JPH07283187A - Wafer cleaner - Google Patents

Wafer cleaner

Info

Publication number
JPH07283187A
JPH07283187A JP9579094A JP9579094A JPH07283187A JP H07283187 A JPH07283187 A JP H07283187A JP 9579094 A JP9579094 A JP 9579094A JP 9579094 A JP9579094 A JP 9579094A JP H07283187 A JPH07283187 A JP H07283187A
Authority
JP
Japan
Prior art keywords
tank
wafer
cleaning
carrier
cleaning tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9579094A
Other languages
Japanese (ja)
Other versions
JP3203950B2 (en
Inventor
Tsutomu Aisaka
勉 逢坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP09579094A priority Critical patent/JP3203950B2/en
Publication of JPH07283187A publication Critical patent/JPH07283187A/en
Application granted granted Critical
Publication of JP3203950B2 publication Critical patent/JP3203950B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Landscapes

  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To reduce the size of a washing tank and wafer cleaner and the consumption of a cleaning liq. by preparing a carrier chuck to carry a wafer carrier which forms an inner tank of the washing tank when mounted in this tank. CONSTITUTION:Washing tanks 1a, 1b and 1c having no inner tanks respectively receive a chemical liq. 2 from their bottom central parts and drain it out from drains attached to outer tanks 3. A carrier receptor 4 disposed above the bottom central part of each tank 1 receives the lower end of a wafer carrier 5. The carrier 5 holds many semiconductor wafers 6 and forms an inner tank of the tank 1 when the lower end is fitted in the receptor 4. A carrier chuck 7 to carry the wafer carrier 5 grips its upper part and carries the carrier. This allows the washing tank itself to be reduced in size and consumption of a washing liq. to be reduced.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ウェーハ洗浄装置、特
にウェーハ、主として半導体ウェーハをウェーハ保持具
(ウェーハキャリア)により保持した状態でウェーハ保
持具搬送手段により洗浄槽内に搬送して洗浄液により洗
浄するウェーハ洗浄装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer cleaning apparatus, and more particularly to a wafer, mainly a semiconductor wafer, which is held by a wafer holder (wafer carrier) and conveyed by a wafer holder conveying means into a cleaning tank for cleaning with a cleaning liquid. Wafer cleaning apparatus.

【0002】[0002]

【従来の技術】半導体装置の製造において半導体ウェー
ハの洗浄工程は不可欠である。そして、ウェーハ洗浄装
置として半導体ウェーハをウェーハ保持具により保持し
た状態でウェーハ保持具搬送手段により洗浄槽内に搬送
して洗浄液により洗浄するようにしたものがある。ま
た、ウェーハ保持具(キャリア)を用いないタイプのウ
ェーハ洗浄装置もある。
2. Description of the Related Art A semiconductor wafer cleaning process is indispensable in the manufacture of semiconductor devices. Then, there is a wafer cleaning apparatus in which a semiconductor wafer is held by a wafer holder and is transferred into a cleaning tank by a wafer holder transfer means to be cleaned with a cleaning liquid. There is also a type of wafer cleaning device that does not use a wafer holder (carrier).

【0003】そして、ウェーハ洗浄装置には、それを構
成する各洗浄槽が内槽と外槽の二重構造を有し、内槽に
てウェーハの洗浄を行い、内槽にて洗浄を行った洗浄液
が外槽にオーバーフローし、外槽からドレインを通して
洗浄槽外部に排出するようにしたタイプのものが多い。
尚、排出された洗浄液はフィルタを通して内槽に還流さ
れるようになっているのが普通である。
In the wafer cleaning apparatus, each cleaning tank constituting the wafer cleaning apparatus has a double structure of an inner tank and an outer tank, and the inner tank is used for cleaning the wafer and the inner tank is used for the cleaning. In many cases, the cleaning liquid overflows into the outer tank and is discharged from the outer tank to the outside of the cleaning tank through a drain.
The discharged cleaning liquid is usually returned to the inner tank through a filter.

【0004】[0004]

【発明が解決しようとする課題】ところで、そのような
従来のウェーハ洗浄装置は、洗浄槽の内槽の内部に搬送
チャックでウェーハ保持具を掴んで装着するので、洗浄
槽の内槽には半導体ウェーハが入る空間のほかにウェー
ハ保持具が入る空間と搬送チャックが入る空間が必要で
ある。そのため、内槽を大きくせざるを得ず、使用薬液
の量が多くなるという問題があり、この問題は半導体装
置の製造コストの低減を阻むので看過できない。
By the way, in such a conventional wafer cleaning apparatus, since the wafer holder is mounted inside the inner tank of the cleaning tank by the transfer chuck, the wafer holder is mounted on the inner surface of the cleaning tank. In addition to the space for the wafer, a space for the wafer holder and a space for the transfer chuck are required. Therefore, there is a problem that the inner tank has to be made large and the amount of the chemical solution used increases, and this problem prevents reduction of the manufacturing cost of the semiconductor device and cannot be overlooked.

【0005】また、内槽が大きいので洗浄槽自体も大き
くなり、装置価格が高くなるだけでなく、ウェーハ洗浄
装置のクリーンルームに占める割合が大きくなるという
問題もある。特に、ウェーハ洗浄装置のクリーンルーム
に占める割合が大きいという問題は、クリーンルームが
内部を超高度のクリーン度に保つために高いコストを要
し利用効率を高める必要性が強いだけに看過できない。
尚、ウェーハ保持具を用いないタイプは内槽にウェーハ
保持具が入る空間を設けなくて済み、内槽の大きさはウ
ェーハ保持具を用いるタイプと比較して若干小さくて済
むといえる。しかしながら、搬送チャックが入る空間は
必要であり、内槽を飛躍的に小さくすることは不可能で
あるし、更に半導体ウェーハが搬送途中で他と接触して
傷がついたり、発塵したりする可能性があるという大き
な問題がある。
Further, since the inner tank is large, the cleaning tank itself becomes large, which raises not only the cost of the apparatus, but also a large proportion of the wafer cleaning apparatus in the clean room. In particular, the problem that the wafer cleaning device occupies a large proportion in the clean room cannot be overlooked because the clean room requires a high cost to maintain an extremely high degree of cleanliness, and there is a strong need to improve utilization efficiency.
It can be said that the type without the wafer holder does not require a space for the wafer holder to enter the inner tank, and the size of the inner tank can be slightly smaller than that of the type using the wafer holder. However, a space for the transfer chuck is required, and it is impossible to dramatically reduce the size of the inner tank. Furthermore, the semiconductor wafer may come into contact with other parts during transfer, causing scratches or dust generation. There is a big problem that is possible.

【0006】本発明はこのような問題点を解決すべく為
されたものであり、半導体ウェーハをウェーハ保持具に
より保持した状態でウェーハ保持具搬送手段により洗浄
槽内に搬送して洗浄液により洗浄するウェーハ洗浄装置
において、各洗浄槽を小さくて済むようにすることによ
り各洗浄槽、そして、ウェーハ洗浄装置の小型化、狭占
有面積化を図ると共に、洗浄液の使用量の低減を図るこ
とを目的とする。
The present invention has been made to solve the above problems, and in the state where a semiconductor wafer is held by a wafer holder, it is carried into a cleaning tank by a wafer holder carrying means and cleaned with a cleaning liquid. The purpose of the wafer cleaning device is to reduce the size of each cleaning tank and the wafer cleaning device by reducing the size of each cleaning tank, and to occupy a smaller occupied area, and to reduce the amount of cleaning liquid used. To do.

【0007】[0007]

【課題を解決するための手段】請求項1のウェーハ洗浄
装置は、内槽を有しない洗浄槽と、洗浄槽内部に装着さ
れたとき洗浄槽の内槽を成すウェーハ保持具と、該ウェ
ーハ保持具を搬送する搬送チャックを有することを特徴
とする。
A wafer cleaning apparatus according to claim 1, wherein the cleaning tank does not have an inner tank, a wafer holder that forms an inner tank of the cleaning tank when mounted inside the cleaning tank, and the wafer holder. It is characterized in that it has a transfer chuck for transferring the tool.

【0008】[0008]

【作用】請求項1のウェーハ洗浄装置によれば、ウェー
ハ保持具が洗浄槽内部に装着されたときこのウェーハ保
持具自身が洗浄槽の内槽を成すので、洗浄槽には内槽を
設ける必要がない。従って、洗浄槽自体を小さくするこ
とができると共に、洗浄液の使用量を少なくすることが
できる。また、洗浄槽にとっての謂わば内槽は、洗浄槽
から独立したウェーハ保持具からなるので内槽(即ち、
ウェーハ保持具)はいつでも、即ち稼働中でも容易に洗
浄できる。
According to the wafer cleaning apparatus of the first aspect, when the wafer holder is mounted inside the cleaning tank, the wafer holder itself forms an inner tank of the cleaning tank. Therefore, it is necessary to provide an inner tank in the cleaning tank. There is no. Therefore, the size of the cleaning tank itself can be reduced, and the amount of cleaning liquid used can be reduced. Further, the so-called inner tank for the cleaning tank is composed of a wafer holder independent of the cleaning tank.
The wafer holder can be easily cleaned at any time, i.e. during operation.

【0009】[0009]

【実施例】以下、本発明ウェーハ洗浄装置を図示実施例
に従って詳細に説明する。図1は本発明ウェーハ洗浄装
置の一つの実施例を示す断面図である。図において、1
a、1b、1cは内槽を有しない構造の洗浄槽で、それ
ぞれ底部中心部分から薬液2を受け入れ、その薬液2を
外槽3に設けたドレインから洗浄槽1外部へ排出するよ
うになっている。この洗浄槽1外へ排出された薬液2は
図示しないフィルタによりフィルタリングされた後洗浄
槽1の底部中央に戻される。即ち、薬液2は洗浄槽1と
図示しないフィルタを少なくとも通る循環系を循環して
いる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The wafer cleaning apparatus of the present invention will be described in detail below with reference to the illustrated embodiments. FIG. 1 is a sectional view showing one embodiment of the wafer cleaning apparatus of the present invention. In the figure, 1
Reference symbols a, 1b, and 1c are cleaning tanks having a structure having no inner tank, and each accepts the chemical solution 2 from the central portion of the bottom and discharges the chemical solution 2 from the drain provided in the outer tank 3 to the outside of the cleaning tank 1. There is. The chemical solution 2 discharged to the outside of the cleaning tank 1 is filtered by a filter (not shown) and then returned to the center of the bottom of the cleaning tank 1. That is, the chemical liquid 2 circulates in the circulation system that passes through at least the cleaning tank 1 and a filter (not shown).

【0010】4は各洗浄槽1の底面中央部の上方に設け
られたキャリア受けで、ウェーハキャリア(ウェーハ保
持具)5の下端部を受ける。ウェーハキャリア5は内部
に多数枚の半導体ウェーハ6を保持すると共に、下端部
が上記キャリア受け4に嵌合したとき洗浄槽1の内槽を
成すようになっている。7はウェーハ保持具5を搬送す
るウェーハ保持具搬送手段を成す搬送チャックで、ウェ
ーハ保持具5の上部を掴んで搬送する。
A carrier receiver 4 is provided above the center of the bottom surface of each cleaning tank 1, and receives the lower end of a wafer carrier (wafer holder) 5. The wafer carrier 5 holds a large number of semiconductor wafers 6 therein, and when the lower end of the wafer carrier 5 is fitted into the carrier receiver 4, it forms an inner tank of the cleaning tank 1. Reference numeral 7 denotes a transfer chuck that constitutes a wafer holder transfer means for transferring the wafer holder 5, and grips and transfers the upper portion of the wafer holder 5.

【0011】ウェーハローダ部において多数枚の半導体
ウェーハ6がセットされたウェーハキャリア5は、搬送
チャック7により上端部を掴まれた状態で洗浄槽1a上
方まで搬送される(図1中の洗浄槽1aの上方参照)。
一方、各洗浄槽1a、1b、1cは、ウェーハキャリア
5が内部に入るまでは、図1中の洗浄槽1aに示すよう
に、底部中央から薬液が上方に噴出してチャック受け4
から外側に溢れて外槽3に落ち込んでドレインへ排出さ
れる状態になっている。
The wafer carrier 5 on which a large number of semiconductor wafers 6 have been set in the wafer loader section is transported to a position above the cleaning tank 1a with the upper end portion being gripped by the transfer chuck 7 (the cleaning tank 1a in FIG. 1). See above).
On the other hand, in each cleaning tank 1a, 1b, 1c, as shown in the cleaning tank 1a in FIG.
It overflows from the outside to the outside tank 3 and is discharged to the drain.

【0012】洗浄槽1上方に搬送されたウェーハキャリ
ア5は洗浄槽1内に下降せしめられ、下端部がキャリア
受け4に嵌合せしめられる。すると、ウェーハキャリア
5が洗浄槽1の内槽を成すようにされているので、薬液
2がウェーハキャリア5内にたまりはじめ、その液面が
徐々に高くなってウェーハキャリア5から外側に溢れは
じめる(図1中の洗浄槽1bのような状態になる)。こ
の状態で洗浄が進められる。尚、ウェーハキャリア5か
ら外側に溢れた薬液2はドレインを通り更にフィルタリ
ングされて洗浄槽1内に還流することは前述のとおりで
ある。
The wafer carrier 5 carried above the cleaning tank 1 is lowered into the cleaning tank 1, and the lower end portion is fitted into the carrier receiver 4. Then, since the wafer carrier 5 is configured to form the inner tank of the cleaning tank 1, the chemical liquid 2 starts to accumulate in the wafer carrier 5, and its liquid level gradually rises and starts to overflow from the wafer carrier 5 to the outside ( (It becomes a state like the cleaning tank 1b in FIG. 1). Cleaning proceeds in this state. As described above, the chemical solution 2 overflowing from the wafer carrier 5 passes through the drain and is further filtered and is returned to the cleaning tank 1.

【0013】予め設定された洗浄時間が経過したとき搬
送チャック7により引き上げられる(図1中の洗浄槽1
cのような状態になり、そのとき薬液2はチャック受け
4・ウェーハキャリア5間を通って外槽3へ流出してい
る。)。そして、搬送チャック7により完全に引き上げ
られたウェーハキャリア5は次の洗浄槽1bに運ばれ、
そこで、洗浄が行われる。そして、一番最後の洗浄槽1
cにおける洗浄を終えたウェーハキャリア5は乾燥工程
に送られる。
When a preset cleaning time has elapsed, the transfer chuck 7 pulls up the cleaning tank (cleaning tank 1 in FIG. 1).
A state like c is reached, and at that time, the chemical liquid 2 flows out to the outer tank 3 through between the chuck receiver 4 and the wafer carrier 5. ). Then, the wafer carrier 5 completely pulled up by the transfer chuck 7 is carried to the next cleaning tank 1b,
There, cleaning is performed. And the last cleaning tank 1
The wafer carrier 5 that has been cleaned in c is sent to the drying step.

【0014】このようなウェーハ洗浄装置によれば、ウ
ェーハキャリア5が洗浄槽1内部に装着されたときこの
ウェーハキャリア5自身が洗浄槽1の内槽を成すので、
洗浄槽1には内槽を設ける必要がない。従って、各洗浄
槽1自体を小さくすることができると共に、洗浄液2の
使用量を少なくすることができる。また、洗浄槽1にと
っての内槽は、洗浄槽1から独立しているのでその内槽
(即ち、ウェーハキャリア)5はいつでも、即ち稼働中
でも容易に洗浄できる。
According to such a wafer cleaning apparatus, when the wafer carrier 5 is mounted inside the cleaning tank 1, the wafer carrier 5 itself forms an inner tank of the cleaning tank 1.
It is not necessary to provide an inner tank in the cleaning tank 1. Therefore, the size of each cleaning tank 1 itself can be reduced, and the amount of the cleaning liquid 2 used can be reduced. Further, since the inner tank for the cleaning tank 1 is independent of the cleaning tank 1, the inner tank (that is, the wafer carrier) 5 can be easily cleaned at any time, that is, during operation.

【0015】尚、上記実施例においては、ウェーハキャ
リア5の下端部がキャリア受け4に嵌合(噛み合う)す
るようにされ、それによってウェーハキャリア5・キャ
リア受け4間で薬液2の流出が生じないようにされてい
た。しかし、嵌合ではなく、パッキングを用いることに
よりウェーハキャリア5・キャリア受け4間で薬液2の
流出が生じないようにしても良い。また、ウェーハキャ
リア5・キャリア受け4間にわざと薬液流量に比較して
ごく少量の薬液が漏れ流れる流路を設けて発塵物を積極
的にウェーハキャリア5外部に流すようにすることも考
えられる。
In the above embodiment, the lower end of the wafer carrier 5 is fitted (engaged) with the carrier receiver 4 so that the chemical solution 2 does not flow out between the wafer carrier 5 and the carrier receiver 4. Was being done. However, it is possible to prevent the chemical solution 2 from flowing out between the wafer carrier 5 and the carrier receiver 4 by using packing instead of fitting. Further, it is also possible to intentionally provide a flow path between the wafer carrier 5 and the carrier receiver 4 so that a very small amount of the chemical liquid leaks in comparison with the flow rate of the chemical liquid so that dust particles are positively flowed to the outside of the wafer carrier 5. .

【0016】[0016]

【発明の効果】本発明ウェーハ洗浄装置は、内槽を有し
ない洗浄槽と、洗浄槽内部に装着されたとき洗浄槽の内
槽を成すウェーハ保持具と、該ウェーハ保持具を搬送す
る搬送チャックを有することを特徴とするものである。
従って、本発明ウェーハ洗浄装置によれば、ウェーハ保
持具が洗浄槽内部に装着されたときこのウェーハ保持具
自身が洗浄槽の内槽を成すので、洗浄槽には内槽を設け
る必要がない。従って、洗浄槽自体を小さくすることが
できると共に、洗浄液の使用量を少なくすることができ
る。また、洗浄槽にとっての内槽は、洗浄槽から独立し
ているので内槽(即ち、ウェーハ保持具)はいつでも、
即ち稼働中でも容易に洗浄できる。
The wafer cleaning apparatus of the present invention comprises a cleaning tank having no inner tank, a wafer holder that forms an inner tank of the cleaning tank when mounted inside the cleaning tank, and a transfer chuck for transferring the wafer holder. It is characterized by having.
Therefore, according to the wafer cleaning apparatus of the present invention, when the wafer holder is mounted inside the cleaning tank, the wafer holder itself constitutes the inner tank of the cleaning tank, and therefore the cleaning tank need not be provided with the inner tank. Therefore, the size of the cleaning tank itself can be reduced, and the amount of cleaning liquid used can be reduced. Also, since the inner tank for the cleaning tank is independent of the cleaning tank, the inner tank (that is, the wafer holder) is always
That is, it can be easily washed even during operation.

【図面の簡単な説明】[Brief description of drawings]

【図1】図1は本発明ウェーハ洗浄装置の一つの実施例
を示す断面図である。
FIG. 1 is a sectional view showing an embodiment of a wafer cleaning apparatus of the present invention.

【符号の説明】[Explanation of symbols]

1a〜1c 洗浄槽 2 洗浄液 3 外槽 5 ウェーハ保持具(ウェーハチャック) 6 ウェーハ 7 ウェーハ保持具搬送手段 1a to 1c Cleaning tank 2 Cleaning liquid 3 Outer tank 5 Wafer holder (wafer chuck) 6 Wafer 7 Wafer holder conveying means

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 内槽を有しない構造の一又は複数の洗浄
槽と、 一又は複数のウェーハを保持し上記洗浄槽内部に着脱自
在であって洗浄槽内部に装着されたとき洗浄槽の内槽を
成すウェーハ保持具と、 上記ウェーハ保持具を搬送して洗浄槽内部に装着した状
態にしたり洗浄槽から離脱させたりするウェーハ保持具
搬送手段と、 を少なくとも有することを特徴とするウェーハ洗浄装置
1. One or a plurality of cleaning tanks having no inner tank, and one or a plurality of wafers which can be detachably attached to the inside of the cleaning tank and are attached to the inside of the cleaning tank. A wafer cleaning apparatus comprising at least a wafer holder that forms a tank, and a wafer holder transfer means that transfers the wafer holder to place the wafer holder inside the cleaning tank or remove the wafer holder from the cleaning tank.
JP09579094A 1994-04-08 1994-04-08 Wafer cleaning equipment Expired - Fee Related JP3203950B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP09579094A JP3203950B2 (en) 1994-04-08 1994-04-08 Wafer cleaning equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09579094A JP3203950B2 (en) 1994-04-08 1994-04-08 Wafer cleaning equipment

Publications (2)

Publication Number Publication Date
JPH07283187A true JPH07283187A (en) 1995-10-27
JP3203950B2 JP3203950B2 (en) 2001-09-04

Family

ID=14147258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP09579094A Expired - Fee Related JP3203950B2 (en) 1994-04-08 1994-04-08 Wafer cleaning equipment

Country Status (1)

Country Link
JP (1) JP3203950B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104304523A (en) * 2014-10-20 2015-01-28 虞建强 Tea leaf washing machine with function of air drying
CN115106329A (en) * 2022-06-17 2022-09-27 广东先导微电子科技有限公司 Wafer processing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104304523A (en) * 2014-10-20 2015-01-28 虞建强 Tea leaf washing machine with function of air drying
CN115106329A (en) * 2022-06-17 2022-09-27 广东先导微电子科技有限公司 Wafer processing device

Also Published As

Publication number Publication date
JP3203950B2 (en) 2001-09-04

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