KR101187844B1 - Small lot size lithography bays - Google Patents

Abstract

In a first aspect, a small lot size lithography bay is provided. The small lot size lithography bay includes (1) a number of lithography tools; And (2) a small lot size transfer system adapted to deliver a small lot size substrate carrier to the lithography tool. Each small lot size substrate carrier is adapted to hold less than 13 substrates. Various other aspects are provided.

Description

SMALL LOT SIZE LITHOGRAPHY BAYS}

1 is an exemplary graph of semiconductor device manufacturing facility (FAB) cycle time or WIP vs. facility output for large and small lot size substrate carriers.

2 is a schematic representation of an exemplary small lot size (SLS) semiconductor device manufacturing facility provided in accordance with the present invention.

3 is a top plan view of an exemplary small lot sized lithographic bay provided in accordance with the present invention.

4 is a flow chart of an example method of operating the small lot size lithographic bay of FIG.

Brief description of the main symbols in the drawings

300: lithography bay 302: wet cleaning processing tool

304: dry strip processing tool 306-312: measurement and inspection tool

314-328: Patterning Tool

This application claims the priority of US Provisional Patent Application No. 60 / 578,792, filed June 10, 2004. This application is also a CIP claiming priority of US patent application Ser. No. 10 / 764,620, filed January 26, 2004, which claims priority of US provisional application No. 60 / 443,001, filed January 27, 2003. The contents of each of the above applications are referenced herein.

This application is related to the following co-transferred, co-pending US patent applications referred to herein:

US Patent Application No. 10 / 650,310, filed August 28, 2003, entitled "System For Transporting Substrate Carriers" (Attorney Docket No. 6900);

US Patent Application No. 10 / 650,312 filed August 28, 2003, entitled "Method and Apparatus for Using Substrate Carrier Movement to Actuate Substrate Carrier Door opening / Closing" (Attorney Docket No. 6976);

US Patent Application No. 10 / 650,481 filed August 28, 2003, entitled "Method and Apparatus for Unloading Substrate Carriers from Substrate Carrier Transport Systems" (Attorney Docket No. 7024);

US Patent Application No. 10 / 650,479 filed August 28, 2003, entitled "Method and Apparatus for Supplying Substrates to a Processing Tool" (Attorney Docket No. 7096);

US Patent Application No. 60 / 407,452, filed August 31, 2002, entitled "End Effector Having Mechanism For Reorienting A Wafer Carrier Between Vertical And Horizontal Orientations" (Attorney Docket No. 7097 / L);

US Patent Application No. 60 / 407,337, filed August 31, 2002, entitled "Wafer Loading Station with Docking Grippers at Docking Stations" (Attorney Docket No. 7099 / L);

US Patent Application No. 10 / 650,311, filed August 28, 2003, entitled "Substrate Carrier Door Having Door Latching and Substrate Clamping Mechanism" (Attorney Docket No.7156);

US Patent Application No. 10 / 650,480, filed August 28, 2003, entitled "Substrate Carrier Handler That Unloads Substrate Carriers Directly From a Moving Conveyor" (Attorney Docket No.7676);

US Patent Application No. 10 / 764,982, filed Jan. 26, 2004, entitled "Methods and Apparatus for Transporting Substrate Carriers" (Attorney Docket No.7163);

US Patent Application No. 10 / 764,820, filed Jan. 26, 2004, entitled "Overhead Transfer Flange and Support for Suspending Substrate Carrier" (Attorney Docket No.8092);

US Provisional Patent Application No. 60 / 443,115, filed Jan. 27, 2003, entitled "Apparatus and Method for Storing and Loading Wafer Carriers" (Attorney Docket No.8202);

US Patent Application No. 10 / 987,956, filed November 12, 2004, entitled "Calibration of High Speed Loader to Substrate Transport System" (Attorney Docket No.8158); And

US Provisional Patent Application No. 60 / 520,035, filed November 13, 2003, entitled "Apparatus and Method for Transporting Substrate Carriers Between Conveyors" (Attorney Docket No.8195 / L).

FIELD OF THE INVENTION The present invention relates to semiconductor device manufacturing systems, and more particularly to small lot size lithographic bays.

Semiconductor device fabrication typically involves performing sequential steps on substrates such as silicon substrates, glass plates, and the like. These steps include polishing, deposition, etching, photolithography, heat treatment, and the like. Typically, a number of different processing steps can be performed in a single processing system or in a "tool" comprising multiple processing chambers. However, it is common for other processes to need to be performed at different processing locations within a manufacturing facility such that the substrate needs to be transferred from one processing location to another within the manufacturing facility. Depending on the type of semiconductor device being manufactured, a relatively large number of processing steps may be required to be performed at many different processing locations within the manufacturing facility.

It is common to transfer substrates from one processing location to another within a substrate carrier, such as a sealed pod, cassette, container, or the like. In addition, automation of automated guided vehicles, overhead delivery systems, substrate carrier handling robots, and the like, to transfer substrate carriers to or from substrate carrier delivery devices or to move substrate carriers from one location to another within a manufacturing facility. It is common to use substrate carrier delivery devices that have been adapted.

For individual substrates, the entire manufacturing process from forming or receiving pure substrates to cutting semiconductor devices from finished substrates requires elapsed time, measured weekly or monthly. In a typical manufacturing facility, multiple substrates may be present at any given time as "Work in Progress" (WIP). Substrates present in manufacturing facilities as WIPs represent a significant investment of operating capital, which tends to increase manufacturing cost per substrate.

When the manufacturing facility is fully operational, reduced WIP reduces capital and manufacturing costs. For example, WIP reduction can be achieved by reducing the average total elapsed time for processing each substrate in the manufacturing facility.

The US patent application Ser. No. 10 / 650,310, filed August 28, 2003, entitled "System for Transporting Semiconductor Substrate Carriers" (Attorney Docket No. 6900) for substrate carriers that is continuously moving while the manufacturing facility is in operation. Disclosed is a substrate carrier delivery system comprising a conveyor. Continuously moving conveyors facilitate the transfer of substrates within a manufacturing facility to reduce the overall "dwell" or "cycle" time of each substrate in the manufacturing facility. WIP reduction can be achieved as less WIP is required to produce the same factory output.

In one aspect of the invention, (1) storing substrates in a plurality of small lot sized substrate carriers, each adapted to hold less than 13 substrates; And (2) delivering at least one small lot sized substrate carrier into the lithographic bay of the semiconductor device manufacturing facility.

In a second aspect of the invention, a small lot sized lithographic bay is provided. Small lot size lithography bays include (1) a number of lithography tools; And (2) a small lot size transfer system adapted to deliver a small lot size substrate carrier to the lithography tool. Each small lot size substrate carrier is adapted to hold less than 13 substrates. Various other aspects are provided.

Other features and aspects of the present invention will become more apparent from the following detailed description, the appended claims, and the accompanying drawings.

The present invention relates to reducing cycle time in semiconductor device manufacturing facilities, such as lithographic portions (bays) of semiconductor device manufacturing facilities. Cycle time is reduced by using a lot size reduction and / or high speed delivery system to transfer small lot size substrate carriers between the processing, metrology and / or inspection tools of the lithographic bay.

As used herein, a "small lot" size substrate carrier is typically a substrate carrier adapted to hold a significantly smaller number of substrates than conventional "large" size substrate carriers having 13 or 25 substrates. Refers to. In one embodiment, for example, a small lot size substrate carrier is adapted to hold five or fewer substrates. Other small lot size substrate carriers may be used (e.g., 1, 2, 3, 4, 5, 6, 7 or more substrates but small lot size carriers that hold a smaller number of substrates than large lot size substrate carriers). Can be used). For example, in one embodiment, each small lot size substrate carrier may hold too few substrates for the transfer of the substrate carrier to be performed by a human within the semiconductor device manufacturing facility.

Cycle time reduction

In a conventional semiconductor device manufacturing facility, a substrate is typically delivered to a substrate carrier having 25 substrates per carrier. In this case, the manufacturing facility uses lot sizes of 25 substrates.

The cycle time CT for processing the substrate lot can be determined using the following equation:

CT = lot processing time + delivery time + tool wait time

Lot processing time (LPT) is the time required to process each substrate in a lot (eg, 25 substrates for a standard lot size). Lot processing time includes, for example, the time required to transfer each substrate from the substrate carrier to the processing chamber of the processing tool, process the substrate and return the substrate to the substrate carrier. The transfer time TT is the time required for transferring a lot (eg, substrate carrier) from one processing tool to another processing tool (eg, when the substrate carrier is closed in the first tool and open in the second tool). Time between).

Tool wait time (TWT) refers to the amount of time the lot must wait in the processing tool before the substrate in the lot is processed in the tool. Assuming each lot is processed immediately after reaching each processing tool, the tool wait time is zero and the minimum cycle time (CTMIN) is

CTMIN = lot processing time + delivery time.

It can be seen from the above equation that during a fixed transfer time, the cycle time increases with the lot size (because in general each substrate in the lot has to be replaced by all other substrates in the lot before the lot is transferred to the new processing tool). Because you have to wait for it to be processed). Thus, by using a small lot size (eg, a substrate carrier with a few substrates), the cycle time can be reduced unless the transfer time is greatly increased. By using a lot size of one substrate (eg, a substrate carrier with only one substrate carrier) without increasing the transfer time, the cycle time can be minimized and transferred to a new processing tool for the next processing step. This is because there is no need to wait for another substrate to be processed before.

For example, suppose that for 130 nanometer logic, the processing time is two days and the delivery time is two days. Also, for this example, for a 25 substrate lot size, assume that each substrate has 10 days to wait for another substrate in the lot to be processed. The minimum cycle time for 25 substrate lots (CTMIN25) is

CTMIN25 = Processing Time + Lot Wait Time + Delivery Time

= 2 days + 10 days + 2 days

       = 14 days.

However, assuming a single substrate lot size is used and the transfer time is fixed, the minimum cycle time (CTMIN1) for one substrate is

CTMIN1 = Processing Time + Lot Wait Time + Delivery Time

= 2 days + 0 days + 2 days

       = 4 days.

Thus, by using a single substrate lot size, the minimum cycle time is reduced by 73%.

From a cycle time point of view, it may seem desirable to use a single substrate carrier. However, the use of more than one substrate lot size may be desirable for other issues such as providing sufficient storage in each processing tool, scheduling lot, processing control strategy, and the like. For example, it may be desirable to use small lot sizes with two, three, four, five, six, or more substrates. Note that the use of such small lot sizes provides a significant reduction in cycle time compared to conventional large lot sizes.

Cycle time and its influence on manufacturing facilities are described below with reference to FIGS. 1 and 2. In particular, FIGS. 1 and 2 illustrate the management of work in progress and cycle time through the use of hot lots. Cycle time adjustment in a small lot size lithography bay is described below with reference to FIGS. 3 and 4.

Cycle time vs. WIP at manufacturing facility

As described, for a fully operational manufacturing facility, WIP reduction reduces capital and manufacturing costs. However, reduced WIP may endanger semiconductor device manufacturing facilities. For example, if a processing tool on a manufacturing line becomes inactive (for example, a "suspension" due to periods of equipment failure, periodic maintenance or cleaning, etc.), WIP will allow the tool in the inactive state to remain in operation. Sufficient substrate buffering may be provided to allow continuous plant output until (eg, "restart"). On the other hand, insufficient WIP can idle the manufacturing line.

In general, when the average cycle time per substrate is reduced in a semiconductor device manufacturing facility, the corresponding decrease in WIP (eg, similarly, proportionally or otherwise) generally results in more substrates. It can be implemented as it moves through the facility. In accordance with at least one embodiment of the present invention, the average cycle time per substrate can be maintained approximately constant by decreasing the cycle time of the higher priority substrate while increasing the cycle time of the lower priority substrate. (Note that low priority substrates and high substrates may be distributed over a range of priority values, such as priority 1 through priority 100, or some other suitable priority range). In this way, the relationship between the cycle time of the high priority substrate and the WIP may be separated such that the cycle time reduction in the high priority substrate does not yield a corresponding decrease in WIP in the semiconductor device manufacturing facility using the present invention. May be reduced (eg, reduced or erased).

In order to reduce the average cycle time according to the invention, a "small lot" size substrate carrier is used with a high speed substrate carrier delivery system. The high speed substrate carrier delivery system can deliver substrate carriers within a semiconductor device manufacturing facility at a considerably faster rate than conventional delivery systems (described below). Thus, any given substrate carrier can be routed through the facility more quickly.

Use of small lot sizes during the manufacture of semiconductor devices

1 is an exemplary graph of semiconductor device manufacturing facility (FAB) cycle time or WIP versus facility output for large and small lot size substrate carriers. Referring to FIG. 1, curve 100 represents the cycle time or WIP versus facility output for a typical semiconductor device manufacturing facility configured to deliver large lot sized substrate carriers. Curve 102 represents the cycle time or WIP versus facility output for a semiconductor device manufacturing facility configured to deliver small lot size substrate carriers in accordance with the present invention.

Curve 100 shows how facility output increases with WIP. As WIP continues to increase, plant output also increases. As a result, large WIP increases are required for relatively small output gains. Thus, to provide facility output estimates, large lot sized equipments typically operate near the bend of curve 100 (as represented by 104). At this location, the plant output is near the maximum and a small increase or decrease in cycle time or WIP has little effect on the plant output.

Curve 102 shows how the use of a small lot size substrate carrier with a high speed substrate carrier delivery system (described below) affects the WIP and / or facility output. For example, as shown in FIG. 1, curve 102 moves down and to the right relative to curve 100. This shift indicates that the same level of facility output can be maintained with less WIP (see 106). Optionally, if the same level of WIP as present in the large lot size facility controlled by curve 100 is desired in the small lot size facility, the output in the small lot size facility will increase (see 108). In at least an embodiment of the invention, the factory output is increased through a slight decrease in WIP as shown for example 110. Other operating points along curve 102 may also be used.

Selection of the "optimal" operating point on curve 102 depends on various factors. For example, some products have long product life cycles and relatively stable values (eg, devices for embedded applications such as devices used in industrial equipment or other long product life applications). The devices used in these products can be manufactured for sale and stored as inventory in the near future with little financial risk. Substrates for such devices are classified as low priority and used to fill the capacity of manufacturing facilities. As inventory is depleted, the priority of these substrates will increase as required to meet the associated business arrangements (eg, lead time, stocking levels, etc.).

 Substrates for devices used as general-purpose products, such as DRAM, which have been on the market for three to four years, are low-priority substrate candidates. Yields for these devices are generally high and the versatility of the product used in these devices ensures that the market exists. Thus, inventory aging is unlikely, but potential profitability is relatively low. However, these substrates provide capacities that allow equipment to continue to be used to make profitable products.

The new product offers a high margin. Substrates for devices used in these products are given high priority. In this way, manufacturing facilities can increase profit per substrate by manufacturing biasing for higher profit products. Often new products experience rapid selling erosion due to competition and market strategies that lower market penetration expansion prices. Higher priority placement and selective reduction of manufacturing cycle times for these products can increase the amount of products that can be sold at higher profitability. In addition, high priority can be given to substrates for devices used in articles with short cycles. Short life cycle products include custom devices for consumer electronics such as, for example, specialized memory devices for digital cameras, video game controllers, cell phone components, and the like. As they become outdated and prices fall rapidly, there is a risk of inventory of this type of device.

Certain order devices or devices under development, which undergo changes or undergo certain quality tests, are specifically processed at the manufacturing facility; Substrates used for the manufacture of such devices are referred to as "hot lots" or "super hot lots." Hot lots are prioritized to be moved in front of the queue for each process step. The super hot lot may be assigned a higher priority and the equipment may be reserved or idle while waiting for the super hot lot substrate to arrive. In conventional manufacturing facilities using 13 or 25 substrates per lot, the use of hot lots and super lots can cause serious confusion in the process flow. However, as will be described further below, in the small lot size manufacturing facility provided in accordance with the present invention, a particular order or other similar device can be integrated into a production flow provided with less loss of tool utilization. Substrates used for the manufacture of such devices are given the highest priority in manufacturing facilities.

Example of small lot size semiconductor device manufacturing facility

2 is a schematic diagram of an exemplary small lot size (SLS) semiconductor device manufacturing facility 200 provided in accordance with the present invention. 2, the SLS facility 200 includes a high speed substrate carrier delivery system 202 adapted to deliver a small lot size substrate carrier to a number of processing tools 204. Local storage or buffering 206 is provided at or near each processing tool 204 for local storage of the WIP. In addition, volume storage or buffering 208 may be provided (e.g., volume stocking to accommodate peaks in the WIP developed during the manufacturing process and for long term storage of the WIP). .

A carrier opening device 210 may be provided to each processing tool 204 to open a small lot size substrate carrier such that the substrate contained therein can be extracted, processed and / or returned. A mechanism (not shown separately) is provided for transferring a small lot size substrate carrier from the high speed delivery system 202 to the carrier opening device 210 of each processing tool 204 as described in more detail below.

Automatic communication and / or software system 212 is provided to control the operation of manufacturing facility 200 and may include, for example, a manufacturing execution system (MES), a substance control system (MCS), a scheduler, and the like. . A separate delivery system controller 214 for controlling the delivery of small lot size substrate carriers to the processing tool 204 is shown in FIG. 2. Delivery system controller 214 may be part of automatic communication and / or software system 212; And / or a separate MES, MCS or scheduler may be used.

Most processing tools process small batches of substrates (eg, by treating one or two substrates per processing chamber at a time) even in large lot size manufacturing facilities. However, certain processing tools, such as furnaces or wet processing tools, process substrates of large batch size (eg, about 25 to 200 substrates per batch). Thus, the small lot size manufacturing facility 200 is adapted to accommodate the delivery, storage and operating conditions of large batch size processing tools. One of such exemplary large batch size processing tools is shown at 216 in FIG. 2.

Many large batch size processing tools can move a substrate (eg one substrate at a time) directly from a large lot size carrier to the robot blade using an Equipment Front End Module (EFEM), not shown separately. Each substrate is then transferred by the processing tool to the processing chamber as required to establish the large substrate arrangement required for processing. By providing local storage of small lot size substrate carriers in such processing tools, large substrate batches can be established using the Equipment Front End Module (EFEM) of the large batch size processing tool in the small lot size manufacturing facility 200.

Another large batch size processing tool pulls a complete large lot size carrier from the large lot size substrate carrier into the internal buffer, or simultaneously pulls multiple substrates into the internal buffer. For such a tool, a sorter module 218 to move the substrate from the small lot size carrier to the large lot size carrier may be used in the small lot size manufacturing facility 200.

As described, the high speed delivery system 202 is adapted to deliver a small lot size substrate carrier to a number of processing tools 204. Such a system preferably has a travel speed capacity of at least twice the average speed required for the normal production capacity (eg, in response to peaks of travel speed conditions occurring during the normal manufacturing process). In addition, the system redirects substrates to different processing tools in response to factory modifications, excursions, and / or manufacturing process changes (eg, unplanned maintenance, priority changes, manufacturing yield issues, etc.). -dircet, re-route, or re-move.

US Patent Application No. 10 / 650,310, filed August 28, 2003, discloses a substrate carrier delivery system (eg, a conveyor) that can be used as a small lot size substrate carrier delivery system 202. The delivery system of the '310 application moves continuously during substrate carrier disassembly and mounting operations. The mounting / dismounting mechanism may be associated with each processing tool or group of processing tools and may operate to mount and / or disassemble the substrate carrier from or onto the delivery system as the delivery system moves. Each mounting / dismounting mechanism may include a mounting / dismounting member that moves during the mounting or dismounting operation so that the delivery system approximately matches the speed at which the substrate carrier is carrying. The mounting and / or dismounting member is adapted for gentle substrate / substrate carrier processing. The delivery system of the '310 application can operate at considerably faster speeds than conventional large lot size delivery systems; Easily allow board re-dircet, re-route and / or re-move with different processing tools in response to factory deformation, excursion and / or manufacturing process changes. have. Other substrate carrier delivery systems can similarly be used.

Specific embodiments of suitable high speed delivery systems are disclosed in US patent application Ser. No. 10 / 764,982, filed Jan. 26, 2004. The '982 application discloses a conveyor system that can include a ribbon of stainless steel or similar material that forms a closed loop within at least a portion of a semiconductor device manufacturing facility and delivers a substrate carrier therein. By orienting the ribbon so that the thick portion of the ribbon is in the vertical plane and the thin portion of the ribbon is in the horizontal plane, the ribbon is flexible in the horizontal plane and rigid in the vertical plane. This configuration allows the conveyor of the invention to be constructed and operated at low cost. For example, such ribbons require little material to construct, are easy to manufacture, and because of the vertical rigidity / strength of the ribbons, the secondary support structure (rollers used in conventional horizontally oriented belt-like conveyor systems or Support of the weight of multiple substrate carriers (such as other similar mechanisms). In addition, the conveyor system is highly customizable because the ribbon can be bent and curved or shaped into various configurations due to its lateral flexibility.

As shown in FIG. 2, the SLS manufacturing facility 200 may include additional high speed delivery systems, indicated at 202 ′, 202 ″. More than three or less such delivery systems may be used. For example, an additional high speed delivery system may include a small lot size substrate carrier in different parts of the manufacturing facility, such as equipment for processing substrates stored in a large lot size substrate carrier, different physical areas of the manufacturing facility (such as an extended area of the facility), and the like. Can be used to deliver. One or more delivery mechanisms 220 may be used to provide substrate carrier transfer and / or additional substrate carrier storage between the high speed delivery systems 202, 202 ′, 202 ″. In at least embodiments of the present invention, one or more substrate carrier handlers and rotating substrate carrier stages may be used to remove the substrate carrier from the first high speed delivery system (eg, the high speed delivery system 202 of FIG. 2) and the second high speed. The substrate carrier may be delivered to a delivery system (eg, the high speed delivery system 202 ′ of FIG. 2) or vice versa. Such systems and methods are disclosed in US Provisional Patent Application No. 60 / 520,035, filed November 13, 2003 (Docket No. 8195 / L).

To prevent depletion of the substrate carrier from the high speed delivery system 202, each processing tool 204 may include local storage for WIP buffering or storage (as disclosed). Without the need for a high speed delivery system 202 to deliver the substrate to the tool, a single operation of the processing tool can be provided. Since various conventional processing tools accommodate at least two large lot size (eg, 25) substrate carriers, at least in one embodiment of the present invention, local storage at or near each processing tool 204 It is adapted to store a similar number of substrates by storing various small lot size substrate carriers at or near each processing tool (eg, at least about 50 small lot size carriers in one embodiment). Other or various numbers of substrate carriers may also be stored at or near each processing tool 204 (eg, less than 50, greater than 50, etc.).

US Provisional Application No. 60 / 443,115, filed Jan. 27, 2003, compares with a conventional bay-distributed stocker, a high-speed bay with a significantly long chassis in the direction of travel of the high-speed delivery system. -Start a distributed stocker (HSBDS). The HSBDS features a high speed substrate carrier handler adapted to mount the substrate carrier on a high speed delivery system and to release the substrate carrier from the high speed delivery system. The HSBDS also includes an additional column of substrate carrier storage shelves to provide additional substrate buffering. Other systems for providing local storage may be used (eg, distributed stockers, field stockers, overhead / ceiling mounted tables or shelves, etc.).

Volume storage or buffering 208 provides volume stocking to accommodate peaks in the WIP that develop during the long term storage of the WIP and during the manufacturing process. For example, hold orders, non-product substrates and the like may be placed in volume storage or buffering. This capacity selection of volume storage or buffering is driven by manufacturing facility requirements. For example, volume storage or buffering 208 may include a small lot size stocker along a fast delivery loop, a large lot size stocker along a fast delivery path or a slow delivery path (not shown), another form of high density storage, a distributed stocker. , Field stockers, overhead and / or ceiling mounted tables or shelves, and the like. The substrate stored in the small lot size substrate carrier may be transferred to the large lot size carrier through a sorter and subsequently placed in a high density storage location.

In at least one embodiment of the present invention, low usage WIPs (e.g., inert WIPs such as substrates placed in engineering hold, test substrates, non-manufacturing substrates, substrates held for long periods of time, etc.) have large storage capacities with greater storage capacity. It can be stored in lot size substrate carriers (since the cost of storing substrates in such high density carriers is generally cheaper than when using small lot size carrier storage). For example, low-use WIPs are transferred from small lot size carriers to large lot size carriers (eg, through sorters) and stored in volume stockers. If a low-use WIP is not processed within a predetermined time period (e.g., 5 days or some other time period), the WIP may range from a small lot size carrier to a large lot size carrier (e.g., 13 or 25 substrates). Is delivered to a carrier that stores and to another location within the manufacturing facility 200. For example, volume storage 208 ′ may include a large lot size volume stocker adapted to store low-use WIPs at locations remote from the main processing area of manufacturing facility 200.

During the mounting and dismounting of the substrate carrier at the processing tool 204, communication between the processing tool 204 and the manufacturing facility 200 may provide lot identification information, processing parameters, tool operating parameters, processing instructions, and the like. Automatic communication and / or software system 212 is designated to handle these and other communications. Preferably such communication takes place quickly enough so as not to delay substrate processing. For example, a typical requirement for mounting a substrate carrier at the factory interface of a processing tool is less than about 200 seconds, and in some cases less than 30 seconds.

In at least one embodiment of the invention, the automatic communication and / or software system 212 is adapted to perform substrate-level-tracking (as opposed to carrier level tracking typically used in large lot size environments) and Reference may be made to substrates grouped as. This substrate-based approach increases the performance of the manufacturing facility 200 and prevents software lot limitations from negating small lot size manufacturing advantages.

In each processing tool 204, the carrier opening device 210 (to open a small lot size substrate carrier such that the substrate contained therein is extracted, processed and / or returned) is an industry standard for minimizing the cost of running a large facility. Interfaces (eg SEMI criteria) are preferably used. An optional carrier opening mechanism can be used. For example, US patent application Ser. No. 10 / 650,311, filed August 28, 2003, describes an actuator mechanism and a latching mechanism at a substrate transfer location (e.g., of a processing tool that can be used during semiconductor device manufacturing). Initiates the door latching mechanism of the substrate carrier which is not automatically latched by In addition, the same actuator mechanism may release the substrate clamping mechanism, which may be part of the substrate carrier (eg, to protect the substrate stored by the substrate carrier during delivery). Likewise, US patent application Ser. No. 10 / 650,312, filed August 28, 2003, discloses the use of movement of the substrate carrier towards the port of the substrate delivery position to allow the door of the substrate carrier to open. Substrate carrier movement away from the port at the substrate transfer position causes the door of the substrate carrier to close. Other carrier opening methods and devices can be used.

Because of the relatively low travel speeds used in large lot size manufacturing facilities, the operator (person) can move the lot between processing tools as needed (eg, when an automated delivery system has failed). For small lot size production, the speed of travel required is so large that the use of the operator is typically impractical. As a result, redundant systems (other than operators) can be used for proper plant operation. Such redundant systems may include, for example, additional control system computers, software databases, automated delivery systems, and the like (not shown separately).

In at least one embodiment of the present invention, while the high speed delivery system 202 is in operation (eg during operation and / or servicing for other tools), the small lot size manufacturing facility 200 may be, for example, new. The ability to install and mount a processing tool. US patent application Ser. No. 10 / 987,956 (8158), filed November 12, 2004, describes a high-speed substrate (for mounting a substrate carrier on and removing it from the delivery system) while the delivery system is in operation. Disclosed is a method by which a carrier delivery station can be aligned and calibrated in a high speed substrate carrier delivery system. The substrate carrier hand-off function of the transfer station is then tested and the fast transfer station is placed in service. Other methods / systems may be used.

The use of a small lot size manufacturing facility as described above with reference to FIG. 2 provides various advantages over conventional large lot size manufacturing facilities. For example, small lot size manufacturing facilities provide significant versatility. As described with reference to FIG. 1, for an equivalent set of processing tools, a small lot size manufacturing facility may have: (1) equivalent output with reduced cycle time; (2) equivalent cycle time with increased factory output, or (2) at any point between them. Facility operating conditions (large lot size baseline) can be adjusted according to other conditions for placing priorities in accordance with either business conditions or cycle time reduction or increased capacity. In addition, through the use of a high speed substrate carrier delivery system, certain orders and other similar devices can be interlaced into existing production flows with little loss of tool utilization. Typically hot lots and / or super hot lots can be processed in small lot size manufacturing facilities with a small impact on manufacturing facility output rates. Thus, less excess capacity is required to handle hot lots and / or super hot lots.

The foregoing description merely discloses exemplary embodiments of the present invention. Modifications of the above disclosed apparatus and methods will be readily apparent to those skilled in the art within the scope of the present invention. For example, other configurations for small lot size manufacturing facilities may be used, such as different processing tools, storage devices and / or delivery system layouts and / or types, many or fewer processing tools, storage devices and / or delivery systems, and the like. In at least one embodiment, a substrate carrier cleaner 222 may be provided to clean a small lot size substrate carrier. In this way, the substrate carrier can be cleaned to prevent cross-contamination of inappropriate processing. The small lot size semiconductor device manufacturing facility shown in FIG. 2 is larger than the semiconductor device (which may include, for example, one or more other small lot size semiconductor device manufacturing facility and / or one or more large lot size semiconductor device manufacturing facility). It may form part or a subset of the manufacturing equipment. For example, small lot size semiconductor device manufacturing facilities can be used to reduce the cycle time, in whole or in part, of the interconnect formation steps of device fabrication. That is, the small lot size semiconductor device manufacturing facility provided in accordance with the present invention can be used to selectively accelerate the portion of device processing time. As another example, in a lithography bay, small lot size fabrication modules can be used to improve cycle times for metrology, substrate rework, and the like.

The automatic communication and / or software system 212, the delivery system controller 214, and / or any other controller may be programmed or otherwise configured to perform various WIP management functions. For example, in at least one embodiment of the present invention, the system and / or controller may be configured to (1) increase the average cycle time of a low priority substrate in a small lot size semiconductor device manufacturing facility 200; And (2) reduce the average cycle time of the high priority substrate in the small lot size semiconductor device manufacturing facility 200, thereby maintaining a predetermined WIP level in the small lot size semiconductor device manufacturing facility 200. It is possible to maintain approximately the predetermined WIP level in the small lot size semiconductor device manufacturing facility 200. In another embodiment of the present invention, the system and / or controller stores (1) a small lot size substrate carrier containing a low priority substrate within a small lot size substrate carrier storage location of one or more processing tools 204. and; (2) configured to process the high priority substrates available in the one or more processing tools 204 prior to the stored low priority substrates, thereby prioritizing without corresponding WIP reduction in the small lot size semiconductor device manufacturing facility 200. It is possible to reduce the cycle time of the high substrate.

In another embodiment of the present invention, the system and / or controller comprises: (1) a small lot size substrate carrier containing a low priority substrate within a small lot size substrate carrier storage location of one or more processing tools 204; Store a small lot size substrate carrier containing a high priority substrate; (2) prior to processing within the one or more processing tools 204, configured to store the higher priority substrates for a generally shorter period of time than the lower priority substrates, such that the corresponding lots in the small lot size semiconductor device manufacturing facility 200 It is possible to reduce the cycle time of high priority substrates without reducing the WIP.

In another embodiment of the present invention, the system and / or controller maintains the small lot size semiconductor device manufacturing facility while maintaining the average cycle time and WIP at approximately the same level as the average lot time and WIP of the large lot size semiconductor device manufacturing facility. It is configured to process the high and low priority substrates at different cycle times within 200.

In yet another embodiment of the present invention, the system and / or controller may, within the small lot size semiconductor device manufacturing facility 200, maintain a large lot size semiconductor, while maintaining the overall output substantially the same as the large lot size semiconductor device manufacturing facility. And to process the substrate with a lower average cycle time than the device fabrication facility.

In another embodiment of the present invention, the system and / or controller increase the output of the small lot size semiconductor device manufacturing facility 200 to the large lot size semiconductor device manufacturing facility, while the small lot size semiconductor device manufacturing facility 200 The substrate is configured to treat the substrate with an average cycle time and WIP that is approximately the same as a large lot size semiconductor device manufacturing facility.

In another aspect of the invention, the system and / or controller may (1) identify a WIP that will not be processed within a predetermined time period; (2) transfer the identified WIP from the small lot size substrate carrier to the large lot size substrate carrier; Configured to store a large lot size substrate carrier of volume storage.

Small Lot Size Lithography Bay

Reduced cycle times are particularly desirable for lithographic portions (bays) of semiconductor device manufacturing facilities. 3 is a top view of an exemplary small lot size lithography bay 300 provided in accordance with the present invention. With reference to FIG. 3, lithographic bay 300 includes a wet cleaning processing tool 302, a dry strip processing tool 304, a plurality of metrology and inspection tools 306-312 and a plurality of patterning tools 314-328. Include. Note that other water and / or types of wet washes, dry strips, metrology and inspection and / or patterning tools can be used. For example, individual metrology and inspection tools can be used.

The wet clean processing tool 302 and dry strip processing tool 304 are adapted to perform a conventional photoresist or other mask removal process or any other conventional process for reworking an undesirably processed substrate during lithography. It is a "re-work" tool. For example, the wet clean processing tool 302 may be adapted to provide a photoresist stripper or other wet chemical bath to the substrate. Similarly, dry strip processing tool 304 utilizes plasma processing (eg, ashing) for substrate rework. Other rework processes and / or tools may be used within the lithographic bay 300, whether aligned or otherwise positioned with other tools 306-328 (shown).

Metrology and inspection tools 306-312 include conventional metrology and inspection tools for determining the critical dimensions, overlay accuracy, defect levels, and / or defect shapes of lithographically processed substrates. In at least one embodiment, metrology and inspection tools 306-312 include a single substrate, standalone tool, but batch and / or integrated metrology and inspection tools may be used.

Patterning tools 314-328 may include conventional lithography tools that perform one or more of resist processing, exposure, imprint, and the like and / or any combination thereof. For example, patterning tools may include standalone resist processing tools, standalone exposure tools, standalone imprint tools, integrated resist processing and exposure tools, integrated resist processing and imprint tools, and the like. In at least one embodiment, the resist processing tool comprises: (1) a substrate carrier is delivered to the resist processing tool; (2) the substrate or substrates are removed from the substrate carrier and a resist (eg photoresist) is provided to the substrate or substrates using a resist processing tool; (3) the substrate or substrates are transferred to and exposed to the exposure tool; (4) the substrate and / or substrates are returned to a resist processing tool and the provided resist is developed; (5) may be integrated or otherwise connected with the exposure tool such that the substrate or substrates are returned to the substrate carrier.

Patterning tools 314-328 may be single substrate or batch tools. As disclosed, other water and / or types of wet washes, dry strips, metrology and inspection, and patterning tools can be used. In one or more embodiments, any exposure tool used may use visible or ultraviolet light to transfer the circuit pattern from the mask to the resist layer. Likewise, direct transfer, extremely strong ultraviolet, e-beam or x-ray lithography tools can be used.

In the embodiment of FIG. 3, a small lot size transfer system 330 is used to transfer a small lot size substrate carrier between the tools 302-328. The small lot size delivery system 330 may be similar to the fast delivery system 202 described above with reference to FIG. 2, or other suitable delivery system may be used. Two or more small lot size delivery systems may be used to transfer the carrier between the tools 302-328.

As further shown in FIG. 3, the small lot size lithography bay 300 includes one or more substrate carrier stockers or similar devices 332-336. The stockers 332-336 may be used to receive large lot size substrate carriers from a conventional large lot size substrate carrier delivery system 338 (such as a conventional overhead delivery system that delivers a substrate carrier having 25 substrates). Can be. In the illustrated embodiment, stockers 332-336 receive large lot size substrate carriers from delivery system 338 and are adapted to transfer the substrates within each large lot size substrate carrier to the small lot size substrate carriers. For example, a substrate may be moved from one 25-substrate substrate carrier such that 25 single-substrate substrate carriers, 13 two-substrate substrate carriers, nine three-substrate substrate carriers, seven four-substrate substrate carriers. , Five five-substrate carriers, four seven-substrate substrate carriers and the like. Each stocker 332-336 can also provide local storage for large and / or small lot size substrate carriers. Less or more stockers 332-336 may be used. Additionally, the small lot size lithography bay 300 can be adapted to receive small lot size carriers directly from another small lot size bay of the manufacturing facility (rather than from a large lot size delivery system).

Behavior of small lot-size lithography bays

4 is a flowchart of an example method 400 of operating a small lot size lithography bay 300. Referring to FIG. 4, at step 401, the substrate is transferred to a small lot size lithography bay 300 via a large lot size delivery system 338. For example, large lot size delivery system 338 may deliver a substrate carrier, each holding 25 substrates, to stockers 332-334. The stocker 332-334 then moves from a large lot size carrier to a small lot size carrier (e.g., a carrier having 25 substrates, to a carrier having 1, 2, 3, 4, 5, 6, etc.). The substrate can be delivered.

Then, at step 402, the first small lot size carrier is delivered to one of the patterning tools 314-328 via the small lot size delivery system 330. Additional small lot size carriers may be delivered (sequentially or in parallel) to the patterning tools 314-328.

In step 403, the substrate or substrates included in the first small lot size carrier is processed. Then, in step 404, after the substrate or substrates of the first carrier have been processed in the patterning tool, the first small lot size carrier is routed through the small lot size delivery system 330 to the metrology and inspection tool 306-312. Is passed on to either.

In step 405, metrology and / or inspection of the substrate or substrates in the first small lot size carrier is performed (eg, to determine threshold or overlay accuracy, defect level or shape, etc.).

In step 406, it is determined whether an error condition is detected on the substrate, such as if there are too many defects, if there is inappropriate patterning, or the like. An error condition is detected and in step 407 the first small lot size substrate carrier and its items are directed to the wet cleaning tool 302 and / or the dry strip tool 304 and reworked (eg, one or more). Stripped, washed and prepared for processing in patterning tool 314-328). If no error condition is found on the substrate or substrates in the first small lot size carrier, then at step 408, the first small lot size transfer system 330 may be processed further than within the small lot size lithography bay 300. Return the carrier to patterning tool 314-328 or to stocker 332-338. In stockers 332-338, substrates are stored and / or transferred from small lot size carriers to large lot size carriers and transferred to another bay of the entire manufacturing facility (not shown) via large lot size delivery system 338. do. The method then terminates.

Data from the metrology and inspection tool 306-312 is fed back to the patterning tool 314-328 to improve processing performance (as shown virtually by step 409 of FIG. 4). For example, if the critical dimension (CD) of the feature (eg, resist layer) is too small or too large, the exposure time and / or resist processing conditions may be changed to improve the processing result. Another processing parameter may similarly be adjusted. By using a small lot size, feedback data can be provided to the patterning tool with a smaller delay than when a large lot size is used. Faster feedback data enhances processing results more quickly and reduces scrap caused by mis-processing. This gain is particularly important for the most complex and / or most important lithographic layers. For these layers, adjustment of processing parameters based on feedback data from the processed substrate may be necessary to meet the processing specifications.

Small lot size lithography bay 300 may include, for example, one or more rework tools 302-304, metrology and inspection tools 306-312, patterning tools 314-328, delivery system 330, and / or the like. Or a controller 340 adapted to control the operation of the lithographic bay 300 as described above by interfacing and / or controlling the stockers 332-338. For example, the controller 340 may be adapted to perform and / or at least initiate one or more steps of the method 400 described above. For example, the controller 340 may be one or more microprocessors and / or microcontrollers, dedicated hardware and combinations thereof, and the like, and may include appropriate computer program code to control the operation of the lithographic bay 300.

The controller 340 forms part of an automated communication and / or software system provided to control the operation of the small lot size lithography bay 300, and includes, for example, a manufacturing execution system (MES), a substance control system (MCS), Scheduler and the like. Individual delivery system controllers (not shown) may be used to control small lot size substrate carrier delivery to processing tools 302-328. The delivery system controller may be part of the automated communication and / or software system disclosed above; And / or a separate MEC, MCS or scheduler can be used.

Through the use of small lot size carriers in the lithography bay 300, the substrate is processed in the patterning tool 314-328 and directed to the metrology and inspection tool 306-312 considerably faster than in conventional large lot size lithography bays. Can lose. The substrate is delivered for metrology and / or inspection with little or no delay (for example, due to the processing of another substrate in the carrier) (in the case of a single substrate carrier). In one embodiment, for example, the measurement delay is reduced from 200 plus substrates to less than 20 substrates. In addition, through the use of small lot size carriers, the substrates are transferred to different metrology tools in parallel. For example, where a single substrate carrier is used, the first substrate may be directed at the critical dimension measurement tool, the second substrate may be directed at the overlay metrology tool, and the third substrate may be directed in parallel with the defect measurement tool. Similar parallel operations can be performed with small lot size carriers comprising two or more substrates without the large latency-time delay associated with large lot size carriers.

As another example, if a new mask setup is used, the setup may be done before the mask setup handles many substrates (e.g. to prevent too many substrates being reprocessed if the setup is defective). Must be verified To perform setup verification, multiple substrates are processed and delivered for metrology. As disclosed, the use of small lot sizes significantly reduces the time required to receive metrology and / or inspection results for the substrate. Thus, the mask setup verification time is reduced. As another alternative, a new mask setup is assumed to be effective and the substrate is processed using the setup. Any error in the setup is detected after metrology on the processed substrate. Again, the use of small lot sizes provides information from metrology and / or inspections more quickly to reduce the number of defective substrates that must be reworked (if present). Quick and parallel information feedback from metrology and / or inspection tools that perform different measurements (eg, of critical dimensions, overlays, defects) (eg, confirm setups, monitor manufacturing processes, process To detect deviations) and provide a rapid, multiple and / or nearly simultaneous indicator of processing conditions.

The use of small lot size lithography bay 300 and the reduced cycle time associated therewith allows for interlacing lots and substrates. For example, monitors and / or small lots can be interlaced without damaging the pipeline (eg, sequential sequencing of the substrate in the processing tool). If the pipeline of the substrate is interrupted, such as by spaces or gaps in the subsequent sequencing of the substrates in the tool, the tool will lose efficiency and net effective utilization will be reduced. In addition, monitoring is enhanced and sampling improves without loss of utility. Single (or small lot size) substrate rework may be included in the lithographic bay 300.

In at least one embodiment of the present invention, after the substrate has been exposed and / or patterned in the patterning tool 314-328, the substrate may be formed (eg, a substrate carrier having 25 substrates may It is moved to the instrument as quickly as possible (without waiting to process more substrates) as it is used to transfer. In addition, small lot size substrate carriers (eg, single substrate carriers) can be delivered to different metrology tools in parallel.

Note that a standalone instrument can be used. Also, in certain embodiments, dry strips and wet cleaning tools may be included in a line (not shown) to provide rapid cycle time rework when the problem is resolved. Other small lot size substrate carrier delivery systems, apparatus and / or methods other than those disclosed herein can be used.

Thus, while the invention has been disclosed in connection with exemplary embodiments, other embodiments may be practiced without departing from the scope and spirit of the invention as defined by the following claims.

In accordance with the present invention, the overall "dwell" or "cycle" time of each substrate in the manufacturing facility is reduced-the transfer of substrates within the manufacturing facility can be facilitated-and the WIP reduction results in the same factory output with less WIP. Can be achieved.

Claims (35)

Storing the substrates in a plurality of small lot size substrate carriers each adapted to hold a maximum capacity of 1, 2, 3, 4, 5, 6 or 7 substrates; And At least one of the small lot size substrate carriers adapted to hold a maximum capacity of 1, 2, 3, 4, 5, 6 or 7 substrates in a lithographic bay of a semiconductor device manufacturing facility Transferring from one processing location to another processing location And storing the substrates in a plurality of small lot size substrate carriers adapted to hold a maximum capacity of 1, 2, 3, 4, 5, 6 or 7 substrates, respectively. Transferring substrates from a large lot sized substrate carrier adapted to retain to a plurality of said small lot sized substrate carriers adapted to retain a maximum capacity of 1, 2, 3, 4, 5, 6 or less than 7 substrates, respectively; Including, the method. The method of claim 1, Storing the substrates in a plurality of small lot size substrate carriers adapted to hold a maximum capacity of 1, 2, 3, 4, 5, 6 or 7 substrates, respectively, (a) receiving a large lot size substrate carrier from a large lot size transfer system configured to store 13 or 25 substrates; And (b) multiple small lot size substrate carriers configured to hold a maximum capacity of 1, 2, 3, 4, 5, 6 or 7 substrates, respectively, from a large lot size substrate carrier configured to store 13 or 25 substrates Transferring substrates to a furnace / RTI > 3. The method of claim 2, Further comprising performing steps (a) and (b) in a stocker. The method of claim 3, wherein Storing the plurality of small lot size substrate carriers in the stocker. The method of claim 1, And the plurality of small lot size substrate carriers are each adapted to have a maximum capacity of four or less substrates. The method of claim 1, Wherein the plurality of small lot size substrate carriers are each adapted to have a maximum capacity of three or less substrates. The method of claim 1, Wherein the plurality of small lot size substrate carriers are each adapted to have a maximum capacity of two or less substrates. The method of claim 1, And the plurality of small lot size substrate carriers are each adapted to hold a maximum capacity of one substrate. The method of claim 1, Delivering at least one of the small lot size substrate carriers in a lithographic bay of the semiconductor device manufacturing facility comprises transferring the small lot size substrate carrier to a patterning tool. The method of claim 9, Patterning a substrate from the small lot size substrate carrier using the patterning tool. The method of claim 9, Transferring the small lot size substrate carrier to a tool adapted to perform at least one of metrology and inspection. The method of claim 11, Performing at least one of metrology and inspection on a substrate from the small lot size substrate carrier. 13. The method of claim 12, Transferring the small lot size substrate carrier to one or more re-work tools based on results of performing at least one of metrology and inspection. The method of claim 13, Reworking the substrate from the small lot size substrate carrier. The method of claim 4, wherein And the reworking of the substrate comprises at least one of wet cleaning and dry stripping of the substrate. The method of claim 1, And simultaneously transferring the plurality of small lot size substrate carriers to the patterning tools. The method of claim 1, Simultaneously delivering multiple small lot size substrate carriers to different metrology tools. The method of claim 1, Delivering at least one of the small lot size substrate carriers into the lithographic bay of the semiconductor device manufacturing facility may comprise using a continuously moving conveyor to deliver the at least one small lot size substrate carrier into the lithography bay. Including, method. As a lithography bay, Multiple lithography tools; A small lot size transfer system adapted to deliver small lot size substrate carriers adapted to hold a maximum capacity of 1, 2, 3, 4, 5, 6 or 7 substrates between the lithography tools, respectively; And Receive a large lot sized substrate carrier from a large lot sized substrate carrier configured to store 13 or 25 substrates; And Substrates from the large lot size substrate carriers adapted to store 13 or 25 substrates to a plurality of small lot size substrate carriers adapted to hold a maximum capacity of 1, 2, 3, 4, 5, 6 or 7 substrates, respectively To transport them Adapted stalker Including, lithography bay. 20. The method of claim 19, The lithographic tool includes at least one of metrology and inspection tools and patterning tools. 20. The method of claim 19, The lithographic tool includes at least one rework tool. 22. The method of claim 21, The at least one rework tool is in-line with other lithography tools. 22. The method of claim 21, The at least one rework tool includes a wet cleaning tool and a dry stripping tool. 20. The method of claim 19, The stocker is at least one of a large lot size carrier adapted to store 13 or 25 substrates and at least one small lot size substrate carrier adapted to hold a maximum capacity of 1, 2, 3, 4, 5, 6 or 7 substrates. Lithography bay, which is adapted to store one. 20. The method of claim 19, The small lot size transfer system is adapted to transfer from small lot size substrate carriers to the stocker. 20. The method of claim 19, The small lot size substrate carriers are each adapted to store substrates of up to four capacities. 20. The method of claim 19, The small lot size substrate carriers are each adapted to store substrates of up to three capacities. 20. The method of claim 19, The small lot size substrate carriers are each adapted to store substrates of up to two capacities. 20. The method of claim 19, The small lot size substrate carriers are each adapted to store a maximum capacity of one substrate. Storing the substrates in a plurality of small lot size substrate carriers each adapted to hold a maximum of less than 13 substrates; Delivering at least one of the small lot size substrate carriers into a lithographic bay of a semiconductor device manufacturing facility; And Maintaining the predetermined level of progress in the semiconductor device manufacturing facility by reducing the average cycle time of the high priority substrates in the lithography bay to properly maintain the progress level of predetermined operation. Wherein storing the substrates in the plurality of small lot size substrate carriers comprises transferring the substrates from the substrate carrier adapted to retain the 25 or less substrates to the plurality of small lot size substrate carriers. , Way. delete delete delete delete delete

Images