JP2009065189A - Method and apparatus for processing substrate and method for manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide: a substrate processing apparatus which copes with small batches to reduce the cost; a substrate processing method using the same; and a method for manufacturing a semiconductor device. <P>SOLUTION: A pod opener 21 opening/closing a cap of a pod 26 is installed in a front lower part of a housing 2 of a batch-type CVD system 1, and first and second pod stages 24 and 25 are installed at left and right sides of a pod loading port 22 of the pod opener 21, respectively. A pod carrying device 30 which carries the pod 26 between the pod opener 21 and the pod stages 24 and 25 with a handle 28 clamped by clamping elements 53 and 50 is installed above the pod opener 21 and both pod stages 24 and 25. Since pods are directly carried between the pod stages and the pod opener by the pod carrying device, shelves for temporary storage of the pods can be omitted to reduce the initial cost and the running cost of a small batch-type CVD system. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus, a substrate processing method, and a method of manufacturing a semiconductor device, and more particularly to a batch processing of a relatively small number of substrates, for example, a semiconductor integrated circuit including a semiconductor element is incorporated. Diffusion / CVD apparatus for diffusing impurities in a semiconductor wafer (hereinafter referred to as a wafer) or forming a CVD film such as an insulating film or a metal film, a wafer processing method using the same, and a semiconductor integrated circuit device (hereinafter referred to as a semiconductor integrated circuit device) IC is effective for use in the manufacturing method.

  In the IC manufacturing method, a batch type vertical diffusion / CVD apparatus (hereinafter referred to as a batch type CVD apparatus) is used as a wafer processing method for diffusing impurities in a wafer or forming a CVD film such as an insulating film or a metal film. Is used.

  By the way, as a carrier (wafer storage container) for storing and transporting a plurality of wafers which are substrates to be processed in a substrate processing apparatus including a batch type CVD apparatus, a substantially cubic body having a pair of opposed surfaces opened. A cassette formed in the shape of a box and a FOUP (front opening unified pod, hereinafter referred to as a pod), which is formed in a substantially cubic box shape with one surface opened and a cap is detachably attached to the opening surface. ) When a pod is used as a wafer carrier, the wafer is transported in a sealed state, so that the cleanliness of the wafer can be maintained even if particles are present in the surrounding atmosphere. it can. Therefore, it is not necessary to set the cleanliness in the clean room in which the substrate processing apparatus is installed so high that the cost required for the clean room can be reduced. Therefore, pods have been used as wafer carriers in recent batch-type CVD apparatuses.

  As a batch type CVD apparatus using a pod as a wafer carrier, a process tube for performing desired processing on the wafer, a boat for holding a large number of wafers (for example, one hundred fifty) and carrying them in and out of the process tube, Wafer transfer port where wafers are transferred between the boats by the wafer transfer device, a pod stage on which the pod is placed, a pod shelf for temporarily storing the pod, a pod between the pod stage and the pod shelf, and a pod There is a pod transfer device that transfers between a shelf and a wafer transfer port, and there is a device that operates as follows.

  That is, in this batch type CVD apparatus, the pod is supplied to the pod stage, and is transported to the pod shelf by the pod transport apparatus and temporarily stored. A plurality of pods stored in the pod shelf are repeatedly transferred to the wafer transfer port by the pod transfer device. Many wafers of the pod transferred to the wafer transfer port are loaded (charged) on the boat by the wafer transfer device. Wafers loaded in the boat are loaded into the process tube by the boat and subjected to desired processing by the process tube. The processed wafer is unloaded from the process tube by the boat. A large number of processed wafers are repeatedly discharged from the boat by the wafer transfer device, and are repeatedly returned to a plurality of empty pods at the wafer transfer port. The pod containing the processed wafer is temporarily stored in the pod shelf by the pod transfer device, and then repeatedly transferred to the pod stage.

  Recently, in the production of system LSIs and the like, QTAT (Quick Turned Around Time) production, in which a wafer is introduced and completed in as short a time as possible, has become important. A batch-type CVD apparatus with a small batch of 5 sheets or less is required. In this small batch batch type CVD apparatus, the number of pods supplied to one batch may be two to three.

  However, the batch-type CVD apparatus described above is for large batches with a processing number of about one hundred and fifty, and the projected floor area and number of steps of the pod shelf are set large, or the pod shelf is constructed in a rotating structure. Since the number of pods stored in the pod shelf has been increased, the initial cost is reduced by diverting to a small batch type CVD system, resulting in a larger size and a more complicated structure. There is a problem that the running cost increases, and there is a problem that the QTAT production cannot be sufficiently handled.

  An object of the present invention is to provide a substrate processing apparatus suitable for small batches and capable of reducing costs, a substrate processing method using the same, and a semiconductor device manufacturing method.

One of the means for solving the problem is that a housing in which a process tube is installed, one or a plurality of pod openers that open and close a cap of a pod that stores a plurality of substrates, and the pod are placed. In a substrate processing apparatus comprising one or a plurality of pod stages, and a pod transfer device that transfers the pod between a pod mounting table of the pod opener and the pod stage,
The substrate processing apparatus, wherein the pod transfer device is disposed directly above the pod mounting table and the pod stage.

  One means for solving the problem is that a pod containing a plurality of substrates is placed on a pod stage, and the pod is placed on a pod placement part of a pod opener between the pod placement table and the pod stage. It is transported by a pod transport device arranged directly above, the cap of the pod is opened by the pod opener, the substrate in the pod is transported to the inside of the housing, and predetermined processing is performed on the substrate A substrate processing method.

  One means for solving the problem is that a pod containing a plurality of substrates is placed on a pod stage, and the pod is placed on a pod placement part of a pod opener between the pod placement table and the pod stage. It is transported by a pod transport device arranged directly above, the cap of the pod is opened by the pod opener, the substrate in the pod is transported to the inside of the housing, and predetermined processing is performed on the substrate A method for manufacturing a semiconductor device, comprising:

  According to the above-described means, it is suitable for a small batch, and the cost can be reduced.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  In the present embodiment, the substrate processing apparatus according to the present invention is a batch type CVD apparatus that handles a small batch of about 50 or less batch processes, that is, a small batch type vertical diffusion / CVD apparatus (hereinafter referred to as a small batch processing apparatus). It is configured as a batch type CVD apparatus.) This small batch type CVD apparatus is configured to handle a product wafer as a product substrate, and is configured to handle a pod as a carrier for the product substrate. In the following description, front, rear, left and right are based on FIG. That is, the pod opener 21 side is the front side, the opposite side is the rear side, the clean unit 17 side is the left side, and the opposite side is the right side.

  As shown in FIGS. 1 to 3, the small batch type CVD apparatus 1 includes a casing 2, and a heater unit 3 is installed in the vertical direction on the upper end of the rear end in the casing 2. The process tube 4 is concentrically disposed inside the heater unit 3. Connected to the process tube 4 are a gas introduction pipe 5 for introducing a raw material gas, a purge gas and the like into the process tube 4 and an exhaust pipe 6 for evacuating the inside of the process tube 4.

  An elevator 7 constituted by a feed screw device or the like is installed at the lower part of the rear end portion of the housing 2, and the elevator 7 raises and lowers a seal cap 8 disposed horizontally just below the process tube 4 in the vertical direction. It is configured as follows. The seal cap 8 is configured to seal the lower end opening which is the furnace port of the process tube 4 and is configured to support the boat 9 vertically. The boat 9 supports a plurality of wafers W as substrates (for example, about fifty or less) in a state where the centers are aligned and horizontally disposed, and a seal cap 8 by an elevator 7 with respect to the processing chamber of the process tube 4. It is comprised so that it may carry in and out with raising / lowering.

  As shown in FIGS. 2 and 3, a wafer transfer apparatus 10 that charges and discharges the wafer W with respect to the boat 9 is installed in the front region in the housing 2. The wafer transfer apparatus 10 includes a rotary actuator 11, and the rotary actuator 11 is configured to rotate a first linear actuator 12 installed on the upper surface within a horizontal plane. A second linear actuator 13 is installed on the upper surface of the first linear actuator 12, and the first linear actuator 12 is configured to move the second linear actuator 13 horizontally. A moving table 14 is installed on the upper surface of the second linear actuator 13, and the second linear actuator 13 is configured to move the moving table 14 horizontally. A plurality of tweezers 15 (five in the present embodiment) for supporting the wafer W from below are arranged on the moving table 14 at equal intervals and mounted horizontally. The wafer transfer device 10 is moved up and down by an elevator 16 constituted by a feed screw mechanism.

  As shown in FIG. 2, a clean unit 17 that blows clean air is installed on the left side wall at the rear of the housing 2 so as to blow clean air onto the boat 9. Further, a wafer stocker 18 configured in the same manner as the boat 9 is installed on the left side of the central portion in the housing 2, and the wafer stocker 18 stores a plurality of side dummy wafers.

  As shown in FIGS. 1 to 3, a wafer loading / unloading port 20 for loading / unloading the wafer W into / from the housing 2 is provided at the center of the front wall of the housing 2. A pod opener 21 is installed at the carry-in / out port 20. The pod opener 21 includes a mounting table 22 for mounting the pod 26, and a cap attaching / detaching mechanism 23 for attaching and detaching a cap 27 of the pod 26 mounted on the mounting table 22, and the pod mounted on the mounting table 22. By removing the 26 caps 27 with the cap attaching / detaching mechanism 23, the wafer loading / unloading opening of the pod 26 is opened and closed.

  As shown in FIGS. 1 to 3, a first pod stage 24 and a second pod stage 24 on which the pod 26 is placed on the left side and the right side of the mounting table 22 of the pod opener 21 in the lower part of the front surface of the housing 2. A pod stage 25 is installed adjacent to the mounting table 22. For the first pod stage 24 and the second pod stage 25, a pod 26 is connected to an in-process transfer device (an unmanned guided vehicle with a transfer device (RGV), an automatic guided vehicle with a transfer device (AGV), not shown). It is supplied and discharged by a manned transport cart (PGV) with a manual transfer device.

  As shown in FIGS. 1 to 3, the upper portion of the front surface of the housing 2 holds the handle 28 of the pod 26 between the pod opener 21, the first pod stage 24, and the second pod stage 25 ( The pod transfer device 30 shown in FIG. 4 is provided which is transferred in a clamped state.

  That is, as shown in FIG. 4, the pod transfer device 30 includes a mounting plate 31 that is vertically fixed so as to extend in the left-right direction. The base plate 33 formed in the above is laid horizontally in the left-right direction and fixed by the bracket 32. A pair of left and right brackets 34, 34 are erected on the left and right ends of the upper surface of the base plate 33, and a pair of pulleys 35, 35 are rotatably supported on the left and right brackets 34, 34, respectively. ing. A timing belt 36 is wound between the left and right pulleys 35 and 35 so as to be able to travel. A central bracket 37 is fixed at an intermediate position between the left and right brackets 34 of the mounting plate 31, and a driving pulley 39 that is driven to rotate by a servo motor 38 is supported on the central bracket 37. The driving pulley 39 is inserted between the upper traveling portion and the lower traveling portion of the timing belt 36, and the upper traveling portion of the timing belt 36 is wound around from above. A pair of tension pulleys 40, 40 are rotatably supported on the left and right sides of the driving pulley 39 of the central bracket 37, and the left and right tension pulleys 40, 40 are attached to the upper running portion of the timing belt 36. By pressing from the outside, the timing belt 36 is pressed against the driving pulley 39 and an appropriate tension is applied.

  A linear guide rail 41 is horizontally laid in the left-right direction on the front surface of the vertical member of the angle-shaped steel-shaped base plate 33, and a travel block 42 is laid over the linear guide rail 41 so as to be able to travel in the left-right direction. . A connection tool 43 is fixed to the upper surface of the travel block 42, and the connection tool 43 is connected to the central portion of the lower travel portion of the timing belt 36. That is, the travel block 42 travels in the left-right direction with the linear guide rail 41 as a guide by the travel of the timing belt 36 through the driving pulley 39 by the servo motor 38.

  A first air cylinder 45 is installed vertically downward via a bracket 44 on the front surface of the travel block 42, and a second air cylinder 48 attaches a bracket 47 to the piston rod 46 of the first air cylinder 45. It is arranged horizontally in the horizontal direction and is suspended. The second air cylinder 48 is provided with left and right piston rods 49, 49 that move forward and backward in the left-right direction. A pair of lower pressers 50, 50 are symmetrically formed at the left and right ends of the left and right piston rods 49, 49. They are arranged and fixed so as to extend vertically. The left and right lower pressers 50, 50 enter the lower side of the handle 28 of the pod 26 from both sides by the shortening operation of the piston rod 49 so as to face the lower end surface of the handle 28.

  A third air cylinder 51 is installed vertically downward at the center of the lower surface of the second air cylinder 48, and an upper presser 53 is orthogonal to the lower end of the piston rod 52 of the third air cylinder 51. And fixed. The upper presser 53 is adapted to grip the handle 28 of the pod 26 in cooperation with the left and right lower pressers 50, 50 by pressing against the upper surface of the handle 28 of the pod 26 by the extension operation of the piston rod 52. . In addition, the above mechanism part in the pod conveyance apparatus 30 is entirely covered with a cover 54 as shown in FIG.

  Hereinafter, a film forming method, which is a characteristic process of an IC manufacturing method according to an embodiment of the present invention and is a wafer processing method according to an embodiment of the present invention, is carried in and out of a pod, which is the characteristic step. (Pod loading and pod unloading) method and wafer loading and unloading (wafer charging and wafer discharging) methods are mainly performed using the small batch type CVD apparatus having the above configuration. 5 and FIG. 6 will be mainly used for explanation. Here, it is assumed that twenty-five side dummy wafers are stored in the pod supplied to the first pod stage 24 (hereinafter referred to as the first pod 26A), and the pod supplied to the second pod stage 25. Assume that twenty-five product wafers as product substrates are stored in (hereinafter referred to as second pod 26B).

  The first pod 26A and the second pod 26B are respectively supplied to the first pod stage 24 and the second pod stage 25 by an in-process transfer device. The first pod 26A supplied to the first pod stage 24 is picked up and gripped by the action shown in FIG. 5 of the pod transfer device 30 and is shown in FIGS. 6 (a) to 6 (b). As described above, the pod opener 21 is transported and placed on the placing table 22.

  Here, the action of pick-up and put-down of the pod transport device 30 will be described with reference to FIG. When the pod transfer device 30 picks up the pod 26 placed on the first pod stage 24, the upper presser 53 is placed on the first pod stage 24 as shown in FIG. It is located directly above the 26 handles 28. That is, the upper block 53 is moved to a predetermined position by the travel block 42 traveling in the left-right direction with the linear guide rail 41 as a guide by the travel of the timing belt 36 via the driving pulley 39 by the servo motor 38. Is done. At this time, the left and right lower pressers 50, 50 are open on both sides above the handle 28 by the piston rods 49, 49 of the second air cylinder 48.

  As shown in FIG. 5 (b), the upper presser 53 and the left and right lower pressers 50, 50 in the opened state are arranged on the upper and lower sides of the handle 28 in a state in which the vertical interval is maintained. The piston rod 46 of the first air cylinder 45 is lowered to the opposite position by the extension operation.

  As shown in FIG. 5C, the left and right lower pressers 50, 50 are inserted into the lower side of the handle 28 by the shortening operation of the piston rods 49, 49 of the second air cylinder 48. By this insertion, the upper surfaces of the tip portions of the left and right lower pressers 50, 50 are opposed to the left end portion and the right end portion of the lower surface of the handle 28 with a slight gap therebetween.

  In this state, as shown in FIG. 5 (d), when the piston rod 46 of the first air cylinder 45 is shortened, the distal ends of the left and right lower pressers 50, 50 become the lower surface of the handle 28. The left and right lower pressers 50, 50 are in a state of scooping up the pod 26. At the same time, when the upper presser 53 is lowered by the extension operation of the piston rod 52 of the third air cylinder 51, the upper presser 53 and the left and right lower pressers 50, 50 are in a state of gripping the handle 28 from above and below. In this way, the handle 28 is held by the clamp portion constituted by the upper presser 53 and the lower presser 50, so that the pod transfer device 30 can transfer the pod 26 safely and quickly.

  The pod carrying device 30 carries the pod 26 from right above the first pod stage 24 to right above the mounting table 22 of the pod opener 21 with the handle 28 held by the upper presser 53 and the lower presser 50. . That is, the travel block 42 travels in the left-right direction with the linear guide rail 41 as a guide by travel of the timing belt 36 via the driving pulley 39 by the servo motor 38, so that the pod transport device 30 moves the pod 26 to the pod 26. It is conveyed directly above the mounting table 22 of the opener 21.

  The pod 26 conveyed immediately above the mounting table 22 of the pod opener 21 is mounted (put down) on the mounting table 22 by the reverse operation to that described above. That is, first, as shown in FIG. 5C, after the upper presser 53 is slightly raised by the shortening operation of the piston rod 52 of the third air cylinder 51, the piston rod 46 of the first air cylinder 45 is moved. The left and right lower pressers 50, 50 are lowered by the extension operation of, and the pod 26 is landed on the mounting table 22. Subsequently, as shown in FIG. 5B, the left and right lower pressers 50, 50 are opened by the extension operation of the piston rod 49 of the second air cylinder 48, and are extracted from the lower space of the handle 28. It is. After that, as shown in FIG. 5A, the upper presser 53 and the left and right lower pressers 50, 50 in the opened state are kept at a distance from each other in the vertical direction of the first air cylinder 45. The piston rod 46 is raised to a predetermined standby position by the extension operation.

  The cap 27 is removed by the cap attaching / detaching mechanism 23 of the first pod 26 </ b> A supplied as shown in FIG. 6B on the mounting table 22 of the pod opener 21 by the action of the pod transfer device 30 described above. The wafer inlet / outlet is opened.

  The plurality of side dummy wafers Wa of the first pod 26 </ b> A opened by the pod opener 21 are discharged (wafer loading) by the wafer transfer device 10 and sequentially loaded (charged) into the boat 9. At this time, as shown in FIG. 3, the side dummy wafers Wa are appropriately distributed and loaded on the upper end portion and the lower end portion of the boat 9.

  When the loading operation of the side dummy wafer Wa of the first pod 26A transferred from the first pod stage 24 to the boat 9 is completed, the first pod 26A emptied on the mounting table 22 of the pod opener 21 is capped. After the cap 27 is attached by the attaching / detaching mechanism 23, as described in FIGS. 6B and 6C, the pod transfer device 30 has been described above from the mounting table 22 of the pod opener 21 to the first pod stage 24. It is transported back by operation.

  Next, as shown in FIGS. 6C and 6D, the second pod 26 </ b> B of the second pod stage 25 is transferred from the second pod stage 25 to the mounting table 22 of the pod opener 21. It is transported and placed by the operation described above. The cap 27 of the second pod 26B supplied to the pod opener 21 is removed by the cap attaching / detaching mechanism 23 to open the wafer loading / unloading opening.

  Subsequently, as shown in FIGS. 6D and 6E, the product wafers Wb of the second pod 26 </ b> B supplied to the pod opener 21 are sequentially loaded into the boat 9 by the wafer transfer device 10. . At this time, as shown in FIG. 3, the product wafers Wb are appropriately loaded between the side dummy wafers Wa that are distributed and loaded to the upper end and the lower end of the boat 9.

  As shown in FIG. 6 (e), the second pod 26 </ b> B emptied by loading all the product wafers Wb into the boat 9 was placed on the mounting table 22 of the pod opener 21. Wait as it is. At this time, the second pod 26B may be put on the cap 27 by the cap attaching / detaching mechanism 23 and wait in that state.

  As described above, the number of side dummy wafers Wa and product wafers Wb specified in advance (for example, the total of thirty to thirty-two side dummy wafers Wa and product wafers Wb) is loaded into the boat 9. Then, the boat 9 is lifted by the elevator 7 and loaded into the processing chamber of the process tube 4 (boat loading). When the boat 9 reaches the upper limit, the peripheral portion of the upper surface of the seal cap 8 holding the boat 9 closes the process tube 4 in a sealed state, so that the processing chamber is hermetically closed.

  The processing chamber of the process tube 4 is hermetically closed and is exhausted by the exhaust pipe 6 so as to have a predetermined pressure, heated to a predetermined temperature by the heater unit 3, and a predetermined source gas is supplied by the gas introduction pipe 5. Only a predetermined flow rate is supplied. As a result, a desired film corresponding to a preset processing condition is formed on the product wafer Wb. Here, the number of product wafers Wb to be processed at once in the processing chamber is set to be equal to or less than the number of product wafers stored in the second pod 26B, which is a carrier for one product substrate, and for one product substrate. All the product wafers accommodated in the second pod 26B as a carrier are processed at a time in the processing chamber.

  When the preset processing time has elapsed, the boat 9 is lowered by the elevator 7, so that the boat 9 holding the processed product wafer Wb and the side dummy wafer Wa is returned to the original standby position (wafer charging and discharge). (Boat unloading).

  When the boat 9 is unloaded to the standby position, the processed product wafer Wb of the boat 9 is first removed by the wafer transfer device 10 in order to prevent the dust from being transferred to the processed product wafer Wb. As shown in FIG. 6 (e), it is loaded (discharged) and stored (wafer unloading) in an empty second pod 26 B waiting on the mounting table 22 of the pod opener 21.

  When the storage operation of the processed product wafer Wb into the empty second pod 26B is completed, the second pod 26B filled with the product wafer Wb is mounted with the cap 27 by the cap attaching / detaching mechanism 23, and then the process shown in FIG. ) And (c), the pod opener 21 is transported and returned from the mounting table 22 to the second pod stage 25 by the operation of the pod transport device 30 described above.

  Next, as referred to in FIGS. 6C and 6B, the empty first pod 26 </ b> A of the first pod stage 24 is transferred from the first pod stage 24 to the mounting table 22 of the pod opener 21. Are conveyed and supplied by the aforementioned operation. Subsequently, after the cap of the first pod 26A is opened by the cap attaching / detaching mechanism 23, the used side dummy wafer Wa of the boat 9 is stored in the empty first pod 26A by the wafer transfer device 10.

  After the first pod 26A storing the used side dummy wafer Wa is closed by the cap attaching / detaching mechanism 23, the first pod 26A is removed from the mounting table 22 of the pod opener 21, as shown in FIGS. 6B and 6A. It is transferred back to the first pod stage 24 by the operation of the pod transfer device 30 described above. The first pod 26 </ b> A may be kept in the pod opener 21 as it is for the next charging operation without returning from the pod opener 21 to the first pod stage 24.

  As described above, the second pod 26B containing the processed product wafer Wb and returned to the second pod stage 25 is transferred from the second pod stage 25 to a subsequent process such as a cleaning process or a film forming inspection process. It is carried by the device. Further, the formed product wafer Wb is transferred to a lithography process or an etching process and subjected to a predetermined process, whereby the IC according to the IC manufacturing method of the present embodiment is manufactured. In addition, the first pod 26A, in which the used side dummy wafer Wa is stored and returned to the first pod stage 24, is repeatedly placed on the first pod stage 24 while the side dummy wafer Wa can be reused. used. The first pod 26A storing the used side dummy wafer Wa is changed from the first pod stage 24 to the present embodiment at the time when the warpage and contamination of the side dummy wafer Wa become an allowable value or more due to repeated use. It is transferred to the side dummy wafer exchange process, which is one process of the IC manufacturing method, by the in-process transfer apparatus.

  Thereafter, the wafer processing method according to the present embodiment described above is repeated, and for example, 25 product wafers Wb are batch-processed by the small batch type CVD apparatus 1, and in one embodiment of the present invention. ICs related to a certain IC manufacturing method are manufactured.

  According to the embodiment, the following effects can be obtained.

1) By setting the number of product wafers per batch to 25 or less, the batch-type CVD device has one first pod as a product wafer carrier and one side dummy wafer carrier per batch. Since only one second pod needs to be handled, the tact time (time from wafer loading to wafer unloading) can be greatly reduced as compared with the conventional large batch type CVD apparatus.

2) By setting the number of pods to be handled to a small number, it is possible to reduce the size of the CVD device, so the initial cost and running cost of the CVD device can be reduced, and the footprint (occupied floor area) can be reduced. It can be made smaller and the clean room can be used effectively.

3) By reducing the number of side dummy wafers used per batch, it is possible to reduce initial costs and running costs related to dummy wafers as compared to large batch CVD devices.

4) A first pod stage and a second pod stage are provided on the left and right sides of the pod opener, and the pod is transported between the pod opener and the pod stage by a pod transport device, thereby temporarily storing the pod. Since shelves can be omitted, initial costs and running costs can be further reduced when handling small batches.

5) By installing the pod transfer device directly above the pod opener, the first pod stage, and the second pod stage, it is possible to avoid an increase in the occupied area due to the installation of the pod transfer device, and a small batch type The throughput of the CVD apparatus can be increased.

6) When the pod is transported by the pod transport device, the pod handle can be safely transported by preventing the pod from falling off by gripping the handle of the pod with the clamp part consisting of the upper and lower pressers. It is possible to reliably prevent wafer damage accidents due to falling off.

7) By installing the pod mounting table and pod stage of the pod opener outside the housing, it is possible to prevent foreign matter such as particles adhering to the pod from entering the housing. The inside of the body can be kept clean. As a result, the quality and reliability of the wafer substrate processing method can be improved, and the manufacturing yield of the IC manufacturing method can be increased.

  FIG. 7 is a perspective view showing an appearance of a small batch type CVD apparatus according to another embodiment of the present invention. FIG. 8 is a plan sectional view thereof. FIG. 9 is a side sectional view thereof.

  The small batch type CVD apparatus 1A according to the present embodiment is different from the small batch type CVD apparatus 1 according to the above embodiment in that the pod transfer device 30 is omitted and the front wall of the housing 2A is omitted. A first wafer loading / unloading port 20A facing the first pod stage 24 and a second wafer loading / unloading port 20B facing the second pod stage 25 are respectively opened. The first pod opener 21A and the second pod opener 21B are respectively installed at the wafer loading / unloading port 20B.

  Hereinafter, by explaining the operation of the small batch type CVD apparatus 1A according to the present embodiment, a film forming method as a wafer processing method according to another embodiment of the present invention is carried out in a pod loading / unloading which is a characteristic step thereof. The method and the wafer loading / unloading method will be mainly described. Here, it is assumed that twenty-five side dummy wafers are stored in the pod supplied to the first pod stage 24 (hereinafter referred to as the first pod 26A) and supplied to the second pod stage 25. It is assumed that 25 product wafers as product substrates are stored in the pod (hereinafter referred to as the second pod 26B). The first pod 26A and the second pod 26B are respectively supplied to the first pod stage 24 and the second pod stage 25 by the in-process transfer device.

  As indicated by an imaginary line in FIG. 8 and a solid line in FIG. 9, the first pod 26A supplied to the first pod stage 24 is transferred to the first wafer by a pod moving device (not shown) of the first pod opener 21A. It is pressed against the carry-in / out port 20A. The pressed first pod 26A has its cap 27 removed by the cap attaching / detaching mechanism 23A of the first pod opener 21A, and the wafer inlet / outlet opening is opened.

  The plurality of side dummy wafers Wa stored in the first pod 26 </ b> A are sequentially loaded (charged) onto the boat 9 by the wafer transfer device 10. At this time, as shown in FIG. 9, the side dummy wafers Wa are appropriately distributed and loaded on the upper end portion and the lower end portion of the boat 9.

  As indicated by an imaginary line in FIG. 8, the second pod 26B supplied to the second pod stage 25 is transferred to the second wafer loading / unloading port 20B by a pod moving device (not shown) of the second pod opener 21B. Pressed against. The pressed second pod 26B has its cap 27 removed by the second cap detaching mechanism 23B of the second pod opener 21B, and the wafer loading / unloading port is opened.

  The plurality of product wafers Wb stored in the second pod 26B are sequentially loaded into the boat 9 by the wafer transfer device 10. At this time, as shown in FIG. 9, the product wafer Wb is appropriately loaded between the side dummy wafers Wa which are distributed and loaded to the upper end portion and the lower end portion of the boat 9.

  As described above, a predetermined number of side dummy wafers Wa and product wafers Wb (for example, a total of thirty to thirty-two side dummy wafers Wa and product wafers Wb) are transferred to the boat 9. When loaded, the boat 9 is lifted by the elevator 7 and carried into the processing chamber of the process tube 4. When the boat 9 reaches the upper limit, the peripheral portion of the upper surface of the seal cap 8 holding the boat 9 closes the process tube 4 in a sealed state, so that the processing chamber of the process tube 4 is in an airtightly closed state.

  The processing chamber of the process tube 4 is hermetically closed and is exhausted by the exhaust pipe 6 so as to have a predetermined pressure, heated to a predetermined temperature by the heater unit 3, and a predetermined source gas is supplied by the gas introduction pipe 5. Only a predetermined flow rate is supplied. As a result, a desired film corresponding to a preset processing condition is formed on the product wafer Wb. Here, the number of product wafers Wb to be processed at once in the processing chamber is set to be equal to or less than the number of product wafers stored in the second pod 26B, which is a carrier for one product substrate, and for one product substrate. The product wafer Wb accommodated in the second pod 26B as a carrier is processed at a time in the processing chamber.

  When a preset processing time has elapsed, the boat 9 is lowered by the elevator 7 so that the boat 9 holding the processed product wafer Wb and the side dummy wafer Wa is carried out to the original standby position.

  When the boat 9 is carried out to the standby position, first, the processed product wafer Wb of the boat 9 is discharged by the wafer transfer device 10, and the empty second pod 26B waiting on the second pod opener 21B is discharged. It is stored in.

  When the storing operation of the processed product wafer Wb into the second pod 26B is completed, the second pod 26B filled with the product wafer Wb is mounted with the cap 27 by the second cap attaching / detaching mechanism 23B, and then the FIG. 7 and FIG. As indicated by a solid line in FIG. 8, the second wafer loading / unloading port 20B is moved back to the second pod stage 25 by the pod moving device of the second pod opener 21B.

  Next, the used side dummy wafers Wa of the boat 9 are discharged by the wafer transfer device 10 and stored in the empty first pod 26A waiting on the first pod opener 21A.

  When the storing operation of the used side dummy wafer Wa into the first pod 26A is completed, the first pod 26A filled with the side dummy wafer Wa is mounted with the cap 27 by the first cap attaching / detaching mechanism 23A, and then the FIG. As indicated by a solid line in FIG. 8, the first wafer loading / unloading port 20A moves from the first wafer loading / unloading port 20A to the first pod stage 24 by the pod moving device of the first pod opener 21A.

  As described above, the second pod 26B containing the processed product wafer Wb and returned to the second pod stage 25 is transferred from the second pod stage 25 to a subsequent process such as a cleaning process or a film forming inspection process. It is carried by the device. Further, the formed product wafer Wb is transferred to a lithography process or an etching process and subjected to a predetermined process, whereby the IC according to the IC manufacturing method of the present embodiment is manufactured. In addition, the first pod 26A, in which the used side dummy wafer Wa is stored and returned to the first pod stage 24, is repeatedly placed on the first pod stage 24 while the side dummy wafer Wa can be reused. used. The first pod 26A storing the used side dummy wafer Wa is changed from the first pod stage 24 to the present embodiment at the time when the warpage and contamination of the side dummy wafer Wa become an allowable value or more due to repeated use. It is transferred to the side dummy wafer exchange process, which is one process of the IC manufacturing method, by the in-process transfer apparatus.

  Thereafter, the wafer processing method according to this embodiment described above is repeated, and for example, 25 product wafers Wb are batch-processed by the small batch type CVD apparatus 1A, and in the embodiment of the present invention. ICs related to a certain IC manufacturing method are manufactured.

  According to the second embodiment, the following effects can be obtained in addition to the first embodiment. That is, the tact time can be further shortened by omitting the pod transfer device.

  Needless to say, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

  For example, in the above embodiment, the case where the side dummy wafer Wa is accommodated in the pod 26 has been described, but the side dummy wafer Wa may be handled in the wafer stocker 18. That is, the wafer stocker 18 is a stocker (storage location) for storing dummy wafers. By storing the side dummy wafers Wa in the wafer stocker 18, the side dummy wafers Wa are placed between the boat 9 and the wafer stocker 18. It will suffice if it is conveyed by Therefore, it is not necessary to take out the side dummy wafer Wa to the pod outside the housing 2 for each processing, and the tact time can be further shortened. Incidentally, in this case as well, the side dummy wafer Wa is replaced at a time when warpage and contamination increase due to repeated processing.

  Further, in the above-described embodiment, one dummy wafer pod and one product wafer pod are loaded to perform one process, and less than 25 sheets in one product wafer pod at a time. However, when the side stock wafer Wa is handled in the wafer stocker 18, two product wafer pods are loaded and less than fifty wafers at a time. It can also be set to process a product wafer.

  In the above embodiment, a CVD apparatus for forming a CVD film on a wafer has been described. However, the present invention is not limited thereto, and a film forming apparatus for forming an oxide film, an insulating film, and a metal film on a wafer, and a wafer. Applicable to all substrate processing equipment such as heat treatment equipment (farnace) that forms oxide films, diffuses impurities into wafers, reflows and anneals for carrier activation and planarization after ion implantation. be able to.

  Further, although the film forming method for forming the CVD film on the wafer has been described in the above embodiment, the present invention is not limited thereto, and the film forming method for forming the oxide film, the insulating film, and the metal film on the wafer. Apply to all substrate processing methods such as heat treatment methods such as forming oxide films on wafers, diffusing impurities in wafers, reflowing and annealing for carrier activation and planarization after ion implantation be able to.

  Furthermore, in the above-described embodiment, the method for manufacturing an IC has been described. However, the present invention is not limited to this, and the method for manufacturing a semiconductor device such as a transistor, a diode, a capacitor, an optical semiconductor device, a hybrid integrated circuit device, etc. Can be applied to.

  The substrate to be processed is not limited to a wafer, and may be a substrate such as a photomask, a printed wiring board, or a liquid crystal panel.

It is the perspective view which showed the external appearance of the small batch type CVD apparatus which is one embodiment of this invention. FIG. FIG. It is a perspective view which shows a pod conveyance apparatus. It is the operation | movement and each partial front view for demonstrating the pod carrying in / out method in the wafer processing method which is one embodiment of this invention. FIG. 5 is a partial front view for explaining the wafer charging and discharging method. It is the perspective view which showed the external appearance of the small batch type CVD apparatus which is other embodiment of this invention. FIG. FIG.

Explanation of symbols

  W ... wafer (substrate), Wa ... side dummy wafer (dummy substrate), Wb ... product wafer (product substrate), 1 ... small batch type CVD apparatus (substrate processing apparatus), 2 ... housing, 3 ... heater unit, 4 ... Process tube, 5 ... Gas introduction pipe, 6 ... Exhaust pipe, 7 ... Elevator, 8 ... Seal cap, 9 ... Boat, 10 ... Wafer transfer device, 11 ... Rotary actuator, 12 ... First linear actuator, 13 ... First Two linear actuators, 14 ... moving table, 15 ... tweezer, 16 ... elevator, 17 ... clean unit, 18 ... wafer stocker (substrate storage location), 20 ... wafer loading / unloading port, 21 ... pod opener, 22 ... mounting table ... Cap attaching / detaching mechanism, 24 ... First pod stage, 25 ... Second pod stage, 26 ... Pod, 26A ... First pod (Da -Substrate carrier), 26B ... second pod (product substrate carrier), 27 ... cap, 28 ... handle, 30 ... pod transfer device, 31 ... mounting plate, 32 ... bracket, 33 ... base plate, 34 ... bracket, 35 ... pulley, 36 ... timing belt, 37 ... bracket, 38 ... servo motor, 39 ... driving pulley, 40 ... tension pulley, 41 ... linear guide rail, 42 ... travel block, 43 ... coupling tool, 44 ... bracket, 45 ... first air cylinder, 46 ... piston rod, 47 ... bracket, 48 ... second air cylinder, 49 ... piston rod, 50 ... lower presser, 51 ... third air cylinder, 52 ... piston rod, 53 ... Upper press, 54 ... Cover, 1A ... Small batch type CVD apparatus (substrate processing apparatus), 2A ... Case, 20A ... First Eha loading / unloading port, 20B ... second wafer loading / unloading port, 21A ... first pod opener, 21B ... second pod opener, 22A ... first loading table, 22B ... second loading table, 23A ... first cap attaching / detaching mechanism, 23B ... Second cap attaching / detaching mechanism.

Claims (7)

A housing in which a process tube is installed, one or a plurality of pod openers for opening and closing a cap of a pod for storing a plurality of substrates, one or a plurality of pod stages for mounting the pod, and the pod In a substrate processing apparatus comprising a pod transfer device for transferring between a pod mounting table of the pod opener and the pod stage,
The substrate processing apparatus, wherein the pod transfer device is disposed immediately above the pod mounting table and the pod stage.   The pod mounting table, the pod stage, and the pod transfer device are respectively arranged outside the casing, and a substrate for carrying the substrate in and out of the casing on the front wall of the casing 2. The substrate processing apparatus according to claim 1, wherein a carry-in / out port is established, and the pod opener is installed at the substrate carry-in / out port.   The substrate processing apparatus according to claim 2, wherein the pod stage is installed on a front side of the front wall of the housing, and the pod mounting table and the pod stage are arranged adjacent to each other. .   The substrate processing apparatus according to claim 3, wherein a plurality of the pod stages are arranged.   The substrate processing apparatus according to claim 4, wherein the pod mounting table is disposed so as to be sandwiched between the plurality of pod stages.   A pod containing a plurality of substrates is placed on a pod stage, and this pod is transported to a pod placement portion of a pod opener by a pod transport device disposed directly above the pod placement table and the pod stage. A substrate processing method, wherein a cap of the pod is opened by the pod opener, a substrate in the pod is transported into the housing, and a predetermined process is performed on the substrate.   A pod containing a plurality of substrates is placed on a pod stage, and this pod is transported to a pod placement portion of a pod opener by a pod transport device disposed directly above the pod placement table and the pod stage. A method of manufacturing a semiconductor device, wherein a cap of the pod is opened by the pod opener, a substrate in the pod is transferred into the housing, and a predetermined process is performed on the substrate.

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