TWI408835B - 發光二極體晶粒上之上層模製 - Google Patents

發光二極體晶粒上之上層模製 Download PDF

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Publication number
TWI408835B
TWI408835B TW094140113A TW94140113A TWI408835B TW I408835 B TWI408835 B TW I408835B TW 094140113 A TW094140113 A TW 094140113A TW 94140113 A TW94140113 A TW 94140113A TW I408835 B TWI408835 B TW I408835B
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Taiwan
Prior art keywords
lens
led
support structure
die
mold
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TW094140113A
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English (en)
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TW200633264A (en
Inventor
Grigoriy Basin
Robert S West
Paul S Martin
Gerard Harbers
Willem Hendrik Smits
Robert Frans Maria Hendriks
Huub Konijn
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Philips Lumileds Lighting Co
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Priority claimed from US10/990,208 external-priority patent/US7452737B2/en
Application filed by Philips Lumileds Lighting Co filed Critical Philips Lumileds Lighting Co
Publication of TW200633264A publication Critical patent/TW200633264A/zh
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Publication of TWI408835B publication Critical patent/TWI408835B/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0071—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source adapted to illuminate a complete hemisphere or a plane extending 360 degrees around the source
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  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
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Description

發光二極體晶粒上之上層模製
本發明係關於一種發光二極體(LED)，且特定言之係關於一種在一LED晶粒上形成一透鏡之技術。
LED晶粒通常以一朗伯特(lambertian)圖案發光。通常在LED晶粒上使用一透鏡使光束變窄或產生一側發射圖案。一種用於一表面黏著LED上之普通透鏡係預成型模製塑料，該模製塑料與一其中安裝有LED晶粒之封裝接合。一種該透鏡係在美國專利第6,274,924號中展示，該專利讓渡於Lumileds Lighting且以引用之方式併入本文中。
本文描述一種在表面黏著LED上形成一透鏡之技術。
將一或多個LED晶粒安裝於一支撐結構上。該支撐結構可為一陶瓷基板、一矽基板或其它類型之支撐結構(其具有電連接至支撐結構之金屬墊之該等LED晶粒)。該支撐結構可為一安裝於一電路板或一封裝中之散熱片上之子基板。
一模中具有對應於支撐結構上LED晶粒之位置的凹槽。以一液態、光學透明材料(如聚矽氧烷(矽膠))填充該等凹槽，當該材料固化時形成一硬化透鏡材料。該等凹槽之形狀將為該透鏡之形狀。將該模與該LED晶粒/支撐結構接合在一起，致使每一LED晶粒處於一相關凹槽中之該液態透鏡材料中。
接著加熱該模以固化(硬化)該透鏡材料。接著將模與支撐結構分離，使一完整聚矽氧烷(矽膠)透鏡留在每一LED晶粒上。此通用方法將稱為上層模製。
該上層模製方法可以不同之模重複以製造同心或重疊之透鏡殼層。每一透鏡可具有不同性質，諸如含有一磷光體、為不同材料、提供不同輻射圖案、具有不同硬度值、具有不同折射率或可以不同技術(例如UV對加熱)固化。
作為預先之敍述，一習知之LED係形成於一生長基板上。在所用之實例中，該LED為一基於GaN之LED，諸如AlInGaN LED，以產生藍或UV光。通常，使用習知技術，使一相對厚之n－型GaN層在一藍寶石生長基板上生長。該相對較厚之GaN層通常包括一低溫晶核層及一或多個附加層，以為該n－型覆蓋層及作用層提供一低缺陷晶格結構。隨後在該厚n－型層上形成一或多個n－型覆蓋層，接著形成一作用層、一或多個p－型覆蓋層及一p－型接觸層(用於金屬化)。
多種技術係用於增加該等n－層之電存取。在一覆晶實例中，蝕刻去p－層及作用層之部分，以曝露一用於金屬化之n－層。以此方式，p接點與n接點位於晶片之同一側，且可直接電連接至封裝(或子基板)接觸焊墊。來自n－金屬接點之電流起初橫向流過n－層。相反地，在一垂直射出(非覆晶)LED中，於晶片之一側形成一n－接點，且在晶片之另一側形成一p－接點。通常以一導線或一金屬橋接器形成p或n－接點中之一者之電接點，而另一接點則直接與一封裝(或子基板)接觸焊墊接合。為簡單起見，在圖1－3之實例中使用一覆晶LED。
形成LED之實例係在美國專利第6,649,440號與第6,274,399號中描述，該等兩個專利皆讓渡於Lumileds Lighting且以引用之方式併入本文中。
視情況，將一導電基板與LED層接合(通常與p－層接合)並移除該藍寶石基板。可將一或多個LED晶粒與一子基板接合，其中該導電基板直接與該子基板接合，這將就圖5及6更詳細地描述。可將一或多個子基板與一印刷電路板接合，該電路板含有金屬導線以連接至其它LED或一電源。該電路板可使串聯及/或並聯之多個LED互連。
所形成之特定LED及其是否安裝於一子基板上，對於瞭解本發明之目的並不重要。
圖1為安裝於一支撐結構12上之四個LED晶粒之側面圖。該支撐結構可為一子基板(例如具有金屬導線之陶瓷或矽)、一金屬散熱片、一印刷電路板或任何其它結構。在本實例中，該支撐結構12係一具有金屬墊/導線之陶瓷子基板。
一模14具有對應於每一LED晶粒10上之一透鏡之所需形狀的凹槽16。模14宜由一金屬形成。將一具有模14之大體形狀之極薄非黏性薄膜18置放於模14上。薄膜18係防止聚矽氧烷(矽膠)與金屬相黏之眾所熟知的習知材料。
若透鏡材料與該模不相黏，則不需要薄膜18。此可藉由使用一非黏性模製塗層、使用一非黏性模製材料或使用一產生一非黏性介面之模製方法來完成。該等方法可包括選擇特定加工溫度，以獲得最小黏性。藉由不使用薄膜18，可形成更複雜之透鏡。
在圖2中，已以一熱固液態透鏡材料20填充模製凹槽16。該透鏡材料20可為任何合適之光學透明材料，諸如聚矽氧烷(矽膠)、環氧樹脂或混合聚矽氧烷(矽膠)/環氧樹脂。混合可用於達到匹配之熱膨脹係數(CTE)。聚矽氧烷(矽膠)與環氧樹脂具有足夠高之折射率(高於1.4)以極大地改良AlInGaN或AlInGaP LED之光提取，以及充當透鏡。一種聚氧矽具有1.76之折射率。
在支撐結構12與模14之周邊之間形成一真空密封部分，且該等兩部分互相施壓，致使每一LED晶粒10插入液態透鏡材料20中且透鏡材料20處於壓縮下。
接著將模加熱至約攝氏150度(或其它合適之溫度)歷經一段時間以硬化透鏡材料20。
接著將支撐結構12自模14上分離。薄膜18使所得硬化透鏡容易地自模14上脫離。接著移除薄膜18。
在另一實施例中，可首先以一材料(諸如黏結劑中之聚矽氧烷(矽膠)或磷光粒子)覆蓋圖1中之LED晶粒10。以另一材料填充模製凹槽16。當隨後把晶粒置放於模中時，模製材料在該覆蓋材料上成形。
圖3說明在每一LED晶粒10上所得之具有一模製透鏡22之結構。在一實施例中，該模製透鏡之直徑係在1 mm與5 mm之間。該透鏡22可為任何尺寸或形狀。
圖4為支撐結構12支撐LED晶粒陣列(每一LED晶粒具有一模製透鏡22)之所得結構之透視圖。所用之模將具有相應之凹槽陣列。若支撐結構12係一陶瓷或矽子基板，則每一LED(及其下方之子基板部分)可藉由鋸切或斷裂子基板12來分離以形成單個LED晶粒。或者，可將支撐結構12分離/分割以支撐LED之組件或可在不分離/分割之情況下使用。
透鏡22不僅改良LED晶粒之光提取且折射光以產生一所需發射圖案，且該透鏡亦封裝LED晶粒以保護晶粒不受污染、增加機械強度且保護任何導線接合(wire bond)。
圖5為單個覆晶LED晶粒10之一實施例之簡化特寫圖，該晶粒位於一由任何合適材料(諸如陶瓷或矽)形成之子基板24上。在一實施例中，子基板24充當圖1－4中之支撐結構12，且圖5之晶粒/子基板藉由鋸切自圖4之結構中分離。圖5之LED晶粒10具有一底部p－接觸層26、一p－金屬接點27、p－型層28及一發光作用層30、n－型層32及一接觸該n－型層32之n－金屬接點31。將子基板24上之金屬墊直接與接點27與31金屬接合。穿過子基板24之通路終止於子基板24之底表面上之金屬墊，該子基板24與一電路板45上之金屬導線40及44相接合。將該等金屬導線40及44連接至其它LED或電源。電路板45可為一具有覆蓋於一絕緣層上之金屬導線40及44之金屬板(例如鋁)。使用圖1－3之技術形成之模製透鏡22封裝LED晶粒10。
圖5中之LED晶粒亦可為一非覆晶晶粒，其中一導線將頂部n－層32連接至子基板24上之一金屬墊。透鏡22可封裝該導線。
在一實施例中，該電路板45自身可為圖1－3之支撐結構12。該實施例展示於圖6中。圖6為一非覆晶LED晶粒10之簡化特寫圖，該LED晶粒10具有藉由一導線38連接至電路板45上之一金屬導線40之一頂部n－金屬接點34。將該LED晶粒10安裝於一子基板36上，其在圖6之實例中係一金屬板。一導線42將p－層26/28電連接至電路板45上之一金屬導線44。展示透鏡22完全封裝導線與子基板36；然而，在其它實施例中，不需要封裝整個子基板或整個導線。
一普通先前技術封裝方法係在一保護塗層上旋塗。然而，該封裝方法對於將一磷光體塗層添加至LED晶粒上並不合適，因為LED晶粒上之封裝厚度不均勻。又，該封裝方法不形成透鏡。一提供LED晶粒上之磷光體之普通技術係以聚矽氧烷(矽膠)/磷光體組合物填充LED晶粒周圍之一反射杯。然而，該技術形成一具有不同厚度之磷光體層且不形成一合適之透鏡。若需要一透鏡，則附加方法仍須製造一塑料模製透鏡並將其固定於LED晶粒上。
圖7－11說明可使用上述技術形成之多種透鏡。
圖7說明使用任何合適之方法以一磷光體60塗覆之一LED晶粒10。一種該方法係借助於美國專利第6,576,488號中所述之電泳法，該專利讓渡於Lumileds Lighting且以引用之方式併入本文中。合適之磷光體已為吾人所熟知。使用上述技術而形成一透鏡22。磷光體60係藉由LED發射(例如藍或UV光)賦能並發射不同波長之光，諸如綠光、黃光或紅光。磷光體發射可單獨或與LED發射一起產生白光。
以一磷光體塗覆一LED之方法耗費時間。為了淘汰以一磷光體塗覆LED晶粒之方法，如圖8所示，可將磷光體粉末與液態聚矽氧烷(矽膠)混合以裝填至透鏡62中。
如圖9所示，在LED晶粒上提供一仔細控制厚度之磷光材料，使用上述技術形成一內透鏡64，且使用一分開模製步驟(使用一具有較深及較寬凹槽之模)形成一直接位於該內透鏡64上之具有任何厚度之外磷光體/聚矽氧烷(矽膠)殼層66。
圖10說明使用另一模可在該磷光體/聚矽氧烷(矽膠)殼層上形成一外透鏡68以使光束進一步成形。
圖11說明分別覆蓋於透明聚矽氧烷(矽膠)殼層76、78及80上之紅光、綠光與藍光發射磷光體之殼層70、72及74。在此狀況下，LED晶粒10發射UV光，且紅光、綠光及藍光發射之組合產生白光。所有殼層係以上述方法產生。
使用上述模製技術可形成許多其它形狀之透鏡。圖12為LED 10、子基板24及一模製側發射透鏡84之截面圖。在一實施例中，透鏡84係由一極可撓性材料(諸如聚矽氧烷(矽膠))形成，該透鏡當其自模中移除時撓曲。當該透鏡並非一簡單形狀時，通常將不使用離型膜18(圖1)。
圖13為LED 10、子基板24及一模製準直透鏡86之截面圖。該透鏡86可使用一可變形模或藉由使用一軟透鏡材料來製造，該材料在自模中拉出時壓縮且在自模上脫離後展開為其模製形狀。
圖14說明如何使一預成型透鏡88可固定於一模製朗伯特透鏡22上。在圖14之實例中，以先前所述之方式形成透鏡22。透鏡22用以封裝及保護LED 10不受污染。接著使用UV固化黏著劑或一機械夾鉗使一預成型側發射透鏡88固定於透鏡22上。此一透鏡形成技術較習知技術更具優勢。在一習知技術中，使一預成型透鏡(諸如一側發射透鏡)黏著地固定於LED晶粒上，且藉由注入聚矽氧烷(矽膠)來填補任何間隙。由於(除其它原因以外)為透鏡置放及間隙填補步驟需小心地安置分離之晶粒/子基板，因此習知方法難於執行。使用圖14之發明技術，LED之大陣列(圖4)可藉由在每一LED上形成一模製透鏡而同時封裝。接著，當LED仍在該陣列中時或在其分離之後，可將一預成型透鏡88固定於每一模製透鏡22上。
另外，可製成極小之模製透鏡(例如直徑為1－2 mm)，而不同於一習知透鏡。因此，可形成一極小、完全封裝之LED。該等LED可製成具有一有益於特定應用之極低輪廓。
圖14亦展示一其上安裝子基板24之電路板45。此電路板45上可使LED/子基板24之陣列安裝於其上。
圖15為一液晶顯示器(LCD)或其它使用背光之顯示器之背光的截面圖。一般用途係用於電視機、監視器、行動電話等。該等LED可為紅光、綠光及藍光，以產生白光。該等LED形成二維陣列。在所示實例中，每一LED結構係圖14中所示之結構，但可使用任何合適之透鏡。背光盒之底部與側壁90以以一白光反射性漫射材料塗覆。一白光漫射點92係直接位於每一LED上，以防止光點由直接位於每一LED上之背光來發射。該等點92係由一透明或漫射PMMA薄片94支撐。將由側發射透鏡88發射之光在背光之較低部分混合，接著在離開上部漫射體96之前，於背光之上部進一步混合。可將LED之線性陣列安裝於窄電路板45之上。
圖16說明用作一相機中之閃光燈之具有一模製透鏡22的LED 10。圖16中之該相機係一行動電話98之一部分。該行動電話98包括一彩色螢幕100(其可具有使用本文所述之LED之背光)及一鍵盤102。
如就圖10而論，可在內殼層上形成一外透鏡，以使光束進一步成形。視各種殼層之要求，可使用不同殼層材料。圖17－30說明可與上層模製方法一起使用之各種透鏡及材料之實例。
圖17與18說明一使用上述模製技術所形成之內殼層之模製透鏡的兩種形狀。許多LED 10可安裝於同一支撐結構12上。如先前所述，該支撐結構12可為一具有金屬跡線與接觸焊墊之陶瓷或矽子基板。儘管沒有必要，但任何數目之LED可安裝於同一支撐結構12上，且通常可以同一方式加工同一支撐結構12上之所有LED。舉例而言，若支撐結構大且規定整個LED陣列之光圖案，則每一LED透鏡可不相同，以提供規定之總光圖案。可注入一底部填充材料，以填補LED晶粒10之底部與支撐基板12之間之任何間隙，以防止任何空氣間隙存在於LED之下，並改良熱傳導。
上文已就圖3－6描述圖17，其中為一朗伯特輻射圖案，內模製透鏡22通常為半球形。圖18中之內模製透鏡106通常為具有圓形邊緣之長方形。視待由一外透鏡提供之輻射圖案，內模製透鏡22或106中之一者可更合適。內模製透鏡之其它形狀可亦合適。自頂向下看，每一透鏡通常為圓形。
圖19說明圖18之結構，其中透鏡外表面具有一折射光以達成一所需輻射圖案之圖案。該外表面圖案可直接在內模製透鏡中形成(藉由模自身)，或該外表面圖案可在一外透鏡中形成，該外透鏡係上層模製於內模製透鏡上或藉由黏著劑(例如聚矽氧烷(矽膠)、環氧樹脂等)固定於其上。圖案108係一繞射光柵，而圖案110使用二元步驟折射光。在該等實例中，該圖案形成一具有圖20中所示之輻射圖案之大致側發射的透鏡。在圖20中，峰值強度產生於50－80度內且顯著高於0度時之強度。
內透鏡之要求通常不同於外透鏡之要求。舉例而言，內透鏡應具有對支撐結構之良好黏著力，不發黃或隨時間變得更不透明，具有高折射率(高於1.4)，不斷裂或施壓於LED之任何導線，耐受高LED溫度且具有相容性熱係數。內透鏡應為非硬質(例如聚矽氧烷(矽膠))以不在LED或任何導線上提供應力。相反，外透鏡材料通常僅需要能夠以所需圖案進行圖案化且黏著於內透鏡上。外透鏡可上層模製或可預成型且黏著地固定於內透鏡上。外透鏡之材料可UV固化，而內透鏡之材料可熱固化。熱固化較UV固化耗時更長。
通常，內透鏡材料之硬度範圍為肖氏(Shore)00 5－90，而外殼層之硬度範圍為肖氏A 30或更高。
圖21說明一於透鏡之外表面上形成的菲涅耳(Fresnel)透鏡圖案112以產生一類似於圖20中之圖案之大致側發射光圖案。如就圖19所述，該外表面可為內模製透鏡之外表面或一外殼層之外表面。此應用於本文所述之所有圖案。
圖22說明外透鏡表面上之稜錐114或圓錐形116圖案以產生一準直光圖案或另一光圖案。
圖23說明一用於產生一準直圖案之高穹頂外透鏡118。
圖19及21－23之表面圖案可經組態(例如藉由改變表面角)以產生任何光圖案。可形成全息結構、TIR及其它圖案。準直光圖案通常用於後投影TV，而側發射光圖案通常用於背光LCD螢幕。
圖24說明使用一軟(例如肖氏XX)材料(諸如聚矽氧烷(矽膠)凝膠)作為內模製透鏡124，以不施壓於接合至LED 10之導線126。通常UV固化該凝膠。外透鏡128可模製或可預成型且以黏著劑固定。為耐久性、粒子抗性(resistance to particles)等，外透鏡128通常較硬。外透鏡128可為聚矽氧烷(矽膠)、環氧樹脂－聚矽氧烷(矽膠)、環氧樹脂、聚矽氧烷(矽膠)彈性體、硬橡膠、其它聚合物或其它材料。外透鏡材料可UV或熱固化。
圖25係類似於圖24，但具有用於不同發射圖案或一較低輪廓之一不同形狀之內模製透鏡129(如圖18)。透鏡129可為一軟聚矽氧烷(矽膠)凝膠。該外透鏡130將使該發射圖案進一步成形且保護該軟內透鏡129。
所有圖中之LED可為覆晶型或導線接合型。
圖26說明一LED結構，其具有一具有內透鏡所需性質之軟內模製透鏡132、一充當一介面層並用於結構穩定性之硬中間體殼層134及一用於產生一側發射光圖案之外透鏡136。該外透鏡136可為軟性的以促進模製加工。另外，外透鏡136可預成型且黏著地固定於該中間體殼層134。使用該中間體殼層134使外透鏡材料之選擇基本上與內透鏡材料無關。
圖27說明如何使外透鏡138形成於中間體殼層134或內透鏡132之任一部分上。
圖28說明直接在內透鏡144材料上形成外透鏡142。
圖29說明模製於一內透鏡132上之側發射透鏡145之另一形狀。透鏡145可直接模製於不具任何內透鏡之LED晶粒10上。
圖30說明一LED，其中每一殼層146、147及148含有不同磷光體材料，諸如紅光發射磷光體、綠光發射磷光體及藍光發射磷光體。該LED晶粒10可發射UV。磷光粒子之間之空隙允許UV穿過一內殼層以賦予一外殼層中之磷光體能量。或者，僅使用紅光及綠光磷光體殼層，且LED晶粒10發射藍光。紅光、綠光及藍光之組合產生白光。可調整殼層厚度、磷光粒子之密度及磷光體色彩之順序以獲得所需光。可使用任何形狀之透鏡。
圖31說明在支撐結構12自身上使用一模製圖案149。藉由將圖案模製於支撐結構12上、使用一類似於圖1所示方法之方法、或使用一金屬化方法、或使用另一合適之方法，形成一高指數材料(例如聚合物)或一反射性材料(如鋁或銀)。接著將該模製圖案149用為一模以供另一種材料形成一透鏡150。在一實施例中，該透鏡150材料係液體(例如聚矽氧烷(矽膠))，其在形成於支撐結構12上之模中沉積，接著固化。接著使表面平面化。所得透鏡如一反射杯般藉由反射/折射照射至壁上之光來準直光。
圖32說明一模製透鏡22，該模製透鏡具有濺鍍於其側面周圍以反射由LED 10發射之光之金屬151。該反射光將由LED 10散射，且最後發射穿過頂部開口。該金屬151可為任何反射性材料，諸如鋁或銀。該金屬可替代地濺鍍於透鏡22之頂部以產生一側發射圖案。可將透鏡22製成任何形狀以產生所需發光圖案。
圖33為具有一LCD螢幕154之液晶顯示器(LCD)152之側面圖，該液晶顯示器具有可控RGB像素、一漫射體156及一背光158以混合來自紅光、綠光及藍光LED 160之光以產生白光。該背光158係一漫射反射盒。該等LED 160具有使用任一上述技術製成之側發射透鏡。
圖34為一後投射電視162之側面圖，該電視具有一用於在一規定視角內增亮影像之前透鏡164、一組紅光、綠光及藍光LED 166、用於調變及聚焦RGB光以產生一彩色TV影像之調變器/光學儀器170及一反射器172。該調變器可為一可控鏡面之陣列、一LCD面板或任何其它合適之裝置。該等LED 166具有使用任一上述技術製成之準直透鏡。
雖然已展示並描述本發明之特定實施例，但對於熟習此項技術者將顯而易見的是，在不脫離本發明之廣泛態樣的情況下，可作變化及修正，且因此，附加之申請專利範圍將所有屬於本發明之真實精神與範疇內之該等變化及修正包括在其範疇內。
10．．．LED晶粒
12．．．支撐結構
14．．．模
16．．．凹槽
18．．．薄膜/離型膜
20．．．熱固液態透鏡材料
22．．．模製透鏡
24．．．子基板
26．．．底部p－接觸層
27．．．p－金屬接點
28．．．p－型層
30．．．發光作用層
31．．．n－金屬接點
32．．．n－型層
34．．．頂部n－金屬接點
36．．．子基板
38．．．導線
40．．．金屬導線
42．．．導線
44．．．金屬導線
45．．．電路板
60．．．磷光體
62．．．透鏡
64．．．內透鏡
66．．．外磷光體/聚矽氧烷(矽膠)殼層
68．．．外透鏡
70．．．紅光發射磷光體之殼層
72．．．綠光發射磷光體之殼層
74．．．藍光發射磷光體之殼層
76．．．透明聚矽氧烷(矽膠)殼層
78．．．透明聚矽氧烷(矽膠)殼層
80．．．透明聚矽氧烷(矽膠)殼層
84．．．模製側發射透鏡
86．．．模製準直透鏡
88．．．預成型透鏡
90．．．背光盒側壁
92．．．白光漫射點
94．．．透明或漫射PMMA片
96．．．上部漫射體
98．．．行動電話
100．．．彩色螢幕
102．．．鍵盤
106．．．內模製透鏡
108．．．圖案
110．．．圖案
112．．．菲涅耳(Fresnel)透鏡圖案
114．．．稜錐型圖案
116．．．圓錐型圖案
118．．．高穹頂外透鏡
124．．．內模製透鏡
126．．．導線
128．．．外透鏡
129．．．內模製透鏡
130．．．外透鏡
132．．．軟內模製透鏡
134．．．硬中間體殼層
136．．．外透鏡
138．．．外透鏡
142．．．外透鏡
144．．．內透鏡
145．．．側發射透鏡
146．．．殼層
147．．．殼層
148．．．殼層
149．．．模製圖案
150．．．透鏡
151．．．金屬
152．．．液晶顯示器(LCD)
154．．．LCD螢幕
156．．．漫射體
158．．．背光
160．．．LED
162．．．後投影電視
164．．．前透鏡
166．．．LED
170．．．調變器
172．．．反射器
圖1為安裝於一支撐結構(諸如一子基板)上之四個LED晶粒及一用於在每一LED晶粒周圍形成一透鏡之模的側面圖。
圖2為將該等LED晶粒插入以一液態透鏡材料填充之該模之凹槽中的側面圖。
圖3為在該液體固化後將LED晶粒自模中移出，從而產生一封裝每一LED晶粒之透鏡的側面圖。
圖4為一子基板或電路板上之LED晶粒陣列(其中在每一LED晶粒上形成一模製透鏡)之透視圖。
圖5為一安裝於一子基板上)之覆晶LED晶粒之特寫側面圖，其中該LED晶粒又安裝於一電路板上且在該LED晶粒上形成一模製透鏡。
圖6為一安裝於一子基板上之非覆晶LED晶粒之特寫側面圖，其中該LED晶粒又安裝於一電路板上，導線將LED晶粒上之n及p金屬電連接至該電路板上之導線，且在該LED晶粒上形成一模製透鏡。
圖7、8、9、10及11為一其上形成不同透鏡之LED晶粒之截面圖。
圖12為使用本發明技術模製於LED晶粒LED上之一側發射透鏡的截面圖。
圖13為使用本發明技術模製於LED晶粒LED上之一準直透鏡的截面圖。
圖14為固定於一使用本發明技術模製於LED晶粒上之朗伯特透鏡上之一預成型側發射透鏡的截面圖。
圖15為使用圖14之LED與側發射透鏡之液晶顯示器或其它類型顯示器之背光截面圖。
圖16為一具有一相機之行動電話的截面圖，該相機使用一具有一模製透鏡之LED作為閃光燈。
圖17與18為兩種模製透鏡之截面圖。儘管本發明亦可應用於非對稱透鏡，但所有展示之透鏡皆關於中軸線對稱。
圖19－22說明為獲得一所需發射圖案之一內透鏡或外殼層透鏡的表面特徵。
圖23說明用於一準直發射圖案之一高穹頂透鏡。
圖24與25說明使用一硬外透鏡與一軟外透鏡限制一導線接合上之應力。
圖26－28說明用於一側發射圖案之形成於多種類型之內或中間透鏡上之一外透鏡。
圖29說明另一側發射模製透鏡。
圖30說明各自含有不同磷光體之模製殼層之用途。
圖31說明在支撐基板上形成一模部分以形成一模製透鏡。
圖32說明在該透鏡之一部分上沉積一金屬反射器以達成一所需發射圖案。
圖33為在背光中使用具有側發射透鏡之LED之一液晶顯示器的側面圖。
圖34為使用具有準直透鏡之LED作為一RGB光源之一後投影TV之側面圖。
10．．．LED晶粒
12．．．支撐結構
14．．．模
16．．．凹槽
18．．．薄膜/離型膜

Claims (19)

  1. 一種在一發光二極體(LED)晶粒上形成一透鏡之方法，其包含：提供一連接至一支撐結構之LED晶粒；將一第一透鏡模製於該LED晶粒上且封裝該LED晶粒，該第一透鏡之一外表面係圓化(rounded)，該第一透鏡係由一第一材料所形成；及將一第二透鏡直接模製於該第一透鏡上，俾使於該第二透鏡之一內表面與該第一透鏡之該外表面間存在直接接觸，該第二透鏡係由一較形成該第一透鏡之該第一材料更硬之第二材料所形成。
  2. 如請求項1之方法，其中模製該第一透鏡進一步包含使用一熱或UV固化來固化該第一材料。
  3. 如請求項1之方法，其中模製該第一透鏡包含：以一第一透鏡材料填充一第一模中之一第一凹槽；將該第一模與該支撐結構接合在一起，使該LED晶粒位於該第一透鏡材料內；固化該液態第一透鏡材料；及將該支撐結構自該第一模中移除，使由該固化之第一透鏡材料形成之一第一透鏡覆蓋於該LED晶粒上。
  4. 如請求項1之方法，其中該支撐結構包含一具有與該LED晶粒上之金屬接點電接觸之金屬導線的子基板。
  5. 如請求項1之方法，其中將該LED晶粒固定於該支撐結構上之複數個LED晶粒中之一者上。
  6. 如請求項1之方法，其中該第一透鏡係直接與該LED晶粒接觸而形成。
  7. 如請求項1之方法，其中模製該第一透鏡進一步包含將一圖案模製於該第一透鏡之一表面中，以影響一發射光圖案。
  8. 如請求項7之方法，其中該圖案包含一菲涅耳(Fresnel)透鏡、一繞射光柵、一二元圖案、稜錐或圓錐。
  9. 如請求項1之方法，其中模製該第二透鏡包含：模製該第二透鏡使其具有一表面圖案，該表面圖案包含一菲涅耳透鏡、一繞射光柵、一二元圖案、稜錐或圓錐。
  10. 如請求項1之方法，其中該第一透鏡之硬度範圍係肖氏(Shore)00 5-90，且該第二透鏡之硬度高於肖氏A 30。
  11. 如請求項1之方法，其中該第二透鏡為一準直透鏡。
  12. 如請求項1之方法，其中該第二透鏡為一側發射透鏡。
  13. 如請求項1之方法，其中該第一材料及該第二材料包含聚矽氧烷(矽膠)、環氧樹脂或一聚矽氧烷(矽膠)/環氧樹脂混合物。
  14. 如請求項1之方法，其中模製該第二透鏡包含：提供具有以該第二材料填充之一第二凹槽之一第二模；將該第二模與該支撐結構接合在一起，其中具有該第一透鏡之該LED晶粒已連接至該支撐結構上，使該第一透鏡位於該第二凹槽中之該第二材料內； 固化該第二材料；及將該支撐結構自該第二模中移除，使該第二材料在該第一透鏡上形成一第一殼層。
  15. 如請求項1之方法，其中該第一透鏡含有一第一磷光體，且該第二透鏡含有一第二磷光體。
  16. 如請求項15之方法，其中該LED光與由該等磷光體發射之光的組合產生白光。
  17. 如請求項1之方法，其進一步包含在該第二透鏡上模製一第三透鏡，該第一透鏡含有一第一磷光體，該第二透鏡含有一第二磷光體，且該第三透鏡含有一第三磷光體。
  18. 一種在一發光二極體(LED)晶粒上形成一透鏡之方法，其包含：提供一連接至一支撐結構之LED晶粒；將一模形成於該支撐結構上；當該晶粒連接至該支撐結構時，將由一第一材料製成之一圓形第一透鏡模製於該晶粒上以封裝該晶粒，使用該支撐結構上之該模，以界定該第一透鏡之形狀；及將一第二透鏡直接模製於該第一透鏡上，俾使於該第二透鏡之一內表面與該第一透鏡之一外表面間存在直接接觸，該第二透鏡係由一較形成該第一透鏡之該第一材料更硬之第二材料所形成。
  19. 如請求項18之方法，其中模製該第一透鏡包含在將該晶粒嵌入該支撐結構上之模之前將一透鏡材料沉積於該模中，且接著固化該透鏡材料。
TW094140113A 2004-11-15 2005-11-15 發光二極體晶粒上之上層模製 TWI408835B (zh)

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