the substrate processing apparatus of the present invention is a cleaning method of a substrate processing apparatus having the following components, the substrate processing apparatus including: a processing tank including an inner tank that stores a processing liquid and performs substrate immersion processing and storage An outer tank of the treatment liquid overflowing from the inner tank; a drainage pipe to discharge the treatment liquid from the treatment tank; a circulation pipe connected to the drainage pipe and connecting the inner tank and the drain The liquid piping is connected; and the bypass piping is connected to the circulation piping and the drainage piping to form a flow path that avoids the processing tank from the circulation piping, and the cleaning method of the substrate processing apparatus includes: washing In the preparation step, the used treatment liquid used for the immersion treatment is discharged from the treatment tank; in the treatment tank cleaning step, the clean treatment liquid is supplied to the inner tank, and then the treatment liquid is passed through the inner tank It is supplied to the outer tank; in the pipe washing step, the cleaned processing liquid is discharged from the outer tank only, and the liquid is drained through the drain pipe, the circulation pipe, and the bypass pipe.

若為所述方法，則能夠使自處理槽排出、且於循環配管內流通的處理液不返回至處理槽而進行排液，故能夠使殘留於配管內的廢液及顆粒不返回至處理槽，而能夠對處理槽內及配管內進行洗淨。According to the above method, the processing liquid discharged from the processing tank and circulating in the circulation piping can be discharged without returning to the processing tank, so that the waste liquid and particles remaining in the piping can not be returned to the processing tank , And can wash the inside of the treatment tank and piping.

另外，於所述配管洗淨步驟中，可將一次排出的處理液的量規定為未滿所述外槽的容積的規定量。若為所述般的方法，則可以將外槽的容積設為限度的規定量單位來管理一次的通液量，從而能夠抑制無需供給及排出多的處理液，故結果能夠提高基板的處理效率，亦可進行處理液的節約。In addition, in the piping washing step, the amount of the processing liquid discharged once may be specified as a predetermined amount that is less than the volume of the outer tank. According to the above-mentioned general method, the volume of the outer tank can be controlled to a predetermined amount unit to control the amount of fluid flow once, and it is possible to suppress the need to supply and discharge a large amount of processing liquid, so as a result, the processing efficiency of the substrate can be improved , You can also save the treatment liquid.

另外，亦可為：所述基板處理裝置更包括回收使用完的處理液的廢液回收罐，作為所述外槽配管洗淨步驟的前工序，可具有確認所述廢液回收罐中是否存在與所述規定量相應的空間的罐剩餘容量確認步驟。In addition, the substrate processing apparatus may further include a waste liquid recovery tank for recovering used processing liquid. As a pre-process of the outer tank piping cleaning step, it may be provided to confirm whether the waste liquid recovery tank exists Step of confirming the remaining tank capacity in the space corresponding to the prescribed amount.

若為所述方法，則可於廢液回收罐中存在空間的情況下，使用藥液對配管內進行洗淨。藉此，於下一次基板處理時，不會因殘留於處理槽及配管內的純水而稀釋藥液的濃度，而可對配管內進行處理。According to the above method, when there is space in the waste liquid recovery tank, the inside of the piping can be washed with the chemical liquid. In this way, in the next substrate processing, the concentration of the chemical solution is not diluted by the pure water remaining in the processing tank and the piping, and the processing in the piping can be performed.

另外，亦可為：於所述罐剩餘容量確認步驟中，更包括罐剩餘容量確保步驟：於所述廢液回收罐中不存在與所述規定量相應的空間的情況下，確認所述廢液回收罐內的處理液的溫度是否為規定的可排液的溫度以下，若為可排液的溫度以下，則將所述廢液回收罐內的處理液自罐排出，若超過可排液的溫度，則重覆待機與確認直至成為可排液的溫度以下為止。In addition, it may be that the tank remaining capacity confirmation step further includes a tank remaining capacity ensuring step: when there is no space corresponding to the prescribed amount in the waste liquid recovery tank, confirm the waste Whether the temperature of the treatment liquid in the liquid recovery tank is below the prescribed dischargeable temperature, if it is below the dischargeable temperature, the treatment liquid in the waste liquid recovery tank is discharged from the tank, if it exceeds the dischargeable liquid Temperature, repeat the standby and confirmation until it becomes below the temperature at which the liquid can be discharged.

若為所述般的方法，則與廢液回收罐的剩餘容量無關，可自動地執行用於進行配管內洗淨的必要的處理，故無需等待操作員的操作（指示）的時間，而可提高裝置的利用率。 [發明的效果]According to the general method described above, regardless of the remaining capacity of the waste liquid recovery tank, the necessary processing for washing in the piping can be automatically performed, so there is no need to wait for the operation (instruction) of the operator. Improve device utilization. [Effect of invention]

根據本發明，能夠提供一種於使用處理液對進行基板處理的基板處理裝置的處理槽及配管內進行洗淨的情況下，將對所述配管內洗淨後的洗淨液不經由處理槽而進行排液的技術。According to the present invention, it is possible to provide a cleaning solution after washing the inside of the piping without passing through the processing tank when the processing tank and the piping of the substrate processing apparatus that performs substrate processing are cleaned using the processing liquid Techniques for drainage.

以下參照圖式，基於實施例對用以實施本發明的形態例示性地進行說明。Hereinafter, referring to the drawings, an embodiment of the present invention will be exemplarily described based on examples.

＜實施例＞ （基板處理裝置的構成） 圖1是表示實施例的基板處理裝置1的概略構成的框圖。基板處理裝置1是將處理液貯存於處理槽11，使用保持基板的升降機（未圖示），使基板浸漬於該處理槽11來進行處理的所謂的批次式的裝置。<Example> (Configuration of Substrate Processing Apparatus) FIG. 1 is a block diagram showing a schematic configuration of a substrate processing apparatus 1 of an example. The substrate processing apparatus 1 is a so-called batch-type apparatus that stores a processing liquid in a processing tank 11 and uses a lifter (not shown) that holds the substrate to immerse the substrate in the processing tank 11 for processing.

再者，於本說明書中，「處理液」這一單詞是以包含藥液與純水的含義來使用。作為藥液，除了混合酸（硝酸、磷酸、醋酸的混合液）之外，還可列舉：例如，硫酸與過氧化氫水的混合液（sulfuric acid/hydrogen peroxide mixture，SPM）、臭氧過水（臭氧、過氧化氫水的混合液）、SC1（氨水與過氧化氫水的混合液）、SC2（鹽酸與過氧化氫水的混合液）、HF（氫氟酸）、H3PO4（磷酸）、FPM（氫氟酸與過氧化氫水的混合液）、FOM（氫氟酸與臭氧過水的混合液）等。所述處理液根據基板上的形成膜的種類、處理工序等而適宜地選擇性地使用。In addition, in this specification, the word "treatment liquid" is used to include the chemical liquid and pure water. As the chemical solution, in addition to the mixed acid (mixed solution of nitric acid, phosphoric acid, and acetic acid), for example, a mixed solution of sulfuric acid and hydrogen peroxide water (sulfuric acid/hydrogen peroxide mixture, SPM), and ozone over water ( Ozone, hydrogen peroxide water mixture), SC1 (ammonia water and hydrogen peroxide water mixture), SC2 (hydrochloric acid and hydrogen peroxide water mixture), HF (hydrofluoric acid), H3PO4 (phosphoric acid), FPM (Mixed solution of hydrofluoric acid and hydrogen peroxide water), FOM (mixed solution of hydrofluoric acid and ozone over water), etc. The processing liquid is appropriately and selectively used according to the type of film formed on the substrate, processing steps, and the like.

處理槽11是用以貯存作為處理液的各種藥液、純水等的容器，包括：進行基板的浸漬處理的內槽111、及以包圍內槽111的周圍的方式配置、且回收自內槽111溢出的處理液的外槽112。內槽111具有可收容載置基板的升降機的大小，外槽112是具有較內槽111小的收容量的容器。The processing tank 11 is a container for storing various chemical liquids, pure water, and the like as a processing liquid, and includes an inner tank 111 that performs immersion treatment of a substrate, and is arranged to surround the inner tank 111 and recovered from the inner tank 111 overflow the outer tank 112 of the processing liquid. The inner tank 111 has a size that can accommodate a lifter on which a substrate is placed, and the outer tank 112 is a container having a smaller storage capacity than the inner tank 111.

於內槽111的底部配置有排出內槽111內的處理液的內槽排液口（未圖示），且連接於後述的排液配管13的內槽排液配管部13a。另外，於內槽111的底部附近，分別沿著長邊方向側面內壁配置有處理液供給噴嘴（未圖示）、及處理液循環噴嘴（未圖示）。處理液供給噴嘴經由處理液供給管122而與處理液供給源121連接，根據配置於處理液供給管122的處理液噴嘴的開閉而朝內槽111供給處理液。處理液循環噴嘴與後述的循環配管14連接。At the bottom of the inner tank 111, an inner tank drain port (not shown) for discharging the processing liquid in the inner tank 111 is disposed, and is connected to an inner tank drain pipe portion 13a of a drain pipe 13 described later. In addition, in the vicinity of the bottom of the inner tank 111, a processing liquid supply nozzle (not shown) and a processing liquid circulation nozzle (not shown) are arranged along the inner wall of the side in the longitudinal direction. The processing liquid supply nozzle is connected to the processing liquid supply source 121 via the processing liquid supply tube 122, and supplies the processing liquid to the inner tank 111 according to the opening and closing of the processing liquid nozzle disposed in the processing liquid supply tube 122. The processing liquid circulation nozzle is connected to a circulation pipe 14 described later.

於外槽112的底部配置有排出外槽112內的處理液的外槽排液口（未圖示），且連接於後述的排液配管13的外槽排液配管部13b。另外，外槽112包括檢測液面的高度（即，貯存的處理液的量）的位準感測器（例如，超聲波變位計等。未圖示）。An outer tank drain port (not shown) for discharging the processing liquid in the outer tank 112 is disposed at the bottom of the outer tank 112, and is connected to an outer tank drain pipe portion 13b of a drain pipe 13 described later. In addition, the outer tank 112 includes a level sensor (for example, an ultrasonic displacement meter, etc. that is not shown) that detects the height of the liquid surface (that is, the amount of the stored processing liquid).

基板處理裝置1具有將處理槽11與廢液回收罐17連接的排液配管13，所述排液配管13包括：與內槽111連接的內槽排液配管部13a及與外槽112連接的外槽排液配管部13b。於排液配管13的內槽排液配管部13a配置有內槽排液閥131，於外槽排液配管部13b配置有外槽排液閥132，根據所述閥的開閉來控制來自內槽111、外槽112的處理液的排出。再者，內槽排液閥131及外槽排液閥132相當於本發明的處理槽排液閥。另外，排液配管13更包括泵133、及配置於較泵133更靠下游處且較廢液回收罐17更靠上游處的單通排液閥134。The substrate processing apparatus 1 includes a drain pipe 13 that connects the processing tank 11 and the waste liquid recovery tank 17. The drain pipe 13 includes an inner tank drain pipe portion 13 a connected to the inner tank 111 and an outer tank 112 connected to the outer tank 112. Outer tank drain piping 13b. An inner tank drain valve 131 is arranged in the inner tank drain pipe 13a of the drain pipe 13, and an outer tank drain valve 132 is arranged in the outer tank drain pipe 13b, and the control from the inner tank is controlled according to the opening and closing of the valve 111. Discharge of the processing liquid from the outer tank 112. In addition, the inner tank drain valve 131 and the outer tank drain valve 132 correspond to the treatment tank drain valve of the present invention. In addition, the drain piping 13 further includes a pump 133 and a one-way drain valve 134 disposed downstream of the pump 133 and upstream of the waste liquid recovery tank 17.

廢液回收罐17包括廢液配管171及廢液閥172，於廢液閥172為打開狀態時，將罐內的廢液自廢液配管171排出至廢液處理設備等。另外，廢液回收罐17包括：檢測罐內的液面的高度的位準感測器（未圖示）、及測量罐內的廢液的溫度的溫度感測器（未圖示）。The waste liquid recovery tank 17 includes a waste liquid pipe 171 and a waste liquid valve 172. When the waste liquid valve 172 is in an open state, the waste liquid in the tank is discharged from the waste liquid pipe 171 to a waste liquid processing facility or the like. In addition, the waste liquid recovery tank 17 includes a level sensor (not shown) that detects the height of the liquid surface in the tank, and a temperature sensor (not shown) that measures the temperature of the waste liquid in the tank.

另外，基板處理狀裝置1具有循環配管14，所述循環配管14的一端連接於泵133與單通排液閥134之間，另一端連接於所述處理液循環噴嘴。循環配管14包括：過濾器141、位於過濾器141與處理液循環噴嘴之間的處理槽循環閥142、及加熱器143。In addition, the substrate processing apparatus 1 has a circulation pipe 14 having one end connected between the pump 133 and the one-way drain valve 134 and the other end connected to the treatment liquid circulation nozzle. The circulation piping 14 includes a filter 141, a treatment tank circulation valve 142 located between the filter 141 and the treatment liquid circulation nozzle, and a heater 143.

另外，基板處理裝置1具有旁通配管15，所述旁通配管15的一端於過濾器141與處理槽循環閥142之間與循環配管14連接，另一端於較單通排液閥134更靠下游處與排液配管13連接。旁通配管15於其上游附近具備循環排液閥151。In addition, the substrate processing apparatus 1 has a bypass pipe 15. One end of the bypass pipe 15 is connected to the circulation pipe 14 between the filter 141 and the processing tank circulation valve 142, and the other end is closer to the single-pass drain valve 134. The drain pipe 13 is connected downstream. The bypass pipe 15 is provided with a circulation drain valve 151 near its upstream.

另外，基板處理裝置1具有控制部16。控制部16的作為硬體的構成與一般的電腦相同。即，構成為包括：鍵盤（keyboard）等輸入部、監視器（monitor）等輸出部、中央處理單元（Central Processing Unit，CPU）、唯讀記憶體（Read only memory，ROM）、隨機存取記憶體（Random access memory，RAM）及大容量儲存裝置等。控制部16與升降機、處理液供給源121、泵133、加熱器143、各部的閥、各種感測器等電性連接，藉由CPU執行規定的處理程式，自裝置各部的感測器獲取資訊，從而對裝置各部的動作進行控制。In addition, the substrate processing apparatus 1 has a control unit 16. The hardware configuration of the control unit 16 is the same as that of a general computer. That is, it is configured to include an input unit such as a keyboard, an output unit such as a monitor, a central processing unit (CPU), a read only memory (ROM), and a random access memory (Random access memory, RAM) and mass storage devices, etc. The control unit 16 is electrically connected to the elevator, the processing liquid supply source 121, the pump 133, the heater 143, the valves of various parts, various sensors, etc. The CPU executes a prescribed processing program to obtain information from the sensors of each part of the device To control the operation of each part of the device.

（處理液的流動） 圖2、圖3、圖4是分別表示閥的開閉狀況與處理液的流動的關係的圖。於所述般的裝置構成中，當單通排液閥134為開放狀態時，自處理槽11排出的處理液被直接回收至廢液回收罐17（參照圖2）。另一方面，當單通排液閥134為封閉狀態時，處理液流入至循環配管14。流入至循環配管14的處理液利用過濾器141被過濾，且若處理槽循環閥142開放，循環排液閥151為封閉的狀態，則自處理液循環噴嘴被供給至內槽111（參照圖3）。另一方面，若處理槽循環閥142封閉，循環排液閥151為開放的狀態，則處理液經由旁通配管15而被回收至廢液回收罐17（參照圖4）。(Flow of the processing liquid) FIGS. 2, 3, and 4 are diagrams showing the relationship between the opening and closing status of the valve and the flow of the processing liquid, respectively. In the general device configuration described above, when the one-way drain valve 134 is opened, the processing liquid discharged from the processing tank 11 is directly recovered to the waste liquid recovery tank 17 (see FIG. 2 ). On the other hand, when the one-way drain valve 134 is in the closed state, the processing liquid flows into the circulation pipe 14. The treatment liquid flowing into the circulation pipe 14 is filtered by the filter 141, and if the treatment tank circulation valve 142 is opened and the circulation drain valve 151 is closed, the treatment liquid circulation nozzle is supplied to the inner tank 111 (refer to FIG. 3 ). On the other hand, when the treatment tank circulation valve 142 is closed and the circulation drain valve 151 is open, the treatment liquid is recovered to the waste liquid recovery tank 17 via the bypass pipe 15 (see FIG. 4 ).

再者，於將基板浸漬於貯存有處理液的內槽111中，並進行基板的處理期間，成為內槽排液閥131為封閉狀態，外槽排液閥132為開放狀態，單通排液閥134為封閉狀態，處理槽循環閥142為開放狀態，循環排液閥151為封閉狀態。而且，自外槽112排出的處理液利用泵133被壓送，而流入至循環配管14，並視需要利用加熱器143進行加熱，於利用過濾器141過濾（去除顆粒）後，自處理液循環噴嘴被供給至內槽111。藉此，處理液自內槽111溢出至外槽112，故即便外槽排液閥132為開放狀態，外槽112亦不會變空，即便不供給新的處理液亦可利用循環的處理液進行基板的處理。Furthermore, during the process of immersing the substrate in the inner tank 111 storing the processing liquid and processing the substrate, the inner tank drain valve 131 is closed, the outer tank drain valve 132 is open, and the single-pass drain The valve 134 is in a closed state, the treatment tank circulation valve 142 is in an open state, and the circulation drain valve 151 is in a closed state. The treatment liquid discharged from the outer tank 112 is pumped by the pump 133, flows into the circulation pipe 14, and is heated by the heater 143 as necessary. After filtering (removing particles) by the filter 141, the treatment liquid circulates The nozzle is supplied to the inner tank 111. As a result, the processing liquid overflows from the inner tank 111 to the outer tank 112, so even if the outer tank drain valve 132 is open, the outer tank 112 will not become empty, and the circulating processing liquid can be used even if no new processing liquid is supplied Process the substrate.

（基板處理裝置的洗淨方法） 以下，參照圖5對本實施例的基板處理裝置1的洗淨的流程進行說明。圖5是表示自基板的處理結束後開始的洗淨的流程的流程圖。如圖5所示，基板的處理結束後，控制部16首先將單通排液閥134、內槽排液閥131及外槽排液閥132開放，將處理槽11內的處理液全部排出（步驟S101）。藉此，內槽111、外槽112（及配管內）成為空的狀態，經排出的處理液全部被回收至廢液回收罐17。再者，所述處理相當於洗淨準備步驟。(Washing Method of Substrate Processing Apparatus) Hereinafter, the flow of cleaning of the substrate processing apparatus 1 of this embodiment will be described with reference to FIG. 5. FIG. 5 is a flowchart showing the flow of cleaning started after the substrate processing is completed. As shown in FIG. 5, after the processing of the substrate is completed, the control unit 16 first opens the one-way drain valve 134, the inner tank drain valve 131, and the outer tank drain valve 132 to discharge all the processing liquid in the processing tank 11 ( Step S101). As a result, the inner tank 111 and the outer tank 112 (and inside the piping) become empty, and all of the discharged processing liquid is recovered to the waste liquid recovery tank 17. In addition, this process corresponds to a washing preparation step.

接著，控制部16將內槽排液閥131及外槽排液閥132封閉，將處理液閥123開放。藉此，自處理液供給源121將新的（潔淨的）處理液供給至內槽111。而且，超過內槽111的容量而供給的處理液溢出至外槽112，於外槽112中亦貯存處理液。此處，貯存於外槽112的處理液的量由設置於外槽112的液面位準感測器檢測，並由控制部16獲取該資訊。而且，於貯存於外槽112的處理液的量達到規定量的情況下，控制部16將處理液閥123封閉，來停止供給處理液。藉此，成為內槽111及外槽112中填充有與規定量相應的處理液的狀態（步驟S102）。所述處理相當於處理槽11洗淨步驟。再者，自洗淨外槽的觀點出發，貯存於外槽的處理液的「規定量」理想的是設為與外槽的容積接近的值（自容積減去餘量所得的程度）。Next, the control unit 16 closes the inner tank drain valve 131 and the outer tank drain valve 132 and opens the processing liquid valve 123. Thereby, a new (clean) processing liquid is supplied to the inner tank 111 from the processing liquid supply source 121. Furthermore, the processing liquid supplied beyond the capacity of the inner tank 111 overflows to the outer tank 112, and the processing liquid is also stored in the outer tank 112. Here, the amount of the processing liquid stored in the outer tank 112 is detected by the liquid level sensor provided in the outer tank 112, and the control unit 16 acquires the information. Then, when the amount of the processing liquid stored in the outer tank 112 reaches a predetermined amount, the control unit 16 closes the processing liquid valve 123 to stop the supply of the processing liquid. Thereby, the inner tank 111 and the outer tank 112 are filled with the processing liquid corresponding to a predetermined amount (step S102). This processing corresponds to the washing step of the processing tank 11. In addition, from the viewpoint of washing the outer tank, the "predetermined amount" of the processing liquid stored in the outer tank is desirably set to a value close to the volume of the outer tank (a degree obtained by subtracting the remaining amount from the volume).

接著，控制部16基於設於廢液罐的液面位準感測器的資訊，判斷廢液回收罐17中是否有規定的剩餘容量（步驟S103）。所述處理相當於罐剩餘容量確認步驟。再者，廢液回收罐17的「規定的剩餘容量」被設定為較步驟S102中所說的外槽的規定量大的值（例如，外槽112的容積）。Next, the control unit 16 determines whether or not there is a predetermined remaining capacity in the waste liquid recovery tank 17 based on the information of the liquid level sensor provided in the waste liquid tank (step S103). This process corresponds to the remaining tank capacity confirmation step. In addition, the "predetermined remaining capacity" of the waste liquid recovery tank 17 is set to a value larger than the predetermined amount of the outer tank (for example, the volume of the outer tank 112) mentioned in step S102.

而且，於步驟S103中，於判定為不存在規定的剩餘容量的情況下，繼而，判斷廢液回收罐17內的廢液的溫度是否為規定的值（例如70℃）以下（步驟S104）。此處，於判定為廢液的溫度為規定的值以下的情況下，將廢液閥172開放，排出罐內的廢液（步驟S105），並返回至步驟S103。另一方面，於步驟S104中，於判定為廢液的溫度超過規定的值的情況下，等待規定時間後，再次重覆判斷廢液回收罐17內的廢液的溫度是否為規定的值以下的處理。再者，所述步驟S104及步驟S105的一系列的處理相當於罐剩餘容量確保步驟。In step S103, when it is determined that there is no predetermined remaining capacity, it is next determined whether the temperature of the waste liquid in the waste liquid recovery tank 17 is equal to or lower than a predetermined value (for example, 70°C) (step S104). Here, when it is determined that the temperature of the waste liquid is equal to or less than a predetermined value, the waste liquid valve 172 is opened to discharge the waste liquid in the tank (step S105), and the process returns to step S103. On the other hand, in step S104, when it is determined that the temperature of the waste liquid exceeds a predetermined value, after waiting for a predetermined time, it is repeatedly determined whether the temperature of the waste liquid in the waste liquid recovery tank 17 is below a predetermined value Treatment. In addition, the series of processing in step S104 and step S105 corresponds to a tank remaining capacity ensuring step.

再者，於步驟S105中，於將廢液回收罐17內的廢液排出的情況下，亦可未必需要將罐完全排空，而進行盡可能確保規定的剩餘容量部分的排出。另外，可一邊執行來自罐的排液一邊返回至步驟S103。In addition, in step S105, when the waste liquid in the waste liquid recovery tank 17 is discharged, the tank may not necessarily be completely emptied, and a portion of the predetermined remaining capacity may be discharged as much as possible. In addition, it is possible to return to step S103 while performing the liquid discharge from the tank.

於步驟S103中，於判定為存在規定的剩餘容量的情況下，將外槽排液閥132設為開放狀態，將單通排液閥134設為封閉狀態，將處理槽循環閥142設為封閉狀態，將循環排液閥151設為開放狀態，將貯存於外槽112的處理液全量排出（步驟S106）。此時，經排出的處理液經由循環配管14及旁通配管15而被回收至廢液回收罐17，藉此對配管內進行洗淨（參照圖4）。所述處理相當於循環排液處理、配管洗淨步驟。In step S103, when it is determined that there is a predetermined remaining capacity, the outer tank drain valve 132 is opened, the one-way drain valve 134 is closed, and the processing tank circulation valve 142 is closed In the state, the circulation drain valve 151 is opened, and the entire amount of the processing liquid stored in the outer tank 112 is discharged (step S106). At this time, the discharged processing liquid is recovered to the waste liquid recovery tank 17 via the circulation pipe 14 and the bypass pipe 15, thereby washing the inside of the pipe (see FIG. 4 ). The processing corresponds to the steps of circulating liquid drainage processing and piping washing.

再者，自處理液供給源121新供給的處理液為常溫（約25℃），故當此處理液被回收至廢液回收罐17時，會促進罐內的廢液的冷卻。即，越進行使用新液的循環排液處理，越能夠迅速地將廢液排出至罐外，故於罐中存在規定的剩餘容量以上的空間的情況下，若直接進行循環排液處理，則可效率良好地確保廢液回收罐17的剩餘容量。Furthermore, the processing liquid newly supplied from the processing liquid supply source 121 is at ordinary temperature (about 25° C.), so when this processing liquid is recovered to the waste liquid recovery tank 17, the cooling of the waste liquid in the tank is promoted. That is, the more the circulating liquid discharge treatment using the new liquid, the more quickly the waste liquid can be discharged to the outside of the tank. Therefore, when there is a space above the predetermined remaining capacity in the tank, if the circulating liquid discharge treatment is directly performed, The remaining capacity of the waste liquid recovery tank 17 can be efficiently ensured.

接著，控制部16判斷進行步驟S106的循環排液處理的次數是否成為規定的重覆次數（例如三次）（步驟S107）。此處，於判定為達到規定的重覆次數的情況下，結束程序，於判定為未滿規定的重覆次數的情況下，返回至步驟S102並重覆處理。再者，為了進行所述判定，控制部16對進行循環廢液處理的次數計數，並保存於ROM等。Next, the control unit 16 determines whether or not the number of times of performing the circular drainage process of step S106 becomes a predetermined number of repetitions (for example, three times) (step S107). Here, when it is determined that the predetermined number of repetitions has been reached, the program is ended, and when it is determined that the predetermined number of repetitions is not reached, the process returns to step S102 and the processing is repeated. In addition, in order to perform the above-mentioned determination, the control unit 16 counts the number of times of circulating waste liquid processing and stores it in the ROM or the like.

藉由以上般的基板處理裝置1的構成，能夠利用圖4所示的路線排出處理液，並且不會使殘留於配管內的廢液、顆粒等進入至處理槽11，而能夠洗淨處理槽11及配管內。因此，能夠將處理槽11內的潔淨度維持得高，藉此可提高基板處理的品質。With the configuration of the substrate processing apparatus 1 as described above, the processing liquid can be discharged by the route shown in FIG. 4, and the processing liquid can be washed without causing waste liquid, particles, etc. remaining in the piping to enter the processing tank 11. 11 and inside the piping. Therefore, the cleanliness in the processing tank 11 can be maintained high, whereby the quality of substrate processing can be improved.

另外，如上所述，使用與外槽112的規定量相應的處理液對配管內進行洗淨，故於基板處理裝置1的洗淨程序結束後，成為於內槽111中填充有潔淨的處理液的狀態。因此，能夠快速的實施下一個基板處理，而可提高裝置的處理量。進而，與將內槽111及外槽112全部進行排液來進行洗淨的情況相比，能夠節約處理液。In addition, as described above, the inside of the piping is cleaned with the processing liquid corresponding to the predetermined amount of the outer tank 112, so after the cleaning process of the substrate processing apparatus 1 is completed, the inner tank 111 is filled with clean processing liquid status. Therefore, the next substrate processing can be carried out quickly, and the throughput of the device can be increased. Furthermore, compared with the case where all the inner tank 111 and the outer tank 112 are drained and washed, the processing liquid can be saved.

另外，若廢液回收罐17中存在與外槽112的規定量相應的剩餘容量，則可進行洗淨處理，故無需等待廢液回收罐17變空，而可效率良好地進行洗淨處理。進而，如上所述，當使用新液進行洗淨處理時，罐內的廢液的溫度下降，故藉由提早進行洗淨處理的時機，亦能夠提早自廢液回收罐17排液的時機。藉由此種協同效應，能夠進一步減少待機時間，從而能夠有助於裝置的流通量的提高。In addition, if there is a surplus capacity corresponding to the predetermined amount of the outer tank 112 in the waste liquid recovery tank 17, the washing process can be performed. Therefore, the washing process can be efficiently performed without waiting for the waste liquid recovery tank 17 to become empty. Furthermore, as described above, the temperature of the waste liquid in the tank decreases when the cleaning process is performed with fresh liquid, so that the timing of discharging the liquid from the waste liquid recovery tank 17 can also be early by the timing of performing the cleaning process earlier. By this synergistic effect, the standby time can be further reduced, which can contribute to the improvement of the circulation of the device.

＜變形例1＞ 再者，所述的實施例例如亦可進行如以下的各變形例般的變形。圖6是表示第1變形例的基板處理裝置1的概略構成的框圖。如圖6所示，本變形例在如下方面與所述實施例不同，即排液配管13於較單通排液閥134更下游處具備藥液排液閥135，且於該藥液排液閥135與單通排液閥134之間具有連接於排液配管13的純水排液配管136。<Modification 1> Furthermore, the above-mentioned embodiment may be modified as in the following modifications, for example. FIG. 6 is a block diagram showing a schematic configuration of the substrate processing apparatus 1 of the first modification. As shown in FIG. 6, this modified example differs from the above-described embodiment in that the liquid discharge pipe 13 is provided with a chemical liquid discharge valve 135 at a position downstream of the single-pass liquid discharge valve 134, and discharges the liquid Between the valve 135 and the one-way drain valve 134, a pure water drain pipe 136 connected to the drain pipe 13 is provided.

純水排液配管136具備純水排液閥137，且於該純水排液閥137為開放狀態，藥液排液閥135為封閉狀態的情況下，處理液不會被回收至廢液回收罐17，而自純水排液配管136朝裝置外進行排液。The pure water discharge piping 136 is provided with a pure water discharge valve 137, and when the pure water discharge valve 137 is in an open state and the chemical liquid discharge valve 135 is in a closed state, the processing liquid is not recovered to waste liquid recovery The tank 17 discharges liquid out of the device from the pure water discharge pipe 136.

若為所述構成，則於使用無需經由廢液回收罐17的處理液（例如純水）的情況下，可直接朝裝置外排出處理液。另一方面，當將純水排液閥137設為封閉狀態，將藥液排液閥135設為開放狀態，則處理液被回收至廢液回收罐17，故可根據使用的處理液而進行靈活的運用。According to the above configuration, when the processing liquid (for example, pure water) that does not need to pass through the waste liquid recovery tank 17 is used, the processing liquid can be directly discharged outside the device. On the other hand, when the pure water discharge valve 137 is closed and the chemical liquid discharge valve 135 is open, the processing liquid is recovered to the waste liquid recovery tank 17, so it can be performed according to the used processing liquid Flexible use.

＜變形例2＞ 圖7是表示第2變形例的基板處理裝置1的概略構成的框圖。如圖7所示，本變形例的基板處理裝置1與實施例相比於如下方面不同：不具備廢液回收罐17、廢液配管171、及廢液閥172。<Modification 2> FIG. 7 is a block diagram showing a schematic configuration of a substrate processing apparatus 1 according to a second modification. As shown in FIG. 7, the substrate processing apparatus 1 of this modification is different from the embodiment in that it does not include the waste liquid recovery tank 17, the waste liquid piping 171, and the waste liquid valve 172.

例如淋洗槽等，若決定僅使用無需經由廢液回收罐17的液體作為處理液，則藉由如此般簡化裝置構成,可削減成本及裝置的設置空間。再者,於該情況下,省略所述的罐剩餘容量確認步驟及罐剩餘容量確保步驟。For example, if it is determined that only a liquid that does not need to pass through the waste liquid recovery tank 17 is used as the processing liquid, the simplification of the device configuration can reduce the cost and installation space of the device. Furthermore, in this case, the above-mentioned tank remaining capacity confirmation step and tank remaining capacity ensuring step are omitted.

＜變形例3＞ 圖8是表示第3變形例的基板處理裝置1的概略構成的框圖。本變形例的基板處理裝置1構成為：於外槽112配置有處理液供給噴嘴，且處理液供給管122將處理液供給至位於外槽112的處理液供給噴嘴。<Modification 3> FIG. 8 is a block diagram showing a schematic configuration of a substrate processing apparatus 1 of a third modification. The substrate processing apparatus 1 of this modification is configured such that a processing liquid supply nozzle is arranged in the outer tank 112, and the processing liquid supply pipe 122 supplies the processing liquid to the processing liquid supply nozzle located in the outer tank 112.

若為所述構成，則可使處理液不經由內槽111而僅貯存於外槽112，來進行循環排液處理。於此種情況下，因無需等待填充內槽111，故與實施例相比，能夠縮短裝置的配管內洗淨自身所需的時間。According to the above-described configuration, the processing liquid can be stored in the outer tank 112 without passing through the inner tank 111 to perform the circulating liquid discharge process. In this case, since there is no need to wait for the inner tank 111 to be filled, the time required for washing itself in the piping of the device can be shortened compared to the embodiment.

＜變形例4＞ 圖9是表示第4變形例的基板處理裝置1的概略構成的框圖。如圖9所示，於本變形例中，循環配管14的下游側的一端與處理液供給管122連接。即，構成為：循環配管14的一端經由處理液供給管122（及處理液供給噴嘴）而與處理槽11相連。<Modification 4> FIG. 9 is a block diagram showing a schematic configuration of a substrate processing apparatus 1 according to a fourth modification. As shown in FIG. 9, in this modification, the downstream end of the circulation pipe 14 is connected to the processing liquid supply pipe 122. That is, one end of the circulation pipe 14 is connected to the processing tank 11 via the processing liquid supply pipe 122 (and the processing liquid supply nozzle).

若為所述構成，則即便於使處理液於處理槽11循環的情況下，亦可移用處理液供給管122的一部分與處理液供給噴嘴。藉此可不設置處理液循環噴嘴，而能夠簡化裝置構成。With this configuration, even when the processing liquid is circulated through the processing tank 11, a part of the processing liquid supply tube 122 and the processing liquid supply nozzle can be transferred. Thereby, it is possible to simplify the device configuration without providing a processing liquid circulation nozzle.

＜變形例5＞ 圖10是表示第5變形例的基板處理裝置1的概略構成的框圖。如圖10所示，於本變形例中，單通排液閥134位於循環配管14，旁通配管15於較藥液排液閥135更靠下游處與排液配管13連接。即，於本變形例中，藉由將藥液排液閥135及純水排液閥137設為封閉狀態，將單通排液閥134設為開放狀態，來實施循環排液處理。而且，藉由循環排液處理而流入至旁通配管15的處理液被回收至廢液回收罐17。<Modification 5> FIG. 10 is a block diagram showing a schematic configuration of a substrate processing apparatus 1 according to a fifth modification. As shown in FIG. 10, in this modification, the one-way drain valve 134 is located in the circulation pipe 14, and the bypass pipe 15 is connected to the drain pipe 13 downstream of the chemical liquid drain valve 135. That is, in this modified example, the circulating liquid discharge process is performed by setting the chemical liquid discharge valve 135 and the pure water discharge valve 137 to the closed state and the single-pass liquid discharge valve 134 to the open state. Then, the processing liquid that has flowed into the bypass pipe 15 by the circulating liquid discharge process is recovered to the waste liquid recovery tank 17.

另外，本變形例的基板處理裝置1包括：於圖10所示般於循環配管14中將過濾器141的上游與下游連接的循環迂回配管145、及對該循環迂回配管145的流路進行開閉的循環迂回閥146。進而，於本變形例中，具有過濾器排液配管18，其一端連接於過濾器141，另一端於較連接循環配管14的位置更靠下游處與排液配管13連接，且該過濾器排液配管18具備過濾器排液閥181。In addition, the substrate processing apparatus 1 of this modification includes a circulation detour pipe 145 connecting the upstream and downstream of the filter 141 to the circulation pipe 14 as shown in FIG. 10, and opening and closing the flow path of the circulation detour pipe 145的Circuit detour valve146. Furthermore, in this modification, there is a filter drain pipe 18, one end of which is connected to the filter 141, and the other end is connected to the drain pipe 13 further downstream than the position where the circulation pipe 14 is connected, and the filter drain The liquid piping 18 includes a filter drain valve 181.

根據所述構成，藉由將循環排液閥151封閉，將過濾器排液閥181開放，即便於本變形例中，於使用無需經由廢液回收罐17的處理液的情況下，亦可直接朝裝置外排出處理液。如此，基板處理裝置1的配管及閥的配置可於本發明的技術思想的範圍內自由地設定。According to the above configuration, by closing the circulation drain valve 151 and opening the filter drain valve 181, even in this modification, when using the processing liquid that does not need to pass through the waste liquid recovery tank 17, it is possible to directly Discharge the treatment fluid out of the device. In this way, the arrangement of piping and valves of the substrate processing apparatus 1 can be freely set within the scope of the technical idea of the present invention.

＜其他＞ 再者，所述各例只不過是例示性地說明本發明，本發明並不限定於所述具體的態樣。本發明於其技術思想的範圍內可進行各種應用。例如，控制部16亦可管理基板的處理次數（片數），並針對規定的處理次數（片數），來執行所述實施例的循環排液處理。若如此，則能夠於將基板處理裝置的處理槽及配管內的清潔性維持在規定水準以上的狀態下，繼續實施基板處理。<Others> Furthermore, the above examples are merely illustrative of the present invention, and the present invention is not limited to the specific aspects. The invention can be used in various applications within the scope of its technical idea. For example, the control unit 16 may manage the number of processing times (number of pieces) of the substrate, and execute the circulating liquid discharge processing of the above-described embodiment for a predetermined number of processing times (number of pieces). In this way, it is possible to continue the substrate processing while maintaining the cleanliness in the processing tank and piping of the substrate processing apparatus above a predetermined level.

另外，於所述實施例中，將廢液回收罐17中的「規定的剩餘容量」設定得較貯存於外槽112的規定量的處理液大，當外槽112中貯存有規定量的處理液時，一次將所述處理液全量排出，但未必需要如此。例如，亦可將廢液回收罐17中的「規定的剩餘容量」設定為小的值，使自外槽112一次排出的處理液的量小於此值（即，亦可為利用一次排液而外槽112不會變空般的值）。In addition, in the above embodiment, the "predetermined remaining capacity" in the waste liquid recovery tank 17 is set to be larger than the prescribed amount of processing liquid stored in the outer tank 112, and when the prescribed amount of processing is stored in the outer tank 112 In the case of liquid, the whole amount of the treatment liquid is discharged at one time, but this is not necessarily the case. For example, the "predetermined remaining capacity" in the waste liquid recovery tank 17 may be set to a small value so that the amount of the treatment liquid discharged from the outer tank 112 at a time is smaller than this value (that is, The outer slot 112 will not become empty).

另外，於所述各例中，僅示出了一個處理液供給部件（處理液供給源121、處理液供給管122、及處理液閥123），但亦可根據使用的處理液的種類來設置多個處理液供給部件。In addition, in the above examples, only one processing liquid supply member (processing liquid supply source 121, processing liquid supply pipe 122, and processing liquid valve 123) is shown, but it may be provided according to the type of processing liquid used Multiple processing liquid supply components.

另外，於所述各例中，自外槽112排出處理液，並進行循環排液處理，但亦可藉由自內槽111排出新液，而進行循環排液處理。進而，於所述各例中，處理槽11為具備內槽111與外槽112的結構，但亦可為僅包含一個槽的處理槽。In addition, in the above examples, the treatment liquid is discharged from the outer tank 112 and the circulation liquid drainage process is performed, but it is also possible to perform the circulation liquid drainage process by discharging the new liquid from the inner tank 111. Furthermore, in the above examples, the processing tank 11 has a structure including the inner tank 111 and the outer tank 112, but it may be a processing tank including only one tank.

1‧‧‧基板處理裝置11‧‧‧處理槽13‧‧‧排液配管13a‧‧‧內槽排液配管部13b‧‧‧外槽排液配管部14‧‧‧循環配管15‧‧‧旁通配管16‧‧‧控制部17‧‧‧廢液回收罐18‧‧‧過濾器排液配管111‧‧‧內槽112‧‧‧外槽121‧‧‧處理液供給源122‧‧‧處理液供給管123‧‧‧處理液閥131‧‧‧內槽排液閥132‧‧‧外槽排液閥133‧‧‧泵134‧‧‧單通排液閥135‧‧‧藥液排液閥136‧‧‧純水排液配管137‧‧‧純水排液閥141‧‧‧過濾器142‧‧‧處理槽循環閥143‧‧‧加熱器145‧‧‧循環迂回配管146‧‧‧循環迂回閥151‧‧‧循環排液閥171‧‧‧廢液配管172‧‧‧廢液閥181‧‧‧過濾器排液閥S101～S107‧‧‧步驟1‧‧‧Substrate processing device 11‧‧‧Process tank 13‧‧‧Discharge piping 13a‧‧‧Inner tank drain piping 13b‧‧‧Outer tank drain piping 14‧‧‧Circulation piping 15‧‧‧ Bypass piping 16‧‧‧Control unit 17‧‧‧ Waste liquid recovery tank 18‧‧‧ Filter discharge piping 111‧‧‧Inner tank 112‧‧‧Outer tank 121‧‧‧Process liquid supply source 122‧‧‧ Treatment liquid supply pipe 123‧‧‧Process liquid valve 131‧‧‧Inner tank drain valve 132‧‧‧Outer tank drain valve 133‧‧‧Pump 134‧‧‧One-way drain valve 135‧‧‧Drainage Liquid valve 136‧‧‧Pure water discharge piping 137‧‧‧Pure water discharge valve 141‧‧‧Filter 142‧‧‧Treatment tank circulation valve 143‧‧‧ Heater 145‧‧‧Circuit detour piping 146‧‧ ‧Circulation detour valve 151‧‧‧Circulation drain valve 171‧‧‧ Waste liquid piping 172‧‧‧ Waste liquid valve 181‧‧‧ Filter drain valve S101～S107‧‧‧Step

圖1是表示實施例的基板處理裝置的概略構成的框圖。 圖2是表示實施例的基板處理裝置的閥的開閉狀況與處理液的流動的關係的第1說明圖。 圖3是表示實施例的基板處理裝置的閥的開閉狀況與處理液的流動的關係的第2說明圖。 圖4是表示實施例的基板處理裝置的閥的開閉狀況與處理液的流動的關係的第3說明圖。 圖5是表示實施例的基板處理裝置的洗淨的流程的流程圖。 圖6是表示第1變形例的基板處理裝置的概略構成的框圖。 圖7是表示第2變形例的基板處理裝置的概略構成的框圖。 圖8是表示第3變形例的基板處理裝置的概略構成的框圖。 圖9是表示第4變形例的基板處理裝置的概略構成的框圖。 圖10是表示第5變形例的基板處理裝置的概略構成的框圖。FIG. 1 is a block diagram showing a schematic configuration of a substrate processing apparatus of an embodiment. 2 is a first explanatory diagram showing the relationship between the opening and closing conditions of the valve of the substrate processing apparatus of the embodiment and the flow of the processing liquid. 3 is a second explanatory diagram showing the relationship between the valve opening and closing conditions and the flow of the processing liquid of the substrate processing apparatus of the embodiment. 4 is a third explanatory diagram showing the relationship between the opening and closing status of the valve of the substrate processing apparatus of the embodiment and the flow of the processing liquid. 5 is a flowchart showing a flow of cleaning of the substrate processing apparatus of the embodiment. 6 is a block diagram showing a schematic configuration of a substrate processing apparatus according to a first modification. 7 is a block diagram showing a schematic configuration of a substrate processing apparatus according to a second modification. 8 is a block diagram showing a schematic configuration of a substrate processing apparatus according to a third modification. 9 is a block diagram showing a schematic configuration of a substrate processing apparatus according to a fourth modification. 10 is a block diagram showing a schematic configuration of a substrate processing apparatus according to a fifth modification.

1‧‧‧基板處理裝置 1‧‧‧Substrate processing device

11‧‧‧處理槽 11‧‧‧Treatment tank

13‧‧‧排液配管 13‧‧‧Drainage piping

13a‧‧‧內槽排液配管部 13a‧‧‧Inner tank drain piping

13b‧‧‧外槽排液配管部 13b‧‧‧Outlet drain piping

14‧‧‧循環配管 14‧‧‧Circulation piping

15‧‧‧旁通配管 15‧‧‧Bypass piping

16‧‧‧控制部 16‧‧‧Control Department

17‧‧‧廢液回收罐 17‧‧‧ Waste liquid recovery tank

111‧‧‧內槽 111‧‧‧Inner slot

112‧‧‧外槽 112‧‧‧Outer slot

121‧‧‧處理液供給源 121‧‧‧Process liquid supply source

122‧‧‧處理液供給管 122‧‧‧Process liquid supply pipe

123‧‧‧處理液閥 123‧‧‧Treatment valve

131‧‧‧內槽排液閥 131‧‧‧Inner tank drain valve

132‧‧‧外槽排液閥 132‧‧‧Outlet drain valve

133‧‧‧泵 133‧‧‧Pump

134‧‧‧單通排液閥 134‧‧‧One-way drain valve

141‧‧‧過濾器 141‧‧‧filter

142‧‧‧處理槽循環閥 142‧‧‧Treatment tank circulation valve

143‧‧‧加熱器 143‧‧‧ Heater

151‧‧‧循環排液閥 151‧‧‧Circulation drain valve

171‧‧‧廢液配管 171‧‧‧ Waste liquid piping

172‧‧‧廢液閥 172‧‧‧ Waste valve

Claims (11)

一種基板處理裝置，其利用處理液對基板進行處理，且所述基板處理裝置包括：處理槽，貯存所述處理液，並使基板浸漬；處理液供給部件，將所述處理液供給至所述處理槽；排液配管，作為所述處理液自所述處理槽朝裝置外排出時的流路；循環配管，包括過濾所述處理液的過濾器，所述循環配管的一端連接於所述處理槽，另一端連接於所述排液配管；旁通配管，作為將所述循環配管與所述排液配管連通，且使經所述過濾器過濾的所述處理液不返回至所述處理槽而進行排液時的流路；一個以上的開閉閥，切換自所述處理槽排出的所述處理液的流路，其中所述開閉閥至少包含單通排液閥，所述單通排液閥切換使自所述處理槽排出的所述處理液僅通過所述排液配管而進行排液的流路、與使自所述處理槽排出的所述處理液自所述排液配管朝所述循環配管流動的流路；以及控制部件，對所述開閉閥進行控制，其中於自所述處理槽排出的所述處理液自所述排液配管朝所述循環配管流動的情況下，所述循環配管形成與所述處理槽之間使所述處理液能夠進行循環的流路。 A substrate processing device that processes a substrate using a processing liquid, and the substrate processing device includes: a processing tank that stores the processing liquid and immerses the substrate; and a processing liquid supply member that supplies the processing liquid to the Treatment tank; drainage pipe as a flow path when the treatment liquid is discharged from the treatment tank to the outside of the device; circulation pipe, including a filter for filtering the treatment liquid, one end of the circulation pipe is connected to the treatment The other end of the tank is connected to the drainage pipe; the bypass pipe serves as a connection between the circulation pipe and the drainage pipe, and the treatment liquid filtered by the filter is not returned to the treatment tank And a flow path at the time of liquid discharge; one or more on-off valves to switch the flow path of the treatment liquid discharged from the treatment tank, wherein the on-off valve includes at least a single-way drain valve, the single-way drain The valve is switched so that the treatment liquid discharged from the treatment tank discharges only through the drainage pipe, and the treatment liquid discharged from the treatment tank is discharged from the drainage pipe toward the A flow path through which the circulation pipe flows; and a control unit that controls the on-off valve, wherein when the treatment liquid discharged from the treatment tank flows from the drainage pipe toward the circulation pipe, the The circulation piping forms a flow path between the treatment tank and the treatment liquid. 如申請專利範圍第1項所述的基板處理裝置，其中所述 排液配管的一端連接於所述處理槽，且所述排液配管於所述配管內的上游處包括切換是否自所述處理槽排出所述處理液的處理槽排液閥，所述循環配管的一端與所述處理槽連通，另一端連接於所述排液配管的較所述處理槽排液閥更靠下游處，且所述循環配管包括位於所述過濾器與所述處理槽之間的處理槽循環閥，所述旁通配管的一端於所述過濾器與所述處理槽循環閥之間和所述循環配管連接，另一端於較連接有所述循環配管的位置更靠下游處與所述排液配管連接，且所述旁通配管包括對所述旁通配管內的流路進行開閉的循環排液閥，所述控制部件藉由對所述處理槽排液閥、單通排液閥、處理槽循環閥、循環排液閥的各閥進行開閉控制，進行使自所述處理槽排出的所述處理液於所述循環配管的一部分及所述旁通配管內流通，且不返回至所述處理槽而進行排液的循環排液處理。 The substrate processing apparatus as described in item 1 of the patent application scope, wherein One end of the drainage pipe is connected to the treatment tank, and the upstream of the drainage pipe includes a treatment tank drainage valve for switching whether to discharge the treatment liquid from the treatment tank, and the circulation pipe Is connected to the treatment tank at one end, and the other end is connected to the drainage pipe more downstream of the treatment tank drainage valve, and the circulation pipe includes between the filter and the treatment tank Treatment tank circulation valve, one end of the bypass pipe is connected between the filter and the treatment tank circulation valve and the circulation pipe, and the other end is located downstream of the position where the circulation pipe is connected It is connected to the drain pipe, and the bypass pipe includes a circulating drain valve that opens and closes the flow path in the bypass pipe. Each valve of the drain valve, the treatment tank circulation valve, and the circulation drain valve performs opening and closing control, and the treatment liquid discharged from the treatment tank is circulated in a part of the circulation piping and the bypass piping, and The circulating liquid discharge process of liquid discharge is performed without returning to the processing tank. 如申請專利範圍第2項所述的基板處理裝置，其更包括回收自所述處理槽排出的處理液的廢液回收罐，所述排液配管的一端連接於所述處理槽，另一端連接於所述廢液回收罐，所述控制部件獲取所述廢液回收罐的剩餘容量的資訊，於所述廢液回收罐中存在規定的剩餘容量的情況下，將所述規定的剩餘容量以下的處理液自所述處理槽排出，來進行所述循環排液處理。 The substrate processing apparatus according to item 2 of the patent application scope further includes a waste liquid recovery tank that recovers the processing liquid discharged from the processing tank, and one end of the liquid discharge pipe is connected to the processing tank and the other end is connected In the waste liquid recovery tank, the control unit obtains information on the remaining capacity of the waste liquid recovery tank, and when the specified residual capacity exists in the waste liquid recovery tank, the predetermined residual capacity is equal to or less than The processing liquid is discharged from the processing tank to perform the circulating liquid discharging process. 如申請專利範圍第3項所述的基板處理裝置，其中所述處理槽包括：使基板浸漬的內槽、及以包圍內槽的周圍的方式配置的外槽，所述排液配管包括：與所述內槽連接的內槽排液配管部、及與所述外槽連接的外槽排液配管部，所述廢液回收罐的規定的剩餘容量設定為所述外槽的容積以上，所述控制部件獲取所述廢液回收罐的剩餘容量的資訊，於所述廢液回收罐中存在規定的剩餘容量的情況下，將貯存於所述外槽的處理液全部排出，來進行所述循環排液處理。 The substrate processing apparatus according to item 3 of the patent application range, wherein the processing tank includes an inner tank in which the substrate is immersed, and an outer tank disposed to surround the inner tank, and the liquid discharge piping includes: The inner tank drain pipe portion connected to the inner tank and the outer tank drain pipe portion connected to the outer tank, the predetermined remaining capacity of the waste liquid recovery tank is set to be equal to or larger than the volume of the outer tank. The control unit acquires information on the remaining capacity of the waste liquid recovery tank, and when there is a predetermined remaining capacity in the waste liquid recovery tank, discharges all the processing liquid stored in the outer tank to perform the process Circulation and drainage treatment. 如申請專利範圍第4項所述的基板處理裝置，其中所述處理液供給部件以將處理液供給至所述內槽的方式配置，所述處理槽為使自所述內槽溢出的處理液貯存於所述外槽的構成，處理液朝所述外槽的供給經由所述內槽進行。 The substrate processing apparatus according to item 4 of the patent application range, wherein the processing liquid supply means is configured to supply the processing liquid to the inner tank, and the processing tank is a processing liquid that overflows from the inner tank In the configuration stored in the outer tank, the supply of the processing liquid to the outer tank is performed through the inner tank. 如申請專利範圍第3項至第5項中任一項所述的基板處理裝置，其中所述廢液回收罐包括：排出已回收至罐內的處理液的流路及開閉所述流路的廢液閥，所述控制部件獲取回收至所述廢液回收罐的處理液的溫度資訊，於所述廢液回收罐內不存在規定的剩餘容量的情況下，只要所述廢液回收罐內的處理液的溫度為規定的溫度以下，則藉由進行所述廢液閥的開閉控制而自所述廢液回收罐排出所述處理液，並於確保所述廢液回收罐的規定的剩餘容量之後，進行所述循環 排液處理。 The substrate processing apparatus according to any one of items 3 to 5 of the patent application range, wherein the waste liquid recovery tank includes: a flow path for discharging the processing liquid recovered into the tank and a means for opening and closing the flow path A waste liquid valve, the control component obtains temperature information of the processing liquid recovered to the waste liquid recovery tank, if there is no prescribed remaining capacity in the waste liquid recovery tank, as long as the waste liquid recovery tank The temperature of the treatment liquid is below a predetermined temperature, the treatment liquid is discharged from the waste liquid recovery tank by performing opening and closing control of the waste liquid valve, and a predetermined surplus of the waste liquid recovery tank is ensured After capacity, perform the cycle Discharge treatment. 如申請專利範圍第2項至第5項中任一項所述的基板處理裝置，其中所述控制部件獲取進行所述循環排液處理的次數的資訊，每次利用所述處理液的基板的處理完成後，重覆進行規定次數的所述循環排液處理。 The substrate processing apparatus according to any one of claims 2 to 5, wherein the control unit acquires information on the number of times the circulating liquid discharge processing is performed, and each time the substrate of the processing liquid is used After the treatment is completed, the circulation drainage treatment is repeated a predetermined number of times. 一種基板處理裝置的洗淨方法，其是具有如下構件的基板處理裝置的洗淨方法，所述基板處理裝置包括：處理槽，具備貯存處理液且進行基板的浸漬處理的內槽及貯存自所述內槽溢出的所述處理液的外槽；排液配管，自所述處理槽排出所述處理液；循環配管，連接於所述排液配管，並將所述內槽與所述排液配管連通；以及旁通配管，連接於所述循環配管及所述排液配管，形成自所述循環配管避開處理槽的流路，且所述基板處理裝置的洗淨方法包括：洗淨準備步驟，將用於所述浸漬處理的已使用完的處理液自所述處理槽排出，處理槽洗淨步驟，將潔淨的處理液供給至所述內槽，進而經由所述內槽將處理液供給至所述外槽，配管洗淨步驟，使所述潔淨的處理液僅自外槽排出，並經由所述排液配管、所述循環配管及旁通配管進行排液。 A cleaning method of a substrate processing apparatus, which is a cleaning method of a substrate processing apparatus having the following components, the substrate processing apparatus including: a processing tank, an inner tank provided with a processing liquid for immersing the substrate and a self storage place An outer tank of the treatment liquid overflowing from the inner tank; a drainage pipe to discharge the treatment liquid from the treatment tank; a circulation pipe connected to the drainage pipe and connecting the inner tank with the drainage liquid Piping connection; and a bypass piping connected to the circulation piping and the drainage piping to form a flow path that avoids the processing tank from the circulation piping, and the cleaning method of the substrate processing apparatus includes: washing preparation In the step, the used treatment liquid used for the immersion treatment is discharged from the treatment tank, the treatment tank cleaning step supplies the clean treatment liquid to the inner tank, and then the treatment liquid is passed through the inner tank It is supplied to the outer tank, and a pipe washing step causes the cleaned processing liquid to be discharged only from the outer tank, and drains liquid through the drain pipe, the circulation pipe, and the bypass pipe. 如申請專利範圍第8項所述的基板處理裝置的洗淨方法，其中於所述配管洗淨步驟中，將一次排出的處理液的量規定為未滿所述外槽的容積的規定量。 The cleaning method of a substrate processing apparatus according to item 8 of the patent application range, wherein in the piping cleaning step, the amount of the processing liquid discharged at a time is regulated to a predetermined amount less than the volume of the outer tank. 如申請專利範圍第9項所述的基板處理裝置的洗淨方法，其中所述基板處理裝置更包括回收已使用完的處理液的廢液回收罐，作為所述外槽配管洗淨步驟的前工序，包括確認所述廢液回收罐中是否有與所述規定量相應的空間的罐剩餘容量確認步驟。 The cleaning method of the substrate processing apparatus as described in item 9 of the patent application scope, wherein the substrate processing apparatus further includes a waste liquid recovery tank for recovering the used processing liquid as a pre-washing step of the outer tank piping The process includes a step of confirming whether the remaining capacity of the tank in the waste liquid recovery tank has a space corresponding to the predetermined amount. 如申請專利範圍第10項所述的基板處理裝置的洗淨方法，其中於所述罐剩餘容量確認步驟中，更包括罐剩餘容量確保步驟：於所述廢液回收罐中不存在與所述規定量相應的空間的情況下，確認所述廢液回收罐內的處理液的溫度是否為規定的能夠排液的溫度以下，若為能夠排液的溫度以下，則自罐排出所述廢液回收罐內的處理液，若超過能夠排液的溫度，則重覆待機與確認直至成為能夠排液的溫度以下為止。The cleaning method of the substrate processing apparatus as described in item 10 of the patent application scope, wherein the step of confirming the remaining capacity of the tank further includes a step of ensuring the remaining capacity of the tank: the waste liquid recovery tank does not exist with the In the case of a space corresponding to a predetermined amount, it is confirmed whether the temperature of the processing liquid in the waste liquid recovery tank is below a predetermined dischargeable temperature, and if it is below the dischargeable temperature, the waste liquid is discharged from the tank If the processing liquid in the recovery tank exceeds the temperature at which the liquid can be discharged, the standby and confirmation are repeated until the temperature at which the liquid can be discharged is lower than.
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