AU2001247512A1 - Method and structure for producing flat wafer chucks - Google Patents

Method and structure for producing flat wafer chucks

Info

Publication number
AU2001247512A1
AU2001247512A1 AU2001247512A AU4751201A AU2001247512A1 AU 2001247512 A1 AU2001247512 A1 AU 2001247512A1 AU 2001247512 A AU2001247512 A AU 2001247512A AU 4751201 A AU4751201 A AU 4751201A AU 2001247512 A1 AU2001247512 A1 AU 2001247512A1
Authority
AU
Australia
Prior art keywords
flat wafer
producing flat
wafer chucks
chucks
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001247512A
Inventor
Robert Chen
Albert Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Matrix Integrated Systems Inc
Original Assignee
Matrix Integrated Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matrix Integrated Systems Inc filed Critical Matrix Integrated Systems Inc
Publication of AU2001247512A1 publication Critical patent/AU2001247512A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2001247512A 2000-05-18 2001-03-16 Method and structure for producing flat wafer chucks Abandoned AU2001247512A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US20589700P 2000-05-18 2000-05-18
US60205897 2000-05-18
US09749241 2000-12-27
US09/749,241 US20010035403A1 (en) 2000-05-18 2000-12-27 Method and structure for producing flat wafer chucks
PCT/US2001/008543 WO2001089268A1 (en) 2000-05-18 2001-03-16 Method and structure for producing flat wafer chucks

Publications (1)

Publication Number Publication Date
AU2001247512A1 true AU2001247512A1 (en) 2001-11-26

Family

ID=26900854

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001247512A Abandoned AU2001247512A1 (en) 2000-05-18 2001-03-16 Method and structure for producing flat wafer chucks

Country Status (3)

Country Link
US (2) US20010035403A1 (en)
AU (1) AU2001247512A1 (en)
WO (1) WO2001089268A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004019658A1 (en) * 2002-08-20 2004-03-04 Ibiden Co., Ltd. Metal heater
KR101018259B1 (en) * 2002-09-10 2011-03-03 액셀리스 테크놀로지스, 인크. Method of heating a substrate in a variable temperature process using a fixed temperature chuck
WO2004049762A1 (en) * 2002-11-25 2004-06-10 Ibiden Co., Ltd. Metal heater
GB0329460D0 (en) * 2003-12-19 2004-01-28 Oxford Instr Plasma Technology Apparatus and method for plasma processing
EP1738251A2 (en) * 2004-04-16 2007-01-03 Cascade Basic Research Corp. Modelling relationships within an on-line connectivity universe
US20060075970A1 (en) * 2004-10-13 2006-04-13 Guenther Rolf A Heated substrate support and method of fabricating same
JP2006140367A (en) * 2004-11-15 2006-06-01 Sumitomo Electric Ind Ltd Heating element for semiconductor manufacturing apparatus and heating apparatus loading heating element
US20060180083A1 (en) * 2005-02-11 2006-08-17 Zenith Materials Technology Corp. Positioning board for positioning heater lines during plasma enhanced CVD (PECVD)
US7429718B2 (en) * 2005-08-02 2008-09-30 Applied Materials, Inc. Heating and cooling of substrate support
US8709162B2 (en) * 2005-08-16 2014-04-29 Applied Materials, Inc. Active cooling substrate support
US7942969B2 (en) * 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
EP2390084B1 (en) * 2010-05-26 2012-07-18 UHLMANN PAC-SYSTEME GmbH & Co. KG Heating plate for heating a film
JP5962833B2 (en) * 2015-01-16 2016-08-03 Toto株式会社 Electrostatic chuck
FR3049210B1 (en) * 2016-03-24 2018-04-13 Centre Technique Des Industries Mecaniques INDUCTION THERMOFORMING MOLD
JP2020064841A (en) * 2018-10-11 2020-04-23 日本発條株式会社 Stage, film forming apparatus, and film processing apparatus

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US2007111A (en) * 1931-10-17 1935-07-02 Doherty Res Co Glazed electric range heating unit and glaze therefor
US2179934A (en) * 1936-09-14 1939-11-14 Richard N Wilson Electric heating unit
US3110795A (en) * 1959-09-17 1963-11-12 Gen Motors Corp Domestic electric appliance
US4313783A (en) 1980-05-19 1982-02-02 Branson International Plasma Corporation Computer controlled system for processing semiconductor wafers
US4512391A (en) 1982-01-29 1985-04-23 Varian Associates, Inc. Apparatus for thermal treatment of semiconductor wafers by gas conduction incorporating peripheral gas inlet
US4457359A (en) 1982-05-25 1984-07-03 Varian Associates, Inc. Apparatus for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer
US4458746A (en) 1982-05-25 1984-07-10 Varian Associates, Inc. Optimum surface contour for conductive heat transfer with a thin flexible workpiece
JPS6060060A (en) 1983-09-12 1985-04-06 株式会社日立製作所 Switchgear for door of railway rolling stock
US4603466A (en) 1984-02-17 1986-08-05 Gca Corporation Wafer chuck
US4567938A (en) 1984-05-02 1986-02-04 Varian Associates, Inc. Method and apparatus for controlling thermal transfer in a cyclic vacuum processing system
US4527620A (en) 1984-05-02 1985-07-09 Varian Associates, Inc. Apparatus for controlling thermal transfer in a cyclic vacuum processing system
US4724621A (en) 1986-04-17 1988-02-16 Varian Associates, Inc. Wafer processing chuck using slanted clamping pins
US5057673A (en) * 1988-05-19 1991-10-15 Fluorocarbon Company Self-current-limiting devices and method of making same
DE58909880D1 (en) 1988-05-24 2001-12-20 Unaxis Balzers Ag Vacuum system
DE3915039A1 (en) 1989-05-08 1990-11-15 Balzers Hochvakuum LIFTING TABLE
US5096536A (en) 1990-06-12 1992-03-17 Micron Technology, Inc. Method and apparatus useful in the plasma etching of semiconductor materials
US5133284A (en) 1990-07-16 1992-07-28 National Semiconductor Corp. Gas-based backside protection during substrate processing
JPH04196528A (en) 1990-11-28 1992-07-16 Toshiba Corp Magnetron etching system
US5155062A (en) 1990-12-20 1992-10-13 Cree Research, Inc. Method for silicon carbide chemical vapor deposition using levitated wafer system
US5356476A (en) 1992-06-15 1994-10-18 Materials Research Corporation Semiconductor wafer processing method and apparatus with heat and gas flow control
US5350479A (en) 1992-12-02 1994-09-27 Applied Materials, Inc. Electrostatic chuck for high power plasma processing
US5382311A (en) 1992-12-17 1995-01-17 Tokyo Electron Limited Stage having electrostatic chuck and plasma processing apparatus using same
US5302217A (en) * 1992-12-23 1994-04-12 United Technologies Corporation Cyclic heat treatment for controlling grain size of superalloy castings
JPH0711446A (en) 1993-05-27 1995-01-13 Applied Materials Inc Suscepter device for vapor growth
JP3165938B2 (en) 1993-06-24 2001-05-14 東京エレクトロン株式会社 Gas treatment equipment
EP0635870A1 (en) 1993-07-20 1995-01-25 Applied Materials, Inc. An electrostatic chuck having a grooved surface
TW444922U (en) * 1994-09-29 2001-07-01 Tokyo Electron Ltd Heating device and the processing device using the same
US5837555A (en) * 1996-04-12 1998-11-17 Ast Electronik Apparatus and method for rapid thermal processing
EP0853444B1 (en) * 1997-01-10 2005-11-23 E.G.O. ELEKTRO-GERÄTEBAU GmbH Cooking system with an electric cooking-plate, transferring heat by conduction
DE19701640A1 (en) 1997-01-10 1998-07-16 Ego Elektro Geraetebau Gmbh Efficient contact heat transfer cooking system
TW452826B (en) * 1997-07-31 2001-09-01 Toshiba Ceramics Co Carbon heater
US6147334A (en) * 1998-06-30 2000-11-14 Marchi Associates, Inc. Laminated paddle heater and brazing process
JP2000243542A (en) * 1999-02-24 2000-09-08 Nhk Spring Co Ltd Heater unit and manufacture thereof

Also Published As

Publication number Publication date
US20010035403A1 (en) 2001-11-01
US20020195440A1 (en) 2002-12-26
WO2001089268A1 (en) 2001-11-22
US6660975B2 (en) 2003-12-09

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