WO2001042526A1 - Element interne de recipient de traitement au plasma et son procede de production - Google Patents

Element interne de recipient de traitement au plasma et son procede de production Download PDF

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Publication number
WO2001042526A1
WO2001042526A1 PCT/JP2000/008584 JP0008584W WO0142526A1 WO 2001042526 A1 WO2001042526 A1 WO 2001042526A1 JP 0008584 W JP0008584 W JP 0008584W WO 0142526 A1 WO0142526 A1 WO 0142526A1
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WO
WIPO (PCT)
Prior art keywords
undercoat
coating
plasma
intermediate layer
plasma processing
Prior art date
Application number
PCT/JP2000/008584
Other languages
English (en)
Japanese (ja)
Inventor
Yoshio Harada
Junichi Takeuchi
Tatsuya Hamaguchi
Nobuyuki Nagayama
Kouji Mitsuhashi
Original Assignee
Tocalo Co., Ltd.
Tokyo Electron Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tocalo Co., Ltd., Tokyo Electron Co., Ltd. filed Critical Tocalo Co., Ltd.
Priority to KR1020017009944A priority Critical patent/KR20020003367A/ko
Priority to US09/890,251 priority patent/US6783863B2/en
Priority to EP00979084.1A priority patent/EP1156130B1/fr
Publication of WO2001042526A1 publication Critical patent/WO2001042526A1/fr
Priority to US10/849,797 priority patent/US6884516B2/en
Priority to US11/072,448 priority patent/US7364798B2/en
Priority to US11/882,462 priority patent/US20080070051A1/en
Priority to US11/882,461 priority patent/US20080066647A1/en
Priority to US11/882,463 priority patent/US20080070028A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C23C28/3455—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/02—Apparatus characterised by being constructed of material selected for its chemically-resistant properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
    • C23C4/11—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/123—Spraying molten metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/02—Apparatus characterised by their chemically-resistant properties
    • B01J2219/0204—Apparatus characterised by their chemically-resistant properties comprising coatings on the surfaces in direct contact with the reactive components
    • B01J2219/0218—Apparatus characterised by their chemically-resistant properties comprising coatings on the surfaces in direct contact with the reactive components of ceramic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/02—Apparatus characterised by their chemically-resistant properties
    • B01J2219/0204—Apparatus characterised by their chemically-resistant properties comprising coatings on the surfaces in direct contact with the reactive components
    • B01J2219/0236—Metal based
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/02—Apparatus characterised by their chemically-resistant properties
    • B01J2219/0204—Apparatus characterised by their chemically-resistant properties comprising coatings on the surfaces in direct contact with the reactive components
    • B01J2219/0236—Metal based
    • B01J2219/024—Metal oxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/02—Apparatus characterised by their chemically-resistant properties
    • B01J2219/025—Apparatus characterised by their chemically-resistant properties characterised by the construction materials of the reactor vessel proper
    • B01J2219/0263—Ceramic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/02—Apparatus characterised by their chemically-resistant properties
    • B01J2219/025—Apparatus characterised by their chemically-resistant properties characterised by the construction materials of the reactor vessel proper
    • B01J2219/0277—Metal based
    • B01J2219/0286—Steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J2219/0894—Processes carried out in the presence of a plasma
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12458—All metal or with adjacent metals having composition, density, or hardness gradient
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12479—Porous [e.g., foamed, spongy, cracked, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12542—More than one such component
    • Y10T428/12549—Adjacent to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y10T428/12618—Plural oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/24999—Inorganic

Definitions

  • the present invention relates to a member inside a plasma processing container having excellent plasma erosion resistance and a method for producing the same.
  • the present invention relates to a member used for plasma processing in a plasma atmosphere using a processing gas containing a halogen element, for example, a deposition shield, a baffle blade, a focus ring, an insulation ring, a shield ring, and a bellows cover.
  • a processing gas containing a halogen element for example, a deposition shield, a baffle blade, a focus ring, an insulation ring, a shield ring, and a bellows cover.
  • the present invention can be applied to components in a plasma processing container in a field of a liquid crystal device manufacturing apparatus, in addition to a semiconductor manufacturing apparatus.
  • the material used for the plasma processing chamber of the semiconductor manufacturing apparatus a metal material such as A1 or A1 alloy, the anodic oxide film of A1 coated on a metal material surface, spray coating and Polo Nkabai de, A1 2 0 Sintered films such as 3 and Si 3 N 4 and polymer films such as fluororesins and epoxy resins are known. These materials, when in contact with strong halogen ions having corrosive, or undergo chemical damage, fine particles such as Si0 2, Si 3 N 4, and by the excited ions by the plasma, to undergo Eroji ® emission damage Are known.
  • halogenated compounds dissociate and generate extremely corrosive atomic F, Cl, Br, I, etc.
  • Si0 2 or Si 3 N 4 Si in its environment, when the fine powder solids such as W is present, members used in the plasma processing chamber, as well as chemical corrosion, the It is strongly affected by both erosion damage caused by fine particles.
  • the environment in which the plasma is excited is ionized even by a non-corrosive gas such as Ar gas, which causes a phenomenon (ion bombardment) that strongly collides with the solid surface.
  • a non-corrosive gas such as Ar gas
  • the various components are more severely damaged.
  • Oxides, carbides, nitrides, fluorides, etc. of Group 3a elements of the periodic table such as Sc, Y, La, Ce, Yb, Eu, and Dy are applied to the member surface by PVD or CVD. or to form a dense film, there is a technique of applying a single crystal of Y 2 0 3 (JP-a-1 0 4 0 8 3 JP).
  • this technique has problems in that the film forming speed is low and productivity is low, and that a plurality of film members cannot be simultaneously formed (composite film).
  • an object of the present invention is to provide a surface treatment member such as a plasma treatment container having a large resistance to damage due to chemical corrosion and damage due to plasma erosion in an environment containing a halogen gas. And to propose an advantageous manufacturing method for it. Disclosure of the invention
  • the present invention overcomes the above-mentioned problems and disadvantages of the prior art by employing the solutions summarized below. That is, the configuration of the present invention is as follows.
  • Upsilon 2 0 3 spray A film of at least one metal or alloy selected from Ni and its alloys, W and its alloys, Mo and its alloys, Ti and its alloys, which has excellent adhesion to the film, is 50 to 500 / m coated to a thickness of, and over the under-one coat, Y 2 0 3 that the sprayed coating to construction to 5 0 -2000 Zeta m thick with a covering member obtained by forming a composite layer.
  • A1 2 0 as an intermediate layer 3 of the film (preferably sprayed coating) to form a further over the intermediate layer is the covering member to form a multilayered composite layer obtained by forming the Y 2 0 3 sprayed coating by thermal spraying as topcoat one DOO thing.
  • an intermediate layer [alpha] 1 2 0 3 and ⁇ form 2 0 3 form a film (preferably sprayed coating) of a mixture of, further that on the intermediate layer, multilayered composite layer formed of two 0 3 thermal spraying, coating ⁇ by thermal spraying as topcoat
  • the surface of the substrate, the Upsilon 2 0 3 spray coating indirectly formed on the construction directly or Andako one Toya intermediate layer, Upsilon on purity 95% or more use the 2 0 3 powder, or plasma spraying the powder in the air, or plasma spraying in a reduced pressure atmosphere of Ar gas is substantially free of oxygen or a high speed,
  • a member coated with a sprayed coating obtained by applying a spraying method selected from flame spraying and explosive spraying.
  • the present invention employs as a means of solving the problem is, what is basically a metal, ceramic, on the substrate surface such as a carbon material, by thermal spraying method to form a thermal spray coating Do that because only Y 2 0 3 It is.
  • a thermal spray coating Do that because only Y 2 0 3 It is.
  • the base material on which the thermal spray coating is applied includes various steels including stainless steel, aluminum and aluminum alloys, tungsten and tungsten alloys, titanium and titanium alloys, molybdenum and molybdenum alloys and carbon and Oxide-based, non-oxide-based ceramics sintered bodies, carbonaceous materials and the like are preferred.
  • Copper and copper alloys are not preferred because they are released by plasma erosion or corrosion by halogen compounds and cause environmental pollution. Therefore, if copper and copper alloys are required for the equipment configuration, they must be covered with Cr, Ni, etc. by means of electroplating, chemical plating, vapor deposition, etc.
  • the coating to the substrate surface, after blasting substrate, or deposited directly on the sprayed Y 2 0 3, or, as first undercoat layer on the substrate surface ⁇ Ha Rogengasu corrosion a film made of sexual strong metal material, PVD process, what is CVD process is also properly formed by thermal spraying, and a composite layer by spraying a 2 0 3 powder ⁇ over the undercoat a topcoat over preparative preferable.
  • the metal undercoat (such as a thermal spray coating) has a thickness in the range of 50 to 500 / m. If the undercoat layer is thinner than 50 ⁇ m, the effect as an undercoat is weak.On the other hand, if the thickness is more than 500 / m, the effect is saturated. .
  • nickel and a nickel alloy As such a metal material for the undercoat, nickel and a nickel alloy, tungsten and a tungsten alloy, molybdenum and a molybdenum alloy, titanium and a titanium alloy, and the like are preferable.
  • Y 2 0 3 sprayed coating comprising a top coat, as long as the construction directly on the substrate surface, also long as you sprayed a composite layer on the undercoat, more as an intermediate layer ⁇ 1 2 0 if 3 or [alpha] 1 2 0 3 + Upsilon 2 0 3 film when the provided, it is preferable to construction in a thickness of 5 O ⁇ 2000 m anyway.
  • a layer thinner than 50 ⁇ m has little effect on preventing damage due to plasma erosion, whereas a layer thicker than 2000zm saturates the effect and is not economical.
  • the porosity of the Y 2 0 3 spray coating topcoat better in the range of 0.5-1 0% ⁇
  • Coating of 0.5% or less is difficult to produce by thermal spraying, and porosity of 10% or more This is because the film of No. is inferior in corrosion resistance and plasma erosion resistance.
  • the most characteristic and constituting the present invention as the outermost layer of the structure of the substrate employs a Upsilon 2 0 3 as a material showing a resistance to plasma erotic one John resistance in an atmosphere containing a halogen gas, covering it as thermal sprayed layer Where it forms. That is, when Ru good to the study of the present inventors, Upsilon 2 0 3 has a specific gravity 4.84, melting point of 2410 ° C, since the chemical bonding force with oxygen is strong, the plasma erosion in an atmosphere containing a halogen gas It was found that even when acted upon, it remained stable.
  • this Y 2 0 3 the purity is necessary to use more than 95%, Fe, Mg, Cr , Al, Ni, the Si of which impurities are contained as oxides, It is not preferable because erosion resistance is reduced. Those having a purity of 98% or more are more preferable.
  • Y 2 0 3 sprayed coating A1 2 0 3 of the intermediate layer to be formed just below the can, after which chemically is cheap Jode, little change even under atmospheric plasma spraying or vacuum plasma spraying environment, Y 2 0 It has the function of compensating for the plasma erosion resistance of No. 3 .
  • the entire coating composition has the following multilayer structure.
  • an intermediate layer mixture sprayed coating of [alpha] 1 2 0 3 and Upsilon 2 0 3 according to on [alpha] 1 2 0 3 sprayed coating or inclined blending thereof and construction as further as a topcoat thereon, is to form a Upsilon 2 0 3 sprayed coating.
  • Such coating structure is preferable because, by forming the corrosion resistance as compared with the metal spray coating, the [alpha] 1 2 0 3 excellent one John Resistance plasma erotic as an intermediate layer, a sprayed coating multilayer structured, through the film Corrosion resistance and erosion resistance by reducing pores It is because it can improve. Moreover, A1 2 0 3 as the intermediate layer, both ⁇ Sunda one coat and top coat exhibits good adhesion.
  • the intermediate layer A1 2 0 3 and Y 2 0 3 and rather more preferably a layer of a mixture of, in this case, while increasing the [alpha] 1 2 0 3 concentration of undercoat side, top in coating side arbitrariness preferred to a Upsilon 2 0 3 concentration according to high becomes such inclined formulation mixed layer. Since formation of such an intermediate layer can be easily performed by employing a thermal spraying method, it is a preferable embodiment to form the intermediate layer as a thermal spray coating. The thickness of the intermediate layer, the same range as Upsilon 2 0 3 sprayed coating of the top coat is preferred.
  • the metal and [alpha] 1 2 0 3, to form a spray coating Upsilon 2 0 3 is air bra Zuma spraying method or a plasma spraying method is a good application of an atmosphere containing substantially no oxygen
  • high-speed flame spraying and explosive spraying are also possible.
  • a required vapor of a metal halide compound is reduced and precipitated by hydrogen or the like, and then oxidized by oxygen or an oxygen compound.
  • the film is formed by heating in air to change into an oxide film.
  • a sintered body or powder is used as a raw material, which is irradiated with an electron beam to be volatilized and deposited on the surface of a base material to form a film.
  • film formation by the CVD and PVD methods is suitable for the construction of thin films (for example, around 50 ⁇ m).
  • Y 2 0 3 sprayed coating was coated according member surface in the present invention, of course particularly useful when used under plasma environment that generates a halogen compound under including atmosphere, New does not contain a halogen element or a halogen compound
  • the present invention is also effective against the plasma erosion effect in an atmosphere such as 2 , 2 or the like, and in this case, the erosion damage is particularly reduced as compared with an atmosphere containing a halogen element or a compound. Since it is moderate, the film-coated member according to the present invention can be used for a long period of time. Demonstrate stable performance.
  • an aluminum test piece after roughened by one surface blasting of (Dimensions Width 50 thigh X length 50 thigh X thickness 5 mm), and air plasma spray method using Y 2 0 3 spray material , by vacuum bra Zuma spraying method at a controlled ambient pressure to 5 0 ⁇ 200HPa in Ar gas to form a Y 2 0 3 spray coating it it thickness 300 m.
  • the undercoat of Ni- 20% A1 alloy After construction the thickness 100 / m thick, the Y 2 0 3 as a topcoat one preparative zm Thick coatings were made.
  • Table 1 summarizes the test results at this time.
  • the surface of the test piece obtained by coating the Y 2 0 3 film directly (No. 1, 3) the first, on which has been subjected to undercoating also show the formation of the Y 2 0 3 film (No. 2, 4) are all of a film containing exhibit good adhesion and thermal shock resistance, absolutely no means inferior as compared to the A1 2 0 3 film.
  • Y 2 0 3 film formed by low pressure plasma spraying method since a small porosity as compared to the film of air spraying method, can be expected good corrosion resistance.
  • adhesion strength is determined by the adhesion strength test method specified in JIS H8666 Ceramic Thermal Spray Coating Test Method,
  • the CF 4, Ar, 0 2 mixed gas was an atmosphere under the following conditions.
  • Table 2 shows the test results. As apparent from the results shown in Table 2, including the specific Comparative Examples (current technology) by anodic oxidation coating (No.8), B 4 C spray coating (No.
  • Upsilon 2 0 3 sprayed coating of the present invention exhibits an extremely excellent resistance to plasma E Rosi tio emission properties, it has been found that also maintains a good performance in an atmosphere containing a halogen compound. Table 2
  • Thermal spraying is performed using the atmospheric plasma spray method, and the thickness of the undercoat is 80 m.
  • Y 2 0 3 formed on the top coat with a film thickness is 200 m, such as A1A
  • the material of the undercoat is 80% Ni—20% A1
  • thermal spray coating of the present invention as long as it forms a Y 2 0 3 sprayed skin layer on the outermost layer (top coat), ⁇ 1 2 0 3, ⁇ 1 2 0 3 / ⁇ 2 0 3 mixture as the intermediate layer Even if a layer is provided, it is not affected by the plasma erosion resistance, only disappearance of 6.1 or more is observed after irradiation for 20 hours, and sufficient performance is exhibited even with a multilayer structure coating It was recognized that.
  • a test piece was prepared by anodizing (alumite-treating) a current aluminum base material, and an 80% Ni-20% A1 alloy coating was coated on the base material as an undercoat to a thickness of 100 zm. and, 250 ⁇ M the Y 2 0 3 film as Todzupuko one bets thereon, using a test piece formed by it it plasma spraying performs bra Zuma etching under the following conditions, and scattered scraped by etching The number of particles (particles) was compared based on the number of particles adhering to the surface of an 8-inch diameter silicon wafer that was left standing in the same chamber. The number of adhering particles was examined using a surface inspection device, and the measurement was performed for particles with a particle diameter of approximately 0.2 zm or more.
  • the anodized (alumite film) test piece exceeded the particle control value of 30 in a general chamber after 17.5 hours after plasma irradiation and exceeded 150 after 25 hours. became.
  • the composition of the particles was composed of Al and F.
  • the member formed with Upsilon 2 0 3 sprayed coating subjected to plasma erosion effects that put in a gas atmosphere containing a halogen compound Excellent resistance when used in an environment. Therefore, even if plasma etching is continued for a long time, the inside of the chamber is less contaminated by particles, and high-quality products can be efficiently produced. In addition, since the rate of contamination by particles in the chamber is slowed, the interval between cleaning operations is prolonged, and productivity can be expected to increase. As a member in a plasma processing container in the fields of semiconductor manufacturing equipment and liquid crystal devices, etc. Extremely effective.

Abstract

L'invention concerne un élément interne de récipient de traitement au plasma présentant une excellente résistance à la corrosion chimique et à l'érosion par le plasma, dans un environnement contenant des gaz halogènes. L'invention porte également sur un procédé de production avantageux dudit élément, qui consiste à former ledit élément par enduction de la surface frontale d'un substrat d'une couche composite multicouche consistant en un revêtement métallique faisant office de sous-couche, d'un revêtement d'AL3O2 formant une couche intermédiaire sur la sous-couche, et d'un dépôt pulvérisé de Y2O3 faisant office de couche de finition sur la couche intermédiaire.
PCT/JP2000/008584 1999-12-10 2000-12-04 Element interne de recipient de traitement au plasma et son procede de production WO2001042526A1 (fr)

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KR1020017009944A KR20020003367A (ko) 1999-12-10 2000-12-04 플라즈마처리 용기 내부재 및 그 제조방법
US09/890,251 US6783863B2 (en) 1999-12-10 2000-12-04 Plasma processing container internal member and production method thereof
EP00979084.1A EP1156130B1 (fr) 1999-12-10 2000-12-04 Element interne de recipient de traitement au plasma et son procede de production
US10/849,797 US6884516B2 (en) 1999-12-10 2004-05-21 Internal member for plasma-treating vessel and method of producing the same
US11/072,448 US7364798B2 (en) 1999-12-10 2005-03-07 Internal member for plasma-treating vessel and method of producing the same
US11/882,462 US20080070051A1 (en) 1999-12-10 2007-08-01 Internal member for plasma-treating vessel and method of producing the same
US11/882,461 US20080066647A1 (en) 1999-12-10 2007-08-01 Internal member for plasma-treating vessel and method of producing the same
US11/882,463 US20080070028A1 (en) 1999-12-10 2007-08-01 Internal member for plasma-treating vessel and method of producing the same

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JP11/351546 1999-12-10
JP35154699A JP3510993B2 (ja) 1999-12-10 1999-12-10 プラズマ処理容器内部材およびその製造方法

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US09890251 A-371-Of-International 2000-12-04
US10/849,797 Continuation US6884516B2 (en) 1999-12-10 2004-05-21 Internal member for plasma-treating vessel and method of producing the same
US10/849,797 Division US6884516B2 (en) 1999-12-10 2004-05-21 Internal member for plasma-treating vessel and method of producing the same

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