JP2000188316A - Method and device for conveyance and manufacture of semiconductor device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To automate the factory as a whole by automating the replacement and conveyance of carrier containers. SOLUTION: This device comprises a reloading part 4, where a semiconductor 1 is reloaded between FOUPs(front opening unified pot) 2 which can contain the semiconductor wafer 1, a stocker 5 which can store FOUPs 2, and a crane 7 which moves the FOUPs 2 between the reloading part 4 and stocker 5 and the reloading part 4, where the semiconductor wafer 1 is reloaded from one FOUP 2 to another FOUP 2 and the stocker 5 which store the FOUPs 2 are united to automate the arrangement of the FOUPs 2, when the semiconductor 1 is reloaded and the movement of the FOUPs 2 after the reloading.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing technique, and more particularly to a technique effective when applied to transfer of a large semiconductor wafer between transfer containers.

[0002]

2. Description of the Related Art The technology described below studies the present invention,
Upon completion, they were examined by the inventor, and the outline is as follows.

[0003] In a semiconductor factory for performing various processes on a next-generation semiconductor wafer having a diameter of 300 mm, automation is considered to be an essential technology for transporting (including transfer) the semiconductor wafer.

In consideration of the flow of processing of semiconductor wafers in a semiconductor factory, a FOUP (Front Opening Unified) in which a semiconductor wafer purchased from a crystal maker is used in each processing step from a transport container called a shipping box.
Pod), the process of transferring to a transfer container,
There is a step of transferring the semiconductor wafer from the OUP to the cleaned FOUP.

Therefore, in the case of a semiconductor wafer having a diameter of 200 mm, when the semiconductor wafer is transferred between the transfer containers,
The transfer device is installed alone in the clean room, and the transfer container is placed on the loader of the transfer device at the time of transfer,
The operator moves the transport container after the transfer.

At this time, the operator first places the transport container on the loader of the transfer device, and then starts the transfer operation.

Here, the transfer unit such as a transfer robot automatically transfers the semiconductor wafer from one transfer container to the other transfer container.

After the transfer is completed, the transfer container housing the semiconductor wafer is transferred to the next step, where a predetermined process is performed on the semiconductor wafer.

It is to be noted that the diameter is 300 m in a semiconductor factory.
m, for example, press technology published by Press Journal December 20, 1997,
"Monthly Semiconductor World 19
January 1998, pp. 131-155.

[0010]

However, the transfer (transfer) of a semiconductor wafer having a diameter of 200 mm according to the technique described above.
In this case, since a worker is interposed, when the worker is absent, there is a problem that processing stops there.

[0011] In addition, since the transport container for accommodating a semiconductor wafer having a diameter of 300 mm is heavy, there is a problem in terms of work safety if an operator is interposed.

Therefore, the transfer of the semiconductor wafer between the transfer containers and the transfer of the transfer container before and after the transfer must be automated.

An object of the present invention is to provide a transfer method and apparatus for automating the entire factory by exchanging and transferring transfer containers, and a method of manufacturing a semiconductor device using the same.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0015]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, in the transport method of the present invention, a transport container stored in a storage unit is moved to a transfer unit, and the transport container is automatically arranged on a loader provided in the transfer unit; A step of transferring the object to be processed by the transfer means between transfer containers, and a step of automatically moving the transfer container from the loader to the storage unit after the transfer of the object to be processed. .

Further, the transfer device of the present invention includes a transfer unit for transferring the object to be processed between the transfer containers capable of storing the object to be processed, and a storage unit capable of storing a plurality of the transfer containers. Transport container moving means for moving the transport container between the transfer unit and the storage unit, wherein the transfer container is disposed at the time of transfer of the workpiece and the transfer container after the transfer. Is automatically performed.

This makes it possible to automate the transfer of an object to be processed between the transfer containers and the transfer of the transfer container from the storage unit, and to provide the storage unit with a buffer function for the transfer container. Further, by having the transfer unit and the storage unit, it is possible to provide a transfer device in which both are integrated.

As a result, it is possible to efficiently transfer the object to be transferred between the transfer containers in terms of investment, space, and operation.

Further, a method of manufacturing a semiconductor device according to the present invention
A step of preparing a transfer device having a storage unit for storing a transfer container capable of storing a semiconductor wafer to be processed, and a transfer unit in which the transfer of the semiconductor wafer is performed between the transfer containers; In the transfer device, a step of moving the transfer container in the storage unit to the transfer unit and automatically arranging the transfer container on a loader provided in the transfer unit; and the transfer unit between the transfer containers. The step of transferring the semiconductor wafer by, and the step of automatically moving the transfer container from the loader to the storage unit after the transfer of the semiconductor wafer, and transferring the transfer container containing the semiconductor wafer to the transfer device. Moving the wafer from the storage unit to the wafer processing apparatus, performing a desired process on the semiconductor wafer by the wafer processing apparatus, And the processing unit takes out the semiconductor wafer, and a step of assembling the semiconductor device using the processed of the semiconductor wafer.

[0021]

Embodiments of the present invention will be described below in detail with reference to the drawings.

1 and 2 are plan views showing an embodiment of the structure of the transfer device according to the present invention. FIG. 3 is a partial configuration diagram showing an example of the structure of a clean room in which the transfer device of the present invention is installed. 4 is an enlarged partial plan view showing the structure of a portion A of the clean room shown in FIG. 3, FIG. 5 is a perspective view showing the structure of a shipping box which is an example of a transfer container used in the transfer device of the present invention, and FIG. FIG. 7 is a perspective view showing a structure of a FOUP which is an example of a transfer container used in the transfer device of the present invention. FIG. 7 is a perspective view showing a structure of an open cassette which is an example of a transfer container used in the transfer device of the present invention. It is a partial perspective view showing an example of the structure of the automatic guided vehicle used in the manufacturing method of the semiconductor device of the present invention, and (a) is AG.
V, (b) is RGV, (c) is OHS, FIG. 9 is a side view showing an example of the structure of a transfer robot as transfer means provided in the transfer unit of the transfer device of the present invention, and FIG. a),
FIG. 11B is a cross-sectional view of an essential part showing an example of a method for manufacturing a semiconductor device using the transfer device of the present invention, and FIGS. 11A, 11B, and 11C.
FIG. 12 is a cross-sectional view of an essential part showing an example of a method for manufacturing a semiconductor device using the transfer device of the present invention. FIG. It is a perspective view.

The transfer apparatus according to the present embodiment is installed in a clean room 3 shown in FIG. 3, and is provided between transfer containers capable of storing a semiconductor wafer 1 (object to be processed) in a semiconductor manufacturing line, particularly, in a semiconductor pre-process line. The transfer station 100 has a function of automatically transferring the semiconductor wafer 1 and a function of storing the transfer container.

In this embodiment, the semiconductor wafer 1
Is described as having a large size of 300 mm in diameter, however, the size of the semiconductor wafer 1 is not limited to this, and may be 200 mm in diameter, or any other size. You may.

First, the basic structure of the transfer apparatus according to the present embodiment will be described with reference to the transfer apparatus shown in FIG. 1. Transfer of the semiconductor wafer 1 between transfer containers capable of storing the semiconductor wafer 1 (workpiece). Transfer unit 4 where the transfer is performed
And a stocker 5 which is a storage unit capable of storing a plurality of the transport containers, and a crane 7 (transport container moving means) for moving the transport containers between the transfer unit 4 and the stockers 5
The arrangement of the transfer container at the time of transfer of the semiconductor wafer 1 and the movement of the transfer container after the transfer are automatically performed.

That is, the transfer device shown in FIG. 1, which is the transfer station 100, integrates a transfer unit 4 for transferring the semiconductor wafer 1 from a transfer container to another transfer container and a stocker 5 for storing the transfer container. It was made.

The transfer device shown in FIG.
This shows a case where the semiconductor wafers 1 are transferred between carrier cassettes called (transport containers).

The transfer unit 4 of the transfer device shown in FIG.
A transfer robot 6 (transfer means) for transferring the semiconductor wafer 1 between the FOUPs 2, a loader 8 for disposing the FOUP 2 at set positions on both sides of the transfer robot 6, and a transfer for the semiconductor wafer 1 and the FOUP 2 An ID reader 11 (identification information recognition means) for recognizing IDs as front and rear identification information is provided.

The ID reader 11 is for recognizing an ID attached to a transfer container such as the semiconductor wafer 1 or the FOUP 2 by image processing or the like, but is not necessarily provided. ,
Any one of I of the semiconductor wafer 1 and the FOUP 2
It may read D.

The transfer section 4 is provided with a transfer robot 6 as transfer means shown in FIG.

The transfer robot 6 includes a main body 6a, an arm 6b rotatably connected to the main body 6a in a horizontal direction,
A hand unit 6c for mounting and supporting the semiconductor wafer 1; and taking out the semiconductor wafer 1 from one FOUP 2 with the semiconductor wafer 1 mounted on the hand unit 6c, and then removing the other FOUP 2
It is a thing to transfer.

The transfer means for transferring the object to be processed (semiconductor wafer 1) may be any means capable of transferring the object to be processed from one transfer container to another transfer container. Other structures other than the above may be used.

The stocker 5 has a multi-stage shelf structure, and has a structure in which a plurality of transport containers such as FOUPs 2 can be stored in a multi-stage manner.

Further, as shown in FIG. 1, the stocker 5 is provided with a crane 7 for taking out the FOUP 2 placed on the shelf and transferring it to the loader 8 of the transfer unit 4 when the semiconductor wafer 1 is transferred. ing.

The crane 7 has a handling mechanism capable of gripping a transport container such as the FOUP 2, and is capable of moving up and down and moving horizontally in correspondence with a multi-stage shelf.

It is to be noted that another dedicated robot for movement is installed in the stocker 5 separately from the crane 7, and the FOUP 2 or the like is transferred from the stocker 5 (the fixed shelf position) to the transfer unit 4 using the dedicated robot for movement. May be transported.

The stocker 5 is provided with opening / closing windows 5a, 5b, 5c which can be freely opened and closed.
Is a window through which the transfer container is inserted and removed when the transfer container is transferred between bays (processes), and the loading / unloading window 5b is a window through which the transfer container is inserted and removed when the transfer container is transferred within the bay.
The loading / unloading window 5c is a window through which the operator takes in and out the transport container for the purpose of cleaning the transport container and the like.

However, each loading / unloading window 5a, 5b,
5c is also capable of loading and unloading the transport container for other purposes.

Next, a schematic structure in the clean room 3 of the semiconductor factory shown in FIG. 3 where the transfer station 100 is installed will be described.

The clean room 3 shown in FIG. 3 is an example of various clean rooms 3 in which the transfer station 100 as the transfer device of the present embodiment is installed in the bay and in the wafer loading chamber 17. .

In the semiconductor factory, the wafer processing apparatus 10 is collectively installed for each process (bay), and the process is progressed by complicatedly moving between the bays. At this time, the transport mode of the transport container can be divided into two modes, an inter-bay transport that connects bays, and an intra-bay transport that transports the transport container to the wafer processing apparatus 10 in the bay.

Here, the transfer container and the automatic transfer vehicle used in the clean room 3 will be described.

The transfer container shown in FIG. 5 is a FOSB (Front
A shipping box 13 called an Opening Shipping Box, which is a type of case capable of accommodating, for example, about 25 semiconductor wafers 1 in a closed state.

The shipping box 13 mainly includes
The semiconductor wafer 1 is used as a transfer container for the semiconductor wafer 1 when the semiconductor wafer 1 is carried in from a crystal maker.

The shipping box 13 comprises a main body 13a and a door 13b which is an opening / closing door. The main body 13a has a robot hand section for handling of a handling mechanism of the automatic transport vehicle shown in FIG. 1
3c and a bottom rail 13e are provided, and further, a manual hand unit 13d for handling an operator is provided.

The door 1 of the shipping box 13
The opening and closing of 3b is manually performed by an operator.

The transfer container shown in FIG. 6 is a FOUP 2 and, like the shipping box 13, the semiconductor wafer 1.
Is a kind of case capable of accommodating, for example, about 25 sheets in a sealed state.

The FOUP 2 is mainly used as a transfer container for performing a desired process on the semiconductor wafer 1 in a process before the semiconductor wafer 1.

The FOUP 2 comprises a main body 2a and a door 2b which is an opening / closing door.
Is provided with a robot hand section 2c, a bottom rail 2e, a side rail 2f, and the like for handling of the handling mechanism of the automatic transport vehicle, and a manual hand section 2d for handling an operator. .

A lock notch 2g and a positioning notch 2h for automatically opening and closing the door 2b are formed on the surface of the door 2b of the FOUP 2.

Therefore, the opening / closing operation of the door portion 2b of the FOUP 2 is automatically performed in connection with the door opening / closing mechanism of the wafer processing apparatus 10 shown in FIG.

The transport container shown in FIG. 7 is an open cassette 14 and is a kind of case capable of accommodating, for example, about 25 semiconductor wafers 1 like the shipping box 13.

However, the open cassette 14 stores the semiconductor wafer 1 in an open state.

The open cassette 14 is mainly used in an atmosphere in which a high degree of cleanliness is required. An opening 14b for carrying in / out the semiconductor wafer 1 is formed at one end of the main body 14a. ing.

Next, the automatic carrier shown in FIG.
It is called an AGV (Auto-matic Guided Vehicle) 12 and runs on a guide tape 12 a formed on the floor of the clean room 3.

The automatic guided vehicle shown in FIG.
It is called a (Reil Guided Vehicle) 15 and runs on a guide rail 15a formed on the floor of the clean room 3.

The automatic transport vehicle shown in FIG.
(Over Head Shuttle) 16 is a horse-riding overhead traveling vehicle that travels on a ceiling rail 16 a formed on the ceiling of the clean room 3.

The AGV 12 and the RGV 15 are used in intra-bay transfer shown in FIG. 3, and the OHS 16 is used in inter-bay transfer.

In the transfer in the bay, the OH shown in FIG.
A hanging-type overhead traveling vehicle called T (Overhead Hoist Transfer) 18 may be used. In the OHT 18, a wire for suspension is extended to a loader position of the wafer processing apparatus 10, and the FOUP 2 is placed thereon.

The wafer loading chamber 17 shown in FIG. 2 is a chamber for transferring the semiconductor wafer 1 loaded from the crystal maker and accommodated in the shipping box 13 to the FOUP 2 in the transfer station 100 installed therein. .

That is, this is an example in which the transfer station 100 shown in FIG. 1 is used for loading a wafer into the clean room 3.

Therefore, various transport containers such as the shipping box 13, the FOUP 2, and the open cassette 14 are stored in the stocker 5 of the transfer station 100 in the wafer loading chamber 17.

In the clean room 3 shown in FIG. 3, a transfer station 100 is used for the wafer loading chamber 17 and only the wafer loading chamber 17 is set to a high cleanliness class (for example, class 1). The cleanliness class outside the wafer loading chamber in 3 can be, for example, about 1,000 to 100,000.

FIG. 4 shows bays in the clean room 3 shown in FIG. 3 which require transfer of the semiconductor wafers 1 between transfer containers and bays which do not.

Here, the transfer of the semiconductor wafer 1 is performed, for example, when cleaning the FOUP 2.

That is, in the bay where the transport container such as the FOUP 2 needs to be cleaned, the transfer station 100 is installed as shown in the upper bay in FIG. 4, while as shown in the lower bay in FIG. The semiconductor wafer 1 between the transfer containers
In a bay in which it is not necessary to perform the transfer, only the stocker 5 is installed.

Therefore, the transfer section 4 and the stocker 5
By installing the transfer station 100 in which the transfer station 100 is integrated, the layout in the clean room 3 is not largely changed, and unnecessary capital investment can be suppressed. Further, also for the lower bay shown in FIG. 4, the transfer unit 100 can be provided by attaching the transfer unit 4 to the stocker 5 later, thereby improving the installation efficiency of the equipment at low cost. A flexible clean room 3 can be realized.

Next, a transport method according to the present embodiment will be described with reference to FIGS.

Here, the transfer method will be described as being included in the method of manufacturing the semiconductor device of the present embodiment shown in FIGS.

The method of manufacturing the semiconductor device is described in FIG.
In the present embodiment, a photolithography step in a semiconductor pre-process line is taken as an example, and the semiconductor wafer 1 is used.
Will be described.

FIGS. 10 and 11 show, as an example of a process for performing processing by photolithography, a fine SiO ₂ (silicon dioxide) film 1002 deposited (deposited) on a main surface of a silicon substrate 1001 as a base substrate. This simply shows a case where a contact hole 1002a, which is a hole, is formed.

First, an FOU capable of accommodating the semiconductor wafer 1
Stocker 5 (storage section) for storing transport containers such as P2, shipping box 13 and open cassette 14
A transfer station 100, which is a transfer device, including a transfer unit 4 for transferring the semiconductor wafer 1 between the transfer containers.

In the present embodiment, a case will be described in which the transfer station 100 is installed in the clean room 3 shown in FIG.

First, after delivering a shipping box 13 containing a plurality of semiconductor wafers 1 from a crystal maker,
Unpack the shipping box 13.

Subsequently, the door portion 13b of the shipping box 13 is opened, and the shipping box 13 is placed on a predetermined shelf of the stocker 5 through the loading / unloading window 5b of the stocker 5 of the transfer station 100 shown in FIG.

Thereafter, the semiconductor wafer 1 is transferred from the shipping box 13 to the FOUP 2 (the transfer from the shipping box 13 to the open cassette 14 may be performed, but the transfer to the FOUP 2 will be described here).

At this time, when the start switch for starting the operation is turned on in the transfer station 100 as a transfer device, first, the shipping box 13 containing the semiconductor wafer 1 placed on a predetermined shelf of the stocker 5 is moved to the crane 7.
The shipping box 13 is automatically moved to the transfer unit 4 by the crane 7.

Further, the shipping box 13 containing the semiconductor wafer 1 is arranged on the loader 8 of the transfer section 4.

Similarly, the empty FOUP 2 previously stored on the shelf of the stocker 5 is grasped by the crane 7 and moved to the transfer section 4, where the FOUP 2 is arranged on the loader 8.

Thereafter, the semiconductor wafer 1 is transferred between the transfer containers by the transfer robot 6 shown in FIGS.

That is, the semiconductor wafer 1 is taken out of the shipping box 13 by the transfer robot 6 and transferred to the FOUP 2.

The transfer station 1 of the present embodiment
00, since the ID reader 11 is installed in the transfer unit 4, the FOUP2
When the semiconductor wafer 1 is transferred to the
The ID (identification information) before and after the transfer in the shipping box 13 and the FOUP 2 is recognized.

That is, before the semiconductor wafer 1 is transferred, first, the respective IDs of the shipping box 13 and the FOUP 2 are read. Subsequently, the semiconductor wafer 1 is taken out of the shipping box 13 by the transfer robot 6, and the ID of the taken out semiconductor wafer 1 is read there.

Then, the semiconductor wafer 1 is supported by the transfer robot 6 and transferred to the FOUP 2.

The transfer of the semiconductor wafers 1 is carried out one by one sequentially.

Subsequently, the IDs of the shipping box 13 and the FOUP 2 after the transfer are read again.

The reading of the ID is not always performed, and only the ID of either the transport container or the semiconductor wafer 1 may be read.

The shipping box 13 of the semiconductor wafer 1
After the transfer from the FOUP 2 to the FOUP 2, the shipping box 13 and the FOUP 2 containing the semiconductor wafer 1 are automatically transferred from the loader 8 to the stocker 5 by the crane 7 again.
To a predetermined shelf.

Thereafter, the FOUP 2 accommodating the transferred semiconductor wafer 1 is moved from the stocker 5 of the transfer station 100 to a predetermined wafer processing apparatus 10.

That is, the FOU passes through the loading / unloading window 5a of the stocker 5 and the loading / unloading window 17a of the wafer loading chamber 17.
P2 is placed on an OHS 16 which is an automatic transfer vehicle for transfer between bays arranged outside the wafer loading chamber.
In step S16, the FOUP 2 is transported to the stocker 5 in a predetermined bay (for example, the stocker 5 that is installed at the lower side in FIG. 4 and does not perform transfer), and one end of the FOUP 2 is
Store FOUP2 in

Subsequently, predetermined pre-processing for performing photolithography processing on the semiconductor wafer 1 is performed by the wafer processing apparatus 10.

Thereafter, the subsequent processing is performed on the semiconductor wafer 1 having been subjected to the pre-processing in the bay of the photolithography process.

First, a silicon substrate 10 as a base substrate
An SiO ₂ film 1002 (oxide film) is formed on the substrate 01, and then a resist film 1003 is formed on the SiO ₂ film 1002 to prepare a semiconductor wafer 1 as shown in FIG.

That is, in the photolithography process of this embodiment, as shown in FIG. 10A, an SiO ₂ film 1002 is deposited on the main surface of a silicon substrate 1001, and a resist is further formed on the SiO ₂ film 1002. The semiconductor wafer 1 on which the film 1003 is applied (formed) is prepared.

Subsequently, the FOUP 2 accommodating the plurality of semiconductor wafers 1 is transported in the bay by the AGV 12 (RGV 15).
In some cases), and depending on the required processing, the AGV
12 is moved to a predetermined wafer processing apparatus 10.

First, the AGV 12 is moved to a position in front of the exposure apparatus which is the wafer processing apparatus 10, and the wafer processing apparatus 1
Using 0, the semiconductor wafer 1 is exposed.

The cleanliness class in the wafer processing apparatus 10 is, for example, class 1.

First, an exposure pattern is exposed on the resist film 1003 of the semiconductor wafer 1.

Here, as shown in FIG. 10B, the reticle on which the exposure pattern to be exposed on the semiconductor wafer 1 is formed is irradiated with exposure light 9 so that the exposure pattern is applied to the resist film of the semiconductor wafer 1. Exposure to 1003.

That is, the exposure light 9 is applied to the silicon substrate 1001
An exposure process is performed by irradiating the resist film 1003 on the main surface of the above.

At this time, the resist film 1003 is irradiated with exposure light 9 by passing through the reticle. Here, the exposure light 9 is not irradiated to the opening hole forming region 1003b having the diameter ΔW.

In this embodiment, the resist film 1003 is of a negative type.

Subsequently, after the completion of the exposure, the processed semiconductor wafer 1 is taken out of the wafer processing apparatus 10 and again
Housed in UP2.

Thereafter, the FOUP 2 is placed on the AGV 12 and transported to the front of a developing device, which is another wafer processing device 10, where the resist film 1003 is developed.

At this time, the semiconductor wafer 1 is transferred into the developing device in the same manner as in the case of the exposure device, and the semiconductor wafer 1 is sequentially developed there.

As a result, only the aperture forming region 1003b having a diameter ΔW which has not been irradiated with the exposure light 9 is dissolved in the developing solution and removed, and as shown in FIG. 11A, the aperture 1003a is formed there. You.

Subsequently, an SiO ₂ film 1002 as an oxide film
Is etched.

That is, after the development is completed, the semiconductor wafers 1 are taken out of the developing device and sequentially stored in the FOUP 2, and then the FOUP 2 is transported to the front of the etching device again using the AGV 12.

Thereafter, the semiconductor wafer 1 is transferred into the etching apparatus in the same manner as in the case of the exposure apparatus, and the semiconductor wafer 1 is sequentially etched there.

That is, the resist film 1 shown in FIG.
SiO ₂ film 10 exposed from opening hole 1003a of 003
02 was removed by etching.
As shown in (b), a contact hole 1002a is formed in the SiO ₂ film 1002.

After that, the resist film 1003 is removed by ashing or the like.

That is, after the completion of the etching process, the semiconductor wafer 1 is taken out of the etching apparatus, and the FOUP
2 sequentially, and again using the AGV12 for FOU
Carry P2 to the front of the ashing device.

Thereafter, the semiconductor wafer 1 is transferred into an ashing apparatus in the same manner as in the case of the exposure apparatus, and the semiconductor wafer 1 is sequentially subjected to ashing processing.

As a result, as shown in FIG.
Contact hole 100 having a diameter ΔW as an exposure pattern
SiO ₂ film 1002 having silicon 2a
1 has been formed.

Thereafter, the same exposure method is repeated to form a desired circuit pattern in each chip region of the semiconductor wafer 1, thereby forming a desired semiconductor integrated circuit in each chip region.

When the FOUP 2 accommodating the semiconductor wafer 1 which has completed the predetermined process is cleaned, for example, in the clean room 3 shown in FIG. 3, the transfer station 100 shown in FIG. The FOUP 2 containing the semiconductor wafer 1 to be cleaned by the OHS 16 for transporting between bays is transported to the bay where is installed.

First, the transfer station 100 shown in FIG.
The FOUP 2 is loaded from the loading / unloading window 5a of the stocker 5 and placed on the shelf of the stocker 5.

Thereafter, in the transfer station 100, the semiconductor wafer 1 is transferred from the FOUP 2 to another FOUP 2.

At this time, the start switch for starting the operation is set to O.
When N is set, first, the FOUP 2 containing the semiconductor wafer 1 placed on a predetermined shelf of the stocker 5 is gripped by the crane 7, and the FOUP 2 is automatically moved to the transfer unit 4 by the crane 7.

Further, the FOUP 2 containing the semiconductor wafer 1 is arranged on the loader 8 of the transfer section 4.

Similarly, another FOUP 2 previously stored on the shelf of the stocker 5 is gripped by the crane 7 and moved to the transfer section 4, where the FOUP 2 is arranged on the loader 8.

Thereafter, the semiconductor wafer 1 is transferred between the transfer containers by the transfer robot 6 shown in FIGS.

That is, the FOU is transferred by the transfer robot 6.
Take out the semiconductor wafer 1 from P2 and put it in another FOU
Transfer to P2.

At this time, the ID of the two FOUPs 2 before and after the transfer and the ID of the semiconductor wafer 1 are read by the ID reader 11 in the same manner as the method performed in the wafer loading chamber 17.

Further, the FO that has become empty after the transfer is completed
The UP2 and the FOUP2 containing the semiconductor wafer 1 are automatically transferred from the loader 8 to the stocker 5 by the crane 7 again.
To a predetermined shelf.

Thereafter, the FOUP 2 accommodating the relocated semiconductor wafer 1 is placed on the OHS 16 through the loading / unloading window 5a of the stocker 5 of the transfer station 100. The FOUP 2 is transported to a stocker 5 (for example, a stocker 5 that is installed at the lower side in FIG. 4 and does not perform transfer),
At one end, the FOUP 2 is stored in the stocker 5.

On the other hand, the empty FOUP 2 is taken out from the loading / unloading window 5c of the stocker 5, and is washed by a washing device installed in another area.

Thereafter, the FOUP 2 accommodating the semiconductor wafer 1 having undergone the pre-process is transferred to the post-process area, where the post-process is started.

That is, individual semiconductor chips are obtained from the semiconductor wafer 1 by dicing, and die bonding, wire bonding, sealing, and the like are performed using the semiconductor chips to assemble a desired semiconductor device.

The types of wire bonding and sealing can be changed according to the type of the semiconductor device.

According to the transfer method and apparatus of the present embodiment and the method of manufacturing a semiconductor device using the same, the following operation and effect can be obtained.

That is, when the transfer of the semiconductor wafer 1 is performed, the transfer container such as the FOUP 2 is automatically moved, and the transfer container after the transfer is automatically moved, and the plurality of transfer containers are stored by the stocker 5 (storage unit). Since the semiconductor wafer 1 can be stored, the transfer of the semiconductor wafer 1 can be automated, and the transfer container can have a buffer function before and after the transfer.

That is, the semiconductor wafer 1 between the transfer containers
Transfer and transfer of the transfer container from the stocker 5 can be automated, and the stocker 5 can have a transfer container buffer function.

Further, by having the transfer section 4 and the stocker 5, a transfer station 100 (transporting apparatus) in which both are integrated can be provided.

As a result, it is possible to efficiently transfer the semiconductor wafer 1 between the transfer containers in terms of investment, space, and operation.

In this embodiment, the object to be processed is the semiconductor wafer 1. Therefore, the transfer of the semiconductor wafers 1 between the transfer containers, which is a key point of the physical distribution of the semiconductor pre-process line, can be performed by the transfer unit 4 integrated with the stocker 5, whereby the physical distribution in the semiconductor factory is performed. The transfer can be performed without hindering the transfer.

Further, when the semiconductor wafer 1 is large (for example, 300 mm in diameter) as in the present embodiment, the transfer of the semiconductor wafer 1 can be performed automatically without the intervention of an operator. Safety can be ensured.

In addition, the transfer unit 4 and the stocker 5 are individually designed in the transfer station 100, so that only the stocker 5 in which the transfer container for transferring the semiconductor wafer 1 is stored is stored. Then, it becomes possible to attach the transfer part 4 by retrofitting.

That is, the transfer unit 4 can be attached to only a specific stocker 5.

As a result, it is possible to ensure flexibility in setting the transfer station 100.

In addition, the transport container and the transfer station 100
And the shipping box 13
It is possible to correspond to any combination of transport containers such as ⇔FOUP2, FOUP2⇔FOUP2, and shipping box 13⇔FOUP2.

As a result, it is possible to automatically transfer the semiconductor wafers 1 between various transport containers and transport these transport containers, and as a result, it is possible to automate the entire factory.

As described above, the invention made by the inventor has been specifically described based on the embodiments of the present invention. However, the present invention is not limited to the embodiments of the present invention, and does not depart from the gist of the invention. It is needless to say that various changes can be made.

For example, in the transfer robot 6 described in the embodiment, the semiconductor wafers 1 are transferred one by one, but a plurality of hand parts 6c of the transfer robot 6 shown in FIG. Accordingly, a plurality of semiconductor wafers 1 can be simultaneously and collectively transferred.

As a result, the time spent for the transfer can be greatly reduced, and the efficiency of the transfer operation can be increased.

As the object to be processed, the wafer processing apparatus 1
Using a monitor wafer for checking the state of 0, and using the transfer device of the above-described embodiment, dividing and transferring a plurality of monitor wafers contained in one transfer container to the plurality of transfer containers, or By performing the merger transfer of the plurality of monitor wafers accommodated in the plurality of transfer containers to one transfer container, the plurality of monitor wafers can be divided and accommodated in the other plurality of transfer containers, or Can be accommodated in another transfer container.

Accordingly, the monitor wafer is transferred to the stocker 5
It is possible to transfer the monitor wafers to a desired transport container by a required number of sheets in a short time if necessary.

As a result, the automatic supply of the monitor wafer can be performed, and as a result, the work of checking the state of the wafer processing apparatus 10 can be automated.

Further, the transfer robot 6 in the above-described embodiment may be one that also has the loader 8.

Since the transfer device as the transfer station 100 has both the transfer section 4 and the stocker 5, the objects to be processed in one transfer container can be sorted.

In the above embodiment, the transfer unit 4
Although the description has been given of the case of the transfer device in which the transfer device and the stocker 5 are integrated, the transfer device may be a stocker 5 with a built-in transfer mechanism in which the transfer unit 4 is mounted inside the stocker 5.

Furthermore, the photolithography process has been described as a method of manufacturing a semiconductor device. In the semiconductor manufacturing process, a transfer station 100 (transfer device) is installed to transfer a semiconductor wafer 1 between transfer containers. May be any semiconductor manufacturing process such as a diffusion process or a cleaning process other than the photolithography process.

In the above-described embodiment, the case where the object to be processed is the semiconductor wafer 1 has been described. However, the object to be processed may be, for example, a disk substrate or the like. The transfer station 100 is used in a disk manufacturing line or the like.

[0154]

The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows.

(1). Automated transfer of the processing object because the transfer container can be automatically arranged and transferred after the transfer of the processing object, and the transfer unit can be moved by the storage unit. And a buffer function of the transport container before and after the transfer can be provided.

(2). By having the transfer unit and the storage unit, it is possible to form a transfer device in which both are integrated. As a result, it is possible to efficiently transfer the object to be transferred between the transfer containers in terms of investment, space, and operation.

(3). By performing a divisional transfer of a plurality of monitor wafers for a wafer processing device state check operation to a plurality of transfer containers or a merged transfer of a plurality of monitor wafers contained in a plurality of transfer containers to a single transfer container,
The monitor wafers can be stored in the transfer container of the storage unit, and the required number of monitor wafers can be transferred to the desired transfer container in a short time if necessary. This makes it possible to automate the work of checking the state of the wafer processing apparatus.

(4). Separate design of the transfer unit and the storage unit allows the transfer unit to be attached later only to the storage unit where the transport containers that need to be transferred are stored. become. Thereby, flexibility can be ensured regarding the installation of the transport device.

(5). By standardizing the transport container and transport device, the shipping box @ FOUP, FO
It can correspond to any combination of transport containers such as UP @ FOUP and shipping box @ FOUP.
As a result, the transfer of the object to be processed between the various transport containers and the transport of the transport containers can be performed automatically, and as a result, the entire factory can be automated.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of an embodiment of the structure of a transport device according to the present invention.

FIG. 2 is a plan view showing an example of an embodiment of the structure of the transport device according to the present invention.

FIG. 3 is a partial configuration diagram illustrating an example of a structure of a clean room in which the transfer device of the present invention is installed.

FIG. 4 is an enlarged partial plan view showing a structure of a portion A of the clean room shown in FIG.

FIG. 5 is a perspective view showing a structure of a shipping box as an example of a transport container used in the transport device of the present invention.

FIG. 6 is a perspective view showing a structure of a FOUP which is an example of a transport container used in the transport device of the present invention.

FIG. 7 is a perspective view showing a structure of an open cassette which is an example of a transport container used in the transport device of the present invention.

FIGS. 8A, 8B, and 8C are partial perspective views showing an example of the structure of an automatic guided vehicle used in the method of manufacturing a semiconductor device according to the present invention; FIG. ) Is RGV,
(C) is OHS.

FIG. 9 is a side view showing an example of the structure of a transfer robot which is transfer means provided in a transfer unit of the transfer device of the present invention.

FIGS. 10A and 10B are cross-sectional views of a main part showing an example of a method for manufacturing a semiconductor device using the transfer device of the present invention.

FIGS. 11A, 11B, and 11C are cross-sectional views of essential parts showing an example of a method for manufacturing a semiconductor device using the transfer device of the present invention.

FIG. 12 is a partial perspective view showing the structure of an OHT which is an example of an automatic carrier used in the method of manufacturing a semiconductor device according to the present invention.

[Explanation of symbols]

Reference Signs List 1 semiconductor wafer (object to be processed) 2 FOUP (transport container) 2a main body 2b door 2c robot hand 2d manual hand 2e bottom rail 2f side rail 2g notch for locking 2h notch for positioning 3 clean room 4 transfer unit Reference Signs List 5 Stocker (storage unit) 5a, 5b, 5c Carry-in / out window 6 Transfer robot (transfer unit) 6a Main unit 6b Arm unit 6c Hand unit 7 Crane (transport container moving unit) 8 Loader 9 Exposure light 10 Wafer processing device 11 ID Reader (identification information recognition means) 12 AGV 12a Guide tape 13 Shipping box (transport container) 13a Main unit 13b Door unit 13c Robot hand unit 13d Manual hand unit 13e Bottom rail 14 Open cassette (transport container) 14a Main unit 14b Open Opening 15 RGV 15a Guide rail 16 OHS 16a Ceiling rail 17 Wafer loading chamber 17a Loading / unloading window 18 OHT 100 Transfer station (transportation device) 1001 Silicon substrate 1002 SiO ₂ film 1002a Contact hole 1003 Resist film 1003a Open hole 1003b Open hole forming area

Claims (9)

[Claims] 1. A step of moving a transfer container stored in a storage unit to a transfer unit and automatically arranging the transfer container on a loader provided in the transfer unit; and transferring means between the transfer containers. A transfer method, comprising: transferring an object to be processed according to the following steps; and automatically transferring the transfer container from the loader to the storage unit after the transfer of the object to be processed. 2. The transfer method according to claim 1, wherein a semiconductor wafer is used as the object to be processed, and the semiconductor wafer is transferred between the transfer containers by a transfer robot serving as the transfer means. Transport method. A transfer unit configured to transfer the object between the transfer containers capable of storing the object; a storage unit configured to store a plurality of the transfer containers; the transfer unit; Transport container moving means for moving the transport container to and from a storage unit, wherein the arrangement of the transport container at the time of transfer of the workpiece and the movement of the transport container after the transfer are automatically performed. A conveying device characterized by the above-mentioned. 4. The transfer device according to claim 3, wherein the object to be processed is a semiconductor wafer, and the transfer unit is provided with a transfer robot that transfers the semiconductor wafer between the transfer containers. A transfer device. 5. The transfer device according to claim 4, further comprising identification information recognizing means for recognizing identification information of the semiconductor wafer and / or the transfer container. 6. A transfer apparatus having a storage unit for storing a transfer container capable of storing a semiconductor wafer as an object to be processed and a transfer unit for transferring the semiconductor wafer between the transfer containers is prepared. Moving the transport container of the storage unit to the transfer unit and automatically arranging the transport container on a loader provided in the transfer unit in the transport device; A step of transferring the semiconductor wafer by the transfer means, a step of automatically moving the transfer container from the loader to the storage unit after the transfer of the semiconductor wafer, and the transfer container containing the semiconductor wafer Transferring the semiconductor wafer from the storage unit of the transfer device to the wafer processing device; performing a desired process on the semiconductor wafer by the wafer processing device; Removing the semiconductor wafer from the wafer processing apparatus after completion, and assembling a semiconductor device using the processed semiconductor wafer. 7. The method for manufacturing a semiconductor device according to claim 6, wherein when the semiconductor wafer is transferred between the transfer containers, identification information before and after the transfer in the semiconductor wafer and / or the transfer container. A method for manufacturing a semiconductor device, comprising: 8. The method for manufacturing a semiconductor device according to claim 6, wherein when transferring the semiconductor wafer between the transfer containers, a plurality of the semiconductor wafers stored in the transfer container are transferred simultaneously. A method for manufacturing a semiconductor device, comprising: 9. The method for manufacturing a semiconductor device according to claim 6, wherein the plurality of monitor wafers, which are the plurality of objects to be processed, housed in one transfer container are transferred to the plurality of transfer containers. A method for manufacturing a semiconductor device, comprising performing a divisional transfer or a merger transfer of a plurality of monitor wafers contained in a plurality of the transport containers to one of the transport containers.