JP2002246432A - Substrate processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To properly and inexpensively provide a bath CVD device in a small batch. SOLUTION: A pod opener 21 opening/closing the cap of a pod 26 is disposed in the front lower part of a casing 2 of the batch CVD device 1. A first pod stage 24 and a second pod stage 25 are arranged on the right and left sides of the installation stand 2 of the pod opener 21. A pod transport device 30 transfers the pod 26 between the pod stages 24 and 25, and the pod opener 21 is installed above them. Pod elevating and lowering devices 60 for elevating and lowering the pods 26 are disposed in the pod stages 24 and 25. Since the pod is transferred directly between the pod stages and the pod opener by the pod transport device, the rack for temporarily keeping the pod can be omitted. Moreover since the pod elevating and lowering devices are arranged in the pod stages, the extra pods are made to wait, without broadening the lateral width of the device as a whole.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, and more particularly to a processing apparatus for batch processing a relatively small number of substrates. , A wafer). The present invention relates to a device that is effective for use in a diffusion / CVD apparatus that diffuses impurities into a film or forms a CVD film such as an insulating film or a metal film.

[0002]

2. Description of the Related Art In a manufacturing process of a semiconductor device, a process of diffusing impurities into a wafer or forming a CVD film such as an insulating film or a metal film includes a batch type vertical diffusion CVD device (hereinafter, batch type CVD device). Device).

[0003] In a substrate processing apparatus including a batch type CVD apparatus, a carrier (wafer storage container) for storing and transporting a plurality of wafers as substrates to be processed has a pair of opposing surfaces opened. And a FOUP (front opening unified) in which a substantially cubic box-shaped cassette is formed, and a substantially cubic box-shaped one-sided opening is formed and a cap is detachably mounted on the opening surface.
pod. Hereinafter, it is called a pod. ). When a pod is used as a wafer carrier, the wafer is transported in a sealed state, so that the cleanliness of the wafer can be maintained even if particles are present in the surrounding atmosphere. it can. Therefore, it is not necessary to set the cleanliness in the clean room in which the substrate processing apparatus is installed, so that the cost required for the clean room can be reduced. Therefore, in recent batch CVD apparatuses, pods have been used as carriers for wafers.

As a batch type CVD apparatus using a pod as a wafer carrier, a process tube for performing desired processing on a wafer and a large number (for example, one hundred and fifty hundred) of wafers are held and carried into and out of the process tube. A boat, a wafer transfer port for transferring wafers between the boats by a wafer transfer device, a pod stage on which pods are placed, a pod shelf for temporarily storing pods, and a pod stage and pod shelf. And a pod transfer device for transferring the pod between the pod shelf and the wafer transfer port.

[0005] That is, in this batch type CVD apparatus, the pod is supplied to a pod stage, transferred to a pod shelf by a pod transfer device, and temporarily stored.
A plurality of pods stored on the pod shelf are repeatedly transferred to the wafer transfer port by the pod transfer device. Many pod wafers are transported to the wafer transfer port,
Loading (charging) on a boat by wafer transfer equipment
Is done. The wafer loaded in the boat is loaded (loaded) into a process tube by the boat, and a desired process is performed by the process tube. The processed wafer is unloaded from the process tube by the boat. A large number of processed wafers are repeatedly discharged from a boat by a wafer transfer device, and are repeatedly returned to a plurality of empty pods at a wafer transfer port. The pod storing the processed wafers is temporarily stored on a pod shelf by a pod transport device, and then repeatedly transported to a pod stage.

[0006]

Recently, a system LSI has been developed.
In the production of such a method, a small batch type batch CVD apparatus in which the number of processed sheets at a time is 25 or less is required. In this small batch batch type CVD apparatus, the number of pods supplied to one batch may be two or three.

However, the above-mentioned batch type CVD apparatus is intended for a large batch in which the number of processed sheets at a time is about one hundred and fifty, so that the projected floor area and the number of steps of the pod shelf are set large or the pod shelf is rotated. Since the number of pods stored on the pod shelf has been increased by building into a structure, if it was diverted to a small batch batch type CVD apparatus, the whole would become large and the structure would become complicated. However, there is a problem that initial costs and running costs increase.

An object of the present invention is to provide a substrate processing apparatus suitable for handling a small number of substrates and capable of reducing costs.

[0009]

According to the present invention, there is provided a substrate processing apparatus comprising: a pod opener for opening and closing a cap of a pod storing a plurality of substrates; and a pod opener installed at a position adjacent to the pod opener. A plurality of pod stages to be mounted, a pod lifting device for vertically moving the pods respectively mounted on the pod stages, and a pod transport device for transporting the pod between the pod stage and a pod opener. I have.

In the above means, the pods are supplied to a plurality of pod stages, and the pods supplied to each pod stage are respectively conveyed to a pod opener by a pod conveying device in a timely manner. The pod conveyed to the pod opener is opened and closed with the cap opened and closed by the pod opener. Then, the pod of the pod opener is transported to each pod stage by the pod transport device. According to the above-described means, the pod is directly transported between the pod stage and the pod opener by the pod transport device, so that a shelf for temporarily storing the pod can be omitted. Further, each pod stage is provided with each pod lifting / lowering device, so that the pods can be made to wait extra without increasing the overall width of the device. That is, the substrate processing apparatus according to the above means is suitable for handling a small number of substrates, and can reduce initial costs and running costs.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

In the present embodiment, a substrate processing apparatus according to the present invention is a batch type CVD apparatus for handling small batches in which the number of batch processes per batch is about 50 or less, that is, a small batch type vertical diffusion / CVD apparatus ( Hereinafter, small batch type CVD
It is called a device. ). This small batch type CVD apparatus is configured to handle a product wafer as a product substrate, and configured to handle a pod as a product substrate carrier. In the following description, front, rear, left and right are based on FIG. That is, the pod opener 21 side is the front side, the opposite side is the rear side, the clean unit 17 side is the left side, and the opposite side is the right side.

As shown in FIGS. 1 to 3, the small batch type CVD apparatus 1 includes a casing 2, and a heater unit 3 is provided vertically above the rear end of the casing 2. The process tube 4 is installed concentrically inside the heater unit 3. The process tube 4 is connected to a gas introduction pipe 5 for introducing a source gas, a purge gas, and the like into the process tube 4 and an exhaust pipe 6 for evacuating the process tube 4 to a vacuum.

An elevator 7 constituted by a feed screw device or the like is installed below the rear end of the casing 2. The elevator 7 vertically moves a seal cap 8 disposed directly below the process tube 4. It is configured to move up and down. Seal cap 8 is the process tube 4
The lower end opening, which is a furnace port, is configured to be sealed, and the boat 9 is configured to be supported vertically. The boat 9 supports a plurality of wafers W as substrates (for example, about fifty or less) in a state where the wafers W are arranged horizontally with their centers aligned. Is configured to be carried in and out as the device is moved up and down.

As shown in FIGS. 2 and 3, a wafer transfer device 10 for charging and discharging the wafer W with respect to the boat 9 is provided in a front area in the housing 2. The wafer transfer device 10 includes a rotary actuator 11, and the rotary actuator 11 is configured to rotate a first linear actuator 12 installed on an upper surface in a horizontal plane. A second linear actuator 13 is provided on the upper surface of the first linear actuator 12, and the first linear actuator 12 is configured to horizontally move the second linear actuator 13. A moving table 14 is provided on the upper surface of the second linear actuator 13,
The second linear actuator 13 is configured to move the movable table 14 horizontally. The wafer W
Tweezers 15 for supporting from below (five in this embodiment) are arranged at equal intervals and horizontally mounted. The wafer transfer device 10 is moved up and down by an elevator 16 constituted by a feed screw device or the like.

Note that, as shown in FIG.
A clean unit 17 for blowing clean air is installed on the left side wall at the rear of the inside so as to blow clean air to the boat 9. Further, a wafer stocker 18 configured similarly to the boat 9 is installed near the left side in the center of the housing 2.
Is designed to store a plurality of side dummy wafers.

As shown in FIG. 1 to FIG.
A wafer loading / unloading port 20 for loading / unloading the wafer W into / out of the housing 2 is opened at a central portion of the front wall.
A pod opener 21 is provided at the wafer loading / unloading port 20. The pod opener 21 includes a mounting table 22 on which the pod 26 is mounted, and a cap attaching / detaching mechanism 23 for mounting and dismounting the cap 27 of the pod 26 mounted on the mounting table 22. 26 caps 2
By attaching / detaching the 7 by the cap attaching / detaching mechanism 23, the wafer inlet / outlet of the pod 26 is opened / closed.

As shown in FIG. 1 to FIG.
Mounting table 22 of pod opener 21 at the lower front of
A first pod stage 24 and a second pod stage 25 on which a pod 26 is mounted are installed adjacent to the mounting table 22, respectively, on the left side and the right side of the table. The pod 26 is supplied to and discharged from the first pod stage 24 and the second pod stage 25 by an in-process transfer device (RGV) (not shown).

As shown in FIG. 1 to FIG.
A pod transport device 30 shown in FIG. 4 is provided at the upper part of the front of the pod. The pod transport device 30 connects the pod 26 between the pod opener 21 and the first pod stage 24 and the second pod stage 25. The grip 28 is configured to be transported while being held (clamped).

That is, as shown in FIG. 4, the pod transport device 30 has a vertically fixed mounting plate 31 extending in the left-right direction. A base plate 33 formed in an angle steel shape is laid horizontally in the left-right direction and fixed by a bracket 32. A pair of left and right brackets 34, 34 are erected on both left and right ends of the upper surface of the base plate 33, and a pair of left and right pulleys 35, 35 are rotatably supported on the left and right brackets 34, 34, respectively. ing. A timing belt 36 is runably wrapped between the left and right pulleys 35, 35. Mounting plate 3
A central bracket 37 is fixed at an intermediate position between the left and right brackets 34, 34.
A drive pulley 39 that is rotated and driven by a servomotor 38 is supported on 7. The driving pulley 39 is inserted between the upper traveling portion and the lower traveling portion of the timing belt 36, and the upper traveling portion of the timing belt 36 is wound around from above. Center bracket 3
A pair of left and right tension pulleys 40, 40 are rotatably supported on both left and right sides of the drive pulley 39 of the drive unit 7, and the left and right tension pulleys 40, 40 are attached to the upper traveling portion of the timing belt 36 from outside. By pressing, the timing belt 36 is pressed against the driving pulley 39, and at the same time, an appropriate tension is urged.

A linear guide rail 41 is laid horizontally in the left-right direction on the front surface of the vertical member of the angle-shaped steel base plate 33, and a traveling block 42 is laid on the linear guide rail 41 so as to run freely in the left-right direction. Have been. A connecting tool 43 is fixed to the upper surface of the traveling block 42, and the connecting tool 43 is connected to a central portion of a lower traveling portion of the timing belt 36. That is, the traveling block 42
Is driven in the left-right direction with the linear guide rail 41 being guided by the travel of the timing belt 36 via the drive pulley 39 by the servomotor 38.

A first air cylinder 45 is mounted vertically downward on a front surface of the traveling block 42 via a bracket 44, and a second air cylinder 48 is mounted on a piston rod 46 of the first air cylinder 45. It is arranged horizontally in the left-right direction via a bracket 47 and is suspended.
The second air cylinder 48 is provided with left and right piston rods 49, 49 which advance and retreat in the left and right direction.
0 and 50 are arranged symmetrically and fixed so as to extend vertically. Left and right lower retainers 50, 5
0 is a piston rod 49 below the handle 28 of the pod 26.
Is made to enter from both left and right sides and face the lower end surface of the handle 28.

A third air cylinder 51 is installed vertically downward at the center of the lower surface of the second air cylinder 48, and an upper holding member is provided at the lower end of the piston rod 52 of the third air cylinder 51. 53 are fixed orthogonally. The upper presser 53 presses and contacts the upper surface of the handle 28 of the pod 26 by the extension operation of the piston rod 52, thereby cooperating with the left and right lower pressers 50, 50 to grip the handle 28 of the pod 26. . In addition,
The above mechanism in the pod transport device 30 is a cover 54
1 as a whole, as shown in FIG.

The operation of picking up and putting down the pod 26 by the pod transport device 30 will be described with reference to FIG.

When the pod transport device 30 picks up the pod 26 placed on the first pod stage 24, as shown in FIG.
Is located right above the handle 28 of the pod 26 placed on the first pod stage 24. That is, the traveling block 4
2 moves in the left-right direction with the linear guide rail 41 being guided by the travel of the timing belt 36 via the drive pulley 39 by the servomotor 38, whereby the upper presser 53 is moved to a predetermined position. At this time, the left and right lower retainers 50, 50 are open on both sides above the handle 28 by the piston rods 49, 49 of the second air cylinder 48.

As shown in FIG. 5 (b), the upper retainer 53 and the left and right lower retainers 50, 5 and 5 in the opened state.
0 is lowered by the extension operation of the piston rod 46 of the first air cylinder 45 to a position opposing the upper side and the lower side of the handle 28 while maintaining the interval in the vertical direction.

As shown in FIG. 5C, the left and right lower retainers 50, 50 are inserted under the handle 28 by the shortening operation of the piston rods 49, 49 of the second air cylinder 48. . By this insertion, the lower holding 5
The upper surfaces of the tips 0 and 50 are opposed to each other with a slight gap between the left and right ends of the lower surface of the handle 28.

In this state, as shown in FIG. 5D, when the piston rod 46 of the first air cylinder 45 is shortened, the tips of the left and right lower retainers 50, 50 are gripped. In order to contact the left end and the right end of the lower surface of 28, the left and right lower retainers 50, 50 are in a state of scooping up the pod 26. At the same time, when the upper presser 53 is lowered by the extension operation of the piston rod 52 of the third air cylinder 51, the upper presser 53 and the left and right lower pressers 5
0 and 50 indicate a state in which the grip 28 is gripped from above and below.
As described above, the handle 28 is made up of the upper holder 53 and the lower holder 50.
Thus, the pod transporting device 30 can transport the pod 26 safely and promptly because the pod 26 is held by the clamp portion constituted by the above.

Then, the pod transport device 30 holds the pod 26 directly above the first pod stage 24 and directly above the mounting table 22 of the pod opener 21 with the handle 28 being gripped by the upper holder 53 and the lower holder 50. Transport to In other words, the pod transport device 30 moves the pod 26 to the pod 26 by the traveling block 42 traveling in the left and right direction with the linear guide rail 41 being guided by the traveling of the timing belt 36 via the driving pulley 39 by the servomotor 38. The sheet is conveyed directly above the mounting table 22 of the opener 21.

The pod 26 conveyed right above the mounting table 22 of the pod opener 21 is mounted (put down) on the mounting table 22 by an operation reverse to that described above. That is,
First, as shown in FIG.
Is slightly raised by the shortening operation of the piston rod 52 of the third air cylinder 51, and then the left and right lower retainers 50, 50 are lowered by the extension operation of the piston rod 46 of the first air cylinder 45, and the pod 26 is Mounting table 2
Landed on 2. Subsequently, as shown in FIG. 5B, the left and right lower retainers 50, 50 are opened by the extension operation of the piston rod 49 of the second air cylinder 48, and are pulled out from the lower space of the handle 28. It is. Thereafter, as shown in FIG. 5A, the upper presser 53 and the left and right lower pressers 50, 50 in the open state are kept apart from each other in the vertical direction while the first air cylinder 45 is kept apart from each other. The piston rod 46 is raised to a predetermined standby position by the extension operation.

As shown in FIG. 1, below the first pod stage 24 and the second pod stage 25, a pod lifting / lowering device 6 shown in FIG.
0 are provided respectively.

That is, as shown in FIG. 6, the pod lifting / lowering device 60 includes a pair of vertically laid guide rails 61, 61.
Between them, a mounting plate 61a is supported so as to be able to move up and down. An upper stage 62 and a lower stage 63 on which the pod 26 is mounted are horizontally fixed to the upper end and the lower end of the mounting plate 61a, respectively. The mounting plate 61a is a driving mechanism composed of an air cylinder or the like. The device 64 is driven to move up and down. The upper-stage elevator 62 and the lower-stage elevator 63 are formed in a U-shape in plan view, and are arranged such that the opening side of the U-shape faces the pod opener 21 side.

The operation of the pod lifting / lowering device 60 according to the above configuration will be described.

FIG. 6A shows a state in which the upper stage 62 is aligned with the upper surface of the mounting table 22 of the pod opener 21. At this time, the piston rod of the driving device 64 is shortened. As shown in FIG. 6B, in a state in which the upper lift 62 and the lower lift 63 are simultaneously raised to the upper positions of the guide rails 61 by the driving device 64, the lower lift 63 is connected to the pod. The opener 21 is aligned with the upper surface of the mounting table 22. By the way, the pod 2 placed on the lower lift 63
When the pod 6 is transported to the pod opener 21, the clamp portion of the pod transport device 30 is inserted through the U-shaped opening of the upper stage lift 62.

Hereinafter, the operation of the small batch type CVD apparatus according to the above configuration will be described mainly with reference to FIGS. 7 and 8, a solid arrow J indicates the movement of the pod, a broken arrow H indicates the movement of the wafer, and a chain arrow S indicates the movement of the elevator of the pod lifting device.

In the initial state shown in FIG. 7A, a pod for accommodating the side dummy wafer Wa (hereinafter, referred to as a dummy wafer pod 26A) is provided on the lower stage 63B of the second pod stage 25. It is placed in an empty state, and the lower lift 63 of the first pod stage 24
A and a pod for accommodating product wafers Wb (hereinafter referred to as product wafer pod 26B) are stored in A and the upper stage 62B of the second pod stage 25 in which a plurality of product wafers Wb to be processed are accommodated. It is placed in each. Incidentally, the side dummy wafer Wa of the dummy wafer pod 26A is transferred to the wafer stocker 18 in advance.

The upper lift 62 of the second pod stage 25
B of a plurality of product wafers Wb is pod product wafers housed (hereinafter, referred to as a first actual pod 26B _1.), As indicated by a solid arrow J ₁ in FIG. 7 (a), the second Pod stage 25 to Pod opener 21
Is transported by the operation of the pod transport device 30 described above with reference to FIG.

[0038] After the first actual pod 26B ₁ of the wafer port which is placed on the table 22 is opened by being removed a cap 27 by the cap removal mechanism 23, FIG. 7
(B) a as indicated by broken line arrows H _1, a plurality of product wafers Wb of the first real pod 26B ₁ is charged into the boat 9 is drawn by the wafer transfer apparatus 10 from the first actual pod 26B ₁ (Charging) is going. The first actual pod 26B ₁ emptied by all product wafers Wb are charged into the boat 9, waits in a state placed on the table 22 of the pod opener 21.

Incidentally, as shown in FIG. 3, side dummy wafers Wa are appropriately distributed from the wafer stocker 18 and loaded on the upper end and the lower end of the boat 9. Therefore, the product wafer Wb is loaded at the center of the boat 9.

As shown in FIG. 3, a predetermined number of side dummy wafers Wa and product wafers Wb (for example, thirty to three in total, including side dummy wafers Wa and product wafers Wb) When twelve (12) are loaded in the boat 9, the boat 9 is lifted by the elevator 7 and carried into the processing chamber of the process tube 4. When the boat 9 reaches the upper limit, the periphery of the upper surface of the seal cap 8 holding the boat 9 closes the process tube 4 in a sealed state, so that the processing chamber is airtightly closed.

In a state where the processing chamber of the process tube 4 is airtightly closed, the processing chamber 4 is evacuated to a predetermined pressure by an exhaust pipe 6, heated to a predetermined temperature by the heater unit 3, and a predetermined raw material gas is introduced. A predetermined flow rate is supplied by the pipe 5. As a result, a desired film corresponding to the preset processing conditions is formed on the product wafer Wb. Here, the number of product wafers Wb to be processed at one time in the processing chamber is set to be equal to or less than the number of product wafers stored in the product wafer pod 26B, which is one product substrate carrier. All the product wafers stored in the product wafer pod 26B, which is a carrier for the product, are processed at once in the processing chamber.

When a predetermined processing time has elapsed, the boat 9 is lowered by the elevator 7, and the boat 9 holding the processed product wafers Wb and the side dummy wafers Wa is unloaded to the original standby position. You.

When the boat 9 is carried out to the standby position, first, the side dummy wafer Wa at the lower end of the boat 9 is transferred to the wafer stocker 18 by the wafer transfer device 10. Subsequently, the processed product wafer W of the boat 9
b is the discharging by the wafer transfer apparatus 10, as indicated by broken line arrows H ₂ in FIG. 7 (b), the original waiting state emptied in table 22 of the pod opener 21 It is accommodated in the first real pod 26B ₁ of. Thereafter, the side dummy wafer Wa at the upper end of the boat 9 is transferred to the wafer stocker 18.

[0044] When accommodating work on the processed product wafers original first actual pod 26B ₁ of Wb is completed, the first actual pod 26B ₁ of product wafers Wb is full are attached to the cap 27 by the cap removal mechanism 23 You. Subsequently, as indicated by a solid arrow J ₂ in FIG. 7 (b), the first actual pod 26B ₁ is the upper lifting table of the first pod stage 24 from the stage 22 of the pod opener 21 6
The pod is transported onto 2A by the above-described operation of the pod transport device 30.

Here, the used side dummy wafer Wa
Will be described. In this replacement work, the empty dummy wafer pod 26A placed on the lower lifting platform 63B of the second pod stage 25 is moved to the upper position, which is the transfer position of the pod transfer device 30 of the second pod stage 25, as shown in FIG. as indicated by the chain line arrow S ₁ in b), it is moved by the elevation of the upper lifting table 62B and the lower lifting table 63B of the pod lifting device 60.

Next, as shown by the solid arrow J ₃ in FIG. 7C, the empty dummy wafer pod 26 A is transferred from the second pod stage 25 to the mounting table 22 of the pod opener 21 by the pod transport device 30. It is conveyed and placed by the operation performed.

The wafer loading / unloading port of the empty dummy wafer pod 26A mounted on the mounting table 22 is opened by removing the cap 27 by the cap attaching / detaching mechanism 23. Then, as indicated by broken line arrows H ₃ in FIG. 7 (c),
The used side dummy wafer Wa stored in the wafer stocker 18 is stored in the empty dummy wafer pod 26A by the wafer transfer device 10. When the used side dummy wafer Wa is stored, the wafer loading / unloading port of the dummy wafer pod 26A is closed by attaching the cap 27 by the cap attaching / detaching mechanism 23.

The used side dummy wafer Wa is stored.
The dummy wafer pod 26A is lowered from the mounting table 22.
And the new dummy wafer Wa is stored in the dummy.
The wafer pod 26A is mounted on the mounting table 22. Continued
FIG. 7 (c) shows a broken arrow H _Four As shown in
From this new dummy wafer pod 26A,
Side dummy wafer Wa is the dummy wafer stocker 18
Is charged by the wafer transfer device 10.

The dummy wafer pod 26A from which the new side dummy wafer Wa has been taken out and emptied is shown in FIG.
As indicated by the solid line arrows J ₄ (c), the back is carried by the above-described operation of the pod transfer device 30 to the lower lifting table 63B of the second pod stage 25 from the stage 22 of the pod opener 21. Empty dummy wafer pod 26A returned to the lower lifting table 63B, as indicated by the chain line arrow S ₂ in FIG. 7 (c), the pod lifting device 6
The lower stage 62B and the lower stage 63B are moved to the lower standby position by the lowering of the upper stage 62B and the lower stage 63B.

[0050] When as described above the replacement of old and new side dummy wafers Wa completed, as indicated by a solid arrow J ₅ in FIG. 8 (a), the upper lifting table 62A of the first pod stage 24 the first actual pod 26B ₁ is conveyed by the pod conveying device 30 from the first pod stage 24 to the second pod stage 25 which is placed, it is placed on the upper lifting table 62B of the second pod stage 25.

[0051] Then, as indicated by the chain line arrow S ₃ in FIG. 8 (a), the upper lifting table 62A and the lower lifting table 63A of the first pod stage 24 is raised by the pod lifting device 60. FIG. 8A shows a solid arrow J _6.
As shown in the figure, the second real pod 26B ₂ placed on the lower lifting platform 63A of the first pod stage 24 is moved from the first pod stage 24 to the loading platform 2 of the pod opener 21.
The pod is transported and placed on the pod 2 by the pod transport device 30.

[0052] After the second actual pod 26B ₂ of the wafer port which is placed on the table 22 is opened by being removed a cap 27 by the cap removal mechanism 23, FIG. 8
(A) in as indicated by broken line arrows H _5, a plurality of product wafers Wb of the second actual pod 26B ₂ are charged into the boat 9 is drawn by the wafer transfer apparatus 10 from the second actual pod 26B ₂ (Charging) is going. Second actual pod 26B ₂ emptied by all product wafers Wb are charged into the boat 9, waits in a state placed on the table 22 of the pod opener 21.

[0053] Then, predetermined processing is performed in the same manner as the first real pod 26B _1. When a predetermined processing is completed, FIG. 8 as indicated by broken line arrows H ₆ (a), the processed product wafers Wb is mounting the second real pod 26B of the original waiting on table 22 ₂ Is returned by the wafer transfer device 10. When accommodating work on the processed product wafers original second actual pod 26B ₂ of Wb is completed, the cap by the second real pod 26B ₂ cap detaching mechanism 23 which product wafers Wb is full 2
7 is attached.

[0054] This is the second in the process for product wafers Wb real pod 26B _2, solid arrows J in FIG. 8 (a)
_As shown by ₆ , the first actual pod 26B ₁ placed on the upper stage 62B of the second pod stage 25
Is transported from the second pod stage 25 to the next process by the in-process transport device.

On the other hand, as shown by a chain line arrow S ₄ in FIG.
2A and the lower lifting platform 63A are lowered by the pod lifting device 60. Then, as indicated by the solid line arrows J ₇ in FIG. 8 (b), on the upper lifting table 62A of the first pod stage 24, for subsequent product wafers which a plurality of product wafers Wb is housed pod (hereinafter, referred to as a third actual pod 26B _3.) is placed to come is conveyed by process transfer device from the previous step.

In turn, the mounting table 22 of the pod opener 21
The second real pod 26B equipped with the cap 27 in
_2, FIG. 8 as indicated by the solid arrow J ₈ (b), the pod transportation device 3 from the mounting table 22 of the pod opener 21 onto the upper lifting table 62B of the second pod stage 25
0 is conveyed by the aforementioned operation.

[0057] Then, as indicated by the solid line arrows J ₉ in FIG. 8 (c), the third actual pod 26B ₃ placed on the upper lifting table 62A of the first pod stage 24 is first pod stage 24 Is transported by the pod transport device 30 onto the mounting table 22 of the pod opener 21 and placed.
Thereafter, as indicated by the solid line arrows J ₁₀ in FIG. 8 (c), on the upper lifting table 62A of the first pod stage 24, the following fourth fruit plurality of product wafers Wb is housed pod 26B ₄ is placed to come is conveyed by process transfer device from the previous step.

[0058] After the wafer port of the third real pod 26B ₃ placed on the table 22 is opened by being removed a cap 27 by the cap removal mechanism 23, FIG. 8
(C) a as indicated by broken line arrows H _7, a plurality of product wafers Wb of the third real pod 26B ₃ is charged into the boat 9 is drawn by the wafer transfer apparatus 10 from the third actual pod 26B ₃ (Charging) is going. Third actual pod 26B ₃ emptied by all product wafers Wb are charged into the boat 9, waits in a state placed on the table 22 of the pod opener 21.

[0059] Then, predetermined processing is performed in the same manner as the first real pod 26B _1. When a predetermined processing is completed, FIG. 8 as indicated by broken line arrows H ₈ (c), the third actual pod 26B ₃ of the original waiting on the treated product wafers Wb worktable 22 Is returned by the wafer transfer device 10. When accommodating work on the processed product wafers Wb original third actual pod 26B ₃ is complete, the cap by the third actual pod 26B ₃ cap detaching mechanism 23 which product wafers Wb is full 2
7 is attached.

[0060] This is the third in the process for product wafers Wb real pod 26B _3, solid arrows J in FIG. 8 (c)
_As shown at ₁₁ , the second real pod 26B ₂ placed on the upper stage 62B of the second pod stage 25
Is transported from the second pod stage 25 to the next process by the in-process transport device.

Thereafter, the above-described operation is repeated, and the product wafers Wb, for example, 25
Batch processing is performed by the VD apparatus 1.

The side dummy wafer Wa loaded in the wafer stocker 18 is placed on the wafer stocker 18 and used repeatedly while it can be reused. Then, at the time when the warp or contamination of the side dummy wafer Wa becomes equal to or more than the allowable value due to repeated use, the side dummy wafer Wa is replaced with a new side dummy wafer by the above-described operation.

According to the above embodiment, the following effects can be obtained.

1) By setting the number of product wafers per batch to 25 or less, the batch type C
Since the VD apparatus only needs to handle one product wafer as a product wafer carrier per batch and one second pod as a side dummy wafer carrier per batch, compared to the conventional large batch type CVD apparatus, Tact time (time from wafer introduction to wafer unloading) can be greatly reduced.

2) By setting the number of pods to be handled to a small number, the size of the CVD apparatus can be reduced, so that the initial cost and running cost of the CVD apparatus can be reduced, and the footprint (occupied floor) can be reduced. Area) can be reduced, and the clean room can be effectively utilized.

3) By reducing the number of side dummy wafers used per batch, the initial cost and running cost of the dummy wafer can be reduced as compared with a large batch type CVD apparatus.

4) A first pod stage and a second pod stage are provided on both left and right sides of the pod opener, and the pod is temporarily stored by transporting the pod between the pod opener and the pod stage by a pod transport device. Can be omitted, so that initial costs and running costs can be further reduced when handling small batches.

5) By installing the pod transport device directly above the pod opener and the first pod stage and the second pod stage, it is possible to avoid an increase in the occupied area due to the installation of the pod transport device. ,
The throughput of the small batch type CVD apparatus can be increased.

6) By installing a pod lifting / lowering device on the pod stage, the pod can be made to stand by extra without increasing the lateral width of the entire CVD device, so that the throughput of the small batch type CVD device can be further increased. it can.

The present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the scope of the present invention.

For example, in the above embodiment, the case where the side dummy wafer Wa is transferred from the dummy wafer pod 26A to the wafer stocker 18 and handled is described, but the side dummy wafer Wa is transferred from the dummy wafer pod 26A to the boat 9. It may be handled as if it were transferred. Incidentally, also in this case, the side dummy wafer Wa
Is replaced at a time when warpage and contamination increase due to repeated processing. However, the wafer stocker 18 is a stocker (storage location) for storing dummy wafers. By storing the side dummy wafers Wa in the wafer stocker 18, the side dummy wafers Wa are transferred between the boat 9 and the wafer stocker 18. It should just be conveyed by. Therefore, there is no need to take out the side dummy wafer Wa to the outside of the housing 2 for each process, so that the tact time can be reduced.

Further, in the above-described embodiment, one product wafer pod is supplied to perform one process, and no more than twenty-five product wafers in one product wafer pod are processed at one time. Was explained,
By handling the side dummy wafer Wa in the wafer stocker 18, two pods for product wafers are put in to perform one processing, and setting is made so that 50 or less product wafers are processed at a time. Can also.

The small batch type CVD apparatus can be used not only for the film forming process but also for processes such as an oxide film forming process and a diffusion process.

In the above embodiment, the case of the small batch type CVD apparatus has been described. However, the present invention is not limited to this, and can be applied to all substrate processing apparatuses.

[0075]

As described above, according to the present invention,
A substrate processing apparatus suitable for handling a small number of substrates and capable of reducing cost can be provided.

[Brief description of the drawings]

FIG. 1 shows a small batch type CVD according to an embodiment of the present invention.
It is a perspective view showing the appearance of an apparatus.

FIG. 2 is a plan sectional view thereof.

FIG. 3 is a side sectional view thereof.

FIG. 4 is a perspective view showing a pod transport device.

FIG. 5 is a partial front view for explaining the operation.

6A and 6B are perspective views showing a pod lifting device, and FIG.
Indicates a descending state, and (b) indicates an ascending state.

FIGS. 7A and 7B are partial front views for explaining the operations of charging and discharging the wafer.

FIG. 8 is a partial front view of the same.

[Explanation of symbols]

W: wafer (substrate), Wa: side dummy wafer (dummy substrate), Wb: product wafer (product substrate), 1 ...
Small batch type CVD device (substrate processing device), 2 ... housing, 3
... heater unit, 4 ... process tube, 5 ... gas introduction pipe, 6 ... exhaust pipe, 7 ... elevator, 8 ... seal cap, 9 ... boat, 10 ... wafer transfer device, 11 ... rotary actuator, 12 ... first linear Actuator, 13: second linear actuator, 14: moving table,
15 Tweezer, 16 Elevator, 17 Clean unit, 18 Wafer stocker (substrate storage location), 20
.., Wafer loading / unloading port, 21 pod opener, 22 mounting table, 23 cap attaching / detaching mechanism, 24 first pod stage, 25 second pod stage, 26 pod, 26
A: Pod for dummy wafer, 26B: Pod for product wafer, 26B ₁ ... first real pod, 26B ₂ ... second real pod, 26B ₃ ... third real pod, 26B ₄ ... fourth real pod, 27 ... cap, 28 ... handle, 30 ... pod transport device, 31 ... mounting plate, 32 ... bracket, 33 ... base plate, 34 ... bracket, 35 ... pulley, 36 ... timing belt, 37 ... bracket, 38 ... servo motor,
39 ... drive pulley, 40 ... tension pulley,
41: Linear guide rail, 42: Travel block, 43
... Connecting tool, 44 ... Bracket, 45 ... First air cylinder, 46 ... Piston rod, 47 ... Bracket, 48 ...
Second air cylinder, 49 ... Piston rod, 50 ... Lower press, 51 ... Third air cylinder, 52 ... Piston rod, 53 ... Upper press, 54 ... Cover, 60 ... Pod elevating device, 61 ... Guide rail, 61a: mounting plate, 6
2, 62A, 62B ... upper stage elevating platform, 63, 63A, 63
B: Lower lifting platform, 64: Drive unit.

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) H01L 21/31 H01L 21/31 BE (72) Inventor Takeshi Takeshi 3-14-20 Higashinakano, Nakano-ku, Tokyo Stock Company Hitachi Kokusai Electric Co., Ltd. FA12 GA03 GA19 GA30 GA47 GA48 GA49 GA60 HA61 LA12 LA13 LA15 MA15 MA16 MA28 NA02 NA07 5F045 BB08 DP19 EB08 EM01 EM10 EN01 EN05

Claims (1)

[Claims] 1. A pod opener for opening and closing a cap of a pod in which a plurality of substrates are stored, a plurality of pod stages installed at positions adjacent to the pod opener for mounting the pod, A pod lifting / lowering device for moving the pods placed thereon up and down,
A substrate processing apparatus comprising: a pod transfer device that transfers the pod between the pod stage and a pod opener.