KR20100053092A - Loading part of batch type cleaning apparatus for substrate - Google Patents

Loading part of batch type cleaning apparatus for substrate Download PDF

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Publication number
KR20100053092A
KR20100053092A KR1020080112071A KR20080112071A KR20100053092A KR 20100053092 A KR20100053092 A KR 20100053092A KR 1020080112071 A KR1020080112071 A KR 1020080112071A KR 20080112071 A KR20080112071 A KR 20080112071A KR 20100053092 A KR20100053092 A KR 20100053092A
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KR
South Korea
Prior art keywords
wafer
cassette
guide
seating
seated
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KR1020080112071A
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Korean (ko)
Inventor
김혜진
Original Assignee
주식회사 실트론
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Priority to KR1020080112071A priority Critical patent/KR20100053092A/en
Publication of KR20100053092A publication Critical patent/KR20100053092A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Disclosed is a batch cleaning apparatus having a wafer loading portion capable of suppressing the shaking of a wafer and a cassette so that the gripper can accurately grasp the wafer and prevent a wafer omission accident. The wafer loading portion of the batch cleaning apparatus capable of preventing a wafer dropping accident may be provided in a seating portion in which a cassette containing a plurality of wafers is seated, and a lower portion of the seating portion is provided in a lower portion of the seating portion to simultaneously lift the wafers from the cassette. A separation unit for separating, a first cassette guide provided at the seating portion to guide the position at which the cassette is seated on the seating portion, and a second cassette guide provided at the seating portion to support the wafer underneath. .

Description

LOADING PART OF BATCH TYPE CLEANING APPARATUS FOR SUBSTRATE}

The present invention relates to a batch cleaning apparatus, and to provide a wafer loading portion of a batch cleaning apparatus that prevents a wafer accident occurrence from a loading portion loading a wafer into the cleaning processing portion.

In general, a semiconductor device is manufactured by repeatedly performing unit processes such as deposition, photolithography, etching, chemical mechanical polishing, cleaning, and drying on a semiconductor substrate.

During each of the unit processes, contaminants such as foreign matter or unnecessary films may be chemically, physically or electrically attached to the wafer surface. Since such contaminants adversely affect the yield and reliability of the product, a cleaning process is performed in the semiconductor manufacturing process to remove contaminants attached to the wafer. In particular, as the integration and miniaturization of semiconductor devices continue, the effects on the characteristics and yield of semiconductor devices due to surface contamination of bare wafers before the semiconductor devices are formed are gradually increasing.

In general, a wafer cleaning method is repeatedly immersed in a chemical bath and a rinse bath to remove contaminants on the wafer surface by the flow of the chemical and the rinse solution. In addition, the wafer cleaning apparatus is classified into a batch type cleaning apparatus for simultaneously cleaning a plurality of wafers according to the number of wafers processed simultaneously, and a single wafer cleaning apparatus for cleaning wafers in sheets. .

The conventional batch cleaning apparatus includes a cleaning processing unit in which a cleaning process is performed, and a loading unit loading a carrier (Cassette or front opening unified pods) FOW containing a wafer into the cleaning processing unit. The loading unit lifts and separates the wafer from the carrier in which the wafer is accommodated, and holds the separated wafer and transfers the wafer to the cleaning processing unit.

However, when the conventional loading unit separates the wafer from the cassette, a missing accident frequently occurs, in which some wafers are not separated from the cassette. As such, when a wafer is missing, an alarm indicating a missing is generated, the operation of the cleaning apparatus is stopped, the production is stopped, and the missing wafer is disposed of. Therefore, when such a wafer is missing, there is a problem in that productivity and yield are deteriorated due to a long operation stop time of the cleaning apparatus. In addition, the wafers transferred to the cleaning unit during the disposal of the missing wafers are waited for a long time (at least 15 minutes up to 1 hour), which increases the possibility that the wafers are exposed to the outside and become contaminated. It will adversely affect the incidence rate and yield.

SUMMARY OF THE INVENTION An object of the present invention for solving the above problems is to provide a batch cleaning apparatus having a wafer loading portion and a loading portion capable of preventing a wafer omission accident.

According to the embodiments of the present invention for achieving the above object of the present invention, the wafer loading portion of the batch type cleaning apparatus that can prevent a wafer missing accident, the seating portion on which a cassette containing a plurality of wafers is seated, the seating A separation unit provided at a lower portion of the cassette to separate the plurality of wafers simultaneously from the cassette by raising the wafer, a first cassette guide provided at the seating portion to guide a position at which the cassette is seated on the seating portion, and the seating And a second cassette guide provided at a portion to support the wafer at a lower portion thereof.

In an embodiment, the cassette supports the wafer in a four-point support manner, and a plurality of seating slots in which the wafer is inserted and seated is formed so as to support two lower wafer guides and the wafer is inserted and seated. A plurality of seating slots are formed to include two second wafer guides for supporting the side of the wafer, the first wafer guide is the circumference of the wafer so that the lifting unit can be moved up and down between the first wafer guide It may be formed spaced apart from each other along the direction.

In an embodiment, the second cassette guide may be formed along a first direction that is a longitudinal direction of the cassette, and the first cassette guide may be formed along a second direction that is perpendicular to the first direction.

In an embodiment, the first cassette guide may be formed to guide the outer surface of the cassette. In addition, the first cassette guide may protrude from the seating portion, and a surface facing the cassette may be formed as an inclined surface inclined along the direction in which the cassette is seated.

In example embodiments, the first and second wafer guides may be spaced apart from each other along the circumferential direction of the wafer, and the second cassette guide may be accommodated between the first wafer guide and the second wafer guide.

In an embodiment, the second cassette guide may be formed with a plurality of slots into which the wafer is inserted and seated.

In an exemplary embodiment, a plurality of slots having a comb shape may be formed on a surface where the separation unit contacts the wafer, and the slot may be inserted in the wafer direction to guide the insertion of the wafer. The first guide surface and the second guide surface may be formed to be inclined at different angles with respect to. For example, the lower second guide surface may be formed to be inclined 20 ° from both sides in the vertical direction along the direction in which the wafer edge is inserted.

On the other hand, according to the embodiments of the present invention for achieving the above object of the present invention, the batch cleaning device having a wafer loading portion that can prevent the wafer missing accident, the process that the wafer is accommodated and the cleaning process is performed And a loading unit configured to receive a module and a cassette containing a plurality of wafers to separate the wafers from the cassettes and to transfer the separated wafers to the process module. The loading unit may include a seating unit on which the cassette is seated, a separation unit provided at a center portion of the seating portion and being lifted in contact with the lower portion of the wafer to simultaneously separate the plurality of wafers from the cassette, and the separated wafer. A gripper for gripping and transporting, a first cassette guide provided at the seating portion to guide a position at which the cassette is seated, and a second cassette guide provided at the seating portion to support a lower portion of the wafer; Is done.

In one embodiment, one side of the seating portion is provided with a missing detection sensor for detecting whether the wafer remains in the cassette after the gripper transfers the wafer.

In example embodiments, the loading unit may include a guide unit configured to receive the wafer transferred from the gripper and transfer the wafer to the process module.

As described above, according to the present invention, first, the first cassette guide is provided to suppress the influence due to the flow of pure water during loading of the cassette to seat the cassette in the correct position of the loading portion and to prevent the shaking of the cassette. .

In addition, since the first cassette guide fixes the position of the side of the cassette, it is possible to prevent an accident of missing the wafer when the wafer is separated and held.

Second, since the second cassette guide supports the wafer, the wafer is not shaken due to the lifting and lowering of the separation unit and the flow of pure water so that the gripper can accurately grip the wafer and prevent the accident of omission.

Third, by reducing the slot width of the separation unit, the wafer can be inserted and seated accurately and stably in the slot, thereby preventing the wafer from being shaken so that the gripper can accurately grip the wafer and prevent the accident of omission.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. In describing the present invention, a detailed description of well-known functions or constructions may be omitted for clarity of the present invention.

Hereinafter, a batch cleaning apparatus for a semiconductor substrate according to an exemplary embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2. For reference, Figure 1 is a schematic diagram of a batch type cleaning apparatus according to an embodiment of the present invention, Figure 2 is a cross-sectional view showing an example of a process module according to an embodiment of the present invention.

Referring to FIG. 1, the batch type washing apparatus 100 includes a buffer unit 101, a loading unit 102, and a washing unit 103.

The buffer unit 101 is a device for loading a wafer for performing a cleaning process into the cleaning device 100 and unloading a wafer having been cleaned, and is equipped with a carrier containing a plurality of wafers. For example, the carrier may be a cassette containing 25 or 50 wafers. Alternatively, the carrier may use a front opening unified pod (FOUP).

The cleaning processor 103 includes a plurality of process modules 130 that receive the wafer and perform a cleaning process. The process module 130 is a cleaning apparatus in which a batch method of simultaneously cleaning a plurality of wafers.

Referring to FIG. 2, the process module 130 includes an inner bath 132, an outer bath 133, a lift unit 131, and an ultrasonic wave generator 134 in which a wafer 10 is cleaned by receiving a cleaning liquid or pure water. And a vibrator 135.

The inner tank 132 contains a predetermined cleaning liquid or pure water mixed with various chemical liquids, and the wafer 10 is immersed in the inner tank 132 to perform a cleaning process. For example, the cleaning liquid is a chemical liquid such as hydrofluoric acid (HF), SC1 (standard cleaning 1), or a mixed chemical liquid thereof.

The lift unit 131 is provided in the inner tank 132 to hold the plurality of wafers 10 in the inner tank 132 while a cleaning process is performed. The lift unit 131 is formed so that the wafer 10 is erected in the direction of gravity so that the wafer 10 can be vertically immersed in the cleaning liquid so that the edge portion is inserted and seated.

The outer tub 133 is provided along an outer circumference of the inner tub 132 to accommodate a washing liquid or pure water overflowed from the inner tub 132.

The outer tank 133 is connected to a supply line 136 for supplying and circulating the cleaning liquid or pure water overflowed to the outer tank 133 to the inner tank 132, and a heater 137 on the supply line 136. A filter 138 and a pump 139 are provided.

The ultrasonic generator 134 and the vibrator 135 for generating ultrasonic waves in the wafer 10 accommodated in the inner tank 132 are provided below the inner tank 132. For example, the vibrator 135 is attached to the bottom surface of the ultrasonic generator 134 and vibrates at a predetermined frequency to vibrate the cleaning liquid or pure water contained in the inner tank 132 through the ultrasonic generator 134. The removal effect of particles adhering to the surface of the wafer 10 by the vibration of the cleaning liquid is improved.

The loading unit 102 is provided between the buffer unit 101 and the cleaning processing unit 103 to temporarily receive the wafer 10 drawn from the cassette 11 before transferring to the cleaning processing unit 103. In particular, the wafer 10 is separated from the cassette 11. The loading unit 102 will be described in detail below with reference to FIGS. 3 to 5.

Hereinafter, the wafer loading unit of the batch cleaning apparatus according to an embodiment of the present invention will be described in detail with reference to FIGS. 3 to 5. For reference, FIG. 3 is a perspective view of a loading unit according to an embodiment of the present invention, FIG. 4 is an exploded perspective view for explaining a state in which a cassette is seated in the loading unit of FIG. 3, and FIG. 5 is a loading unit of FIG. 3. A cross section of the separation unit.

3 to 5, the loading unit 102 includes a wafer separation module for accommodating a cassette 11 having a plurality of wafers 10 largely separated from the cassette 11. 121 and a transfer module 122 for transferring the separated wafer 10 to the process module 130.

The wafer separation module 121 includes a seating unit 211 on which the cassette 11 in which the wafer 10 is accommodated is mounted, and a separation unit 212 and the cassette separating the wafer 10 from the cassette 11. And the first and second cassette guides 214 and 215 which suppress the shaking of the cassette 11 and the wafer 10 when separating the wafer 10 from (11).

The cassette 11 is formed to be accommodated in a state in which the plurality of wafers 10 are erected in a vertical direction, and is formed to support four edge portions 10a of the wafer 10. That is, the cassette 11 has two first wafer guides 111 supporting the lower portion of the wafer 10 and two second wafer guides 112 supporting the side portions of the wafer 10. . The first and second wafer guides 111 and 112 are formed with a plurality of guide slots 111a and 112a into which the edge portion 10a of the wafer 10 is inserted and seated. In addition, the cassettes 11 are formed with guide slots 111a and 112a at equal intervals so that the cassettes 10 are spaced apart at equal intervals from each other.

The first and second wafer guides 111 and 112 are formed to be spaced apart from each other along a circumferential direction of the wafer 10. In particular, when the cassette 11 is seated on the seating portion 211, the separation unit 212 moves up and down between the two first wafer guides 111.

The separation unit 212 is provided to move up and down in the center portion of the seating portion 211, and when the cassette 11 is seated on the seating portion 211, the separation unit 212 is lowered from the wafer 10. The wafer 10 is simultaneously detached from the cassette 11 by raising the wafer 10 in contact with.

The comb in which the edge portion 10a of the wafer 10 is inserted and seated on the surface contacting the wafer 10 in the separation unit 212 so as to support the wafer 10 at a predetermined interval from each other. A plurality of seating slots 230 are formed in the form of a comb.

Here, the seating slot 230 is formed to suppress the shaking of the wafer 10 seated in the seating slot 230 while the separation unit 212 is raised. For example, the seating slot 230 has a groove having a cross-sectional shape of approximately 'V' shape along the circumferential direction of the wafer 10 so that the edge portion 10a of the wafer 10 is inserted and seated. It is formed long.

In detail, referring to FIG. 5, the seating slot 230 may be left or right with respect to the surface of the wafer 10, that is, the vertical direction, in the direction in which the edge portion 10a of the wafer 10 is inserted. A predetermined angle inclined guide surface 231, 232 is formed, the guide surface 231, 232 is the first guide surface 231 and the first guide surface inclined at a predetermined angle along the insertion direction of the wafer 10 ( The second guide surface 232 having a smaller inclination angle than that of 231. Here, the inclination angles of the first and second guide surfaces 231 and 232 are planes parallel to the surface of the wafer 10 and passing through the center of the seating slot 230 and the first and second guide surfaces ( Refers to an angle formed by the 231 and 232, and refers to the angle based on the vertical axis passing through the center of the seating slot 230.

The first guide surface 231 is a surface in contact with the wafer 10 to guide the wafer 10 to be smoothly inserted into the seating slot 230. The second guide surface 232 has a smaller angle than the first guide surface 231 so that the edge portion 10a of the wafer 10 guided by the first guide surface 231 can be gripped more stably. Is formed. For example, the second guide surface 232 is formed at 20 degrees.

The first cassette guide 214 is provided at the seating portion 211 to guide the outside of the cassette 11. For example, the first cassette guides 214 may include two first cassettes in a longitudinal direction at both sides of the cassette 11, that is, in a second direction perpendicular to a first direction that is a longitudinal direction of the cassette 11. Guide 214 is formed.

The first cassette guide 214 protrudes a predetermined height from the seating portion 211 so as to guide the movement of the cassette 11 when the cassette 11 is mounted on the seating portion 211. The inner side facing the cassette 11 is formed to be inclined to the inner lower side. In addition, the first cassette guide 214 is provided on the outside of the cassette 11 is formed to a length sufficient to suppress the shake of the cassette (11).

Here, since the wafer 10 is separated from the cassette 11 in a state where pure water is filled in the wafer separation module 121, the separation unit 212 may be moved when the wafer 10 is separated. Flow may occur in the pure water, and the cassette 11 and the wafer 10 may be shaken by the flow of the pure water. As described above, when the cassette 11 or the wafer 10 is shaken, the gripper 222 may not hold the wafer 10 accurately and may cause a missing accident in which some wafers 10 are left in the cassette 11 and transferred. Can be. In addition, even when the cassette 11 is mounted on the wafer separation module 121, the cassette 11 is shaken due to the flow of pure water filled in the wafer separation module 121, thereby accurately positioning the seating portion 211. It can be difficult to get settled on.

However, according to the present exemplary embodiment, the first cassette guide 214 prevents the occurrence of a missing accident of the wafer 10 by suppressing the shaking of the cassette 11 due to the flow of pure water, and the cassette 11 is When mounted on the seating portion 211 guides to be seated in the correct position.

The first cassette guide 214 supports the outside of the cassette 11 to suppress shaking of the cassette 11, and the second cassette guide 215 is provided inside the cassette 11 to provide the wafer. The shaking of (10) is suppressed.

In detail, the second cassette guide 215 is formed to protrude a predetermined height from the seating portion 211 such that the cassette 11 contacts the lower portion of the wafer 10 when the cassette 11 is seated on the seating portion 211. It is formed to protrude into the cassette (11). For example, the second cassette guide 215 is formed along the longitudinal direction of the cassette 11, and the first wafer guide 214 when the cassette 11 is seated on the seating portion 211. And protrude into the space 13 between the second wafer guide 215.

In addition, the portion in contact with the wafer 10 has a predetermined curved shape to correspond to the outer periphery of the wafer 10, and a plurality of seating grooves 216 into which the edge portion 10a of the wafer 10 is inserted and seated. ) Is formed.

However, the present invention is not limited by the drawings, and the shape of the first and second cassette guides 214 and 215 may vary substantially depending on the shape and size of the cassette 11 and the size of the wafer 10. Can be changed.

The transfer module 122 includes a gripper 222 for holding and transferring the wafer 10 separated from the wafer separation module 121 and a guide unit 221 for receiving the separated wafer 10. .

The gripper 222 is provided on the loading unit 102 so as to reciprocate between the wafer separation module 121 and the transfer module 122 and simultaneously hold the plurality of wafers 10. The roller 223 is provided to be. For example, the gripper 222 is formed to grip the side edge portion 10a of the wafer 10.

The guide unit 221 is a wafer 10 transferred by the gripper 222 is accommodated in the guide unit 221 is transferred to the cleaning processing unit 103 while moving the process module 130 sequentially The cleaning process is performed.

On the other hand, when the gripper 222 grips and transports the wafer 10 to the seating portion 211, whether the cassette 11 and the separation unit 212 have the remaining wafer 10. Missing detection sensor 213 for detecting is provided.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

1 is a block diagram of a batch cleaning apparatus of a semiconductor substrate according to an embodiment of the present invention;

2 is a cross-sectional view illustrating a process module of the batch cleaning device of FIG. 1;

3 is a perspective view for explaining a loading unit according to an embodiment of the present invention;

4 is an exploded perspective view illustrating a state in which a cassette is seated in the loading unit of FIG. 3;

Figure 5 is a side cross-sectional view of the separation unit in the loading portion of FIG.

<Explanation of symbols for the main parts of the drawings>

10: wafer 10a: wafer edge

11: cassette 101: buffer portion

102: loading unit 103: cleaning treatment unit

111, 112: wafer guides 111a, 112a: guide slots

121: wafer separation module 122: transfer module

130: process module 131: lift unit

132: inner bath 133: outer bath

134: ultrasonic generator 135: oscillator

136: supply line 137: heater

138: filter 139: pump

211: seating unit 212: separation unit

213: Missing sensor 214, 215: Cassette guide

216: mounting groove 221: guide unit

222: gripper 223: roller

230: Seating slots 231, 232: Guide surface

Claims (12)

A seating part on which a cassette containing a plurality of wafers is seated; A separation unit provided below the seating portion and simultaneously separating the plurality of wafers from the cassette by raising the wafer; A first cassette guide provided in the seating part to guide a position at which the cassette is seated in the seating part; And A second cassette guide provided in the seating part to support the wafer at a lower portion thereof; Loading portion of the batch cleaning device comprising a. The method of claim 1, The cassette supports the wafer in a four-point support manner, Two first wafer guides having a plurality of seating slots into which the wafer is inserted and seated to support a lower portion of the wafer; And And a second wafer guide having a plurality of seating slots in which the wafer is inserted and seated to support side portions of the wafer. And the first wafer guides are spaced apart from each other along the circumferential direction of the wafer so that the separation unit can move up and down between the first wafer guides. The method of claim 2, The second cassette guide is formed along a first direction which is a longitudinal direction of the cassette, and the first cassette guide is formed along a second direction which is perpendicular to the first direction. part. The method of claim 3, And the first cassette guide is formed to guide the outer surface of the cassette. The method of claim 4, wherein The first cassette guide protrudes from the seating portion, and the loading unit of the batch cleaning device, characterized in that the surface facing the cassette is formed with an inclined surface inclined along the direction in which the cassette is seated. The method of claim 3, The first and second wafer guides are spaced apart from each other along the circumferential direction of the wafer, and the second cassette guide is accommodated between the first wafer guide and the second wafer guide. Loading section. The method of claim 6, And the second cassette guide is formed with a plurality of slots into which the wafer is inserted and seated. The method of claim 1, On the surface where the separation unit is in contact with the wafer, a plurality of slots having a comb shape into which an edge portion of the wafer is inserted are formed, And the slot has a first guide surface and a second guide surface formed to be inclined at different angles with respect to the insertion direction of the wafer so as to guide the insertion of the wafer. The method of claim 8, And a lower portion of the second guide surface inclined 20 ° from both sides in the vertical direction along the direction in which the wafer edge is inserted. A process module in which a wafer is accommodated and a cleaning process is performed; And A loading unit accommodating a cassette containing a plurality of wafers, separating the wafers from the cassettes, and transferring the separated wafers to the process module; Including, The loading unit, A seating part on which the cassette is seated; A separation unit provided at a center portion of the seating portion and separated from the cassette at the same time by being lifted in contact with the lower portion of the wafer; A gripper for holding and transferring the separated wafer; A first cassette guide provided in the seating part to guide a position at which the cassette is seated in the seating part; And A second cassette guide provided in the seating part to support the wafer at a lower portion thereof; Batch cleaning apparatus comprising a. The method of claim 10, One side of the seating portion batch cleaning device, characterized in that the gripper transfers the wafer after the missing detection sensor for detecting whether the wafer remains in the cassette. The method of claim 10, The loading unit further comprises a guide unit for receiving the wafer transferred from the gripper to transfer to the process module.
KR1020080112071A 2008-11-12 2008-11-12 Loading part of batch type cleaning apparatus for substrate KR20100053092A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101589601B1 (en) * 2014-08-27 2016-01-28 주식회사 엘지실트론 Method for manufacturing wafer
KR20170103444A (en) 2016-03-04 2017-09-13 주식회사 케이씨텍 Loading apparatus of batch type cleaning apparatus for substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101589601B1 (en) * 2014-08-27 2016-01-28 주식회사 엘지실트론 Method for manufacturing wafer
KR20170103444A (en) 2016-03-04 2017-09-13 주식회사 케이씨텍 Loading apparatus of batch type cleaning apparatus for substrate

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