KR20100008562A - Substrate transferring method - Google Patents
Substrate transferring method Download PDFInfo
- Publication number
- KR20100008562A KR20100008562A KR1020080069110A KR20080069110A KR20100008562A KR 20100008562 A KR20100008562 A KR 20100008562A KR 1020080069110 A KR1020080069110 A KR 1020080069110A KR 20080069110 A KR20080069110 A KR 20080069110A KR 20100008562 A KR20100008562 A KR 20100008562A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- substrate
- processed
- buffer unit
- wafers
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 58
- 235000012431 wafers Nutrition 0.000 abstract description 99
- 238000004140 cleaning Methods 0.000 description 12
- 239000000126 substance Substances 0.000 description 8
- 238000005406 washing Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004380 ashing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
The present invention relates to an apparatus for manufacturing a semiconductor substrate, and more particularly to a method for transferring the substrate in the process of processing the semiconductor substrate.
In general, in the substrate manufacturing process, the deposition, etching, coating of photoresist, development, and removal of asher are repeated several times in order to perform fine patterning. Patterning) is made, and as the process progresses, foreign substances are left in the substrate that are not completely removed by etching or ashing. A process for removing such foreign matters is a cleaning process using deionized water or chemical.
Substrate cleaning devices are classified into a batch processor and a single processor. The batch washing apparatus includes a chemical bath, a rinse bath, a dry bath, and the like, which can process 25 sheets or 50 sheets at a time. The batch cleaning device soaks the substrates in each bath for a period of time to remove debris. Such a batch cleaning device has the advantage that the upper and lower portions of the substrate can be cleaned at the same time and at the same time handle a large capacity. However, as the diameter of the substrate increases, the size of the tank increases, and thus the size of the apparatus and the amount of chemical liquid used increase, and at the same time, foreign matters separated from adjacent substrates are reattached to the substrate that is being cleaned in the chemical chamber.
Recently, due to the increase in the diameter of the substrate, sheet type cleaning devices are frequently used. The single sheet cleaning apparatus fixes the substrate with a substrate chuck in a small chamber capable of processing a single substrate, and then rotates the substrate by a motor and nozzles at the top of the substrate. The chemical liquid or pure water is provided to the substrate through. Chemical liquid or pure water is spread over the substrate by the rotational force of the substrate, thereby removing foreign substances adhering to the substrate. This single sheet type washing apparatus has an advantage that the size of the apparatus is smaller than that of the batch washing apparatus and has a homogeneous washing effect.
In general, the single-sheet cleaning device is composed of a structure including a loading / unloading unit, an index robot, a buffer unit, a process chamber, and a main transfer robot from one side. The index robot transfers the substrate between the buffer unit and the loading / unloading unit, and the substrate transfer robot transfers the substrate between the buffer unit and the process chamber.
The buffer unit is provided with a plurality of slots for accommodating a plurality of substrates, and waits for the substrate before cleaning to be put into the process chamber, or waits for the cleaned substrate to be transferred to the loading / unloading unit. The index robot pulls out the substrate from the FOUP seated on the loading / unloading unit and loads the substrate in the buffer unit, and removes the cleaned substrate from the buffer unit and loads the substrate in the pool. The main transfer robot takes out the substrate before cleaning from the buffer unit, provides it to the process chamber, and loads the substrate on which the cleaning has been completed.
At this time, the main transfer robot collects the substrates completed in the process chamber in any order and loads the substrates into empty slots in the buffer unit, so that the transfer efficiency is lowered when the index robot transfers the processed substrates to the release.
An object of the present invention is to provide a substrate transfer method capable of transferring the substrate efficiently.
According to one aspect of the present invention, a substrate transfer method includes loading substrates processed in a plurality of process chambers in which a substrate is processed, into a buffer unit, and processing substrates currently processed. After sequentially withdrawing from the process chamber according to the order put into the field, the withdrawn substrates are simultaneously transferred to the buffer unit.
According to the present invention described above, the continuous substrate according to the loading order can be continuously stored in the buffer portion, it is possible to efficiently store the substrate, shorten the time required for wafer transfer, and improve productivity. .
Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention. In the following, the wafer is described as an example of the substrate, but the technical spirit and scope of the present invention are not limited thereto.
1 is a schematic view of a substrate processing system according to an exemplary embodiment of the present invention, and FIG. 2 is a perspective view illustrating a buffer unit illustrated in FIG. 1.
Referring to FIG. 1, the
The loading /
Front open unified pods (FOUPs) 120a, 120b, 120c, and 120d in which wafers are accommodated are mounted in the
Hereinafter, for convenience of description, a wafer processed by the
The
In addition, the
1 and 2, the
The
The
The first and
The first and
The supports of the
Raw wafers stored in the
The
On the other hand, the
In this embodiment, the
Further, in this embodiment, the plurality of process chambers are arranged in a single layer structure, but may be arranged in a multilayer structure in which two or more process chambers are stacked.
On the other hand, the
For example, when the
Hereinafter, a process in which the
FIG. 3 is a flowchart illustrating a process in which the main transfer robot pulls wafers from process chambers in the substrate processing system illustrated in FIG. 1.
1 and 3, first, the
The
Subsequently, the retrieved processed wafer is set as the processed wafer to be picked up by the first pick-up hand among the plurality of pick-up
The
In step S140, if there is a processing wafer continuous with the processing wafer of the first pick-up hand, it is set as the processing wafer of the second pick-up hand located immediately below the first pick-up hand, and the second pick-up hand is The processed wafer is picked up (step S150).
In step S140, if there is no processed wafer continuous with the processed wafer of the first pick-up hand, the processed wafer having the largest slot number among the remaining processed wafers except the processed wafer of the first pick-up hand is found on the wafer list. The processing apparatus of the second pick-up hand is set, and the second pick-up hand picks up the processing wafer (step S160).
The
In step S170, if there is a processing wafer continuous with the processing wafer of the second pick-up hand, it is set as the processing wafer of the third pick-up hand located immediately below the second pick-up hand, and the third pick-up hand is The processed wafer is picked up (step S180).
In step S170, if there is no processed wafer continuous with the processed wafer of the second pick-up hand, the processed wafer having the largest slot number among the remaining processed wafers except the processed wafer of the second pick-up hand is placed on the wafer list. The processing device of the third pickup hand is set, and the third pickup hand picks up the processing wafer (step S190).
The
As such, the
Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. I will be able.
1 is a schematic view of a substrate processing system according to an embodiment of the present invention.
FIG. 2 is a perspective view illustrating the buffer unit illustrated in FIG. 1.
FIG. 3 is a flowchart illustrating a process in which the main transfer robot pulls wafers from process chambers in the substrate processing system illustrated in FIG. 1.
Explanation of symbols on the main parts of the drawings
110: loading /
200: index robot 300: buffer unit
400: transfer passage 500: main transfer robot
600: process chamber
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080069110A KR20100008562A (en) | 2008-07-16 | 2008-07-16 | Substrate transferring method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080069110A KR20100008562A (en) | 2008-07-16 | 2008-07-16 | Substrate transferring method |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20100008562A true KR20100008562A (en) | 2010-01-26 |
Family
ID=41817159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080069110A KR20100008562A (en) | 2008-07-16 | 2008-07-16 | Substrate transferring method |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20100008562A (en) |
-
2008
- 2008-07-16 KR KR1020080069110A patent/KR20100008562A/en not_active Application Discontinuation
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101226954B1 (en) | Substrate processing apparatus and method for transferring substrate of the same | |
KR101094387B1 (en) | Substrate processing apparatus and method for transferring substrate of the same | |
KR101015225B1 (en) | Substrate processing apparatus and method for transferring substrate of the same | |
KR101077566B1 (en) | Substrate processing apparatus and method for transferring substrate of the same | |
KR100980706B1 (en) | Substrate transfer device, substrate processing apparatus having the same and method for transferring substrate of the same | |
KR20100025857A (en) | Substrate processing apparatus and method for transferring substrate of the same | |
KR100890486B1 (en) | A semiconductor substrate processing apparatus and method thereof | |
KR100978127B1 (en) | Substrate processing apparatus and method for transferring substrate of the same | |
KR100957226B1 (en) | Substrate processing apparatus and method for transferring substrate of the same | |
KR20100008562A (en) | Substrate transferring method | |
KR100964870B1 (en) | Substrate processing apparatus and method for transferring substrate of the same | |
KR101197588B1 (en) | Substrate processing apparatus and method for transferring substrate of the same | |
KR101000942B1 (en) | Substrate keeping method | |
KR20090126578A (en) | Substrate transferring method | |
KR101085186B1 (en) | Substrate processing apparatus and method for transferring substrate of the same | |
KR20100024220A (en) | Substrate processing apparatus and method for transferring substrate of the same | |
KR100978129B1 (en) | Method for transferring substrate | |
KR20100053092A (en) | Loading part of batch type cleaning apparatus for substrate | |
KR20090124445A (en) | Substrate processing apparatus and method for transferring substrate of the same | |
KR20100033113A (en) | Substrate processing apparatus and method for transferring substrate of the same | |
KR100978855B1 (en) | Substrate processing apparatus and method for transferring substrate of the same | |
KR101066594B1 (en) | Substrate processing apparatus, method of setting nozzle using the same and method of processing substrate using the same | |
KR101134654B1 (en) | Apparatus for treating substrates and method for transferring substrates | |
KR20100059479A (en) | Substrate transfer device and substrate processing apparatus having the same | |
KR20090126583A (en) | Substrate transferring method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |