KR100978855B1 - Substrate processing apparatus and method for transferring substrate of the same - Google Patents

Abstract

The substrate processing apparatus includes a main loader providing a substrate to the process module, a buffer loader facing the process module with the main loader interposed therebetween, and a port transfer unit positioned between the main loader and the buffer loader. The main stacker and the buffer stacker may load a plurality of storage containers containing substrates, and the port transfer unit transports the storage container between the main stacker and the buffer stacker. In this way, the substrate processing apparatus includes a separate buffer stacking unit for waiting for the storage container in addition to the main stacking unit for providing a substrate for process input. Accordingly, the substrate processing apparatus can shorten the time required for transferring the substrate and improve the productivity.

Description

SUBSTRATE PROCESSING APPARATUS AND METHOD FOR TRANSFERRING SUBSTRATE OF THE SAME}

The present invention relates to an apparatus for manufacturing a semiconductor substrate, and more particularly to a substrate processing apparatus for processing a semiconductor substrate and a substrate transfer method thereof.

In general, in the substrate manufacturing process, the deposition, etching, coating of photoresist, development, and removal of asher are repeated several times in order to perform fine patterning. Patterning) is made, and as the process progresses, foreign substances are left in the substrate that are not completely removed by etching or ashing. A process for removing such foreign matters is a cleaning process using deionized water or chemical.

Substrate cleaning devices are classified into a batch processor and a single processor. The batch washing apparatus includes a chemical bath, a rinse bath, a dry bath, and the like, which can process 25 sheets or 50 sheets at a time. The batch cleaning device soaks the substrates in each bath for a period of time to remove debris. Such a batch cleaning device has the advantage that the upper and lower portions of the substrate can be cleaned at the same time and at the same time can handle a large capacity. However, as the diameter of the substrate increases, the size of the tank increases, and thus the size of the apparatus and the amount of chemical liquid used increase, and at the same time, foreign matters separated from adjacent substrates are reattached to the substrate that is being cleaned in the chemical chamber.

Recently, due to the increase in the diameter of the substrate, sheet type cleaning devices are frequently used. The single sheet cleaning apparatus fixes the substrate with a substrate chuck in a small chamber capable of processing a single substrate, and then rotates the substrate by a motor and nozzles at the top of the substrate. The chemical liquid or pure water is provided to the substrate through. Chemical liquid or pure water is spread over the substrate by the rotational force of the substrate, thereby removing foreign substances adhering to the substrate. Such single sheet type washing apparatus has a smaller size and a homogeneous washing effect than the batch type washing apparatus.

In general, the single-leaf type washing apparatus is composed of a structure including a plurality of load ports, an index robot, a buffer unit, a plurality of process chambers, and a main transfer robot from one side. Each load port is loaded with a front opening Unified Pod (FOUP) containing substrates. The index robot transfers the substrate stored in the pool to the buffer unit, and the main transfer robot transfers the substrate stored in the buffer unit to each process chamber. The main transfer robot loads the cleaned substrate into the buffer unit in the process chamber, and the index robot removes the cleaned substrate from the buffer unit and stores the cleaned substrate again in the pool. When the storage of the substrates cleaned in the pool is completed, the pool is returned to the outside.

In general, the loosened is transported by an overhead hoist transport (OHT). The logistics transfer device transfers the pool in which the substrates before the cleaning process are stored and loads it into an empty load port, and picks up the pool in which the cleaned substrates are stored from the load port and transports the pool to the outside.

Since the logistic transfer device is operated at a low speed, it takes longer to transfer the pool by the logistic transfer device than the time required to take out and clean the substrates from the pool and then complete the storage of the cleaned substrates again. In particular, as the efficiency of the cleaning apparatus is improved through technology development, the cleaning processing time of the substrate is shortened, but the logistics transport apparatus is still running at a low speed. For this reason, the pull conveyance efficiency of a logistics conveyance apparatus further reduces, the idle time of a washing | cleaning apparatus increases, and productivity falls.

An object of the present invention is to provide a substrate processing apparatus capable of improving the transfer efficiency of the substrate.

It is also an object of the present invention to provide a method of transferring a substrate in the substrate processing apparatus described above.

A substrate processing apparatus according to one feature for realizing the object of the present invention described above comprises a process module, a main loader, a buffer loader and at least one port transfer unit.

The process module is processed of the substrate. The main loading part is installed at the front end of the process module, and loads a plurality of storage containers for storing the substrates, respectively, and transfers the substrate between the loaded storage container and the process module. The buffer stacker faces the process module with the main stacker therebetween and stacks the storage container. The port transfer unit is located between the main loading portion and the buffer loading portion, and transfers the storage container between the main loading portion and the buffer loading portion.

The port conveying unit includes a guide lane and a slider. The guide rail is located between the main stack and the buffer stack. Picking up the storage container loaded in the buffer loading unit or the main loading unit, and moves along the guide rail, it is possible to lift and lower.

The substrate processing apparatus may further include a pull transfer unit configured to transfer the storage container between the load ports.

The substrate processing apparatus may further include a logistics transfer unit for loading the storage container into the buffer stacking unit and carrying out the storage container loaded in the buffer stacking unit to the outside.

In addition, the substrate transfer method according to one feature for realizing the above object of the present invention is as follows. First, the storage container in which the substrates waiting to be processed are received is loaded into the buffer storage unit. The storage container loaded in the buffer stacking unit is transferred to the main stacking unit in order to insert the substrates waiting to be processed into a process module in which the substrate is processed. The storage container containing the processed substrates is transferred from the main loading part to the buffer loading part.

The main loading unit is composed of a plurality of load ports, the plurality of load ports are divided into an operation load port for loading the storage container waiting to be processed and a load port for carrying out the loaded storage container is operated,

The buffer stacking unit is composed of a plurality of buffer ports, and the plurality of buffer ports are divided into an input buffer port into which the storage container waiting to be processed is loaded and a load port for carrying out the loaded storage container to be operated.

According to the present invention described above, the substrate processing apparatus includes separate buffer ports for loading the storage containers in addition to the load ports to shorten the time for transferring the storage containers waiting for the process to the load ports. Accordingly, the substrate processing apparatus can shorten the time required for transferring the substrate and improve the productivity.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Hereinafter, a wafer will be described as an example of a semiconductor substrate, but the spirit and scope of the present invention are not limited thereto.

1 is a partial perspective view showing a substrate processing apparatus according to an embodiment of the present invention, Figure 2 is a partial plan view showing the substrate processing apparatus shown in FIG. For reference, FIG. 2 is a pull transfer shown in FIG. 1 to clearly show the arrangement relationship between the main loader 200, the buffer loader 300, and the plurality of port transfer units 400 shown in FIG. 1. The unit 500 is omitted.

1 and 2, the substrate processing apparatus 800 of the present invention supplies a process module 100 in which a wafer processing process is performed, and supplies unprocessed wafers to the process module 100, and processes the processed wafers externally. The substrate supply module 600 to be carried out to the.

Specifically, the unprocessed wafers are provided to the substrate processing apparatus 800 in a state of being housed in a front opening Unified Pod (FOUP) 10, and likewise, the processed wafers are also provided to the pool 10. It is stored and taken out.

3 is an exploded perspective view showing the pull shown in FIG.

Referring to FIG. 3, the pull 10 includes an accommodating part 11 having an accommodating space RS for accommodating wafers, and a door 12 enclosing the accommodating space RS. The accommodating part 11 may include an accommodating body 11a having one side open to the wafers, and a plurality of support protrusions formed on the accommodating body 11a. The plurality of support protrusions are formed on both side walls of the receiving body 11a facing each other, and are spaced apart from each other in a vertical direction with respect to the bottom surface of the receiving body 11a.

Each support protrusion 11b protrudes from an inner wall of the housing body 11a to support an end of the wafer. One wafer is formed on different sidewalls of the housing body 11a and supported by two support protrusions facing each other. At this time, the wafers accommodated in the pool 10 are disposed to face the bottom surface of the housing body 11a.

The door 12 is provided at an open side of the housing body 11a to seal the inside of the housing body 11a.

Referring again to FIGS. 1 and 2, the process module 100 includes an index robot 110 that pulls out unprocessed wafers from the pool 10 supplied to the substrate supply module 600. The wafers drawn by the index robot 110 are provided to a plurality of process chambers (not shown) in which a processing process is performed. In the process chambers, a processing process such as wafer cleaning may be performed. In addition, the index robot 110 loads the processed wafers back into the corresponding pool 10 loaded on the substrate supply module 600. That is, the wafers on which the processing process is completed are withdrawn from the process chambers, and the index robot 110 transfers the processed wafers and loads the processed wafers into the pool 10.

On the other hand, the substrate supply module 600 for providing wafers in the unit of the pool 10 is installed at the front end of the process module 100.

Specifically, the substrate supply module 600 may include a main loading unit 200, a buffer loading unit 300, a plurality of port transfer units 400, and a pull transfer unit 500.

The main loading part 200 is installed at the front end of the process module 100 to be in contact with the process module 100. The main loading part 200 may include a plurality of load ports 210,..., 240, and one pull 10 may be loaded in each load port 210,..., 240.

In this embodiment, the main loading unit 200 is composed of four load ports (210, ..., 240), the number of the load port (210, ..., 240) is the substrate processing apparatus It may increase or decrease depending on the process efficiency of 800.

The load ports 210,..., 240 are located on one sidewall of the partition bay 120 in which the facilities of the process module 100 are embedded, and the load bays 210,. In response to 240, a plurality of door openers are installed. Each door opener 130 opens and closes the door 12 (see FIG. 3) of the pull 10 seated in a corresponding load port.

The load ports 210, ..., 240 are disposed in parallel in the horizontal direction with respect to the ground, each load port (210, ..., 240) is sliding to be installed on the surface supporting the pull 10 Plate 211 may be included. The sliding plate 211 is moved in the horizontal direction to adjust the horizontal position of the pool 10 seated on the upper surface.

That is, when the pull 10 is seated on the load ports 210, ..., 240, the sliding plate 211 moves horizontally in the first direction D1 to move the pull 10 to the door opener ( 130, the door opener 130 opens the door 12 (see FIG. 3) of the pull 10. When the door 12 of the pull 10 is opened, the index robot 110 withdraws the wafer from the open pull 10.

When storage of the processed wafers is completed in the pool 10, the door opener 130 closes the door 12 of the pool 10 to seal the pool 10 and the sliding plate 211. Moves horizontally in the second direction D2 opposite to the first direction D1 to move the pull 10 backward.

Fixing protrusions 211a may be formed on the upper surface of the sliding plate 211 to fix the pull 10 loaded on the sliding plate 211. The fixing protrusions 211a are coupled to the pool 10 loaded on the sliding plate 211 to fix the pool 10 to the sliding plate 211.

Meanwhile, the buffer stacking unit 300 is installed at the rear of the main stacking unit 200. The buffer loading part 300 faces the process module 100 with the main loading part 200 interposed therebetween, and loads a plurality of pools.

In detail, the buffer loading unit 300 includes a plurality of buffer ports 310,..., 340. In one example of the present invention, the plurality of buffer ports 310,..., 340 is formed in the same number as the plurality of load ports 210,..., 240, and the load ports 210,. .., 240 and one-to-one correspondence. However, the number of buffer ports 310,..., 340 may increase or decrease depending on the process efficiency of the substrate processing apparatus 800.

The buffer ports 310,..., 340 are arranged in the same direction as the load direction of the load ports 210,..., 240. Facing the corresponding load port. Each of the buffer ports 310,..., 340 may include a plurality of coupling protrusions 311 for fixing the pull 10 mounted on the upper surface. The coupling protrusions 311 are coupled to the pool 10 loaded on the upper surface of the buffer ports 310,..., 340 to couple the pool 10 to the buffer ports 310,..., 340. ).

The plurality of port transfer units 400 are installed between the main loader 200 and the buffer loader 300. The plurality of port transfer units 400 are located in a one-to-one correspondence with the buffer ports 310,..., 340, and each port transfer unit 400,..., 440 is the main loading part 200. And the pool 10 between the buffer stacking unit 300.

In this embodiment, the substrate processing apparatus 800 includes four port transfer units 410, ..., 440, but the number of the port transfer units 410, ..., 440 is the buffer. It may increase or decrease depending on the number of ports 310,..., 340.

FIG. 4 is a perspective view illustrating the load port, the buffer port, and the port transfer unit illustrated in FIG. 1, and FIG. 5 is a perspective view illustrating the slider illustrated in FIG. 4.

2 and 4, the plurality of port transfer units 400 may include first to fourth port transfer units 410,..., 440. In this embodiment, the first to fourth port transfer units 410, ..., 440 have the same configuration. Therefore, hereinafter, in the detailed description of the configuration of the first to fourth port transfer units 410, ..., 440, the first port transfer units 410, ..., 440 will be described as an example. The detailed description of the second to fourth port transfer units 410,..., 440 will be omitted.

The first port transfer unit 410 may include a slider 411 for loading and transferring the pull 10 and a guide rail 412 for guiding a movement path of the slider 411.

4 and 5, the slider 411 includes a plate 411a, a support shaft 411b, a vertical driver 411c, a moving plate 411d, and a horizontal driver 411e. When the pool 10 is transferred between the main stack 200 and the buffer stack 300, the pool 10 is seated on the plate 411a. The plate 411a is formed with a plurality of protrusions 41 for fixing the pool 10 on the upper surface in order to safely transport the pool 10. In this embodiment, the plate 411a has a triangular shape, but the shape of the plate 411a is not limited thereto.

The support shaft 411b is coupled to the bottom surface of the plate 411a. The support shaft 411b supports the plate 411a and is coupled to the vertical driver 411c. The support shaft 411b is raised and lowered together with the plate 411a according to the driving of the vertical driver 411. The vertical driving part 411 is coupled to the upper surface of the moving plate 411d. The moving plate 411d is coupled to the guide rail 412 and the horizontal driver 411e. The moving plate 411d moves along the guide rail 412 by driving the horizontal driver 411e. Accordingly, the plate 411a and the support shaft 411b provided on the moving plate 411d move horizontally.

Referring again to FIGS. 2 and 4, each of the load ports 210, ..., 240 is formed with first openings 212, 222, 232, 242 that can receive corresponding port transfer units. . Each of the first openings 212, 222, 232, 242 is provided as a passage through which the plate 411a of the corresponding port transfer unit can be raised and lowered in the corresponding load port.

In this embodiment, each sliding plate 211 has the first openings 212, 222, 232, and 242 in the same shape as the plate 411a, but the shape is not limited thereto.

Like the load ports 210, ..., 240, each of the buffer ports 310, ..., 340 has a second opening 312, 322, 332, which can receive a corresponding port transfer unit. 342 is formed. Each second opening 312, 322, 332, 342 is provided as a passage through which the plate 411a of the corresponding port transfer unit can be raised and lowered within the corresponding buffer port.

Hereinafter, for convenience of description, load ports 210,..., 240 and buffer ports 310, corresponding to the first to fourth port transfer units 410,..., 440, respectively. ..., 340 are referred to as first to fourth load ports 210,..., 240, and first to fourth buffer ports 310,..., 340. The units 410, ..., 440, the first to fourth load ports 210, ..., 240 and the first to fourth buffer ports 310, ..., 340 are in the same direction. Are arranged sequentially.

Hereinafter, the transfer process of the pull 10 between the main loading unit 200 and the buffer loading unit 300 will be described below using the first port transfer unit 410 as an example.

In the case of transferring the loose seated on the first load port 210 to the first buffer port 310, first, the slider 411 of the first port transfer unit 410 is moved by the horizontal drive unit 411e. The drive moves horizontally toward the first load port 210 along the corresponding guide rail 412. In this case, the plate 411a is positioned lower than the sliding plate 211 of the first load port 210. Subsequently, the plate 411a is moved up and down through the first opening 212 of the first load port 210 by driving the vertical driver 411c, and thus, the first load port 210 is moved to the first load port 210. The loaded loose is seated on the plate 411a. In this case, the vertical driving unit 411c raises and lowers the plate 411a higher than an upper surface of the first load port 210. Subsequently, the slider 411 horizontally moves toward the first buffer port 310 along the guide rail 412. In this case, the plate 411a is positioned higher than the top surface of the first buffer port 310. Subsequently, the plate 411a is lowered through the second opening 312 of the first buffer port 310 by the driving of the vertical driver 411c, and thus, the loose loaded on the plate 411a is removed. The first buffer port 310 is seated.

On the contrary, when transferring the loose seated on the first buffer port 310 to the first load port 210, first, the plate 411a of the first port transfer unit 410 is first buffered. Ascending and descending through the second opening 312 of the port 310, the loosening loaded in the first buffer port 310 is seated on the plate (411a). Subsequently, the slider 411 moves horizontally along the guide rail 412 toward the first load port 210. In this case, the plate 411a is positioned higher than an upper surface of the first load port 210. Subsequently, the plate 411a descends through the first opening 212 of the first load port 210, and accordingly, a release loaded on the plate 411a is applied to the first load port 210. It is seated.

Each slider 411, 421, 431, 441 of the first to fourth port transfer units 410,..., 440 waits in a first opening of a corresponding load port or a second opening of a corresponding buffer port. can do.

Referring back to FIG. 1, the pull transfer unit 500 for transferring the pull 10 between the load ports 210,..., 240 is installed at the upper portion of the main loading part 200.

In detail, the pull transfer unit 500 may include a transfer rail 510 and a pickup unit 520. The transfer rail 510 extends in a direction in which the load ports 210,..., 240 are arranged. In this embodiment, the transfer rail 510 is installed on the top of the partition bay 120 of the process module 100, but may be installed separately from the partition bay 120.

The pickup unit 520 is coupled to the transfer rail 510 to move horizontally along the transfer rail 510, and picks up a pull loaded in any one of the load ports 210,..., 240. do. Specifically, the pick-up unit 520 is coupled to the transfer rail 510, the rail moving unit 521 moving along the transfer rail 510, the top 10 of the pool 10 to be transported when transferring the pool 10 It may include a fixing part 522 detachably coupled to the, and a wire part 523 for adjusting the vertical position of the fixing part 522.

One side of the rail moving part 521 is coupled to the transfer rail 510 and moves in a horizontal direction to adjust a horizontal position of the fixing part 522. That is, the rail moving part 521 moves to the load ports 210,..., 240 loaded with the pull 10 to be transferred along the transfer rail 510. Accordingly, the pickup unit 520 is located above the load port. When the rail moving part 521 moves, the fixing part 522 is positioned at a height such that interference with the pools mounted on the main loading part 200 does not occur.

One end of the wire part 523 is coupled to the fixing part 522, and the other end thereof is coupled to the rail moving part 521. The wire part 523 raises and lowers the fixing part 522 by adjusting its length.

That is, when the pickup 520 is located above the load port on which the pull 10 to be transferred is loaded, the wire part 523 lowers the fixing part 522 to correspond to the fixing part 522. It is located on the upper surface of the pool (10). The fixing part 522 is coupled to the upper surface of the pull 10 and fixes the pull 10 to the pickup part 520. When the pull 10 is fixed to the fixing part 522, the wire part 523 lifts the fixing part 522 to loosen the coupling coupled to the fixing part 522 to the main loading part 200. Position it so that it does not interfere with the grass loaded on the floor. Subsequently, the rail moving part 521 moves to the load port to load the pull 10 picked up along the transfer rail 510. Subsequently, the wire part 523 lowers the fixing part 522 to load the picked up pull 10 into the load port.

In this embodiment, the fixing part 522 is coupled to the upper surface of the pool 10, but may be detachably coupled to the side of the pool 10. In addition, the pickup part 520 adjusts the vertical position of the fixing part 522 by using a wire, but has a separate arm movable in the vertical direction or by using a separate rail of the fixing part 522. You can also change the vertical position.

On the other hand, the upper portion of the buffer stacking unit 300 is equipped with a facility rail 720 for moving the logistics hoist (Overhead Hoist Transfer: OHT) 710. In general, the facility rail 720 is installed on the ceiling of the semiconductor line where the substrate processing apparatus 800 is installed. The logistic transfer device 710 moves along the facility rail 720 and loads the pull 10 from the outside and loads it into one of the buffer ports 310,..., 340. In addition, the logistics transport device 710 picks up any one of the pools loaded in the buffer ports (310, ..., 340) and take it out to the outside.

The logistic transfer device 710 includes a grip portion 711 detachably coupled to the pool to be transferred, the grip portion 711 is adjusted vertical position by a wire.

As described above, the substrate processing apparatus 800 may have separate buffer ports 310,... Which the pool 10 to wait for the process input may wait in addition to the load ports 210,..., 240. 340. Accordingly, since the time required to provide the process waiting pool to the process module 100 is shortened, it is possible to reduce facility idle time and improve productivity.

Hereinafter, with reference to the drawings will be described in detail the process of transferring the pool in the process atmosphere in the substrate processing apparatus 800 and the process of transferring the completed pool to the outside in detail.

6A through 6D are process diagrams illustrating a process of supplying a wafer in the substrate processing apparatus of FIG. 1. 6B and 6D omit the pull transfer unit 500 in order to clearly illustrate the pull transfer relationship between the main loader 200 and the buffer loader 300, and FIG. The buffer stacking unit 300 is omitted in order to clearly show the pool transfer relationship between the main stacking unit 200 and the pool transporting unit 500.

6A and 6B, the logistics transport apparatus 710 may bring in a pull 10 waiting for a process from the outside to be in a standby state among the first to fourth buffer ports 310,..., 340. It loads into the buffer ports 310, ..., 340.

In an example of the present invention, the second to fourth buffer ports 320, 330, and 340 may be loaded with pending processes, and the first buffer port 310 may be loaded with processed pools. That is, the first to fourth buffer ports 310, 320, 330, and 340 may be operated by being divided into an input port for waiting for a process to wait for a process and an export port for waiting for a completed process to wait. have. In this embodiment, the first to fourth buffer ports 310, 320, 330, 340 are divided into three input ports and one export port, but one input port and three export ports It can be divided into ports.

In addition, the load ports 210, ..., 240 are operated in the same manner as the operating method of the buffer ports 310, 320, 330, 340, each buffer port (310, ..., 340) Is used for the same purpose as the corresponding load port.

The pools loaded on the first to third buffer ports 310, 320, and 330 are transferred to the corresponding load ports when the load ports corresponding to the buffer ports are idle. As shown in FIG. 6B, when the fourth load port 240 is in an idle state, the fourth port transfer unit 440 corresponding to the fourth buffer port 340 is the fourth buffer port 340. The pool 10 loaded therein is transferred to the fourth load port 240 and loaded in the fourth load port 240.

Referring to FIGS. 6C and 6D, when the processing of the wafers processed in the pool 10 loaded in the fourth load port 240 is completed, the pickup unit 520 moves along the transfer rail 510. The upper portion of the fourth load port 240. Subsequently, the pickup unit 520 picks up the pull 10 on the fourth load port 240, and then moves along the transfer rail 510 to carry out the first load port 210. It is located at the top. Subsequently, the pickup unit 520 loads the picked-up pull 10 to the first load port 210.

Subsequently, the first port transfer unit 410 corresponding to the first load port 210 transfers the pull 10 loaded on the first load port 210 to the first buffer port 310 to perform the transfer. The first buffer port 310 is loaded.

The logistics transport apparatus 710 transports the pull 10 loaded in the first buffer port 310 to the outside.

Meanwhile, when the loaded load 10 is transferred to the first load port 210, the fourth load port 240 is in an idle state. When the fourth load port 240 is in an idle state, the fourth port transfer unit 440 transfers the pull 20 currently loaded in the fourth buffer port 240 to the fourth load port 240. It is transferred and loaded in the fourth load port 240.

As such, the substrate processing apparatus 800 includes separate buffer ports 310,..., 340 to wait for the pools, and transfers the processed pool to the port transfer unit 400 and the pool transfer. The unit 500 is transferred to the buffer stacking unit 300, and a pool waiting for processing is transferred to the buffer stacking unit 300 using the port transfer unit 400. Accordingly, the substrate processing apparatus 800 may directly inject the pool waiting for the process directly into the process module 100 without depending on the speed of the logistics transfer device 710. Therefore, the substrate processing apparatus 800 may reduce the time required to receive the pool and improve productivity.

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be.

1 is a perspective view showing a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view illustrating the substrate supply module illustrated in FIG. 1.

3 is an exploded perspective view showing the pull shown in FIG.

4 is a perspective view illustrating the load port, the buffer port, and the first transfer unit illustrated in FIG. 1.

5 is a perspective view illustrating the slider shown in FIG. 4.

6A through 6D are process diagrams illustrating a process of supplying a wafer in the substrate processing apparatus of FIG. 1.

Explanation of symbols on the main parts of the drawings

100: process module 200: main loading part

300: buffer loading unit 410, 420, 430, 440: port transfer unit

500: loose transfer unit 600: substrate supply module

710: logistics transfer device 800: substrate processing device

Claims (15)

A process module in which a substrate is processed; A main stacking unit installed at a front end of the process module, each stacking a plurality of storage containers accommodating substrates, and configured to transfer substrates between the stacked storage containers and the process module; A buffer stacker configured to face the process module with the main stacker therebetween to stack the storage container; And And at least one port transfer unit positioned between the main stacking unit and the buffer stacking unit and transferring the storage container between the main stacking unit and the buffer stacking unit. The method of claim 1, wherein the port transfer unit, A guide rail positioned between the main loader and the buffer loader; And And a slider configured to pick up the storage container loaded in the buffer stacking unit or the main stacking unit, move along the guide rail, and move up and down. The method of claim 2, wherein the slider, A plate supporting the storage container when the storage container is transferred; A vertical moving part coupled to the plate to support the plate and to elevate and lower the plate; And And a horizontal moving unit coupled to the vertical moving unit and coupled to the guide rail to move along the guide rail. The method of claim 3, The main loading portion includes a plurality of load ports for loading the storage container, respectively, The load ports are respectively arranged in front of the process module and located parallel to each other, Each load port has a first opening formed therein to accommodate the slider to provide a space for the slider to move up and down. The method of claim 4, wherein The buffer stacking unit includes at least a plurality of buffer ports for loading the storage container, Each buffer port is disposed facing one of the load ports, the substrate processing apparatus characterized in that the second opening is formed to accommodate the slider to provide a space for the slider to move up and down. The substrate processing apparatus of claim 5, further comprising a plurality of pull transfer units corresponding to the buffer ports one-to-one. The method according to any one of claims 4 and 5, And a pull transfer unit configured to transfer the storage container between the load ports. The method of claim 7, wherein the pull transfer unit, A transfer rail extending in a direction in which the load ports are arranged; And And a pick-up unit configured to pick up the storage container loaded in any one of the load ports and move along the transfer rail. The substrate processing apparatus according to claim 7, further comprising a logistics transfer unit for loading the storage container into the buffer stacking unit and carrying out the storage container loaded in the buffer stacking unit to the outside. The method of claim 9, wherein the logistics transport unit, Logistic transfer rail passing through the upper portion of the buffer loading portion, disposed parallel to the transfer rail in plan view; And And a grip part configured to pick up the container and move along the logistics transport rail. Importing a storage container containing substrates waiting to be processed from the outside and loading the storage container into a buffer stacking unit; Transferring the storage container loaded on the buffer stacking unit to the main stacking unit to insert the substrates waiting to be processed into a process module in which the substrate is processed; And  And transferring the receiving container containing the processed substrates from the main loading part to the buffer loading part. The method of claim 11, The main loading unit is composed of a plurality of load ports, the plurality of load ports are divided into an operation load port for loading the storage container waiting to be processed and a load port for carrying out the loaded storage container is operated, The buffer stacking unit is composed of a plurality of buffer ports, and the plurality of buffer ports are operated by being divided into a loading buffer port in which the storage container waiting for processing is loaded and a loading port for loading the processed storage container. A substrate transfer method characterized by the above-mentioned. The method of claim 12, The step of transferring the storage container waiting for processing to the main loading part may include transferring the storage container waiting for processing from the input buffer port corresponding to the idle load port to the idle load port. Substrate transfer method. The method of claim 13, Transferring the processed storage container to the buffer loading unit, Transferring the processed storage container to the loading port; Transferring the storage container loaded in the carrying load port to a carrying buffer port corresponding to the carrying load port; And And transporting the storage container loaded in the carrying buffer port to the outside. The method of claim 14, Transporting the storage container between the load port and the buffer port corresponding to each other is made through a port transport unit for transporting the storage container in a sliding manner, The process of loading the storage container in the input buffer port and transporting the storage container loaded in the carrying buffer port is performed by a logistics transport unit. Transfer of the storage container between the load port is a substrate transfer method, characterized in that made by a pull transfer unit installed on the top of the load ports.

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