TW310481B - - Google Patents

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Publication number
TW310481B
TW310481B TW085108142A TW85108142A TW310481B TW 310481 B TW310481 B TW 310481B TW 085108142 A TW085108142 A TW 085108142A TW 85108142 A TW85108142 A TW 85108142A TW 310481 B TW310481 B TW 310481B
Authority
TW
Taiwan
Prior art keywords
die
semiconductor element
bonding material
semiconductor device
semiconductor
Prior art date
Application number
TW085108142A
Other languages
English (en)
Chinese (zh)
Inventor
Mitsuo Yamazaki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15917998&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW310481(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of TW310481B publication Critical patent/TW310481B/zh

Links

Classifications

    • H10W72/013—
    • H10W72/071—
    • H10W70/417—
    • H10W72/0113—
    • H10W95/00—
    • H10W72/0198—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07337—
    • H10W72/075—
    • H10W72/354—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer

Landscapes

  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW085108142A 1995-07-06 1996-07-05 TW310481B (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17115495 1995-07-06

Publications (1)

Publication Number Publication Date
TW310481B true TW310481B (cg-RX-API-DMAC10.html) 1997-07-11

Family

ID=15917998

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085108142A TW310481B (cg-RX-API-DMAC10.html) 1995-07-06 1996-07-05

Country Status (8)

Country Link
US (5) US6855579B2 (cg-RX-API-DMAC10.html)
EP (4) EP1308996A3 (cg-RX-API-DMAC10.html)
JP (2) JP3117971B2 (cg-RX-API-DMAC10.html)
KR (3) KR100328898B1 (cg-RX-API-DMAC10.html)
AU (1) AU6319596A (cg-RX-API-DMAC10.html)
MY (5) MY131253A (cg-RX-API-DMAC10.html)
TW (1) TW310481B (cg-RX-API-DMAC10.html)
WO (1) WO1997002595A1 (cg-RX-API-DMAC10.html)

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TW310481B (cg-RX-API-DMAC10.html) 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
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CN102160163A (zh) * 2008-09-22 2011-08-17 日立化成工业株式会社 半导体装置及其制造方法
JP5534682B2 (ja) * 2009-02-06 2014-07-02 積水化学工業株式会社 電子部品用熱硬化性接着剤及びこの接着剤を用いた電子部品内蔵基板の製造方法
KR101704891B1 (ko) 2012-04-26 2017-02-08 후루카와 덴키 고교 가부시키가이샤 필름 형상 접착제용 조성물 및 그의 제조방법, 필름 형상 접착제, 및, 필름 형상 접착제를 이용한 반도체 패키지 및 그의 제조방법
JP6468698B2 (ja) * 2013-09-26 2019-02-13 デクセリアルズ株式会社 太陽電池モジュール及びその製造方法
TWI685905B (zh) * 2017-07-12 2020-02-21 日商新川股份有限公司 接合裝置和接合方法
JP6838686B2 (ja) 2019-03-06 2021-03-03 昭和電工マテリアルズ株式会社 電子部品装置を製造する方法、及びこれに用いられる積層フィルム
WO2021019697A1 (ja) 2019-07-30 2021-02-04 昭和電工マテリアルズ株式会社 電子部品装置を製造する方法、及び電子部品装置

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MY131253A (en) 2007-07-31
US20080290529A1 (en) 2008-11-27
US20040253770A1 (en) 2004-12-16
AU6319596A (en) 1997-02-05
JP2000200794A (ja) 2000-07-18
EP0837498A1 (en) 1998-04-22
US7387914B2 (en) 2008-06-17
KR100328899B1 (ko) 2002-03-15
MY135104A (en) 2008-02-29
EP1032036A3 (en) 2000-11-22
US6855579B2 (en) 2005-02-15
JP2000200793A (ja) 2000-07-18
KR100328898B1 (ko) 2002-06-20
KR100366009B1 (ko) 2002-12-31
US7781896B2 (en) 2010-08-24
MY135220A (en) 2008-02-29
EP1235276A1 (en) 2002-08-28
EP0837498A4 (en) 1999-05-06
US7078094B2 (en) 2006-07-18
US20030160337A1 (en) 2003-08-28
MY130455A (en) 2007-06-29
WO1997002595A1 (en) 1997-01-23
US20060180903A1 (en) 2006-08-17
MY135107A (en) 2008-02-29
US20010016384A1 (en) 2001-08-23
JP3117971B2 (ja) 2000-12-18
JP3117972B2 (ja) 2000-12-18
US7057265B2 (en) 2006-06-06
EP1308996A3 (en) 2003-05-14
KR19990028267A (ko) 1999-04-15
EP1032036A2 (en) 2000-08-30
EP1308996A2 (en) 2003-05-07

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