JPH10242241A - Semiconductor manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To minimize the reticle replacing time by placing at least an SMIF indexer at a reticle transfer height enough to take out a substrate from an SMID pod with its door opened to carry the pod between the indexer and mount. SOLUTION: A reticle SMIF indexer 2 is disposed at a front left part of an aligner chamber 2 and its pot mounting face is higher by a given amount from the reticle transfer height. At a front left part of the chamber 1 a pot mount 3 and mount lift 4 to move the mount 3 up and down from near a height of 800mm above the floor to near the pod mount face height of the indexer 2. Above the indexer 2 and lift 4 a robot hand 5 and vertically and horizontally moving means 6 are disposed to thereby minimize the reticle replacing time and reticle contamination during carrying.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor manufacturing apparatus having a standard mechanical interface (SMIF) pod transport means. That is, the substrate is supplied to a semiconductor manufacturing apparatus such as an exposure apparatus using an openable and closable container (hereinafter abbreviated as SMIF pod) capable of keeping a cassette containing a substrate such as a semiconductor wafer or a reticle clean. The present invention also relates to a so-called SMIF system-compatible semiconductor manufacturing apparatus.

[0002]

2. Description of the Related Art Conventionally, in order to improve the yield in a semiconductor manufacturing process, especially in a lithography process, a substrate such as a semiconductor wafer has been processed in a clean room where submicron-sized dust causing element defects is controlled. However, today, as the integration of elements and the miniaturization of circuits are progressing, it is becoming technically and costly difficult to realize a clean room for managing dust having a smaller particle size corresponding to these. For this reason, as one of the alternatives to the improvement of cleanliness in a clean room, a cassette with a built-in substrate is housed in an openable and closed container whose inside is kept clean,
A standard mechanical interface, that is, a so-called SMIF system, which enables clean transfer of substrates by providing each container with an opening / closing means for the container has been proposed.

[0003] For example, consider the SMIF for reticle carry-in / out in a semiconductor exposure apparatus, as shown in FIGS. 6 and 7. That is, this semiconductor exposure apparatus
Opening / lowering means 103 (hereinafter abbreviated as SMIF indexer) for opening and closing the SMIF pod 102 and pulling out the stored reticle carrier (cassette) 103a from the pod 102, and a cassette 102a drawn into the semiconductor exposure apparatus 101 by the SMIF indexer 103 Having a fork-shaped hand 104 for holding a reticle for taking out a reticle 102b from the cassette 102, and a transport means 105 for moving the hand 104 forward and backward with respect to the cassette 102a, ascending and descending, and transporting it to a pre-alignment stage (not shown). Becomes Then, contamination of the reticle 102b carried by the carrying means 105 and reticle 102b
Considering the replacement time of the reticle 102b, the height when the reticle 102b is taken out from the cassette 102a is made substantially equal to the height at which the reticle 102b is transported to the pre-alignment stage.
The transport path should be kept to a minimum. In order to do so, the pod mounting surface of the SMIF indexer 103 is arranged slightly above the reticle transport surface. Moreover, the reticle transport height is 1600 mm or more from the floor because it is near the reticle stage height of the exposure apparatus.

[0004]

However, since the pod mounting surface is high in the above arrangement, the guided unmanned transport vehicle (hereinafter referred to as A) traveling on the pod exchange or the floor by the operator.
It is difficult to supply and collect pods by using a GV (abbreviated as GV), and it is necessary to use an AGV running on a track suspended from the ceiling of a clean room, which increases equipment cost and increases layout restrictions.

On the other hand, when the position of the indexer is set at a height of 800 to 1000 mm from the floor surface in order to cope with the pod exchange and the floor traveling AGV by the operator, the reticle is transported in a clean environment in the semiconductor manufacturing apparatus. The distance between the reticle and the reticle may be greatly increased, and dust from the transport mechanism may contaminate the clean environment and the reticle. It is necessary to re-convey in a cassette with a lid, or to combine each drive unit with a swivel arm to suppress dust generation. Further, when a plurality of reticles are stored in the pod, there is a disadvantage that the time required for reticle replacement is increased.

Accordingly, an object of the present invention is to provide means for minimizing contamination and replacement time of stored items in a semiconductor manufacturing apparatus compatible with the SMIF system, and enabling replacement of pods by an operator or a floor AGV. It is in.

[0007]

In order to achieve the above object, according to the present invention, the height of the semiconductor manufacturing apparatus when the SMIF pod opening / closing door is opened and the substrate stored therein is taken out is substantially equal to the reticle transport height. And a mounting table for loading and unloading the pod at a height suitable for loading and unloading the pod, for example, at a height of about 900 mm from the floor.
A transport unit for transporting the pod between the indexer and the mounting table is provided.

[0008]

According to this, since the position of the SMIF indexer is set so that the height when the reticle is taken out from the pod substantially coincides with the reticle carrying surface, a path for carrying the reticle taken out of the pod to the pre-alignment stage. Reticle replacement time can be minimized, and contamination of the reticle during transportation can be minimized. Further, since the pod loading / unloading position is provided separately from the indexer, the height can be set to an arbitrary height, for example, 900 mm.
It is possible to be close to it, and it is easy for the operator to respond to pod exchange and floor traveling AGV. Furthermore, since the pod transport path is covered with a cover and the inside is evacuated, the pod transport mechanism can be separated from the clean environment or clean room environment in the semiconductor manufacturing equipment.
The system can be manufactured at low cost.

[0009]

FIG. 1 is a bird's-eye view of an entire semiconductor exposure apparatus according to one embodiment of the present invention. A reticle SMIF indexer 2 is located above the front left side of the exposure apparatus chamber 1, and its pod mounting surface is set higher than the reticle conveyance height by a predetermined amount. On the other hand, on the front left side of the chamber 1, a pod mounting table 3 and a mounting table elevating means 4 for raising and lowering the mounting table 3 from near the height of 800 mm above the floor to near the pod mounting surface of the indexer 2 Are arranged. A robot hand 5 for holding a handling member formed on the pod 2a and a vertical moving means 6 for vertically and horizontally moving the hand 5 are provided above the indexer 2 and the mounting table raising / lowering means 4. . Note that the robot hand 5 and the vertical moving means 6 are constituted by known mechanisms, for example, a pulse motor, a ball screw, a linear guide and the like. The transport area of the mechanism and the pod is covered with a cover 7 and is separated from both the clean environment in the exposure apparatus and the environment in the clean room, and is exhausted by exhaust means (not shown). The two environments are not contaminated. 7
Reference numeral a denotes a door provided on the cover 7 for loading and unloading the pod 2a with respect to the mounting table 3.

Next, the configuration around the pod mounting table 3 at the pod 2a loading / unloading height will be described with reference to the plan view of FIG. 2 and the sectional view of FIG. Eight guide pins 9 for roughly guiding the outer shape of the pod 2a on the pod mounting table 3, and three positioning pins 8 for fitting the positioning holes provided on the bottom surface of the pod 2a to determine the position of the pod, and the pod A first presence / absence detection sensor 10 is provided to detect when the 2a is placed at a regular position. The first presence / absence detection sensor 10 includes a leaf spring 1 having one end fixed to the back surface of the mounting table 3.
The pin 10a urged upward by 0b is pressed down by the bottom surface of the pod 2a, and the light-shielding portion provided at the other end of the leaf spring 10b shields the photo-interrupter 10c, thereby detecting that the pod is placed at the proper position. It has become. On the other hand, the pod mounting table 3 is fixed on the lifting table 4a of the mounting table lifting means 4, and the transmission type sensor detects whether the pod 2a is on the mounting table 3 on the lifting table 4a. Sensor 12 (12a, 12a)
b) is attached. These two presence / absence sensors 10 and 12 enable detection of a pod that is not at a regular position.

Further, an ID provided on the pod 2a at the pod loading / unloading height is provided on the base portion of the mounting table elevating means 4.
An ID reading unit 11 that communicates with the communication unit 13 and reads ID information is attached.

A door 7a is provided at the pod loading / unloading height of the cover 7 for loading / unloading the pod 2a into / from the loading table 3, and the loading table 3 is placed at the loading height (lower position) by a lock mechanism (not shown). The door 7a does not open when the door is not in the position.

Next, the operation of the pod when loading and unloading will be described with reference to the flowcharts of FIGS.
The loading operation is performed when the operator places the pod 2 on the pod mounting table 3.
is set, the pod placement unit door 7a is closed, and a load switch (not shown) above the door 7a is pressed to start the operation. Referring to FIG. 4, first, on the indexer 2 or the pod transport robot 5 to be loaded as a confirmation as to whether the set pod 2a is in a transportable state.
Confirm that another pod does not already exist on the proximity sensor or software (not shown). Here, if another pod is present on the indexer 2 or the pod transport robot 5, an alarm 1 is issued to inform the operator that the next pod cannot be loaded unless the existing pod is unloaded. Stop the operation. On the other hand, if it is confirmed that the pod 2a can be loaded, it is confirmed by the first presence / absence sensor 10 that the pod 2a is set at the proper position. If NG, an alarm 2 is issued in the same manner as described above. The ID is read by the ID reading means 11. Here, the read ID is compared with the ID set in the manufacturing apparatus in advance to confirm that the pod is to be loaded. If the wrong pod is set, an alarm 3 is issued and the loading operation is stopped.

When all the above confirmations are OK, the actual transport operation is started. First, to prevent danger, the pod mounting portion door 7a is locked so as not to be opened, and then the mounting table 3 is moved to the upper position by the lifting / lowering means 4. Next, the robot hand 5 is lowered to the pod holding height by the hand lifting / lowering horizontal moving means 6 while the robot hand 5 is opened, and the robot hand 5 is closed to hold the pod 2 a on the mounting table 3. After confirming that the pod 2a has been gripped normally, the robot hand 5 is raised and moved to a position above the indexer 2. Then, the robot hand 5 is lowered, and when the pod 2a is placed on the indexer 2, the robot hand 5 is opened and the pod 2a is opened.
To release. Here, after confirming that the pod 2a has been normally placed on the indexer 2, the robot hand 5 is raised and moved upward of the pod placement table 3. Then, the indexer 2 grips the pod 2a, releases the lock of the pod bottom cover, and pulls out the cassette 102a in the pod 2a into the manufacturing apparatus to complete the loading operation, as shown in FIG. Thereafter, the known reticle transport means 10 as described in the conventional example is used.
4 and 105, the reticle 102 in the cassette 102a.
b may be transferred to the pre-alignment stage.

Similarly, the unload operation is started when the operator presses an unload switch near the load switch. Referring to FIG. 5, it is firstly shown that a pod 2a to be unloaded is on the indexer 2 and that there is no other pod on the pod transport robot 5 and the pod mounting table 3 that prevents unloading. It is confirmed by a sensor or software, and is confirmed by the second presence / absence sensor 12. If any of them becomes NG, the corresponding alarms 4 and 5 are issued, and the unload operation is stopped.

When all the above confirmations are OK, the actual transport operation is started. First, after locking the pod mounting door 7a, the pod mounting table 3 is moved to the upper position by the lifting / lowering means 4. Next, it is confirmed that all the reticles 102b taken out of the cassette 102a in FIG.
If there is 02b, it is stored in the cassette 102a by the reticle transport means 104 and 105. All reticles 10
2b is stored in the cassette 102 by the indexer 2.
a in the pod 2a, lock the bottom cover,
Release the constraint. Then, the robot hand 5 is lowered from the position above the indexer 2 to the pod gripping height while the robot hand 5 is open, and the robot hand 5 is closed and the indexer 2 is closed.
Hold the upper pod 2a. After confirming that the pod 2a has been gripped normally, the robot hand 5 is raised and moved above the mounting table 3. Then, after lowering again, the first presence / absence sensor 10 confirms that the pod 2a has been properly placed on the pod mounting table 3, then the robot hand 5 is opened to release the pod 2a, and the robot hand 5 is Move upward. When the movement of the robot hand 5 is completed, the pod mounting table 3 is moved from the upper position to the lower position, the lock of the pod mounting section door 7a is released, and the unload operation is completed.

The loading and unloading operations in the case where the pod 2a is supplied and recovered by the operator are described above. In the above description, the pod mounting door 7a and the load / unload switch are replaced with known wireless communication means and positioning marks. , The supply and collection of the pod 2a by the floor traveling AGV can be performed.

Further, in this embodiment, the pod is transported to one SMIF indexer. However, if the vertical stroke of the hand lifting / lowering horizontal moving means 6 is set larger than the overall height of the pod 2a, the pod can be transported to a plurality of SMIF indexers. It goes without saying that it may be conveyed to a plurality of exposure apparatuses. Further, the pod mounting table and the lifting / lowering means have a separate structure from the exposure apparatus, but may have an integral structure with the exposure apparatus.

[0019]

[Embodiment of Device Production Method] Next, an embodiment of a device production method using the above-described exposure apparatus or exposure method will be described. FIG. 8 shows a micro device (a semiconductor chip such as an IC or an LSI, a liquid crystal panel, a CCD, a thin film magnetic head,
2 shows a flow of manufacturing a micromachine or the like. Step 1
In (Circuit Design), a device pattern is designed. Step 2 is a process for making a mask on the basis of the designed pattern. Step 3 (wafer manufacturing)
Then, a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is called a pre-process,
An actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). including. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 9 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 15
In (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the exposure apparatus having the above-described pod carrier to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

By using the production method of this embodiment, a highly integrated device, which was conventionally difficult to produce, can be produced at low cost.

[0022]

As described above, according to the present invention, the SMIF
Since the height of the indexer at the time of removing the reticle from the pod is almost the same as the reticle transport surface, the path for transporting the reticle extracted from the pod to the pre-alignment stage is the shortest, and the reticle exchange time is the shortest. And the contamination of the reticle during transportation can be minimized. Further, since the pod loading / unloading position is provided separately from the indexer, the height can be set to a desired height. Therefore, for example, a height of 900
If the distance is in the vicinity of mm, it is easy for the operator to respond to pod exchange and floor traveling AGV. Furthermore, since the pod transport path is covered with a cover and the inside is evacuated, the pod transport mechanism can be separated from the clean environment or clean room environment. Become.

[Brief description of the drawings]

FIG. 1 is a bird's-eye view of an entire semiconductor exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the apparatus of FIG.

FIG. 3 is a sectional view of the apparatus of FIG. 1;

FIG. 4 is a flowchart showing an operation at the time of pod loading in the apparatus of FIG. 1;

FIG. 5 is a flowchart showing an operation at the time of pod unloading in the apparatus of FIG. 1;

FIG. 6 is a bird's-eye view of the entire conventional semiconductor exposure apparatus.

FIG. 7 is an enlarged sectional view of a main part of the apparatus of FIG. 6;

FIG. 8 is a diagram showing a flow of manufacturing a micro device.

FIG. 9 is a diagram showing a detailed flow of a wafer process in FIG. 8;

[Explanation of symbols]

1: exposure apparatus chamber, 2: reticle SMIF indexer, 2a: pod, 3: pod mounting table, 4: mounting table elevating means, 5: robot hand, 6: elevating horizontal moving means,
7: Cover, 7a: Pod placement door, 8: Positioning pin, 9: Guide pin, 10: First presence / absence detection sensor, 1
0a: pin, 10b: leaf spring, 10c: photo interrupter, 11: ID reading means, 12 (12a, 12
b): second presence / absence detection sensor, 101: exposure apparatus chamber, 102: pod, 102a: cassette, 102b:
Reticle, 103: SMIF indexer, 104: hand, 105: transport means.

Claims (9)

[Claims] An openable and substantially closed storage container for keeping at least one substrate and a cassette containing the substrate clean, and at least one storage container opening / closing means for opening and closing the storage container. A mounting table at a position different from the opening / closing means for carrying the storage container in and out of the manufacturing apparatus; and a loading / unloading position of the mounting table and opening / closing of the opening / closing means. And a transport means for transporting the storage container between positions. 2. The semiconductor manufacturing apparatus according to claim 1, wherein the storage container loading / unloading position of the mounting table is lower than the opening / closing position of the opening / closing means. 3. The lifting means for raising and lowering the mounting table from the container loading / unloading height to near the storage container opening / closing height, and the mounting table or the storage container near the storage container opening / closing height. A hand for gripping the storage container placed on the opening and closing means, a hand elevating means for elevating the hand, and a horizontal moving means for horizontally moving the elevating means between the mounting table and the storage container opening and closing means. 2. The semiconductor manufacturing apparatus according to claim 1, comprising: 4. The mounting table according to claim 1, further comprising a plurality of presence / absence sensors for detecting that the storage container is mounted, wherein one of the sensors is activated only when the storage container is at a proper position. 2. The semiconductor manufacturing apparatus according to claim 1, wherein: 5. The storage container has a bar code or a communication unit from which an ID can be read, and the ID is set when at least the storage container is placed on the mounting table at the container loading / unloading position. 2. The semiconductor manufacturing apparatus according to claim 1, further comprising information reading means capable of reading the data. 6. The semiconductor manufacturing apparatus according to claim 1, wherein an environment in the semiconductor manufacturing apparatus and an environment in a transfer space of the storage container are substantially separated. 7. The semiconductor manufacturing apparatus according to claim 1, wherein the substrate stored in the storage container and carried into and out of the semiconductor manufacturing apparatus is a reticle. 8. The semiconductor manufacturing apparatus according to claim 1, wherein a transfer space of the storage container is covered with a cover, and exhaust means for exhausting the inside of the transfer space is provided. 9. A semiconductor device manufactured by using the semiconductor exposure apparatus according to claim 1. Description: