KR20100059479A - Substrate transfer device and substrate processing apparatus having the same - Google Patents

Abstract

PURPOSE: A substrate transport apparatus and a substrate processing apparatus having the same are provided to reduce the vibration of an arm unit by moving the center of mass of an arm unit to a center position of a corresponding linear moving member. CONSTITUTION: A plurality of arm units is loaded and move horizontally. A body is combined with the plurality of arm units. The body comprises a case(211) and a plurality of linear moving members. The case is provided beneath the substrate loaded in the arm unit. A plurality of holes(211a) is formed on the sidewall of the case. The linear moving member horizontally moves the corresponding arm unit.

Description

Substrate transfer device and substrate processing device having same {SUBSTRATE TRANSFER DEVICE AND SUBSTRATE PROCESSING APPARATUS HAVING THE SAME}

The present invention relates to an apparatus for manufacturing a semiconductor substrate, and more particularly to a substrate transfer apparatus for processing a semiconductor substrate and a substrate processing apparatus having the same.

In general, in the substrate manufacturing process, the deposition, etching, coating of photoresist, development, and removal of asher are repeated several times in order to perform fine patterning. Patterning) is made, and as the process progresses, foreign substances are left in the substrate that are not completely removed by etching or ashing. A process for removing such foreign matters is a cleaning process using deionized water or chemical.

Substrate cleaning devices are classified into a batch processor and a single processor. The batch washing apparatus includes a chemical bath, a rinse bath, a dry bath, and the like, which can process 25 sheets or 50 sheets at a time. The batch cleaning device soaks the substrates in each bath for a period of time to remove debris. Such a batch cleaning device has the advantage that the upper and lower portions of the substrate can be cleaned at the same time and at the same time can handle a large capacity. However, as the diameter of the substrate increases, the size of the tank increases, and thus the size of the apparatus and the amount of chemical liquid used increase, and at the same time, foreign matters separated from adjacent substrates are reattached to the substrate that is being cleaned in the chemical chamber.

Recently, due to the increase in the diameter of the substrate, sheet type cleaning devices are frequently used. The single sheet cleaning apparatus fixes the substrate with a substrate chuck in a small chamber capable of processing a single substrate, and then rotates the substrate by a motor and nozzles at the top of the substrate. The chemical liquid or pure water is provided to the substrate through. Chemical liquid or pure water is spread over the substrate by the rotational force of the substrate, thereby removing foreign substances adhering to the substrate. This single sheet type washing apparatus has an advantage that the size of the apparatus is smaller than that of the batch washing apparatus and has a homogeneous washing effect.

In general, the single-sheet cleaning device is composed of a structure including a loading / unloading unit, an index robot, a buffer unit, processing units, and the main transfer robot from one side. The index robot transfers the substrate between the buffer unit and the loading / unloading unit, and the main transfer robot transfers the substrate between the buffer unit and the processing units. In the buffer unit, the substrate before cleaning is waited to be introduced into the process unit, or the substrate after cleaning is waited to be transferred to the loading / unloading unit. The main transfer robot transfers the cleaned substrate from the process unit to the buffer unit, and extracts the substrate before cleaning from the buffer unit and puts it into the process unit.

A substrate transfer robot, such as an index robot and a main transfer robot, has a plurality of arms each for loading one substrate, and each arm is horizontally moved to withdraw or load the substrate from an accommodating device, such as a release or buffer portion. The plurality of arms are disposed facing each other in the vertical direction and are installed parallel to the ground. Each arm is coupled to the LM guide and moves horizontally by the movement of the LM guide.

Since the SM guides are disposed in a vertical direction under the plurality of arms, vibrations are generated a lot at the uppermost arm when the arm moves horizontally. For this reason, the number of arms is limited and the transfer efficiency of a board | substrate falls.

It is an object of the present invention to provide a substrate transfer apparatus capable of improving transfer efficiency.

Moreover, the objective of this invention is providing the substrate processing apparatus provided with the said substrate transfer apparatus.

According to one aspect of the present invention, a substrate transfer device includes a plurality of arm units and a body.

The arm units each load a substrate and move in the horizontal direction, respectively. The body engages with the plurality of arm units and moves each arm unit in a horizontal direction. The body includes a case and a plurality of linear moving members. The case is provided below the substrate mounted on the arm unit. The linear moving member is embedded in the case, is arranged horizontally in parallel to the bottom surface of the case, is installed to correspond to the arm units to move the corresponding arm unit horizontally.

Here, each unit has a center of gravity adjacent to the longitudinal center position of the corresponding linear moving member in plan view.

In addition, the substrate processing apparatus according to one feature for realizing the above object of the present invention comprises a receiving member, a process chamber and a transfer member.

The accommodating member accommodates a plurality of substrates arranged to face the ground. The process chamber is a process of processing the substrate. The transfer member draws and loads the substrate from the housing member and transfers the substrate. The conveying member includes a plurality of arm units and a body. The arm units each load a substrate and move in the horizontal direction, respectively. The body engages with the plurality of arm units and moves each arm unit in a horizontal direction. The body includes a case and a plurality of linear moving members. The case is provided below the substrate mounted on the arm unit. The linear moving member is embedded in the case, is arranged horizontally in parallel to the bottom surface of the case, is installed to correspond to the arm units to move the corresponding arm unit horizontally.

According to the present invention described above, since the linear moving members are horizontally arranged, the center of gravity of each arm unit can be moved as much as possible to the center position of the corresponding linear moving member. Accordingly, since the vibration of each arm unit is reduced, the substrate transfer device can stably transfer the substrate, and can increase the number of arm units without limit.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following, the wafer is described as an example of the substrate, but the technical spirit and scope of the present invention are not limited thereto.

1 is a schematic view showing a substrate processing system according to an embodiment of the present invention.

Referring to FIG. 1, the substrate processing system 1000 of the present invention includes a loading / unloading unit 110, an index robot 200, a buffer unit 300, and a main transfer robot ( 500, and a plurality of process chambers 600.

The loading / unloading unit 110 includes a plurality of load ports 110a, 110b, 110c and 110d. In this embodiment, the loading / unloading unit 110 has four load ports 110a, 110b, 110c, and 110d, but the number of load ports 110a, 110b, 110c, and 110d is the substrate. It may increase or decrease depending on the process efficiency and the foot print condition of the processing system 1000.

Front open unified pods (FOUPs) 120a, 120b, 120c, and 120d in which wafers are accommodated are mounted in the load ports 110a, 110b, 110c, and 110d. Each of the pools 120a, 120b, 120c, and 120d is provided with a plurality of slots for accommodating the wafers in a state in which the wafers are arranged horizontally with respect to the ground. In the pools 120a, 120b, 120c, and 120d, wafers that are introduced into the process chamber 600 and processed are received or wafers that are injected into the process chamber 600 to be processed. Hereinafter, for convenience of description, a wafer processed by the substrate processing system 1000 is called a processed wafer, and a wafer not yet processed is called a raw wafer.

A first transfer passage 410 is positioned between the loading / unloading unit 110 and the buffer unit 300, and the index robot 200 is installed in the first transfer passage 410. The index robot 200 is installed on the first transfer rail 420 provided in the first transfer passage 410. The index robot 200 transfers wafers between the buffer unit 300 and the pools 120a, 120b, 120c, and 120d while moving along the first transfer rail 420.

Hereinafter, a configuration of the index robot 200 will be described in detail with reference to the accompanying drawings.

FIG. 2 is a perspective view of the index robot shown in FIG. 1, and FIG. 3 is a cross-sectional view of the index robot shown in FIG. 2.

2 and 3, the index robot 200 includes an index body 210, a plurality of arm units 220, a rotating part 230, a vertical moving part 240, and a horizontal moving part 250. It may include.

In detail, the index body 210 horizontally moves the arm units 220, and each arm unit 221, 222, 223, and 224 is individually driven by the index body 210.

3 and 4, the index body 210 may include a case 211, a frame 212, and a plurality of linear motion guides 213a, 213b, 213c, and 213d.

The case 211 has the frame 212 built therein, and the plurality of L guides 213a, 213b, 213c, and 213d are installed in the frame 212. Although not shown in the figure, a drive unit for driving the L guides 213a, 213b, 213c, and 213d is installed in the frame 212.

The case 211 provides a space in which the frame 212 is accommodated, and the LEDs 213a, 213b, 213c, and 213d correspond one-to-one with the arm units 220. In this embodiment, the index body 210 has four LM guides (213a, 213b, 213c, 213d), but the number of the LM guide is the number of the arm units (221, ..., 224) Increases or decreases accordingly.

The LM guides 213a, 213b, 213c, and 213d are formed of first to fourth LM guides 213a, 213b, 213c, and 213d, and are installed on the bottom surface of the case 211.

The L guides 213a, 213b, 213c, and 213d are disposed in parallel with each other on the bottom surface of the case 211, and a driving unit (not shown) for driving the L guides 213a, 213b, 213c, and 213d. Is connected in a one-to-one correspondence. In addition, the first to fourth LM guides 213a, 213b, 213c, and 213d have one-to-one correspondence with the arm units 220 and are coupled with corresponding arm units. Each of the LM guides 213a, 213b, 213c, and 213d receives a rotational force from the connected driving unit and reciprocates in the longitudinal direction thereof, so that the connected arm unit moves horizontally.

The arm units 220 are installed on the index body 210. The arm units 220 may include first to fourth arm units 221, 222, 223, and 224, and one end of each of the arm units 220 may be coupled to a corresponding M guide. In this embodiment, the index robot 200 has four arm units 221, 222, 223, and 224, but the number of arm units 221, 222, 223, and 224 is determined by the substrate processing system ( It may be increased or decreased depending on the process efficiency of 1000).

 The arm units are spaced apart from each other and each has a support surface on which the wafer is seated. The support surfaces of the arm units 221, 222, 223, and 224 are positioned above the index body 210, have a rectangular shape in plan view, and face each other in a direction perpendicular to the ground.

In one example of the present invention, one end of the first arm unit 221 is coupled to the first LM guide 214a and is horizontally moved according to a horizontal reciprocating movement of the first LM guide 214a. The second arm unit 222 is coupled to the second LM guide 213b positioned outside the first LM guide 213a, and moves horizontally in accordance with the horizontal reciprocating movement of the second LM guide 213b. do. The third arm unit 223 is coupled to the third SM guide 212c and is horizontally moved according to the horizontal reciprocating movement of the third LS guide 213c. The fourth arm unit 224 is coupled to the fourth MP guide 212d and horizontally moved according to the horizontal reciprocating movement of the fourth LS guide 213d.

In this embodiment, the first to fourth arm units 221, 222, 223, and 224 are separated from each other and into the index body 210 through sidewalls facing each other of the index body 210. Connected.

For example, when viewed from the front of the index robot 200, the first and second arm units 221 and 222 are positioned on the left side of the index body 210 and the third and fourth arm units 223, 224 is located on the right side of the index body 210. In this case, the support surfaces of the first to fourth arm units 221, 222, 223, and 224 are sequentially spaced apart from each other in the vertical direction and arranged in parallel, and the support surfaces of the first arm unit 221 are the lowest. Placed in the Accordingly, the second arm unit 222 is located outside the first arm unit 221 on the side of the index body 210, and the fourth arm unit 224 is the third arm unit 223. Located outside). Accordingly, the first and third LM guides 213a and 213c are positioned between the second and fourth LM guides 213b and 213d.

The arm units 220 have the first to fourth LM guides 213a, 213b, 213c, and 213d installed horizontally on the bottom surface of the case 211, so that each arm unit 221 is viewed in plan view. , 222, 223, and 224 may be maximally moved to a central position in the longitudinal direction of the corresponding M guide. Accordingly, since the vibration of each of the arm units 221, 222, 223, and 224 can be minimized, the index robot 200 can transfer the wafer stably, and increase the number of arm units without limit. You can.

A plurality of holes 211a are formed at sidewalls of the case 211 to connect the arm units 220 to the L guides 213a, 213b, 213c, and 213d. The holes 221a are formed to correspond to the LM guides 214a, 214b, 214c, and 214d, and the arm units 220 are partially inserted into the case 211 through the holes.

The arm units 220 may be divided into operation arm units 221 and 222 for transferring a raw wafer and discharge arm units 223 and 224 for transferring a processed wafer. In one example of the present invention, the first and second arm units 221 and 222 are operated as an input arm unit, respectively, and the third and fourth arm units 223 and 224 are discharge arm units, respectively. Can be operated. In this case, the input arm units 221 and 222 and the discharge arm units 223 and 224 are not mixed with each other. That is, the discharge arm units 223 and 224 are positioned above the input index arms 221 and 222. Accordingly, the index robot 200 may prevent the processing wafer from being contaminated by the raw wafer in the process of transferring the raw wafer and the processing wafer, thereby improving the yield of the product.

The input arm units 221 and 222 are mounted on the loading / unloading unit 110 to withdraw the raw wafer from any one of the pools waiting for processing and then load the raw wafers into the buffer unit 300. The index robot 200 may withdraw one or a plurality of raw wafers at a time from the pool waiting to be processed. That is, the input arm units 221 and 222 may simultaneously pull out the raw wafers and then pull out the raw wafers. As a result, two raw wafers are simultaneously taken out from the process waiting pool.

In addition, the index robot 200 may load one or more raw wafers into the buffer unit 300 at a time. That is, the input arm units 221 and 222 simultaneously enter the buffer unit 300 and then simultaneously load the raw wafer seated on the upper surface of the buffer unit 300. As a result, two raw wafers are simultaneously loaded into the buffer unit 300.

In one example of the present invention, the maximum number of wafers that the index robot 200 can withdraw from the pool waiting for the process at one time and the maximum number of wafers that can be loaded into the buffer unit 300 at one time are the input arms. It is equal to the number of units 221, 222.

Meanwhile, the discharge arm units 223 and 224 take out the processed wafer from the buffer unit 300 and then load the processed wafers into the buffer unit 300. The index robot 200 may withdraw one or more processed wafers from the buffer unit 300 at a time. That is, the discharge arm units 223 and 224 may simultaneously enter the buffer unit 300 and then simultaneously extract the processed wafers. As a result, two processed wafers are simultaneously drawn out from the buffer unit 300.

In addition, the index robot 200 may reload one or a plurality of processed wafers into the pool waiting to be processed at a time. That is, the discharge arm units 223 and 224 simultaneously enter the pool waiting for the process, and then simultaneously load the processed wafer seated on the upper surface. As a result, two processed wafers are simultaneously loaded into the process waiting pool.

In one example of the present invention, the maximum number of wafers that the index robot 200 can withdraw from the buffer unit 300 at one time and the maximum number of wafers that can be loaded at a time in the pull are the discharge arm units 223. , 224).

As such, the index robot 200 may draw out and load a plurality of wafers from the pools 120a, 120b, 120c, and 120d and the buffer unit 300 at one time, thereby reducing the time required for wafer transfer. Productivity can be improved.

The rotating part 230 is installed below the index body 210. The rotating unit 230 is coupled to the arm driving unit 210 and rotates to rotate the index body 210. Accordingly, the arm units 220 rotate together.

The vertical moving part 240 is installed below the rotating part 230, and the horizontal moving part 250 is installed below the vertical moving part 240. The vertical moving part 240 is combined with the rotating part 230 to raise and lower the rotating part 230, thereby adjusting the vertical positions of the index body 210 and the arm units 220. . The horizontal moving part 250 is coupled to the first transport rail 420 to move horizontally along the first transport rail 420. Accordingly, the index robot 200 may move along the arrangement direction of the load ports 110a, 110b, 110c, and 110d.

Meanwhile, the buffer unit 300 is located between an area in which the index robot 200 is installed, and an area in which the plurality of process chambers 600 and the main transfer robot 500 are installed. The buffer unit 300 accommodates the raw wafers transferred by the index robot 200 and the processed wafers processed in the process chambers 600.

4 is a perspective view illustrating the buffer unit illustrated in FIG. 1.

1 and 4, the buffer part 300 includes a main body 310 and first and second support parts 320 and 330.

In detail, the main body 310 includes a bottom surface 311, first and second sidewalls 312 and 313 vertically extending from the bottom surface 311, and the first and second sidewalls 312 and 313. It may include a top surface 314 coupled to the top of the).

The main body 310 has a front sidewall facing the index robot 200 and a rear sidewall facing the main transfer robot 500 to open and close the wafer. Accordingly, the index robot 200 and the main transfer robot 500 can easily draw and withdraw wafers from the buffer unit 300.

The first and second sidewalls 312 and 313 are disposed to face each other, and the upper surface 314 is partially removed to form an opening 314a.

The first and second support parts 320 and 330 are formed in the body 310. The first support 320 is coupled to the first sidewall 312, and the second support 330 is coupled to the second sidewall 313. The first and second supports 320 and 330 each include a plurality of supports. The supports of the first support part 320 correspond one to one with the supports of the second support part 330, and the wafer supports the support of the first support part 320 and the support of the second support part 330 corresponding to each other. The end is supported by and is received in the buffer unit 300. In this case, the wafer is disposed to face the bottom surface 311.

The supports of the first and second supports 320 and 330 are spaced apart from each other in the vertical direction. The supports are spaced apart at first intervals by the same number unit as the number of the input arm units 221 and 222 (see FIG. 2) and the carrying arm units 223 and 224 (see FIG. 2). The arm units 221 and 222 and the arm units 223 and 224 for carrying out are also spaced apart from each other at the first interval. Accordingly, the index robot 200 may withdraw and load a plurality of wafers from the buffer unit 300 at one time. Here, the first interval is the same as the slot interval of the pool (120a, 120b, 120c, 120d).

Each support of the first and second support parts 320 and 330 may be provided with guide protrusions 31 to guide the position of the wafer. The guide protrusion 31 is formed to protrude from the upper surface of the support, and supports the side of the wafer.

As described above, the buffer unit 300 is positioned at the same interval as the interval between the index arms that can be picked up or stacked at the same time a predetermined number of support units located in succession. Accordingly, since the index robot 200 can take out and load a plurality of wafers from the buffer unit 300 at one time, the work efficiency is improved, the process time is shortened, and the productivity is improved.

Raw wafers stored in the buffer unit 300 are transferred to each process chamber by the main transfer robot 500. The main transfer robot 500 is installed in the second transfer passage 430 and moves along the second transfer rail 440 provided in the second transfer passage 430. The second transfer passage 430 is connected to the plurality of process chambers 600.

The main transfer robot 500 picks up the raw wafer from the buffer unit 300 and then moves along the second transfer rail 30 to provide the raw wafer to the process chamber. In addition, the main transfer robot 500 loads the processed wafers processed in the plurality of process chambers 600 in the buffer unit 300.

5 is a perspective view of the main transport robot shown in FIG.

1 and 5, the main transport robot 500 includes a hand body 510, a plurality of pickup hand units 520, a rotating part 530, a vertical moving part 540, and a horizontal moving part 550. It may include.

In this embodiment, the hand body 510, the rotating part 530, the vertical moving part 540, and the horizontal moving part 550 are formed of the index robot 200 shown in FIGS. 2 and 3. Since the index body 210, the rotating part 230, the vertical moving part 240, and the horizontal moving part 250 each have the same configuration, duplicate description thereof will be omitted.

Specifically, the hand body 510 horizontally moves the pickup hand units 520, and each pickup hand unit 521, 522, 523, 524 is individually driven by the hand driver 510.

The pick-up hand units 520 are installed on an upper portion of the hand body 510, and the pick-up hand units 520 may each load one wafer. In this embodiment, each pick-up hand unit 521, 522, 523, 524 is each arm unit 221, 222, 223, 224 of the index robot 200 except for the shape of the support plate on which the wafer is seated. Since it has the same configuration and the same arrangement relationship), detailed description of the respective pickup hand unit (521, 522, 523, 524) will be omitted.

In addition, in this embodiment, the coupling relationship between the pick-up hand units 520 and the hand body 510 is the same as the coupling relationship between the arm units 220 and the index body 210. Detailed description will be omitted.

In addition, in this embodiment, the main transfer robot 500 has four pickup hand units 521, 522, 523, 524, but the number of the pickup hand units 521, 522, 523, 524 It may be increased according to the process efficiency of the substrate processing system 1000.

The pick-up hand units 520 may be divided into input pick-up hand units 521 and 522 for transferring a raw wafer and discharge pick-up hand units 523 and 524 for transferring a processed wafer. In this case, the input pickup hand units 521 and 522 and the discharge pickup hand units 523 and 524 are not mixed with each other. In one example of the present invention, the discharge pickup hand units 523 and 524 are positioned on the input pickup hand units 521 and 522. Accordingly, the main transfer robot 500 may prevent the processing wafer from being contaminated by the raw wafer in the process of transferring the raw wafer and the processing wafer, thereby improving the yield of the product.

The pick-up pick-up hand units 521 and 522 take out the processing wafer from the buffer unit 300 and provide them to an idle process chamber. The pick-up pickup hand units 521 and 522 are spaced apart from each other at the same first intervals as the support units of the number of units of the buffer unit 300. Accordingly, the input pickup hand units 521 and 522 may simultaneously take out the raw wafers from the buffer unit 300.

On the other hand, the discharge pickup hand units 523 and 524 take out the processed wafer from the completed process chamber and load them in the buffer unit 300, respectively. The discharge pickup hand units 523 and 524 are spaced at the first interval. Accordingly, the discharge pickup hand units 523 and 524 may simultaneously load the processed wafers taken out from the process chambers 600 into the buffer unit 300.

In this embodiment, the processing pick-up hand units 521 and 522 and the discharge pick-up hand units 523 and 524 are each composed of two pick-up hand units. The number of the 522 and the discharge pickup hand units 523 and 524 may increase according to the processing efficiency of the substrate processing system 1000.

In one example of the present invention, the number of supports continuously spaced apart from the buffer unit 300 at the first interval, and the index robot 200 can withdraw or load the wafer from the buffer unit 300 at one time. The maximum number of index arms that can be used and the maximum number of pickup hand units that the main transfer robot 500 can take or load wafers from the buffer unit 300 at the same time are the same.

As described above, the main transfer robot 500 may pull out a plurality of raw wafers from the buffer unit 300 at a time, or may pull out one raw wafer as needed. In addition, the main transfer robot 500 may load a plurality of processed wafers into the buffer unit 300 at a time as needed, or may load one processed wafer. Accordingly, since the transfer time of the wafer is shortened, the substrate processing system 1000 may shorten the process time and improve productivity.

On the other hand, the rotating part 530 is installed below the hand body 510. The rotating part 530 is coupled to the hand body 510 and rotates to rotate the hand body 510. Accordingly, the pickup hand units 520 rotate together.

The vertical moving part 540 is installed below the rotating part 530, and the horizontal moving part 550 is installed below the vertical moving part 540. The vertical moving part 540 is combined with the rotating part 530 to elevate and lower the rotating part 530. Accordingly, the vertical positions of the hand body 510 and the pickup hand units 520 are adjusted. do. The horizontal moving unit is coupled to the second transfer rail 440 to move horizontally along the second transfer rail 440. Accordingly, the main transfer robot 500 may move between the buffer unit 300 and the process chambers 600.

The process chambers 600 are disposed at both sides of the second transfer passage 430 in which the main transfer robot 500 is installed to process the raw wafer to generate the processed wafer. The processing performed in the process chambers 600 may include a cleaning process for cleaning the raw wafer. In the plurality of process chambers 600, two process chambers are disposed to face each other with the second transfer passage 430 interposed therebetween, and three process chambers are disposed at both sides of the second transfer passage 430, respectively. do.

In this embodiment, the substrate processing system 1000 includes six process chambers, but the number of the process chambers may increase or decrease according to the process efficiency and the footprint of the substrate processing system 1000. . In addition, in this embodiment, the process chambers 600 are arranged in a single layer structure, but 12 process chambers may be arranged in a multi-layer structure of six.

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be.

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be.

1 is a schematic view of a substrate processing system according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating the index robot shown in FIG. 1.

3 is a cross-sectional view illustrating the index robot shown in FIG. 2.

4 is a perspective view illustrating the buffer unit illustrated in FIG. 1.

5 is a perspective view of the main transport robot shown in FIG.

Explanation of symbols on the main parts of the drawings

110: loading / unloading unit 120a, 120b, 120c, 120d: loosening

200: index robot 300: buffer unit

400: transfer passage 500: main transfer robot

600: process chamber 1000: substrate processing system

Claims (8)

A plurality of arm units each carrying a substrate and each moving in a horizontal direction; And A body coupled with the plurality of arm units and moving each arm unit in a horizontal direction; The body, A case provided below the substrate mounted on the arm unit; And And a plurality of linear moving members embedded in the case, arranged horizontally in parallel to the bottom surface of the case, and installed to correspond to the arm units to horizontally move the corresponding arm units. . The method of claim 1, The case is provided with a plurality of holes in the side wall, One end of the arm units is inserted into the case through the plurality of holes and coupled with a corresponding linear moving member. The method of claim 2, Wherein each unit has a center of gravity adjacent to a longitudinal center of the corresponding linear moving member in plan view. The method of claim 3, Each arm unit has a support surface on which the substrate is seated, The support surfaces of the arm units are spaced apart from each other in the vertical direction from the top of the body, the substrate transport apparatus characterized in that facing each other. The substrate transfer apparatus of claim 3, wherein the linear moving member is an LM guide. An accommodating member accommodating a plurality of substrates facing the ground; At least one process chamber in which the substrate is processed; And And a conveying member for extracting and loading the substrate from the accommodating member and conveying the substrate. The transfer member, A plurality of arm units each carrying a substrate and each moving in a horizontal direction; And A body coupled with the plurality of arm units and moving each arm unit in a horizontal direction; The body, A case provided below the substrate mounted on the arm unit; And And a plurality of linear moving members embedded in the case and arranged horizontally in parallel to the bottom surface of the case and installed to correspond to the arm units to horizontally move the corresponding arm units. . The method of claim 6, Wherein each unit has a center of gravity adjacent to a center position in the longitudinal direction of the corresponding linear moving member in plan view. The method of claim 7, wherein Wherein each unit has a center of gravity adjacent to a longitudinal center position of the corresponding linear moving member in plan view.

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