CN111036616A - Device and method for removing particles on surface of wafer - Google Patents
Device and method for removing particles on surface of wafer Download PDFInfo
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- CN111036616A CN111036616A CN201911251663.XA CN201911251663A CN111036616A CN 111036616 A CN111036616 A CN 111036616A CN 201911251663 A CN201911251663 A CN 201911251663A CN 111036616 A CN111036616 A CN 111036616A
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- wafer
- opening
- box body
- closed box
- closing door
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B6/00—Cleaning by electrostatic means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
Abstract
The invention discloses a device and a method for removing particles on the surface of a wafer, and belongs to the field of semiconductor wafer processing. The device comprises a closed box body, wherein an opening and closing door is arranged on the closed box body, a wafer supporting structure used for vertically supporting the wafer from the bottom is arranged at the inner bottom of the closed box body, two particulate matter removing modules are arranged in the closed box body, and the two particulate matter removing modules are distributed on two sides of the wafer. The invention can remove the particles on the two sides of the wafer simultaneously, improves the efficiency of removing the particles on the wafer, greatly reduces the risk that the wafer contacts other external pollution sources, and is beneficial to improving the working efficiency and the quality. And simple structure, convenient to use, the cost is lower.
Description
Technical Field
The invention relates to the field of semiconductor wafer processing, in particular to a device and a method for removing particles on the surface of a wafer.
Background
With the continuous development of the semiconductor industry, the requirements for the integration level and performance of the very large scale integrated circuit are gradually increased to adapt to the trend that the smaller each electronic product is, the stronger the function is. The trend of gradually increasing integration along with the gradual enhancement of chip functions is that the technical requirements for various different links in the process are higher and higher, wherein the control of the surface pollution of the wafer is an especially important link. In the semiconductor integrated circuit manufacturing process, surface particle contamination is one of the important factors of yield loss of the product. Therefore, in order to achieve good device performance, the requirement for semiconductor cleanliness is becoming more stringent, and minute amounts of contaminant impurities can also cause failure of the semiconductor device, necessitating removal of particles from the wafer surface.
Wafer surface particulate refers to any undesirable material introduced into the wafer during wafer fabrication that compromises microchip yield and electrical performance. The surface particles include, but are not limited to, particles, metal impurities, organic contamination and oxides, small objects that can adhere to the wafer surface, photoresist and etching impurities, and the like. Sources of such surface particles include, but are not limited to, environmental (air, people, plants, water, process chemicals, etc.) dust, production equipment (equipment friction, stripping of films within equipment reaction chambers, automated wafer handling and transfer, mechanical manipulation, vacuum environment extraction and discharge, etc.). Each stage of wafer fabrication, including build-up, photolithography, doping, thermal processing, etc., can result in contamination of the wafer surface.
Chinese patent document CN102403199A discloses a method for removing particles on the surface of a wafer, which comprises: firstly, a wafer is transferred into a lower wafer carrying device of a wafer surface particle removing module. An upper charge distribution device is arranged above the surface of the wafer, the charge generation and control device releases charges on the upper charge distribution device, and the adsorption function of static electricity is utilized to adsorb the particles on the surface of the wafer to the upper charge distribution device. Then the wafer is transferred out of the wafer surface particle removing module and transferred into the wafer transfer box. And finally releasing the surface particles adsorbed in the wafer surface particle removal module.
As can be seen from the above method, the method adopted in this patent application is to electrostatically adsorb surface particles of the wafer. In this process, can only carry out surface cleaning to the wafer single face, if need two-sided clean, then need extra overturn to the wafer, the wafer must contact wafer turning device during the upset, so have the risk of bringing into other particulate matters, lead to the removal effect of wafer surface particulate matter to reduce. Meanwhile, the cleanliness of the bearing device contacted with the lower surface of the wafer is difficult to be effectively guaranteed in the operation process. In addition, during the working process, the wafer is in an open space, and the pollution of the wafer by an external pollution source is not negligible.
Disclosure of Invention
In order to solve the technical problems, the invention provides a device and a method for removing particles on the surface of a wafer, which can simultaneously remove the particles on two surfaces of the wafer, improve the efficiency of removing the particles on the wafer, greatly reduce the risk of contacting the wafer with other external pollution sources, and are beneficial to improving the working efficiency and the quality. And simple structure, convenient to use, the cost is lower.
The technical scheme provided by the invention is as follows:
the utility model provides a device for getting rid of wafer surface particulate matter, includes the airtight box, the last opening and closing door that has seted up of airtight box, the bottom is provided with the wafer supporting structure that is used for getting up the vertical support of wafer from the bottom in the airtight box, be provided with two particulate matter in the airtight box and get rid of the module, two particulate matter get rid of the module and distribute in the both sides of wafer.
Furthermore, the closed box body is provided with an exhaust hole, and the exhaust hole is connected with an exhaust device.
Furthermore, the opening and closing door is provided with an opening and closing cylinder for controlling the opening and closing of the opening and closing door.
Furthermore, the opening and closing door is opened on the side wall of the closed box body, the closed box body further comprises an upper cover, and the exhaust hole is opened on the bottom wall of the closed box body.
Furthermore, the wafer supporting structure comprises a supporting structure main body, the upper surface of the supporting structure main body is of a downward-sunken arc-shaped structure, and an arc-shaped groove is formed in the upper surface of the supporting structure main body.
Further, the arc-shaped groove is of a sectional structure.
Furthermore, the supporting structure main body is two supporting plates spliced together side by side.
Further, the particulate matter removing module is an electrostatic adsorption module.
A method for removing the particulate matter on the surface of the wafer comprises the following steps:
opening the opening and closing door, placing the wafer on a wafer supporting structure in the closed box body through the opening and closing door by the external transmission device, vertically supporting the wafer by the wafer supporting structure, and closing the opening and closing door;
opening the exhaust device for a period of time, exhausting the gas in the closed box body, thereby exhausting impurities in the closed box body and closing the exhaust device;
opening the two particulate matter removing modules to remove the particulate matters on the two surfaces of the wafer;
opening the opening and closing door, and taking out the wafer in the closed box body by the external transmission device through the opening and closing door;
closing the two particulate removal modules;
and opening the exhaust device for a period of time, and exhausting the gas in the closed box body, thereby exhausting the particulate matters removed by the two particulate matter removing modules and closing the exhaust device.
The invention has the following beneficial effects:
according to the invention, particles on the surface of the wafer are removed in the closed box body, and a relatively independent space is formed in the closed box body, so that an external pollution source is isolated, and a good environment is created for cleaning the wafer. In addition, the invention can remove the particulate matters on the two surfaces of the wafer at the same time, thereby improving the removal efficiency of the particulate matters and avoiding other particulate matters caused by the turnover of the wafer. In addition, the wafer support structure is in contact with the bottom of the circumference of the vertical wafer, and the contact is line contact (contact with the circumferential part of the wafer), so that the risk of the wafer contacting other particles is greatly reduced. Finally, the invention also has the advantages of simple structure, convenient use and lower cost.
Drawings
FIG. 1 is a schematic diagram illustrating an external structure of an apparatus for removing particles on a wafer surface according to the present invention;
FIG. 2 is a cross-sectional view of an apparatus for removing particles from a wafer surface according to the present invention;
FIG. 3 is a top view of the apparatus for removing particles from the surface of a wafer (removing the top cover) of the present invention;
FIG. 4 is a schematic view of a first embodiment of a wafer support structure (including a wafer);
FIG. 5 is a schematic view of a second embodiment of a wafer support structure (including a wafer);
FIG. 6 is a schematic view of a second embodiment of a wafer support structure (not including a wafer);
FIG. 7 is a flowchart of a method for removing particles from a wafer surface according to the apparatus of the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantages of the present invention more apparent, the following detailed description is given with reference to the accompanying drawings and specific embodiments.
The embodiment of the invention provides a device for removing particles on the surface of a wafer, which comprises a closed box body 1, wherein an opening and closing door 2 is arranged on the closed box body 1, a wafer supporting structure 4 for vertically supporting the wafer 3 from the bottom is arranged at the bottom in the closed box body 1, two particle removing modules 5 are arranged in the closed box body 1, and the two particle removing modules 5 are distributed on two sides of the wafer 3.
When the wafer loading device is used, a wafer is placed on the wafer supporting structure in the closed box body from the opened opening and closing door, so that the wafer is vertically supported by the wafer supporting structure from the bottom. Then the opening and closing door is closed, so that an independent space is formed in the closed box body. Then the particle removing modules positioned at the two sides of the wafer are started, and the particles on the surface of the wafer are adsorbed and removed. And finally, opening the opening and closing door, moving the wafer out of the closed box body from the opening and closing door, and closing the particle removal module.
According to the invention, particles on the surface of the wafer are removed in the closed box body, and a relatively independent space is formed in the closed box body, so that an external pollution source is isolated, and a good environment is created for cleaning the wafer. In addition, the invention can remove the particulate matters on the two surfaces of the wafer at the same time, thereby improving the removal efficiency of the particulate matters and avoiding other particulate matters caused by the turnover of the wafer. In addition, the wafer support structure is in contact with the bottom of the circumference of the vertical wafer, and the contact is line contact (contact with the circumferential part of the wafer), so that the risk of the wafer contacting other particles is greatly reduced. Finally, the invention also has the advantages of simple structure, convenient use and lower cost.
As a modification of the present invention, as shown in fig. 2 and 4, the sealed box 1 is provided with an EXHAUST hole 6, and the EXHAUST hole 6 is connected to an EXHAUST (EXHAUST) device.
After the wafer is placed on the wafer supporting structure in the closed box body and the opening and closing door is closed, the exhaust device is opened for a period of time, and gas in the closed box body is exhausted, so that impurities in the closed box body are exhausted, a relatively closed clean space is formed in the closed box body, and the pollution of the original impurities in the closed box body to the wafer is avoided. Then remove the module through the particulate matter and get rid of the particulate matter on wafer surface, the particulate matter of getting rid of that can be more thorough.
After the wafer is moved out of the closed box body from the opening and closing door and the particulate matter removing module is closed, the exhaust device is opened for a period of time, and gas in the closed box body is exhausted, so that particulate matters removed by the particulate matter removing module are exhausted, the inside of the closed box body is cleaned, and subsequent surface particulate matters of the wafer are conveniently removed.
The opening and closing door can be opened or closed manually or automatically, and when the opening and closing door is opened or closed automatically, an opening and closing device for controlling the opening and closing of the opening and closing door 2 is arranged on the opening and closing door 2.
The opening and closing device can be an opening and closing air cylinder 7. The opening and closing cylinder is connected with control systems such as a PLC (programmable logic controller) and the like, and sends instructions to the opening and closing cylinder through the control systems to control the opening and closing of the opening and closing door.
The opening and closing door 2 is arranged on the side wall of the closed box body 1, preferably perpendicular to the side wall of the wafer, so that the wafer can be conveniently taken and placed, and the arrangement of the particle removal module is not influenced.
The enclosure 1 further comprises an upper cover 8, which is in an open state when the wafer support structure is mounted to the bottom of the enclosure, and the wafer support structure is mounted to the bottom through the upper side, and the wafer support structure is mechanically connected, preferably bolted, to the bottom of the enclosure. After the wafer support structure is mounted to the bottom of the enclosure, an upper cover is secured to the top of the enclosure, the upper cover being mechanically attached, preferably bolted, to the top of the enclosure.
The upper cover of the invention facilitates the installation of the wafer supporting structure and the bottom of the closed box body, and the upper cover can be conveniently maintained at a later stage.
As another improvement of the present invention, as shown in fig. 4, the wafer supporting structure 4 includes a supporting structure body 41, an upper surface 42 of the supporting structure body 41 is a downward concave arc-shaped structure, and an arc-shaped groove 43 is opened on the upper surface 42 of the supporting structure body 41.
The wafer is placed in circular arc recess, and the upper surface of supporting structure main part is sunken downwards, can reduce the area of contact on two surfaces of supporting structure main part and wafer as far as, reduces the risk that the wafer contacted other particulate matters as far as possible.
As shown in fig. 5 and 6, the circular arc-shaped groove 43 may be a segmented structure, which further reduces the contact area between the main body of the supporting structure and the two surfaces of the wafer.
The invention is not limited to the structural form of the supporting structure body, and in one example, the supporting structure body 41 is two supporting plates 411, 412 spliced together side by side. The two bearing plates are spliced together side by side, and the middle part of the bearing plates is provided with an arc-shaped groove.
The particle removing module 5 is an electrostatic adsorption module, and the purpose of removing particles on the surface of the wafer is achieved through the electrostatic adsorption effect of the electrostatic adsorption module.
The invention is not limited to the form of the particulate removal module, and the electrostatic adsorption module is only one preferred embodiment.
An embodiment of the present invention further provides a method for removing the apparatus for removing particles from the surface of the wafer, as shown in fig. 7, the method includes:
s1: and opening the opening and closing door 2, placing the wafer 3 on a wafer supporting structure 4 in the closed box body 1 through the opening and closing door 2 by the external transmission device, vertically supporting the wafer 3 by the wafer supporting structure 4, and closing the opening and closing door 2.
When the opening and closing door is connected with the opening and closing cylinder, the PLC control system sends an instruction to the opening and closing cylinder to control the opening and closing of the opening and closing door. The external transmission device may be a robot, or other mechanism for transmitting the wafer.
S2: and opening the exhaust device for a period of time, exhausting the gas in the closed box body 1, thereby exhausting impurities in the closed box body 1, forming a relatively closed clean space in the closed box body, and closing the exhaust device.
The time for which the exhaust is open can be set as desired, for example 5 seconds before closing.
S3: opening the two particulate matter removing modules 5 to remove the particulate matters on the two surfaces of the wafer 3;
s4: and opening the opening and closing door 2, taking out the wafer 3 in the closed box body 1 through the opening and closing door 2 by the external transmission device, and carrying out subsequent processes.
S5: both particulate removal modules 5 are turned off.
S6: the exhaust apparatus is opened for a certain period of time to exhaust the gas in the hermetic container 1, thereby discharging the particulate matter removed by the two particulate matter removing modules 5, and the exhaust apparatus is closed. The particle removal of the follow-up wafer is convenient.
According to the invention, particles on the surface of the wafer are removed in the closed box body, and relatively independent spaces are formed in the closed box body, so that an external pollution source is isolated, and a good environment is created for cleaning the wafer. In addition, the invention can remove the particulate matters on the two surfaces of the wafer at the same time, thereby improving the removal efficiency of the particulate matters and avoiding other particulate matters caused by the turnover of the wafer. In addition, the wafer supporting structure is in contact with the bottom of the circumference of the vertical wafer, the contact is line contact, and the risk that the wafer is in contact with other particles is greatly reduced.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. The device for removing the particles on the surface of the wafer is characterized by comprising a closed box body, wherein an opening and closing door is arranged on the closed box body, a wafer supporting structure for vertically supporting the wafer from the bottom is arranged at the inner bottom of the closed box body, two particle removing modules are arranged in the closed box body, and the two particle removing modules are distributed on two sides of the wafer.
2. The apparatus according to claim 1, wherein the hermetic container has an exhaust hole, and the exhaust hole is connected to an exhaust device.
3. The device for removing the particles on the surface of the wafer as claimed in claim 2, wherein the opening and closing door is provided with an opening and closing cylinder for controlling the opening and closing of the opening and closing door.
4. The device for removing particles on the surface of the wafer as claimed in claim 3, wherein the opening and closing door is opened on the side wall of the closed box body, the closed box body further comprises an upper cover, and the exhaust hole is opened on the bottom wall of the closed box body.
5. The apparatus as claimed in any one of claims 1 to 4, wherein the wafer supporting structure comprises a supporting structure body, an upper surface of the supporting structure body is a downward concave arc-shaped structure, and an arc-shaped groove is formed in the upper surface of the supporting structure body.
6. The device for removing particles on the surface of the wafer as claimed in claim 5, wherein the circular arc-shaped groove is of a segmented structure.
7. The apparatus of claim 6, wherein the supporting structure body is two supporting plates spliced together side by side.
8. The apparatus as claimed in claim 7, wherein the particle removing module is an electrostatic adsorption module.
9. A method for removing particles on the surface of a wafer according to any one of claims 2 to 8, comprising:
opening the opening and closing door, placing the wafer on a wafer supporting structure in the closed box body through the opening and closing door by the external transmission device, vertically supporting the wafer by the wafer supporting structure, and closing the opening and closing door;
opening the exhaust device for a period of time, exhausting the gas in the closed box body, thereby exhausting impurities in the closed box body and closing the exhaust device;
opening the two particulate matter removing modules to remove the particulate matters on the two surfaces of the wafer;
opening the opening and closing door, and taking out the wafer in the closed box body by the external transmission device through the opening and closing door;
closing the two particulate removal modules;
and opening the exhaust device for a period of time, and exhausting the gas in the closed box body, thereby exhausting the particulate matters removed by the two particulate matter removing modules and closing the exhaust device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911251663.XA CN111036616A (en) | 2019-12-09 | 2019-12-09 | Device and method for removing particles on surface of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911251663.XA CN111036616A (en) | 2019-12-09 | 2019-12-09 | Device and method for removing particles on surface of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111036616A true CN111036616A (en) | 2020-04-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911251663.XA Pending CN111036616A (en) | 2019-12-09 | 2019-12-09 | Device and method for removing particles on surface of wafer |
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| CN (1) | CN111036616A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112588692A (en) * | 2020-12-23 | 2021-04-02 | 绍兴同芯成集成电路有限公司 | Ultra-thin wafer belt cleaning device of high hydrophobicity |
-
2019
- 2019-12-09 CN CN201911251663.XA patent/CN111036616A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112588692A (en) * | 2020-12-23 | 2021-04-02 | 绍兴同芯成集成电路有限公司 | Ultra-thin wafer belt cleaning device of high hydrophobicity |
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Address after: 100176 floor 2, building 2, yard 19, Kechuang 10th Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing (Yizhuang group, high-end industrial area of Beijing Pilot Free Trade Zone) Applicant after: BEIJING U-PRECISION TECH Co.,Ltd. Applicant after: BEIJING YANDONG MICROELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 100084 Tsinghua Science Park, Haidian District, Beijing Applicant before: BEIJING U-PRECISION TECH Co.,Ltd. Applicant before: BEIJING YANDONG MICROELECTRONIC TECHNOLOGY Co.,Ltd. |