KR20100033113A - Substrate processing apparatus and method for transferring substrate of the same - Google Patents

Abstract

PURPOSE: A substrate processing apparatus and this board feeding method are provided to implement the exchange preparation of a substrate by the mobile history of a carry-along element and processing unit at the same time. The waiting time for exchanging for substrate is reduced. CONSTITUTION: In the processing unit, a processing of substrate operates. In the processing unit, the processing of substrate is completed. The carry-along element moves to the processing unit. Simultaneously, the processing unit prepares the withdrawal of the processed substrate(S150). The carry-along element draws out the processed substrate from the processing unit(S160). The carry-along element transfers the drawn substrate to a receiving member.

Description

Substrate Processing Equipment and Substrate Transfer Method {SUBSTRATE PROCESSING APPARATUS AND METHOD FOR TRANSFERRING SUBSTRATE OF THE SAME}

The present invention relates to an apparatus for manufacturing a semiconductor substrate, and more particularly to a substrate processing apparatus for processing a semiconductor substrate and a substrate transfer method thereof.

In general, in the substrate manufacturing process, the deposition, etching, coating of photoresist, development, and removal of asher are repeated several times in order to perform fine patterning. Patterning) is made, and as the process progresses, foreign substances are left in the substrate that are not completely removed by etching or ashing. A process for removing such foreign matters is a cleaning process using deionized water or chemical.

Substrate cleaning devices are classified into a batch processor and a single processor. The batch washing apparatus includes a chemical bath, a rinse bath, a dry bath, and the like, which can process 25 sheets or 50 sheets at a time. The batch cleaning device soaks the substrates in each bath for a period of time to remove debris. Such a batch cleaning device has the advantage that the upper and lower portions of the substrate can be cleaned at the same time and at the same time can handle a large capacity. However, as the diameter of the substrate increases, the size of the tank increases, and thus the size of the apparatus and the amount of chemical liquid used increase, and at the same time, foreign matters separated from adjacent substrates are reattached to the substrate that is being cleaned in the chemical chamber.

Recently, due to the increase in the diameter of the substrate, sheet type cleaning devices are frequently used. The single sheet cleaning apparatus fixes the substrate with a substrate chuck in a small chamber capable of processing a single substrate, and then rotates the substrate by a motor and nozzles at the top of the substrate. The chemical liquid or pure water is provided to the substrate through. Chemical liquid or pure water is spread over the substrate by the rotational force of the substrate, thereby removing foreign substances adhering to the substrate. This single sheet type washing apparatus has an advantage that the size of the apparatus is smaller than that of the batch washing apparatus and has a homogeneous washing effect.

In general, the single-sheet cleaning device is composed of a structure including a loading / unloading unit, an index robot, a buffer unit, processing units, and the main transfer robot from one side. The index robot transfers the substrate between the buffer unit and the loading / unloading unit, and the main transfer robot transfers the substrate between the buffer unit and the processing units. In the buffer unit, the substrate before cleaning is waited to be introduced into the process unit, or the substrate after cleaning is waited to be transferred to the loading / unloading unit. The main transfer robot transfers the cleaned substrate from the process unit to the buffer unit, and extracts the substrate before cleaning from the buffer unit and puts it into the process unit.

Looking at the process of replacing the substrate of the process unit in the sheet cleaning system as follows. First, the main transfer robot selects a process unit into which a substrate before cleaning is put and moves to the process unit where the cleaning process is completed. Subsequently, the substrate is requested to be replaced by the process unit, and the process unit prepares to replace the substrate. When the substrate exchange preparation is completed, the main transfer robot pulls out the cleaned substrate from the processing unit, and then inserts the substrate before cleaning.

As described above, since the main transfer robot moves to the process unit in which the process is completed, the substrate replacement preparation of the process unit is performed, so that the time required for the substrate exchange increases, and the substrate transfer efficiency and productivity decrease.

An object of the present invention is to provide a substrate processing apparatus capable of improving the transfer efficiency.

It is also an object of the present invention to provide a substrate transfer method for transferring a substrate using the substrate processing apparatus described above.

The substrate transfer method according to one feature for realizing the object of the present invention described above is as follows.

First, processing of the substrate is performed in the processing unit. When the processing of the substrate in the processing unit is completed, the transfer member moves to the processing unit, and together with this, the processing unit prepares to take out the processed substrate. The transfer member pulls out the processed substrate from the processing unit.

Looking at the process of moving the transfer member to the process unit as follows. First, the transfer member pulls out an unprocessed substrate waiting to be put into the processing unit from the housing member. The transfer member carrying the unprocessed substrate is moved to the process unit, and at the same time, the process unit prepares to take out the processed substrate.

In addition, the substrate transfer method, after the step of taking out the processed substrate, the unprocessed substrate loaded with the transfer member is put into the processing unit, the transfer member is taken out of the processed substrate The method may further include transferring to the receiving member.

In addition, the substrate transfer method according to one feature for realizing the above object of the present invention is as follows.

First, processing of substrates is performed in a plurality of processing units, respectively. When the processing of the substrate is completed in any one of the process units, the transfer member is moved to the process unit is completed, with the process unit is ready to take out the processed substrate. The transfer member draws out the processed substrate from the processed process unit.

In addition, the substrate processing apparatus according to one feature for realizing the above object of the present invention comprises an accommodating member, at least one processing unit, a conveying member, and a controller.

The housing member accommodates a plurality of substrates arranged to face the ground. The processing unit is a substrate processing step. The transfer member has at least one transfer arm disposed to face the ground to load the substrate, and transfers the substrate between the accommodation member and the process unit. The control unit controls the movement operation of the transfer member and the substrate processing operation of the process unit, and controls the transfer member to move to the process unit when the substrate is processed in the process unit. Control to prepare the substrate for withdrawal.

According to the present invention described above, in the substrate transfer method, the process of moving the transfer member to the process unit and the process of the substrate to prepare for replacement of the substrate are performed at the same time. As a result, the waiting time for the transfer member to change the substrate is shortened, so that the process time can be shortened and the transfer efficiency and productivity of the substrate can be improved.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following, the wafer is described as an example of the substrate, but the technical spirit and scope of the present invention are not limited thereto.

1 is a view schematically showing a substrate processing system according to an embodiment of the present invention, Figure 2 is a perspective view of the index robot shown in FIG.

1 and 2, the substrate processing system 1000 of the present invention includes a loading / unloading unit 110, an index robot 200, a buffer unit 300, and a main transfer robot. Robot) 500, a plurality of process units 610,..., 660, and a controller 710.

The loading / unloading unit 110 includes a plurality of load ports 110a, 110b, 110c and 110d. In this embodiment, the loading / unloading unit 110 has four load ports 110a, 110b, 110c, and 110d, but the number of load ports 110a, 110b, 110c, and 110d is the substrate. It may increase or decrease depending on the process efficiency and the foot print conditions of the processing system 1000.

Front open unified pods (FOUPs) 120a, 120b, 120c, and 120d in which wafers are accommodated are mounted in the load ports 110a, 110b, 110c, and 110d. Each of the pools 120a, 120b, 120c, and 120d is provided with a plurality of slots for accommodating the wafers in a state in which the wafers are arranged horizontally with respect to the ground. In the pools 120a, 120b, 120c, and 120d, wafers processed in the processing units 610, 660, and 660 or wafers to be injected into the processing units 610,. . Hereinafter, for convenience of description, the wafers processed by the processing units 610, ..., 660 are referred to as processed wafers, and wafers not yet processed are referred to as raw wafers.

The index robot 200 is installed between the loading / unloading unit 110 and the buffer unit 300, and a first transfer rail 20 is installed below the index robot 200. The index robot 200 moves along the first transfer rail 20 and transfers wafers. The index robot 200 may include an arm driver 210, a plurality of index arms 220, a plurality of connectors 230, a rotating part 240, a vertical moving part 250, and a horizontal moving part 260. Can be.

In detail, the arm driver 210 horizontally moves the index arms 220, and each index arm 221, 222, 223, and 224 is individually driven by the arm driver 210.

The index arms 220 are installed above the arm driver 210. The index arms 220 may be disposed to face each other in the vertical direction and may load one wafer. In this embodiment, the index robot 200 has four index arms 221, 222, 223, and 224, but the number of index arms 221, 222, 223, and 224 is determined by the substrate processing system ( It may increase with the process efficiency of 1000).

The index arms 220 may be operated by being divided into index index arms 221 and 222 for transporting raw wafers and index index arms 223 and 224 for transporting processed wafers. The arms 221 and 222 and the ejection index arms 223 and 224 are not located in a mixed state. In one example of the present invention, the discharge index arms 223 and 224 are positioned above the input index arms 221 and 222. Accordingly, the index robot 200 may prevent the processing wafer from being contaminated by the raw wafer in the process of transferring the raw wafer and the processing wafer, thereby improving the yield of the product.

The input index arms 221 and 222 are mounted on the loading / unloading unit 110 to withdraw the raw wafer from any one of the pools waiting for processing and then load the raw wafers into the buffer unit 300. The index robot 200 may withdraw one or a plurality of raw wafers at a time from the pool waiting to be processed. That is, the input index arms 221 and 222 may be simultaneously introduced into the pool waiting to be processed, and then the raw wafers may be simultaneously taken out. As a result, two raw wafers are simultaneously taken out from the process waiting pool.

In addition, the index robot 200 may load one or more raw wafers into the buffer unit 300 at a time. That is, the index index arms 221 and 222 are introduced into the buffer unit 300 at the same time, and then load the raw wafer seated on the upper surface of the buffer unit 300 at the same time. As a result, two raw wafers are simultaneously loaded into the buffer unit 300.

In one example of the present invention, the maximum number of wafers that the index robot 200 can withdraw from the pool waiting for the process at one time and the maximum number of wafers that can be loaded into the buffer unit 300 at one time are the index for the loading. It is equal to the number of arms 221, 222.

Meanwhile, the discharge index arms 223 and 224 take out the processed wafer from the buffer unit 300 and then load the processed wafers into the buffer unit 300. The index robot 200 may withdraw one or more processed wafers from the buffer unit 300 at a time. That is, the discharge index arms 223 and 224 may be simultaneously introduced into the buffer unit 300, and then the processed wafers may be simultaneously taken out. As a result, two processed wafers are simultaneously drawn out from the buffer unit 300.

In addition, the index robot 200 may reload one or a plurality of processing wafers at a time in the pool waiting for the process. That is, the discharge index arms 223 and 224 are simultaneously introduced into the pool waiting for the process, and then simultaneously load the processed wafer seated on the upper surface. As a result, two processed wafers are simultaneously loaded into the process waiting pool.

In one example of the present invention, the maximum number of wafers that the index robot 200 can draw out from the buffer unit 300 at one time and the maximum number of wafers that can be loaded at a time in the pull are the index index arms 223 for discharge. 224).

As such, the index robot 200 may draw out and load a plurality of wafers from the pools 120a, 120b, 120c, and 120d and the buffer unit 300 at one time, thereby reducing the time required for wafer transfer. Productivity can be improved.

The index arms 220 are connected to the plurality of connectors 230. The plurality of connection units 230 are coupled to the arm driver 210 to horizontally move the connected index arms according to the driving of the arm driver 210.

The rotating part 240 is installed below the arm driving part 210. The rotating part 240 is coupled to the arm driving part 210 and rotates to rotate the arm driving part 210. Accordingly, the index arms 220 rotate together.

The vertical moving part 250 is installed below the rotating part 240, and the horizontal moving part 260 is installed below the vertical moving part 250. The vertical moving unit 250 is combined with the rotating unit 240 to raise and lower the rotating unit 240, and thus the vertical positions of the arm driving unit 210 and the index arms 220 are adjusted. The horizontal moving part 260 is coupled to the first transfer rail 20 to move horizontally along the first transfer rail 20. Accordingly, the index robot 200 may move along the arrangement direction of the load ports 110a, 110b, 110c, and 110d.

Meanwhile, the buffer unit 300 is located between an area in which the index robot 200 is installed, and an area in which the plurality of process chambers 600 and the main transfer robot 500 are installed. The buffer unit 300 accommodates the raw wafers transferred by the index robot 200 and the processed wafers processed in the process chambers 600.

3 is a perspective view illustrating the buffer unit illustrated in FIG. 1.

1 and 3, the buffer part 300 includes a main body 310 and first and second support parts 320 and 330.

In detail, the main body 310 includes a bottom surface 311, first and second sidewalls 312 and 313 vertically extending from the bottom surface 311, and the first and second sidewalls 312 and 313. It may include a top surface 314 coupled to the top of the).

The main body 310 has a front sidewall facing the index robot 200 and a rear sidewall facing the main transfer robot 500 to open and close the wafer. Accordingly, the index robot 200 and the main transfer robot 500 can easily draw and withdraw wafers from the buffer unit 300.

The first and second sidewalls 312 and 313 are disposed to face each other, and the upper surface 314 is partially removed to form an opening 314a.

The first and second support parts 320 and 330 are formed in the body 310. The first support part 320 is coupled to the first side wall 312, and the second support part 330 is coupled to the second side wall 313. The first and second supports 320 and 330 each include a plurality of supports. The supports of the first support part 320 correspond one to one with the supports of the second support part 330, and the wafer supports the support of the first support part 320 and the support of the second support part 330 corresponding to each other. The end is supported by and is received in the buffer unit 300. In this case, the wafer is disposed to face the bottom surface 311.

The supports of the first and second supports 320 and 330 are spaced apart from each other in the vertical direction. The supports are spaced apart at first intervals by the same number unit as the number of the index index arms 221 and 222 (see FIG. 2) and the index index arms 223 and 224 (see FIG. 2). The indexing arms 221 and 222 and the indexing arms 223 and 224 for carrying out are also spaced apart from each other at the first interval. Accordingly, the index robot 200 may withdraw and load a plurality of wafers from the buffer unit 300 at one time. Here, the first interval is the same as the slot interval of the pool (120a, 120b, 120c, 120d).

Each support of the first and second supports 320 and 330 may be formed with a guide 31 to guide the position of the wafer. The guide part 31 is formed to protrude from the upper surface of the support, and supports the side of the wafer.

As described above, the buffer unit 300 is positioned at the same interval as the interval between the index arms that can be picked up or stacked at the same time a predetermined number of support units located in succession. Accordingly, since the index robot 200 can withdraw and load a plurality of wafers from the buffer unit 300 at one time, work efficiency is improved, process time is shortened, and productivity is improved.

Raw wafers stored in the buffer unit 300 are transferred to each process chamber by the main transfer robot 500. The main transfer robot 500 is installed in the transfer passage 400 and moves along the second transfer rail 30 installed in the transfer passage 400. The transfer passage 400 is connected to the plurality of process chambers 600.

The main transfer robot 500 picks up the raw wafer from the buffer unit 300 and then moves along the second transfer rail 30 to provide the raw wafer to the processing unit. In addition, the main transfer robot 500 loads the processed wafer processed in the process units 610,..., 660 into the buffer unit 300.

4 is a perspective view showing the main transport robot shown in FIG.

1 and 4, the main transport robot 500 includes a hand driver 510, a plurality of pickup hands 520, a plurality of connectors 530, a rotating part 540, a vertical moving part 550, and It may include a horizontal moving unit 560.

In detail, the hand driver 510 horizontally moves the pickup hands 520, and each pickup hand 521, 522, 523, and 524 is individually driven by the hand driver 510.

The pick-up hands 520 are installed above the hand driver 510. The pick-up hands 520 may be disposed to face each other in the vertical direction, and may load one wafer. In this embodiment, the main transfer robot 500 has four pick-up hands 521, 522, 523, 524, but the number of pick-up hands 521, 522, 523, 524 is the substrate processing. It may increase with the process efficiency of system 1000.

The pick-up hands 520 may be divided into input pick-up hands 521 and 522 for transferring a raw wafer and discharge pick-up hands 523 and 524 for transferring a processed wafer. In this case, The input pickup hands 521 and 522 and the discharge pickup hands 523 and 524 are not mixed with each other. In one example of the present invention, the discharge pick-up hands 523 and 524 are positioned on the input pickup hands 521 and 522. Accordingly, the main transfer robot 500 may prevent the processing wafer from being contaminated by the raw wafer in the process of transferring the raw wafer and the processing wafer, thereby improving the yield of the product.

The pick-up pick-up hands 521 and 522 take out the processing wafer from the buffer unit 300 and provide them to an idle process chamber. The pick-up pickup hands 521 and 522 are spaced apart from each other at the same first intervals as the support units for the unit number of the buffer unit 300. Accordingly, the input pickup hands 521 and 522 may simultaneously take out the raw wafers from the buffer unit 300.

On the other hand, the discharge pickup hands 523 and 524 take out the processed wafer from the completed process unit, respectively, and load the processed wafers in the buffer unit 300. The discharge pick-up hands 523 and 524 are spaced at the first interval. Accordingly, the discharge pickup hands 523 and 524 may simultaneously load the processed wafers drawn from the process units 610,..., 660 into the buffer unit 300.

In this embodiment, the processing pick-up hands 521 and 522 and the discharge pick-up hands 523 and 524 each consist of two pick-up hands, but the processing pick-up hands 521 and 522 and the discharge hand The number of the pick-up hands 523 and 524 may increase according to the processing efficiency of the substrate processing system 1000.

In one example of the present invention, the number of supports continuously spaced apart from the buffer unit 300 at the first interval, and the index robot 200 can withdraw or load the wafer from the buffer unit 300 at one time. The maximum number of index arms that can be used and the maximum number of pickup hands that the main transfer robot 500 can pull out or load the wafer from the buffer unit 300 at the same time are the same.

As described above, the main transfer robot 500 may pull out a plurality of raw wafers from the buffer unit 300 at a time, or may pull out one raw wafer as needed. In addition, the main transfer robot 500 may load a plurality of processed wafers into the buffer unit 300 at a time as needed, or may load one processed wafer. Accordingly, since the transfer time of the wafer is shortened, the substrate processing system 1000 may shorten the process time and improve productivity.

The pickup hands 520 are connected to the plurality of connections 530. The plurality of connection parts 530 are coupled to the hand driver 510 to horizontally move the picked-up hands connected by the hand driver 510.

The rotating part 540 is installed below the hand driving part 510. The rotating unit 540 is coupled to the hand driving unit 510 and rotates to rotate the hand driving unit 510. Accordingly, the pickup hands 520 rotate together.

The vertical moving part 550 is installed below the rotating part 540, and the horizontal moving part 560 is installed below the vertical moving part 550. The vertical moving part 550 is combined with the rotating part 540 to raise and lower the rotating part 540, thereby adjusting the vertical positions of the hand driving part 510 and the pick-up hands 520. . The horizontal moving part is coupled to the second transfer rail 30 to move horizontally along the second transfer rail 30. Accordingly, the main transfer robot 500 may move between the buffer unit 300 and the process chambers 600.

The processing units 610,..., 660, which process the raw wafers to generate the processed wafers, are disposed at both sides of the transfer passage 400 in which the main transfer robot 500 is installed. The processing process performed in the processing units 610,..., 660 may include a cleaning process for cleaning the raw wafer. The plurality of process units 610,... 660 are two process units disposed to face each other with the transfer passage 400 interposed therebetween, and three process units each on both sides of the transfer passage 400. Are placed.

In this embodiment, the substrate processing system 1000 includes six processing units 610, ..., 660, but the number of the processing units 610, ..., 660 is the substrate processing system. It may increase or decrease depending on the process efficiency and footprint conditions of 1000. In addition, in this embodiment, the process units 610, ..., 660 are arranged in a single layer structure, but 12 process units may be arranged in a multi-layer structure of six.

Meanwhile, the main transfer robot 500 and the process units 610,..., 660 operate according to a control signal of the controller 710. In detail, when the processing process is completed in any one of the process units 610,..., 660, the controller 710 moves the processed process unit to the raw wafer. Set as a process unit to be injected, and transmits a movement command to the main transfer robot 500 to control the main transfer robot 500 to move to the process unit is completed. At the same time, a wafer exchange preparation instruction for controlling the process completed process unit to prepare for wafer exchange is transmitted to the process unit. Accordingly, while the main transfer robot 500 moves to the processing unit, the processing unit takes out the generated processed wafer to the outside and performs a preparation operation for receiving the raw wafer.

Here, in the wafer exchange preparation operation of the process units 610, 660, 660, the chucking of the wafer inserted therein is released, and the height at which the wafer can be drawn out of the support member (not shown) on which the wafer is seated. And so on.

As such, the substrate processing system 1000 may move the main transfer robot 500 to the corresponding processing unit and replace the wafer of the processing unit when the wafers of the processing units 610, 660 are replaced. The preparation operation is performed at the same time. As a result, the substrate processing system 1000 shortens the time required for wafer exchange, thereby reducing the process time and improving the transfer efficiency and productivity of the wafer.

Hereinafter, the wafer exchange process of the process units 610,... 660 will be described in detail with reference to the accompanying drawings. For convenience of description, the wafer exchange process of the first process unit 610 of the process units 610, ..., 660 will be described as an example, and each process unit 610, ..., 660 will be described. Wafer exchange process is the same.

6 is a flowchart illustrating a wafer exchange method of a processing unit in the substrate processing system shown in FIG. 1.

1 and 6, first, each of the process units 610,... 660 performs a process of processing a raw wafer, and a first of the process units 610,. When the processing process is completed in the processing unit 610, the main transfer robot 500 withdraws at least one raw wafer from the buffer unit 300 (step S110).

The controller 710 sets the first process unit 610 as a process unit into which the main transfer robot 500 is to insert the raw wafer (step S120).

Subsequently, the controller 710 transmits a movement command for controlling the main transfer robot 500 to move to the first process unit 610 to the main transfer robot 500, and at the same time, the first process. The wafer exchange preparation instruction is transmitted to the unit 610 (step S130).

The main transfer robot 500 moves to the first process unit 610 according to the movement command (step S140). At this time, the main transfer robot 500 moves in a state in which the raw wafer drawn out from the buffer unit 300 is loaded.

While the main transfer robot 500 moves to the first process unit 610, the first process unit 610 executes a wafer exchange preparation operation for taking out the processed wafer generated therein. (Step S150). Accordingly, since the main transfer robot 500 arrives at the first process unit 610, the waiting time until the first process unit 610 completes the wafer exchange preparation operation may be shortened. . Therefore, the substrate processing system 1000 may shorten the waiting time of the main transfer robot 500 when the wafers of the processing units 610,... 660 are replaced, thereby improving wafer transfer efficiency and productivity. Can be.

Subsequently, the main transfer robot 500 draws out the processed wafer from the first process unit 610 (step S160).

In this embodiment, the time point when the main transfer robot 500 arrives at the first process unit 610 may be the same as or later than when the first process unit 610 completes the wafer exchange preparation operation. have. Accordingly, the main transfer robot 500 may directly withdraw the processing wafer from the first processing unit 610 without waiting after arriving at the first processing unit 610.

Subsequently, the main transfer robot 500 injects the loaded raw wafer into the first process unit 610 (step S170). The first processing unit 610 performs a processing process of the injected raw wafer, and the main transfer robot 500 transfers the processed wafers drawn from the first processing unit 610 to the buffer unit 300. .

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be.

1 is a schematic view of a substrate processing system according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating the index robot shown in FIG. 1.

3 is a perspective view illustrating the buffer unit illustrated in FIG. 1.

4 is a perspective view showing the main transport robot shown in FIG.

FIG. 5 is a block diagram conceptually illustrating a configuration of the first controller illustrated in FIG. 1.

6 is a flowchart illustrating a wafer exchange method of a processing unit in the substrate processing system shown in FIG. 1.

Explanation of symbols on the main parts of the drawings

110: loading / unloading unit 120a, 120b, 120c, 120d: loosening

200: index robot 300: buffer unit

400: transfer passage 500: main transfer robot

610, 620, 630, 640, 650, 660: process unit

710: control unit 1000: substrate processing system

Claims (10)

Processing the substrate in the processing unit; When the processing of the substrate in the processing unit is completed, the transfer member is moved to the processing unit, with the process unit, preparing the withdrawal of the processed substrate; And And transferring the processed substrate from the processing unit by the transfer member. The method of claim 1, wherein the transferring member moves to the processing unit, Extracting, by the transfer member, an unprocessed substrate awaiting input into the process unit from an accommodation member; And And the transfer member on which the unprocessed substrate is loaded moves to the processing unit, and at the same time, the processing unit prepares to take out the processed substrate. 3. A substrate transfer method according to claim 2, wherein the point at which the transfer member starts moving to the process unit is the same as the point at which the process unit starts preparation for withdrawing the processed substrate. The method of claim 2, wherein the time point at which the process unit completes the preparation for withdrawing the processed substrate is faster or the same as the time point when the transfer member arrives at the process unit. The method of claim 2, wherein after the withdrawing the processed substrate, Injecting the unprocessed substrate on which the transfer member is loaded into the processing unit; And And transferring, by the transfer member, the processed substrate taken out from the process unit to the accommodation member. Treating the substrate in each of the plurality of processing units; When the processing of the substrate is completed in any one of the processing units, the transfer member is moved to the process unit is completed, with the process, the process unit is prepared, withdraw the processed substrate; And And transferring the processed substrate from the processed processing unit by the transfer member. The method of claim 6, wherein the transferring member moves to the completed process unit. Withdrawing the at least one unprocessed substrate on which the transfer member is waiting to be input to the process units from the housing member; Selecting, by the transfer member, the unprocessed substrate, the process unit having been processed as a process unit into which the unprocessed substrate is to be put among the process units; And And the transfer member, which has loaded the unprocessed substrate, moves to the process-processed process unit, and at the same time, the process-processed process unit prepares to take out the processed substrate. 8. The substrate transfer method according to claim 7, wherein the transfer member starts moving to the processing unit and the processing unit starts to take out the processed substrate. 8. The method of claim 7, wherein after the withdrawing the processed substrate, Injecting the unprocessed substrate on which the transfer member is loaded into the processing unit; And And transferring, by the transfer member, the processed substrate taken out from the process unit to the accommodation member. An accommodating member accommodating a plurality of substrates facing the ground; At least one process unit on which a substrate process is performed; A transfer member disposed facing the ground and having at least one transfer arm on which a substrate is loaded, and transferring the substrate between the accommodation member and the process unit; And Controlling the movement of the transfer member and the substrate processing operation of the process unit, and when the processing of the substrate is completed in the process unit, controlling the transfer member to move to the process unit and simultaneously And a control unit which controls to prepare for drawing.

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