CN112530830A - Substrate processing system, valve plate assembly and working method of substrate processing system - Google Patents
Substrate processing system, valve plate assembly and working method of substrate processing system Download PDFInfo
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- CN112530830A CN112530830A CN201910882766.XA CN201910882766A CN112530830A CN 112530830 A CN112530830 A CN 112530830A CN 201910882766 A CN201910882766 A CN 201910882766A CN 112530830 A CN112530830 A CN 112530830A
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- opening
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- sealing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
Abstract
A substrate handling system, a valve plate assembly and a method of operating a substrate handling system, wherein the substrate handling system comprises: a first chamber having a first substrate transfer port; a second chamber having a second substrate transfer port, the second chamber being arranged in a horizontal direction with the first chamber; the sealed shell is positioned between the first cavity and the second cavity and is communicated with the first substrate transmission port and the second substrate transmission port; a first valve plate located within the seal housing; the second valve plate is positioned on the sealing shell and is stacked with the first valve plate up and down; a first drive means for moving said first valve plate to seal the first substrate transfer port; a second driving means for moving the second valve plate to seal the second substrate transfer port. The substrate processing system has high substrate processing efficiency.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a substrate processing system, a valve plate assembly and a working method of the substrate processing system.
Background
Existing substrate processing systems are typically vacuum Cluster tools (Cluster) that include a tool front end module, a Load Lock chamber (Load Lock), a transfer chamber, and a process chamber that encloses the transfer chamber. The conveying cavity is internally provided with a mechanical arm (Robot), the mechanical arm is used for taking the substrate to be processed out of the vacuum lock and placing the substrate to be processed into any one process cavity, the substrate to be processed is processed in the process cavity, and after the substrate to be processed is processed, the mechanical arm takes the processed substrate out of the process cavity and transmits the processed substrate to the external atmospheric environment.
In the existing substrate processing system, a valve plate is arranged between the transmission cavity and the process cavity and between the transmission cavity and the airlock cavity. When the valve plate needs to be replaced, the vacuum environment of the transmission cavity, the process cavity and the air lock cavity is damaged by removing the valve plate, so that the substrate processing system is difficult to continuously process the substrate to be processed, the downtime frequency of the conventional substrate processing system is high, and the processing efficiency of the substrate to be processed is low.
Disclosure of Invention
The invention aims to provide a substrate processing system, a valve plate assembly and a working method of the substrate processing system, so as to improve the processing efficiency of the substrate processing system on a substrate to be processed.
To solve the above technical problem, the present invention provides a substrate processing system, comprising: a first chamber having a first substrate transfer port; a second chamber having a second substrate transfer port, the second chamber being arranged in a horizontal direction with the first chamber; the sealed shell is positioned between the first cavity and the second cavity and is communicated with the first substrate transmission port and the second substrate transmission port; a first valve plate located within the seal housing; the second valve plate is positioned on the sealing shell and is stacked with the first valve plate up and down; a first drive means for moving said first valve plate to seal the first substrate transfer port; a second driving means for moving the second valve plate to seal the second substrate transfer port.
Optionally, the first driving device and the second driving device each include an up-down power device and a horizontal power device, the up-down power device is used for enabling the first valve plate or the second valve plate to move in the up-down direction, and the horizontal power device is used for enabling the first valve plate or the second valve plate to move in the horizontal direction.
Optionally, the sealed housing includes a first opening and a second opening, the first opening corresponds to the first substrate transfer port, and the second opening corresponds to the second substrate transfer port.
Optionally, the first valve plate is configured to seal the first substrate transfer port or the first opening when the opening area of the first opening is larger than the opening area of the first substrate transfer port.
Optionally, when the opening area of the first opening is smaller than or equal to the opening area of the first substrate transfer port, the first valve plate is configured to seal the first opening.
Optionally, a sealing device is disposed on a side surface of the first valve plate, and is used for achieving close fitting with the first substrate conveying port or the first opening.
Optionally, a first step is arranged around the first substrate conveying port or around the first opening, the first valve plate is provided with a sealing step matched with the first step, the first valve plate further comprises a sealing device arranged on the sealing step, and the sealing device is used for achieving sealing between the sealing step and the first step.
Optionally, the second valve plate is configured to seal the second substrate transfer port or the second opening when the opening area of the second opening is larger than the opening area of the second substrate transfer port.
Optionally, the second valve plate is configured to seal the second opening when the opening area of the second opening is smaller than or equal to the opening area of the second substrate transfer port.
Optionally, a sealing device is disposed on a side surface of the second valve plate, and is used for achieving close fitting with the second substrate conveying port or the second opening.
Optionally, a second step is provided around the second substrate delivery port or around the second opening, the second valve plate is provided with a sealing step matching the second step, and the second valve plate further comprises a sealing device provided on the sealing step, wherein the sealing device is used for sealing between the sealing step and the second step.
Optionally, the first cavity is a process cavity, and the second cavity is a transfer cavity.
Optionally, when the number of the process chambers is greater than 1, the process chambers greater than 1 surround the transfer chamber; and the first valve plate, the second valve plate and the sealing shell are arranged between each process cavity and the transmission cavity.
Optionally, the first cavity is an airlock cavity, and the second cavity is a transmission cavity.
Optionally, the first valve plate and the second valve plate have the same or different sizes.
The present invention provides a valve plate assembly for a substrate processing system, comprising: a first valve plate; the second valve plate is vertically stacked with the first valve plate; a seal housing located at the periphery of the first valve plate and the second valve plate, the seal housing having a first opening and a second opening in a horizontal direction; the first driving device is used for enabling the first valve plate to move along the vertical direction and the horizontal direction; and a second driving means for moving the second valve plate in up-and-down and horizontal directions.
Optionally, the first valve plate and the second valve plate each comprise a sealing means.
Optionally, the sealing means is provided to a side wall of the first valve plate and/or the second valve plate.
Optionally, a first step is arranged around the first opening, the first valve plate is provided with a sealing step matched with the first step, and the sealing device of the first valve plate is located on the sealing step; and a second step is arranged around the second opening, the second valve plate is provided with a sealing step matched with the second step, and the sealing device of the second valve plate is positioned on the sealing step.
Optionally, the first driving device and the second driving device each include an up-down power device and a horizontal power device, the up-down power device is used for enabling the first valve plate or the second valve plate to move up and down, and the horizontal power device is used for enabling the first valve plate or the second valve plate to move in the horizontal direction.
Correspondingly, the invention also provides a working method of the substrate processing system, which comprises the following steps: providing the substrate processing system; the first valve plate is moved to seal the first substrate transfer port by the first drive means and/or the second valve plate is moved to seal the second substrate transfer port by the second drive means.
Optionally, the second valve plate is replaced when the first valve plate seals the first substrate transfer port; alternatively, the first valve plate is replaced while the second valve plate seals the second substrate transfer port.
Compared with the prior art, the technical scheme of the embodiment of the invention has the following beneficial effects:
in the substrate processing system provided by the technical scheme of the invention, the first valve plate is used for sealing the first substrate transmission port, so that the vacuum environment in the first cavity is ensured; the second valve plate is used for sealing the second substrate transmission port, and is beneficial to ensuring that a vacuum environment is maintained in the second cavity. When the first valve plate needs maintenance, the second valve plate seals the second substrate transmission port, so that the vacuum environment can be maintained in the second cavity, and when the second valve plate needs maintenance, the first valve plate seals the first substrate transmission port, so that the vacuum environment can be maintained in the first cavity. When the first cavity or the second cavity can still maintain a vacuum environment, the first cavity or the second cavity can still continue to carry out process treatment without stopping the machine, so that the downtime frequency is reduced, and the treatment efficiency of the substrate to be treated is improved.
Drawings
FIG. 1 is a top view of a substrate processing system;
FIG. 2 is a schematic cross-sectional view of a substrate processing system of the present invention;
FIG. 3 is a schematic diagram of a first valve plate sealing a first substrate transfer port in the substrate processing system of FIG. 2;
FIG. 4 is a schematic diagram of a second valve plate sealing a second substrate transfer port in the substrate processing system of FIG. 2;
FIG. 5 is a schematic cross-sectional view of another substrate processing system of the present invention;
FIG. 6 is a schematic illustration of a first valve plate sealing a first substrate transfer port in the substrate processing system of FIG. 5;
FIG. 7 is a schematic diagram of a second valve plate sealing a second substrate transfer port in the substrate processing system of FIG. 5;
FIG. 8 is a schematic structural view of a valve plate assembly for a substrate processing system of the present invention;
FIG. 9 is a side view of a first valve plate of the valve plate assembly of FIG. 8;
FIG. 10 is a schematic view of another valve plate assembly for a substrate processing system in accordance with the present invention;
FIG. 11 is a side view of a first valve plate of the valve plate assembly of FIG. 10;
FIG. 12 is a flow chart of a method of operating a substrate processing system in accordance with the present invention.
Detailed Description
As described in the background art, the conventional substrate processing system has a low processing efficiency on a substrate to be processed, and in order to solve the above technical problems, the present invention provides a substrate processing system, a valve plate assembly for the substrate processing system, and a method for operating the substrate processing system, wherein the substrate processing system includes: a first chamber having a first substrate transfer port; a second chamber having a second substrate transfer port, the second chamber being arranged in a horizontal direction with the first chamber; the sealed shell is positioned between the first cavity and the second cavity and is communicated with the first substrate transmission port and the second substrate transmission port; a first valve plate located within the seal housing; a second valve plate located in the seal housing, the second valve plate being located above the first valve plate; a first drive means for moving said first valve plate to seal the first substrate transfer port; a second driving means for moving the second valve plate to seal the second substrate transfer port. The substrate processing system has higher processing efficiency on the substrate to be processed.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
FIG. 1 is a top view of a substrate processing system.
Referring to fig. 1, the substrate processing system includes: a process chamber 100, a transfer chamber 101, and an airlock chamber 102, the process chamber 100 and the airlock chamber 102 surrounding the transfer chamber 101.
The Process chamber (PM) 100 is a vacuum environment for performing a semiconductor Process on a substrate to be processed.
The interior of the Transfer chamber (TM) 101 is a vacuum environment, and a robot is disposed in the Transfer chamber 101 for transferring the substrate to be processed in the Transfer chamber 101 into one of the process chambers 100.
The airlock 102 is used to switch between an atmospheric environment and a vacuum environment.
FIG. 2 is a schematic cross-sectional view of a substrate processing system of the present invention.
Referring to fig. 2, a first chamber 200, the first chamber 200 having a first substrate transfer port 201; a second chamber 202, the second chamber 202 having a second substrate transfer port 203, the second chamber 202 being arranged in a horizontal direction X1 with the first chamber 200; a hermetic enclosure 204 positioned between the first chamber 200 and the second chamber 202, the hermetic enclosure 204 being in communication with the first substrate transfer port 201 and the second substrate transfer port 203; a first valve plate 205 located within the seal housing 204; a second valve plate 206 disposed on the sealing case 204, wherein the second valve plate 206 is stacked on the first valve plate 205; a first drive 207 for moving the first valve plate 205 to seal the first substrate transfer port 201; a second driving means 208 for moving the second valve plate 206 to seal the second substrate transfer port 203.
In one embodiment, the first chamber 200 is a Process Module (PM) having a vacuum environment therein, and a semiconductor Process is performed on a substrate to be processed in the first chamber 200, the semiconductor Process including: a plasma etching process, a first substrate transfer opening 201 of the first chamber 200 is used for transferring a substrate to be processed into or out of the chamber. The second chamber 202 is a Transfer Module (TM), and a robot (not shown) is disposed in the second chamber 202, and is configured to grab a substrate to be processed and Transfer the substrate to or from the second substrate Transfer port 203.
In another embodiment, the first chamber 200 is a transfer chamber and the second chamber 202 is an airlock chamber (Loadlock).
The second chamber 202 and the first chamber 200 are arranged along a horizontal direction X1, a sealed shell 204 is arranged between the second chamber 202 and the first chamber 200, and the sealed shell 204 is respectively connected with the second chamber 202 and the first chamber 200.
In this embodiment, the sealed housing 204 includes a first opening 209 and a second opening 210, the first opening 209 corresponds to the first substrate transfer port 201, and the second opening 210 corresponds to the second substrate transfer port 203.
In this embodiment, each of the first drive device 207 and the second drive device 208 includes an up-and-down power device (not shown) for moving the first valve plate 205 or the second valve plate 206 in the up-and-down direction Y1 so that the first valve plate 205 may be opposed to the first substrate delivery port 201, the second valve plate 206 may be opposed to the second substrate delivery port 203, and a projection of the first valve plate 205 on the seal case 204 may cover the first substrate delivery port 201, and a projection of the second valve plate 206 on the seal case 204 may cover the second substrate delivery port 203, and a horizontal power device (not shown) for pressing the first valve plate 205 against the first opening 209 to seal the first substrate delivery port 201, or pressing the second valve plate 206 against the second opening 210 to seal the second substrate delivery port 203.
In this embodiment, when the first valve plate 205 needs to be maintained or replaced, the first valve plate 205 needs to be removed. When the first valve plate 205 is removed, the second valve plate 206 seals the second opening 210, facilitating ensuring a vacuum environment inside the second chamber 202; also, when the second valve plate 206 needs maintenance or replacement, the first valve plate 205 seals the first opening 209, so that the vacuum environment in the first chamber 200 is not damaged, and the process of the first chamber 200 or the second chamber 202 is not interrupted, thereby facilitating the improvement of the processing efficiency of the substrate to be processed.
In the present embodiment, the method of disassembling the first valve plate 205 includes: simultaneously disassembling the first valve plate 205 and the first drive device 207; the method of removing the second valve plate 206 includes: the second valve plate 206 and the second drive device 208 are removed simultaneously.
In this embodiment, the substrate processing system further includes: support legs (not shown) at the bottom of the first and second chambers 200, 202, a device plate below the support legs, and a support post below the device plate.
In this embodiment, since the first valve plate 205 and the second valve plate 206 are stacked one on top of the other, so that the first valve plate 205 and the second valve plate 206 have the same or close floor area as the floor area with only the first valve plate 205, the center of gravity of the substrate processing system does not shift or slightly shifts, so that the original support feet and support columns do not need to be designed again, which is beneficial to reducing the design difficulty.
In this embodiment, when the first chamber 200 is a process chamber and the second chamber 202 is a transfer chamber, if the number of the process chambers is greater than 1, a plurality of process chambers surround the transfer chamber, and the first valve plate 205, the second valve plate 206 and the seal housing 204 are disposed between each process chamber and the transfer chamber.
In the present embodiment, the first valve plate 205 and the second valve plate 206 are equal in size.
In other embodiments, the first valve plate and the second valve plate are not the same size.
Fig. 3 is a schematic view of a first valve plate sealing a first substrate transfer port in the substrate processing system of fig. 2.
In this embodiment, the opening area of the first opening 209 is equal to the opening area of the first substrate delivery port 201, and the first driving device 207 is used to cause the first valve plate 205 to seal the first opening 209. In other embodiments, the first opening has an open area less than an open area of the first substrate transfer port, and the first drive mechanism causes the first valve plate to seal the first opening; alternatively, the first opening has an opening area larger than that of the first substrate transfer port, and the first driving device causes the first valve plate to seal the first substrate transfer port or the first opening.
In this embodiment, a sealing device 205a is disposed on the side surface of the first valve plate 205, and when the first valve plate 205 seals the first opening 209, the sealing device 205a is used for achieving close fit with the first opening 209.
In this embodiment, when the second valve plate 206 needs maintenance or replacement, the first valve plate 205 seals the first opening 209, which is beneficial to ensure a vacuum environment in the first chamber 200, so that the process in the first chamber 200 is not interrupted, thereby being beneficial to improving the process efficiency of the substrate processing system.
Fig. 4 is a schematic diagram of a second valve plate sealing a second substrate transfer port in the substrate processing system of fig. 2.
In this embodiment, the opening area of the second opening 210 is equal to the opening area of the second substrate transfer port 203, and the second driving device 208 is used to make the second valve plate 206 seal the second opening 210.
In other embodiments, the second opening has an opening area smaller than an opening area of the second substrate transfer port, and the second driving means causes the second valve plate to seal the second opening; or the opening area of the second opening is larger than that of the second substrate transmission port, and the first driving device enables the second valve plate to seal the second substrate transmission port or the second opening.
In this embodiment, a sealing device 206a is disposed on a side surface of the second valve plate 206, and when the second valve plate 206 seals the second opening 210, the sealing device 206a is used for achieving close fit with the second opening 210.
In this embodiment, when the first valve plate 205 needs to be maintained or replaced, the second valve plate 206 seals the second opening 210, which is beneficial to ensuring a vacuum environment in the second chamber 202, so that the process in the second chamber 202 is not interrupted, thereby being beneficial to improving the process efficiency of the substrate processing system.
FIG. 5 is a schematic cross-sectional view of another substrate processing system of the present invention.
Referring to fig. 5, a first chamber 300, the first chamber 300 having a first substrate transfer port 301; a second chamber 302, the second chamber 302 having a second substrate transfer port 303, the second chamber 302 being arranged in a horizontal direction X2 with the first chamber 300; a sealed housing 304 positioned between the first chamber 300 and the second chamber 302, the sealed housing 304 being in communication with the first substrate transfer port 301 and the second substrate transfer port 303; a first valve plate 305 located within the seal housing 304; a second valve plate 306 disposed on the sealing case 304, the second valve plate 306 being stacked on top of the first valve 305; a first drive 307 for moving said first valve plate 305 to seal the first substrate transfer port 301; a second driving means 308 for moving said second valve plate 306 to seal the second substrate transfer port 303.
In this embodiment, the sealing case 304 includes a first opening 309 and a second opening 310, the first opening 309 corresponds to the first substrate transfer port 301, and the second opening 310 corresponds to the second substrate transfer port 303.
In this embodiment, the opening area of the first opening 309 is equal to the opening area of the first substrate delivery port 301, and the first opening 309 is surrounded by a first step 311, and the first valve plate 305 has a sealing step 305a matching the first step 311 and a sealing means 305b on the sealing step 305 a; the opening area of the second opening 310 is equal to the opening area of the second substrate transfer port 303, and the second opening 310 has a second step 312 around it, and the second valve plate 306 has a sealing step 306a matching with the second step 312 and a sealing means 306b on the sealing step 306 a.
In other embodiments, the first opening has an opening area smaller than an opening area of the first substrate transfer port, the first opening has a first step around it, and the first valve plate is configured to seal the first opening; the opening area of the second opening is smaller than that of the second substrate conveying port, a second step is arranged around the second opening, and the second valve plate is used for sealing the second opening; or the opening area of the first opening is larger than that of the first substrate conveying port, a first step is arranged around the first substrate conveying port, and the first valve plate is used for sealing the first opening or the second substrate conveying port; the opening area of the second opening is larger than that of the second substrate transmission port, a second step is arranged around the second substrate transmission port, and the second valve plate is used for sealing the second opening or the second substrate transmission port.
Fig. 6 is a schematic diagram of a first valve plate sealing a first substrate transfer port in the substrate processing system of fig. 5.
In this embodiment, a first step 311 is provided around the first opening 309, the first valve plate 305 is provided with a sealing step 305a matching with the first step 311 and a sealing device 305b on the sealing step 305a, the first driving device 307 matches the sealing step 305a with the first step 311, and the sealing device 305b is used for realizing the sealing between the sealing step 305a and the first step 311.
In this embodiment, the first valve plate 305 includes the sealing means 305b provided on the sealing step 305a, and when the first valve plate 305 seals the first step 311 by the driving means, the driving force applied is not reduced by the plate material of the first valve plate 305, but is transmitted to the sealing means 305b on the top of the first valve plate 305, so that a good sealing effect can be achieved with a small driving force. Further, since the first step 311 is sealed by the first valve plate 305, the rigidity of the material of the first valve plate 305 is required to be low.
In other embodiments, the first opening has an open area less than an open area of the first substrate transfer port, and the first drive mechanism causes the first valve plate to seal the first opening; alternatively, the first opening has an opening area larger than that of the first substrate transfer port, and the first driving device causes the first valve plate to seal the first substrate transfer port or the first opening.
In this embodiment, when the second valve plate 306 needs maintenance or replacement, the first valve plate 305 seals the first opening 309, which is beneficial to ensure a vacuum environment in the first chamber 300, so that the process in the first chamber 300 is not interrupted, thereby being beneficial to improving the process efficiency of the substrate processing system.
Fig. 7 is a schematic diagram of a second valve plate sealing a second substrate transfer port in the substrate processing system of fig. 5.
In this embodiment, the second opening 310 has a second step 312 around it, the second valve plate 306 has a sealing step 306a matching the second step 312 and a sealing device 306b on the sealing step 306a, the second driving device 308 matches the sealing step 306a with the second step 312, and the sealing device 306b is used for sealing between the sealing step 306a and the second step 312.
In this embodiment, the second valve plate 306 includes the sealing means 306b disposed on the sealing step 306a, and when the driving means is used to seal the second valve plate 306 against the second step 312, the driving force applied is not reduced by the plate material of the second valve plate 306, but is transmitted to the sealing means 306b on the top of the second valve plate 306, so that a good sealing effect can be achieved with a small driving force. In addition, the second step 312 is sealed by the second valve plate 306, and the rigidity requirement for the material of the second valve plate 306 is low.
In other embodiments, the second opening has an opening area smaller than an opening area of the second substrate transfer port, and the second driving means causes the second valve plate to seal the second opening; or the opening area of the second opening is larger than that of the second substrate transmission port, and the second driving device enables the second valve plate to seal the second substrate transmission port or the second opening.
In this embodiment, when the first valve plate 305 needs to be maintained or replaced, the second valve plate 306 seals the second opening 310, which is beneficial to ensure a vacuum environment in the second chamber 302, so that the process in the second chamber 302 is not interrupted, thereby being beneficial to improving the process efficiency of the substrate processing system.
FIG. 8 is a schematic structural view of a valve plate assembly for a substrate processing system of the present invention; FIG. 9 is a side view of the first valve plate of the valve plate assembly of FIG. 8.
Referring to fig. 8, a first valve plate 401; a second valve plate 402 stacked on top of the first valve plate 401; a seal case 400 positioned at the periphery of the first valve plate 401 and the second valve plate 402, the seal case 400 having a first opening 405 and a second opening 406 in a horizontal direction X3; a first driving device 403 for moving the first valve plate 401 in the up-down direction Y3 and the horizontal direction X3; a second driving device 404 for moving the second valve plate 402 in the up-down direction Y3 and the horizontal direction X3.
The first driving means 403 and the second driving means 404 each include an up-down power means (not shown) for moving the first valve plate 401 or the second valve plate 402 in the up-down direction Y3, and a horizontal power means (not shown) for moving the first valve plate 401 or the second valve plate 402 in the horizontal direction X3.
In this embodiment, the side wall of the first valve plate 401 is provided with a sealing device 401b, and the method for sealing the first opening 405 by the first valve plate 401 comprises the following steps: moving the first valve plate 401 in the up-down direction Y3 by the up-down power unit until the first valve plate 401 is opposite to the first opening 405; after the first valve plate 401 is opposed to the first opening 405, the first valve plate 401 is pressed against the seal case 400 by the horizontal power unit, so that the first valve plate 401 seals the first opening 405.
In this embodiment, the sealing device 402b is disposed on the side wall of the second valve plate 402, and the method for sealing the second opening 406 by the second valve plate 402 includes: moving the second valve plate 402 in the up-down direction Y3 by the up-down power unit until the second valve plate 402 is opposite to the second opening 406; after the second valve plate 402 is opposite to the second opening 406, the second valve plate 402 is pressed against the sealing case 400 by the horizontal power unit, so that the second valve plate 402 seals the second opening 406.
In the present embodiment, the configuration of the first valve plate 401 is the same as that of the second valve plate 402, specifically, the side wall of the first valve plate 401 is provided with a sealing device 401b, and the side wall of the second valve plate 402 is provided with a sealing device 402 b.
Taking the first valve plate 401 as an example, please refer to fig. 9, and fig. 9 is a side view of the first valve plate in the valve plate assembly of fig. 8.
When the first valve plate 401 moves to a position opposite to the first opening 405 under the action of the up-and-down power device, the sealing device 401b of the first valve plate 401 faces the first opening 405; when the first valve plate 401 is pressed against the first opening 405 by the horizontal power device to seal the first opening 405, the sealing device 401b surrounds the first opening 405.
FIG. 10 is a schematic view of another valve plate assembly for a substrate processing system in accordance with the present invention; FIG. 11 is a side view of the first valve plate of the valve plate assembly of FIG. 10.
Referring to fig. 10, a first valve plate 501; a second valve plate 502 stacked on top of the first valve plate 501; a seal case 500 positioned at the periphery of the first valve plate 501 and the second valve plate 502, the seal case 500 having a first opening 505 and a second opening 506 in a horizontal direction X4; a first driving device 503 for moving the first valve plate 501 in the up-down direction Y4 and the horizontal direction X4; a second driving device 504 for moving the second valve plate 502 in the up-down direction Y4 and the horizontal direction X4.
In this embodiment, the first opening 505 has a first step 507 around it; the second opening is provided with a second step 508 around, the first valve plate 501 is provided with a sealing step 501a matched with the first step 507 and a sealing device 501b positioned on the sealing step 501 a; the second valve plate 502 has a sealing land 502a that mates with the second land 508 and a sealing device 502b on the sealing land 502 a.
In other embodiments, the first opening has a first step around it and the second opening does not have a second step around it, the first valve plate has a sealing step matching the first step and a sealing means on the sealing step; or the first opening is not provided with a first step around, the second opening is provided with a second step around, and the second valve plate is provided with a sealing step matched with the second step and a sealing device positioned on the sealing step.
In the present embodiment, the shape of the first valve plate 501 is the same as the shape of the second valve plate 502. Taking the shape of the first valve plate 501 as an example, please refer to fig. 11, and fig. 11 is a side view of the first valve plate 501 in the valve plate assembly of fig. 10.
When the first valve plate 501 seals the first opening 505, the sealing means 501b of the first valve plate 501 contacts the first step 507 around the first opening 505 for sealing the first opening 505.
In other embodiments, the first and second valve plates are different in shape, one of the first and second valve plates being in the configuration shown in fig. 8, the other being in the configuration shown in fig. 10.
FIG. 12 is a process flow diagram of a method of operating a substrate processing system in accordance with the present invention.
Referring to fig. 12, step S1: providing the substrate processing system;
and (S2) moving the first valve plate to seal the first substrate transfer port with the first drive and/or moving the second valve plate to seal the second substrate transfer port with the second drive.
The first valve plate is used for sealing the first substrate transmission port, and is beneficial to ensuring that a vacuum environment is maintained in the first cavity; the second valve plate is used for sealing the second substrate transmission port, and is beneficial to ensuring that a vacuum environment is maintained in the second cavity. When the first valve plate needs maintenance, the second valve plate seals the second substrate transmission port, so that the vacuum environment can be maintained in the second cavity, and when the second valve plate needs maintenance, the first valve plate seals the first substrate transmission port, so that the vacuum environment can be maintained in the first cavity. When the first cavity or the second cavity can still maintain a vacuum environment, the first cavity or the second cavity can still continue to carry out process treatment without stopping the machine, so that the downtime frequency is reduced, and the treatment efficiency of the substrate to be treated is improved.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (22)
1. A substrate processing system, comprising:
a first chamber having a first substrate transfer port;
a second chamber having a second substrate transfer port, the second chamber being arranged in a horizontal direction with the first chamber;
the sealed shell is positioned between the first cavity and the second cavity and is communicated with the first substrate transmission port and the second substrate transmission port;
a first valve plate located within the seal housing;
the second valve plate is positioned on the sealing shell and is stacked with the first valve plate up and down;
a first drive means for moving said first valve plate to seal the first substrate transfer port;
a second driving means for moving the second valve plate to seal the second substrate transfer port.
2. The substrate processing system of claim 1, wherein the first drive means and the second drive means each comprise an up-down power means for moving the first valve plate or the second valve plate up and down and a horizontal power means for moving the first valve plate or the second valve plate in a horizontal direction.
3. The substrate processing system of claim 1, wherein the sealed enclosure comprises a first opening corresponding to the first substrate transfer port and a second opening corresponding to the second substrate transfer port.
4. The substrate processing system of claim 3, wherein the first valve plate is adapted to seal the first substrate delivery port or the first opening when the first opening has an open area greater than the open area of the first substrate delivery port.
5. The substrate processing system of claim 3, wherein the first valve plate is adapted to seal the first opening when the first opening has an open area equal to or less than the open area of the first substrate transfer port.
6. A substrate processing system according to claim 3, wherein a side of said first valve plate is provided with sealing means for effecting a close fit with said first substrate transfer port or first opening.
7. A substrate processing system according to claim 3, wherein the first substrate transfer port has a first step around the first opening, the first valve plate having a sealing step matching the first step, the first valve plate further comprising a sealing means on the sealing step for effecting a seal between the sealing step and the first step.
8. The substrate processing system of claim 3, wherein the second valve plate is adapted to seal the second substrate transfer port or the second opening when the open area of the second opening is greater than the open area of the second substrate transfer port.
9. The substrate processing system of claim 3, wherein the second valve plate is adapted to seal the second opening when an opening area of the second opening is equal to or less than an opening area of the second substrate transfer port.
10. A substrate processing system according to claim 3, wherein a side of said second valve plate is provided with sealing means for effecting a close fit with said second substrate transfer port or second opening.
11. A substrate processing system according to claim 3, wherein a second step is provided around the second substrate delivery port or around the second opening, the second valve plate being provided with a sealing step matching the second step, the second valve plate further comprising sealing means provided on the sealing step for effecting a seal between the sealing step and the second step.
12. The substrate processing system of claim 1, wherein the first chamber is a process chamber and the second chamber is a transfer chamber.
13. The substrate processing system of claim 12, wherein when the number of process chambers is greater than 1, the greater than 1 process chamber surrounds the transfer chamber; and the first valve plate, the second valve plate and the sealing shell are arranged between each process cavity and the transmission cavity.
14. The substrate processing system of claim 1, wherein the first chamber is an airlock chamber and the second chamber is a transfer chamber.
15. The substrate processing system of claim 1, wherein the first valve plate and the second valve plate are equal or unequal in size.
16. A valve plate assembly for a substrate processing system, comprising:
a first valve plate;
the second valve plate is vertically stacked with the first valve plate;
a seal housing located at the periphery of the first valve plate and the second valve plate, the seal housing having a first opening and a second opening in a horizontal direction;
the first driving device is used for enabling the first valve plate to move along the vertical direction and the horizontal direction;
and a second driving means for moving the second valve plate in up-and-down and horizontal directions.
17. The valve plate assembly of claim 16, wherein the first valve plate and the second valve plate each comprise a sealing device.
18. The valve plate assembly of claim 17, wherein the sealing means is disposed on a sidewall of the first valve plate and/or the second valve plate.
19. The valve plate assembly of claim 17 wherein a first land is disposed about said first opening, said first valve plate having a sealing land matching said first land, said first valve plate sealing means being located on said sealing land; and a second step is arranged around the second opening, the second valve plate is provided with a sealing step matched with the second step, and the sealing device of the second valve plate is positioned on the sealing step.
20. The valve plate assembly of claim 16, wherein the first and second drive means each comprise an up-down power means for moving the first valve plate or the second valve plate up and down and a horizontal power means for moving the first valve plate or the second valve plate in a horizontal direction.
21. A method of operating a substrate processing system, comprising:
providing a substrate processing system as recited in claims 1 through 15;
the first valve plate is moved to seal the first substrate transfer port by the first drive means and/or the second valve plate is moved to seal the second substrate transfer port by the second drive means.
22. The method of operation of claim 21 wherein the second valve plate is replaced while the first valve plate seals the first substrate transfer port; alternatively, the first valve plate is replaced while the second valve plate seals the second substrate transfer port.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910882766.XA CN112530830A (en) | 2019-09-18 | 2019-09-18 | Substrate processing system, valve plate assembly and working method of substrate processing system |
| TW109127279A TWI741729B (en) | 2019-09-18 | 2020-08-12 | Substrate processing system, valve plate assembly and working method of substrate processing system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910882766.XA CN112530830A (en) | 2019-09-18 | 2019-09-18 | Substrate processing system, valve plate assembly and working method of substrate processing system |
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| CN112530830A true CN112530830A (en) | 2021-03-19 |
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Also Published As
| Publication number | Publication date |
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| TWI741729B (en) | 2021-10-01 |
| TW202114019A (en) | 2021-04-01 |
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