JPH10256346A - Cassette transferring mechanism and semiconductor manufacturing apparatus - Google Patents

Cassette transferring mechanism and semiconductor manufacturing apparatus

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Publication number
JPH10256346A
JPH10256346A JP7891497A JP7891497A JPH10256346A JP H10256346 A JPH10256346 A JP H10256346A JP 7891497 A JP7891497 A JP 7891497A JP 7891497 A JP7891497 A JP 7891497A JP H10256346 A JPH10256346 A JP H10256346A
Authority
JP
Japan
Prior art keywords
cassette
mechanism
loading
unloading
semiconductor manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7891497A
Other languages
Japanese (ja)
Inventor
Teruo Asakawa
Yoji Iizuka
輝雄 浅川
洋二 飯塚
Original Assignee
Tokyo Electron Ltd
東京エレクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, 東京エレクトロン株式会社 filed Critical Tokyo Electron Ltd
Priority to JP7891497A priority Critical patent/JPH10256346A/en
Publication of JPH10256346A publication Critical patent/JPH10256346A/en
Pending legal-status Critical Current

Links

Abstract

(57) [Problem] To provide a front end of a conventional semiconductor manufacturing apparatus, via a tray 2 pulled out from a front panel 5 when a pod P is carried in / out of a load port of the semiconductor manufacturing apparatus. Since the pod P is loaded and unloaded, a dedicated space for pulling out the tray 2 is required, so that the footprint of the semiconductor manufacturing apparatus is increased and a bay area formed by a group of apparatuses of the same model is required. There was a problem that extra space was required. In addition, in the case of the conventional load port, since only one pod P can be loaded and unloaded via the tray 2, the wafer processing cycle is short, the number of loading and unloading of the pod P is increased, and the operation efficiency of the apparatus itself is reduced. There was a problem that it was low. A cassette loading / unloading mechanism (12) is provided at a wafer loading / unloading port in a semiconductor manufacturing apparatus (10) for performing a predetermined process on a wafer and stores a plurality of pods (20) in a vertical direction. Cassette transfer mechanism 1 that is disposed beside storage mechanism 13 and transfers pod 20 to and from cassette storage mechanism 13
4 is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cassette loading / unloading mechanism and a semiconductor manufacturing apparatus having the cassette loading / unloading mechanism.

[0002]

2. Description of the Related Art Wafer processing in a semiconductor manufacturing process tends to shift from a current 6-inch or 8-inch semiconductor wafer (hereinafter simply referred to as "wafer") to a 12-inch wafer at a stretch. Along with this, semiconductor manufacturing apparatuses for 12-inch wafers are being developed. In the era of 12-inch wafers, not only are the wafers simply larger and heavier, but also the integrated circuits formed on the wafers have an ultra-fine structure with a line width of sub-quarter microns or less. Ultra-clean technology for clean rooms and technology for automatically transferring wafers are becoming increasingly important. In addition, since the footprints of various semiconductor manufacturing apparatuses increase, it is increasingly important to suppress an increase in the footprint around the semiconductor manufacturing apparatuses.

By the way, when transferring wafers between each process up to an 8-inch wafer, it is necessary to transfer the cassette in a state where the wafers are erected and to level the wafers when loading and unloading semiconductor devices in each process. Was common. Loading and unloading of cassettes into and from the apparatus are performed via an operator or via an AGV. However, 12
In the case of inch wafers, if the wafers are transported while standing, the lower end of the wafers may be damaged due to the weight of the wafers or vibrations during the transportation. When carrying in and out of the apparatus, it is performed in a horizontal state as it is. Then, it is difficult to carry the cassette in and out of the apparatus through an operator from the viewpoint of countermeasures against the weight of the wafer and particles, so that automation of these operations is promoted.

Further, up to an 8-inch wafer, a cassette storage chamber in which a cassette is mounted is evacuated to a predetermined degree of vacuum, and then wafers are transferred one by one to a predetermined processing chamber via a load lock chamber. Was. However, since the capacity of the cassette becomes large when a 12-inch wafer is used, a great amount of time is required until the cassette storage chamber is evacuated, and an organic gas or the like is released as an impurity gas from the plastic cassette by evacuation. And the inside of the device may be contaminated. Therefore, in the case of a manufacturing apparatus for 12 inches, a relay chamber is arranged in a stage preceding the load lock chamber, and the wafer in the cassette is once taken out into the relay chamber. Wafers are transferred one by one. Therefore, the cassette is required to be compatible with 12-inch wafers. At present, there are two types of cassettes, for example, an open type cassette and a closed type pod (for example, a unified pod) in which the cassette is stored in a pod and the lid is closed.
Is considered.

[0005] By the way, the current 12-inch semiconductor manufacturing apparatus under the above-mentioned circumstances, particularly as a front end thereof, is configured as shown in FIG. 8, for example. The semiconductor manufacturing apparatus 1 includes, for example, a tray 2 for loading and unloading a pod P containing 13 or 25 wafers into and from a cassette storage chamber, an opener 3 for opening and closing a lid of the pod P on the tray 2, A relay chamber 4 for taking out a plurality of wafers from the pod P opened by the opener 3 is provided. Although not shown, a load lock chamber is connected to the relay chamber 4 via a gate valve so that the wafers in the relay chamber 4 are transferred one by one to a wafer processing chamber. A front panel 5 is provided on the front surface of the apparatus, and the front panel 5 partitions the apparatus side and the clean room side. The front panel 5 is provided with a door 6 that opens and closes when the pod P is carried into and out of the cassette storage chamber via the tray 2.

[0006]

However, in the case of the front end of the conventional semiconductor manufacturing apparatus, a tray pulled out from the front panel 5 when the pod P is carried in and out of the cassette storage chamber of the semiconductor manufacturing apparatus. Since the pod P is carried in and out through the pod 2, a dedicated space for pulling out the tray 2 is required, and the footprint of the semiconductor manufacturing apparatus is increased accordingly, and the pods P are formed by a group of apparatuses of the same model. There was a problem that extra space was required in the bay area. In the case of a conventional cassette storage room, the pod P
Can be carried in and out one by one, so that the processing cycle of the wafer is short, the number of times the pod P is carried in and out is increased, and the operation efficiency of the apparatus itself is low.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a cassette loading / unloading mechanism and a semiconductor manufacturing apparatus capable of reducing a footprint and improving operating efficiency. And

[0008]

According to a first aspect of the present invention, there is provided a cassette loading / unloading mechanism which is disposed at a loading / unloading port of a workpiece in a semiconductor manufacturing apparatus for performing a predetermined process on the workpiece and includes a plurality of cassettes. And a cassette transfer mechanism that is disposed on the side of the cassette storage mechanism and transfers a cassette to and from the cassette storage mechanism.

According to a second aspect of the present invention, in the cassette loading / unloading mechanism according to the first aspect, the cassette transfer mechanism includes a cassette capable of moving the cassette forward and backward with respect to the cassette storage mechanism. A mounting body is provided.

According to a third aspect of the present invention, a cassette loading / unloading mechanism is provided at a loading / unloading port of a workpiece in a semiconductor manufacturing apparatus for performing a predetermined process on the workpiece, and a plurality of cassettes are vertically arranged. A cassette storage mechanism for storing a cassette; and a cassette delivery mechanism for delivering a cassette to and from the cassette storage mechanism, wherein the cassette delivery mechanism is a rotary shaft provided on one side between the carry-in / out opening and the cassette storage mechanism. And a cassette mounting body extending horizontally from the rotation shaft and capable of rotating forward and backward through the rotation shaft.

According to a fourth aspect of the present invention, there is provided a cassette loading / unloading mechanism according to any one of the first to third aspects, wherein the cassette accommodating mechanism mounts the cassette. And a plurality of cassette mounts that can be moved up and down.

According to a fifth aspect of the present invention, there is provided a cassette loading / unloading mechanism for loading / unloading a cassette into / from a loading / unloading port of a workpiece in a semiconductor manufacturing apparatus for performing a predetermined process on the workpiece. A shaft that is erected on the side of the loading / unloading mechanism, and is horizontally connected to the shaft in a plurality of upper and lower stages, and can be independently rotated in forward and reverse directions and integrally with the shaft. And a plurality of cassette mounts that can be moved up and down.

According to a sixth aspect of the present invention, there is provided a semiconductor manufacturing apparatus having a cassette loading / unloading mechanism for loading / unloading a cassette containing a plurality of objects to / from the apparatus body. The cassette loading / unloading mechanism is disposed at a loading / unloading port of the object to be processed and stores a plurality of cassettes in a vertical direction. And a cassette delivery mechanism for delivering the cassette.

According to a seventh aspect of the present invention, in the semiconductor manufacturing apparatus according to the sixth aspect, the cassette loading / unloading mechanism integrates the cassette storage mechanism and the cassette delivery mechanism. It is characterized by the following.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in FIGS. As shown in FIGS. 1 to 3, a semiconductor manufacturing apparatus 10 according to the present embodiment includes an apparatus body 11 in which a plurality of processing chambers are arranged in a cluster around a transfer chamber.
And a cassette loading / unloading mechanism 12 disposed on the front surface of the apparatus main body 11 for loading / unloading wafers in cassette units. Cassette 2 carried in / out by cassette carrying-in / out mechanism 12
0 is, for example, 13 or 25 12-inch wafers.
It is configured as a closed pod formed of a synthetic resin such as polycarbonate, PEEK (polyetheretherketone), or the like, for storing sheets. Further, for example, nitrogen gas is sealed in the pod 20 to prevent natural oxidation of the wafer as much as possible and to make the inside a clean environment. Therefore, hereinafter, the cassette 20 will be described as the pod 20.

The cassette loading / unloading mechanism 12 includes a pair of left and right cassette storage mechanisms 13 arranged at a wafer loading / unloading port of the apparatus main body 11 and storing a plurality of (for example, two) pods 20 in a vertical direction. Each cassette storage mechanism 13
And a cassette transfer mechanism 14 that transfers the pod 20 to and from the cassette storage mechanism 13 and is configured to perform drive control according to a predetermined program. Each cassette storage mechanism 13 is stored in a cassette storage chamber 13A, and an opening through which a pod 20 passes is formed in a side surface of each cassette storage chamber 13A on the cassette transfer mechanism 14 side.
The door 13B of this opening is opened and closed when the carry-in / out operation is performed.

As shown in FIGS. 1 and 3, a cassette transfer device 15 is provided above the cassette transfer mechanism 14, and the cassette transfer device 15 is provided with various types of rails according to rails 16 provided on the ceiling of a clean room. The pods 20 are moved between the bay areas of the semiconductor manufacturing apparatus group, and are moved in the bay areas to directly transfer the pods 20 to and from the cassette transfer mechanisms 14 of the plurality of semiconductor manufacturing apparatuses 10. Therefore, the cassette transport device 15 has a gripping portion 15A that grips the pod 20 by descending from the ceiling via a wire or the like, and grips the gripped portion 22 formed on the upper surface of the main body 21 of the pod 20. is there. Therefore, in the present embodiment, all the pods 20 are transported by the cassette transport device 15.

As shown in FIG. 4, a relay chamber 17 is disposed at the back of the cassette storage chamber 13A through a gap.
A load lock chamber 18 (see FIG. 4) is connected to the relay chamber 17 via a gate valve. This relay room 17
A multi-joint type handling arm (not shown) is disposed in the inside, and a plurality of (for example, 13 or 25) wafers are collectively transported between the pod 20 and the relay chamber 17 via the handling arm. At the same time, a plurality of wafers are held horizontally in the relay chamber 17. Also,
A gap is formed between the cassette storage chamber 13A and the relay chamber 17, and an opener 19 for opening and closing the lid 23 of the pod 20 is provided in the gap. As shown in FIG. 5, the opener 19 holds the wafer W via a handling arm.
When the wafer is transported, the lid 23 of the pod 20 is automatically opened and closed at a wafer loading / unloading position with respect to the apparatus main body 11. Further, the gap is shut off from the cassette storage chamber 13A and the outside, and purified air or the like is supplied to the gap through a filter in a downward flow as shown by an arrow in FIG. Even when 23 is opened, the wafer is prevented from adhering particles and the gap is always kept clean. Further, a gate valve (not shown) is attached to a surface of the relay chamber 17 facing the opener 19, and the gate valve is opened when a wafer is loaded and unloaded, and after the wafer is loaded, the gate valve is closed to close the relay chamber 17. Is sealed. Therefore, after the lid 23 of the pod 20 is opened by the opener 19, the wafers are carried from the pod 20 through the handling arm into the relay chamber 17 and held therein. Are transported to various processing chambers through the processing chamber, and, for example, etching processing, film forming processing, and the like are performed in each processing chamber.

By the way, the cassette storage mechanism 13 includes:
As shown in FIGS. 3 and 4, for example, a cassette mounting body 13 </ b> C in the upper and lower stages and an elevating control mechanism (not shown) that integrally controls the elevating and lowering of these cassette mounting bodies 13 </ b> C are provided. Each cassette mounting body 13C is stopped at a wafer loading / unloading position by a mechanism. Further, a cassette positioning mechanism (not shown) is provided on the cassette mounting body 13C, and the pod 20 is positioned on the cassette mounting body 13C by this positioning mechanism, and the lid 23 thereof can be opened and closed. The positioning mechanism includes, for example, a plurality of protrusions formed on the upper surface of the cassette mounting body 13C, and a concave portion formed on the back surface of the pod 20 corresponding to these protrusions, or a protrusion. There are, for example, those in which the concave portions are reversed. Also, the cassette mounting body 1
3C is configured to be able to move forward and backward with respect to the direction of the opener 19, and to advance toward the opener 19 when stopped at a wafer loading / unloading position via a lifting drive mechanism.
Therefore, the cassette storage mechanism 13 can store two pods 20 and can carry in and out one other pod 20 while processing the wafer in one pod 20. Continuous operation can be performed without stopping the manufacturing apparatus 10.

The cassette transfer mechanism 14 includes a left and right cassette storage chambers 1 which are dead spaces of the apparatus main body 11.
It is arranged between 3A. As shown in FIG. 3, the cassette transfer mechanism 14 includes a cassette mounting body 14A on which the pod 20 is mounted, and a driving mechanism (FIG. 3) for moving the cassette mounting body 14 forward and backward with respect to the left and right cassette storage chambers 13A. (Not shown), the cassette mounting body 14A is advanced into the left and right cassette storage chambers 13A via the drive mechanism, and the pod 20 is transferred to and from each cassette mounting body 13C of the cassette storage mechanism 13. It is. A positioning mechanism similar to the cassette mounting body 13C of the cassette housing mechanism 13 is formed on the upper surface of the cassette mounting body 14A. Further, the cassette mounting body 14A is formed such that the cassette mounting bodies 14A and 13C do not interfere with each other when the pod 20 is transferred between the cassette mounting body 13C and the cassette mounting body 13C. Accordingly, the cassette transfer mechanism 14 is automatically positioned at a predetermined position when receiving the pod 20 transferred by the wafer transfer device 15 so that the pod 20 can be smoothly transferred to the cassette storage mechanism 13.

Next, the operation will be described. For example, the cassette storage chamber 1 on the left side of the semiconductor manufacturing apparatus 10 shown in FIG.
A case where the pod 20 is carried into the 3A will be described. In this case, an indicator lamp indicating that the pod 20 is to be carried into the cassette storage chamber 13A is lit on an operation panel (both not shown),
Call for import. Then, the operator knows the state in which the cassette can be loaded, and operates a cassette loading operation button (not shown). As a result, the cassette transport device 15 is
5A, the pod 20 is moved along the rail 16 while holding the pod 20, and the cassette delivery mechanism 1 of the semiconductor manufacturing apparatus 10 is moved.
When stopped just above the position 4, the holder 15A is lowered, and the pod 20 is mounted on the cassette mounting body 14A. At this time, the pod 20 is accurately positioned at a predetermined position on the cassette mounting body 14A via the positioning mechanism. At the same time, the elevation control mechanism of the cassette storage mechanism 13 drives the cassette mounting body 13C, moves the cassette mounting body 13C up and down to the pod receiving position, and stands by.

Next, the door 13 of the cassette storage chamber 13A
When B is opened, the cassette mounting body 14A of the cassette transfer mechanism 14 is driven via the drive mechanism, advances into the cassette storage chamber 13A, and stops at the pod transfer position.
Thereafter, the cassette mounting body 13C moves up, passes through the cassette mounting body 14A, receives the pod 20, and is positioned at a predetermined position, and the cassette mounting body 14A retreats and returns to the initial position of the cassette transfer mechanism 14. . Further, when the next pod 20 is loaded, the pod 20 is loaded in the same procedure as in the above-described case. As described above, when two pods 20 are successively carried in, it is possible to specify so on the operation panel. Further, the pod 20 is loaded into the other cassette storage mechanism 13 in the same manner.

When the pod 20 is carried into the semiconductor manufacturing apparatus 10 as described above, the processing of the wafer is started. At this time, the cassette storage mechanism 13 is driven, and one of the cassette mounting bodies 13C moves up and down to the wafer loading / unloading position and stops. Next, after the opener 19 is driven to open the lid 23 of the pod 20, the handling arm of the relay chamber 17 is driven to collect a predetermined number of wafers in the pod 20 and carry the wafer into the relay chamber 17. It drives and closes the pod 20 with the lid 23. When the wafers are loaded into the relay chamber 17, the wafers are loaded one by one into the load lock chamber 1.
The wafer is conveyed to each processing chamber via 8 and subjected to a predetermined process in each processing chamber. When the predetermined processing is completed in each processing chamber, the processed wafer is returned to the relay chamber 17, and further,
The processed wafer is returned into the pod 20 via the handling arm. Thereafter, the next pod 20 moves to the wafer loading / unloading position, loads the wafer into the relay chamber 17, and performs the same processing on the wafer. During this time, in the cassette storage chamber 13A, the cassette placing body 1 is moved via the elevation control mechanism.
After the pod 20 containing the processed wafer is placed on the cassette 3C and raised and lowered to the cassette transfer position and stopped there, the pod 20 is transferred to the cassette storage chamber 13A via the cassette mount 14A of the cassette transfer mechanism 14. Is carried out, and the wafer is transferred to a predetermined portion by the wafer transfer device 15. Then, the next pod 20 is transferred via the wafer transfer device 15 to the cassette transfer mechanism 14 of the semiconductor manufacturing apparatus 10.
, And delivered to the cassette transfer mechanism 14.

According to the present embodiment as described above,
Cassette transfer mechanism 1 beside the cassette storage chamber 13A
Since the space 4 is provided, the dead space of the semiconductor manufacturing apparatus 10 can be effectively used, and it is not necessary to provide a dedicated space for cassette transfer in the front of the apparatus (the front of the cassette storage chamber) as in the related art. Only the footprint of the semiconductor manufacturing apparatus 10 can be reduced. Further, according to the present embodiment, two pods 20 are stored in the cassette storage mechanism 13, and the wafers stored in each pod 20 can be continuously processed.
The semiconductor manufacturing apparatus 10 can be continuously operated even when the pod 20 is carried in and out, and the operation efficiency can be significantly improved without stopping the semiconductor manufacturing apparatus 10 every time the pod 20 is carried in and out.

Semiconductor manufacturing apparatus 3 according to another embodiment of the present invention
0 will be described with reference to FIG. As shown in the figure, a semiconductor manufacturing apparatus 30 of the present embodiment includes
A cassette loading / unloading mechanism 32 is provided on the front surface of the apparatus main body 31. The apparatus main body 31 includes a relay chamber 37 having a wafer loading / unloading port, a load lock chamber 38 connected to the relay chamber 37 via a gate valve,
A plurality of processing chambers are connected to the load lock chamber 38 via a transfer chamber and arranged in a cluster.
A multi-joint type handling arm 37A similar to that of the above embodiment is disposed in the relay room 37, and a plurality of wafers are held by the handling arm 37A during wafer processing. In the case of the present embodiment, the loading / unloading port for the wafer is formed not on the front side but on the side of the relay chamber 37. 37B is a gate valve.

As shown in FIG. 6, the cassette loading / unloading mechanism 32 includes a cassette storage mechanism 33 and a cassette delivery mechanism 34. The cassette storage mechanism 33 is configured according to the above-described embodiment, and is disposed to face the carry-in / out entrance of the relay chamber 37 of the apparatus main body 31. On the other hand, the cassette transfer mechanism 34 is different from the above-described embodiment in that the cassette transfer mechanism 34 is of a rotary type. In other words, the cassette transfer mechanism 34 is connected to the rotating shaft 34A standing upright from the inside of the front panel F slightly outside the opener 39 and connected to the rotating shaft 34A at a corner at the base end and extends horizontally. A cassette mounting body 34B is provided, and the rotation shaft 34A rotates forward and backward by 90 °, for example, as shown by an arrow via a rotation driving mechanism (not shown). Then, the cassette mounting body 34
B is formed in, for example, a comb shape so that the cassette mounting body 33C of the cassette storage mechanism 33 does not interfere with the vertical movement of the cassette mounting mechanism 33 when the cassette mounting mechanism 33A reaches the delivery position of the pod 20 in the cassette storage chamber 33A. Therefore, the cassette mounting body 34
Even when B reaches the cassette transfer position in the cassette storage chamber 33A, the cassette mounting body 33C of the cassette storage mechanism 33 moves up and down without interfering with the cassette mounting body 34B, and can transfer the pod 20. . Others are configured according to the above embodiment.

Therefore, in the present embodiment, a wafer loading / unloading port is provided on the side of the relay chamber 37 for transferring wafers, and a cassette loading / unloading mechanism 32 is arranged opposite to the loading / unloading port to provide a front side of the semiconductor manufacturing apparatus 30. 6 (side of the relay room), the cassette mounting body 34B of the cassette transfer mechanism 34 is located in the space shown by the dashed line in FIG. 6 occupied by the cassette loading / unloading mechanism of the above embodiment. It only overhangs and requires at most the space occupied by the cassette loading / unloading mechanism in the above embodiment, so that the footprint can be reduced as in the above embodiment as compared with the related art. According to the present embodiment, two pods 20 are provided in the same manner as in the above embodiment.
Is provided, the operating efficiency of the semiconductor manufacturing apparatus 30 can be improved.

FIG. 7 is a view corresponding to FIG. 6 showing still another embodiment of the present invention. In the case of the semiconductor manufacturing apparatus 40 of this embodiment, the relay room 47 is divided into first and second relay rooms 47C and 47D as shown in the figure, and the first and second relay rooms 47C and 47D are It is partitioned by a gate valve 47B. The inside of the articulated handling arm 47A is disposed in the first relay room 47C,
A wafer holding mechanism 47E that collectively holds a plurality of wafers vertically is provided in the relay chamber 47D. Fig. 6 for others
Of the semiconductor manufacturing apparatus 30 shown in FIG. Therefore, in this embodiment, the same operation and effect as those of the semiconductor manufacturing apparatus 30 of the embodiment shown in FIG. 6 can be expected.

Although not shown, the cassette loading / unloading mechanism of the present invention may be one in which the cassette storage mechanism and the cassette delivery mechanism shown in FIGS. 6 and 7 are integrated. In other words, this cassette carrying-in / out mechanism is configured such that the rotation axis in FIGS.
Are mounted in two vertical stages. Then, each cassette mounting body is 90 °
It is configured to be individually rotatable in the forward and reverse directions and to be capable of integrally controlling the elevation. Therefore, when transferring the pod to and from the wafer transfer device, one of the cassette mounting members protrudes alternately outside the front panel, and when loading and unloading a wafer from the pod, the cassette mounting body faces the transfer port of the relay chamber. The pods are integrally moved up and down so that each pod is located at the entrance. In this case, the cassette loading / unloading mechanism becomes compact, and the cassette loading / unloading mechanism can be manufactured at lower cost.

In each of the above embodiments, the wafer transfer device 1
Although the case where the pod 20 is directly transferred to the cassette transfer mechanism via the transfer device 5 has been described, the wafer transfer device is used only when the transfer is performed between the bays constituted by the respective semiconductor manufacturing device groups, and within each bay area, the wafer transfer device is used. The pod may be delivered to each delivery mechanism via an AGV or an operator. Further, in each of the above embodiments, the case where the wafer is transferred using the pod which is a sealed cassette has been described, but it goes without saying that the wafer may be transferred using the open type cassette.

[0031]

According to the first to seventh aspects of the present invention, a cassette loading / unloading mechanism and a semiconductor manufacturing apparatus capable of reducing a footprint and improving operating efficiency are provided. can do.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a front end of a semiconductor manufacturing apparatus of the present invention to which an embodiment of a cassette carrying-in / out mechanism of the present invention is applied.

FIG. 2 is a plan view showing a main part of a cassette carrying-in / out mechanism of the semiconductor manufacturing apparatus shown in FIG.

FIG. 3 is a front view showing a main part of the cassette loading / unloading mechanism shown in FIG. 2;

FIG. 4 is a side view of the semiconductor manufacturing apparatus shown in FIG.

FIG. 5 is a perspective view showing a state in which a lid of a pod is opened by the opener shown in FIG. 2;

FIG. 6 is a plan view corresponding to FIG. 2, showing another embodiment of the cassette carrying-in / out mechanism of the present invention.

FIG. 7 is a plan view corresponding to FIG. 2 and showing still another embodiment of the cassette carrying-in / out mechanism of the present invention.

FIG. 8 is a plan view showing a front end of a semiconductor manufacturing apparatus to which a conventional cassette loading / unloading mechanism is applied.

[Explanation of symbols]

 10, 30, 40 Semiconductor manufacturing apparatus 11, 31, 41 Main body 12, 32, 42 Cassette loading / unloading mechanism 13, 33, 43 Cassette storage mechanism 13C, 33C Cassette mounting body 14, 34, 44 Cassette delivery mechanism 14A, 34B Cassette mounting body 34A Rotating shaft 20 Pod (cassette)

Claims (7)

[Claims]
1. A cassette storage mechanism which is disposed at a loading / unloading port of a target object and stores a plurality of cassettes in a vertical direction in a semiconductor manufacturing apparatus for performing a predetermined process on the target object, and And a cassette transfer mechanism for transferring the cassette to and from the cassette storage mechanism.
2. The cassette loading / unloading mechanism according to claim 1, wherein the cassette transfer mechanism includes a cassette mounting member capable of moving the cassette forward and backward with respect to the cassette storage mechanism.
3. A cassette storage mechanism, which is arranged at a loading / unloading port of the object to be processed and stores a plurality of cassettes in a vertical direction in a semiconductor manufacturing apparatus for performing predetermined processing on the object to be processed, between the cassette storing mechanism. A cassette delivery mechanism for delivering a cassette, the cassette delivery mechanism comprising: a rotating shaft erected on one side between the loading / unloading port and the cassette storage mechanism; and a horizontally extending rotating shaft extending from the rotating shaft. A cassette loading / unloading mechanism, comprising: a cassette mounting member that is rotatable forward and backward through the cassette mounting mechanism.
4. The cassette storage mechanism according to claim 1, wherein the cassette storage mechanism includes a plurality of cassette mounting bodies on which the cassette is mounted and which can be moved up and down.
The cassette loading / unloading mechanism according to the paragraph.
5. A cassette loading / unloading mechanism for loading / unloading a cassette from / to a loading / unloading port of a workpiece in a semiconductor manufacturing apparatus for performing a predetermined process on the workpiece, wherein said cassette loading / unloading mechanism is provided on a side of said loading / unloading mechanism. And a plurality of cassette mounts that are horizontally connected to the shaft in a plurality of upper and lower stages, are independently rotatable in forward and reverse directions, and are integrally controlled to move up and down according to the shaft. A cassette loading / unloading mechanism.
6. A semiconductor manufacturing apparatus having a cassette loading / unloading mechanism for loading / unloading a cassette containing a plurality of workpieces with respect to an apparatus body, wherein the cassette loading / unloading mechanism is provided at a loading / unloading port of the workpiece. A cassette storage mechanism that is disposed and stores a plurality of cassettes in a vertical direction; and a cassette transfer mechanism that is disposed beside the cassette storage mechanism and transfers a cassette to and from the cassette storage mechanism. Semiconductor manufacturing equipment.
7. The semiconductor manufacturing apparatus according to claim 6, wherein said cassette loading / unloading mechanism integrates said cassette storage mechanism and said cassette delivery mechanism.
JP7891497A 1997-03-13 1997-03-13 Cassette transferring mechanism and semiconductor manufacturing apparatus Pending JPH10256346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7891497A JPH10256346A (en) 1997-03-13 1997-03-13 Cassette transferring mechanism and semiconductor manufacturing apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7891497A JPH10256346A (en) 1997-03-13 1997-03-13 Cassette transferring mechanism and semiconductor manufacturing apparatus
TW87103564A TW432463B (en) 1997-03-13 1998-03-11 A cassette loading/unloading mechanism and a semiconductor manufacturing apparatus
KR1019980008317A KR19980080191A (en) 1997-03-13 1998-03-12 Cassette Carry-In / Out Device and Semiconductor Manufacturing Equipment

Publications (1)

Publication Number Publication Date
JPH10256346A true JPH10256346A (en) 1998-09-25

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Family Applications (1)

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Country Status (3)

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JP (1) JPH10256346A (en)
KR (1) KR19980080191A (en)
TW (1) TW432463B (en)

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