JPH0322619B2 - - Google Patents

Info

Publication number
JPH0322619B2
JPH0322619B2 JP61153849A JP15384986A JPH0322619B2 JP H0322619 B2 JPH0322619 B2 JP H0322619B2 JP 61153849 A JP61153849 A JP 61153849A JP 15384986 A JP15384986 A JP 15384986A JP H0322619 B2 JPH0322619 B2 JP H0322619B2
Authority
JP
Japan
Prior art keywords
sulfonic acid
acid ester
naphthoquinonediazide
weight
quinonediazide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61153849A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62123444A (ja
Inventor
Yukihiro Hosaka
Ikuo Nozue
Masashige Takatori
Yoshuki Harita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
Japan Synthetic Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15959629&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH0322619(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Japan Synthetic Rubber Co Ltd filed Critical Japan Synthetic Rubber Co Ltd
Publication of JPS62123444A publication Critical patent/JPS62123444A/ja
Publication of JPH0322619B2 publication Critical patent/JPH0322619B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/16—Chemical modification with polymerisable compounds
    • C08J7/18—Chemical modification with polymerisable compounds using wave energy or particle radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/008—Azides
    • G03F7/0085—Azides characterised by the non-macromolecular additives

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP61153849A 1985-08-07 1986-06-30 ポジ型感放射線性樹脂組成物 Granted JPS62123444A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60-173396 1985-08-07
JP17339685 1985-08-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP63262031A Division JPH0693115B2 (ja) 1988-10-18 1988-10-18 ネガ型感放射線性樹脂組成物

Publications (2)

Publication Number Publication Date
JPS62123444A JPS62123444A (ja) 1987-06-04
JPH0322619B2 true JPH0322619B2 (cg-RX-API-DMAC10.html) 1991-03-27

Family

ID=15959629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61153849A Granted JPS62123444A (ja) 1985-08-07 1986-06-30 ポジ型感放射線性樹脂組成物

Country Status (5)

Country Link
US (6) US5405720A (cg-RX-API-DMAC10.html)
EP (2) EP0457367A1 (cg-RX-API-DMAC10.html)
JP (1) JPS62123444A (cg-RX-API-DMAC10.html)
KR (2) KR910007224B1 (cg-RX-API-DMAC10.html)
DE (1) DE3684200D1 (cg-RX-API-DMAC10.html)

Families Citing this family (147)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62123444A (ja) * 1985-08-07 1987-06-04 Japan Synthetic Rubber Co Ltd ポジ型感放射線性樹脂組成物
EP0260994B1 (en) * 1986-09-18 1992-07-15 Japan Synthetic Rubber Co., Ltd. Process for producing integrated circuit
DE3752371T2 (de) * 1986-12-23 2004-04-15 Shipley Co. Inc., Marlborough Fotoresistzusammensetzungen und ihre Bestandteile
US5128230A (en) * 1986-12-23 1992-07-07 Shipley Company Inc. Quinone diazide containing photoresist composition utilizing mixed solvent of ethyl lactate, anisole and amyl acetate
JPS63178228A (ja) * 1987-01-20 1988-07-22 Fuji Photo Film Co Ltd ポジ型フオトレジスト組成物
JPH07117746B2 (ja) * 1987-04-16 1995-12-18 富士写真フイルム株式会社 感光性平版印刷版の製造方法
JPH0196646A (ja) * 1987-10-09 1989-04-14 Hitachi Ltd フオトレジスト組成物
US4886728A (en) * 1988-01-06 1989-12-12 Olin Hunt Specialty Products Inc. Use of particular mixtures of ethyl lactate and methyl ethyl ketone to remove undesirable peripheral material (e.g. edge beads) from photoresist-coated substrates
NO891062L (no) * 1988-03-31 1989-10-02 Thiokol Morton Inc Positiv fotofoelsom sammensetning.
NO891063L (no) * 1988-03-31 1989-10-02 Thiokol Morton Inc Novolakharpikser av blandede aldehyder og positive fotoresistmaterialer fremstilt fra slike harpikser.
US4996122A (en) * 1988-03-31 1991-02-26 Morton International, Inc. Method of forming resist pattern and thermally stable and highly resolved resist pattern
US4920028A (en) * 1988-03-31 1990-04-24 Morton Thiokol, Inc. High contrast high thermal stability positive photoresists with mixed cresol and hydroxybenzaldehyde prepared novolak and photosensitive diazoquinone
US5130409A (en) * 1988-04-22 1992-07-14 Morton International, Inc. Mixed aldehyde novolak resins useful as high contrast high thermal stability positive photoresists
US4997734A (en) * 1988-08-02 1991-03-05 Morton International, Inc. Method of forming a thermally stable mixed aldehyde novolak resin containing resist pattern and that pattern on a substrate
EP0349301A3 (en) * 1988-06-28 1990-12-27 Mitsubishi Kasei Corporation Positive-type photoresist composition
CA1337626C (en) * 1988-07-07 1995-11-28 Haruyoshi Osaki Radiation-sensitive positive resist composition
US5456995A (en) * 1988-07-07 1995-10-10 Sumitomo Chemical Company, Limited Radiation-sensitive positive resist composition
US5001040A (en) * 1988-07-11 1991-03-19 Olin Hunt Specialty Products Inc. Process of forming resist image in positive photoresist with thermally stable phenolic resin
US4959292A (en) * 1988-07-11 1990-09-25 Olin Hunt Specialty Products Inc. Light-sensitive o-quinone diazide composition and product with phenolic novolak prepared by condensation with haloacetoaldehyde
US4943511A (en) * 1988-08-05 1990-07-24 Morton Thiokol, Inc. High sensitivity mid and deep UV resist
JPH03502614A (ja) * 1988-09-30 1991-06-13 マクダーミツド　インコーポレーテツド ホトレジストのソフト焼成処理
US4965167A (en) 1988-11-10 1990-10-23 Olin Hunt Specialty Products, Inc. Positive-working photoresist employing a selected mixture of ethyl lactate and ethyl 3-ethoxy propionate as casting solvent
US5063138A (en) * 1988-11-10 1991-11-05 Ocg Microelectronic Materials, Inc. Positive-working photoresist process employing a selected mixture of ethyl lactate and ethyl 3-ethoxy propionate as casting solvent during photoresist coating
JPH03127067A (ja) * 1989-10-13 1991-05-30 Sumitomo Chem Co Ltd ポジ型感放射線性レジスト組成物
EP0496830B1 (en) * 1989-10-16 1999-03-31 THE UNITED STATES OF AMERICA as represented by the Secretary UNITED STATES DEPARTMENT OF COMMERCE Total synthesis of northebaine, normorphine, noroxymorphone enantiomers and derivatives via n-nor intermediates
JPH04328747A (ja) * 1991-03-27 1992-11-17 Internatl Business Mach Corp <Ibm> 均一にコートされたフォトレジスト組成物
JP3139088B2 (ja) * 1991-04-26 2001-02-26 住友化学工業株式会社 ポジ型レジスト組成物
TW213532B (cg-RX-API-DMAC10.html) * 1991-07-26 1993-09-21 Mitsubishi Gas Chemical Co
TW267219B (cg-RX-API-DMAC10.html) * 1991-12-27 1996-01-01 Sumitomo Chemical Co
KR100341563B1 (ko) * 1992-03-23 2002-10-25 제이에스알 가부시끼가이샤 레지스트도포조성물
JP3619261B2 (ja) 1993-06-15 2005-02-09 三菱レイヨン株式会社 溶剤組成物
JP3364727B2 (ja) * 1993-10-22 2003-01-08 イハラケミカル工業株式会社 ２，２−ビス（３，５−ジ置換−４−ヒドロキシフェニル）プロパン誘導体とその製造方法およびこの誘導体を用いるピロガロールの製造法
JPH07271023A (ja) * 1994-04-01 1995-10-20 Toagosei Co Ltd ポジ型フォトレジスト組成物
JPH07301917A (ja) * 1994-04-28 1995-11-14 Tokuyama Sekiyu Kagaku Kk ポジ型感放射線性樹脂組成物
US5977034A (en) * 1994-08-19 1999-11-02 Lifenet Research Foundation Composition for cleaning bones
FI100932B (fi) * 1995-04-12 1998-03-13 Nokia Telecommunications Oy Äänitaajuussignaalien lähetys radiopuhelinjärjestelmässä
DE19533608A1 (de) * 1995-09-11 1997-03-13 Basf Ag Positivarbeitendes strahlungsempfindliches Gemisch und Verfahren zur Herstellung von Reliefstrukturen
JP3057010B2 (ja) * 1996-08-29 2000-06-26 東京応化工業株式会社 ポジ型レジスト組成物及びレジストパターンの形成方法
US5910559A (en) * 1996-12-18 1999-06-08 Clariant Finance (Bvi) Limited Fractionated novolak resin from cresol-formaldehyde reaction mixture and photoresist composition therefrom
JP3365318B2 (ja) 1998-08-12 2003-01-08 信越化学工業株式会社 高分子化合物、レジスト材料及びパターン形成方法
US6200891B1 (en) * 1998-08-13 2001-03-13 International Business Machines Corporation Removal of dielectric oxides
KR100498440B1 (ko) * 1999-11-23 2005-07-01 삼성전자주식회사 백본이 환상 구조를 가지는 감광성 폴리머와 이를포함하는 레지스트 조성물
KR100786596B1 (ko) 1999-12-29 2007-12-21 엑손모빌 케미칼 패턴츠 인코포레이티드 에스테르 함유 유체 조성물
CA2404023A1 (en) * 2000-04-03 2001-10-11 Richard E. Olson Cyclic lactams as inhibitors of a.beta. protein production
JP4838437B2 (ja) * 2000-06-16 2011-12-14 Ｊｓｒ株式会社 感放射線性樹脂組成物
KR100760146B1 (ko) * 2000-09-18 2007-09-18 제이에스알 가부시끼가이샤 감방사선성 수지 조성물
JP4438218B2 (ja) * 2000-11-16 2010-03-24 Ｊｓｒ株式会社 感放射線性樹脂組成物
US7582226B2 (en) * 2000-12-22 2009-09-01 Exxonmobil Chemical Patents Inc. Ester-containing fluid compositions
US6838225B2 (en) 2001-01-18 2005-01-04 Jsr Corporation Radiation-sensitive resin composition
US7192681B2 (en) 2001-07-05 2007-03-20 Fuji Photo Film Co., Ltd. Positive photosensitive composition
US7531286B2 (en) * 2002-03-15 2009-05-12 Jsr Corporation Radiation-sensitive resin composition
JP4048824B2 (ja) * 2002-05-09 2008-02-20 Ｊｓｒ株式会社 感放射線性樹脂組成物
US6939662B2 (en) 2002-05-31 2005-09-06 Fuji Photo Film Co., Ltd. Positive-working resist composition
TWI314943B (en) * 2002-08-29 2009-09-21 Radiation-sensitive resin composition
JP3937996B2 (ja) * 2002-10-08 2007-06-27 Ｊｓｒ株式会社 感放射性樹脂組成物
KR20040092550A (ko) * 2003-04-24 2004-11-04 클라리언트 인터내셔널 리미티드 레지스트 조성물 및 레지스트 제거용 유기용제
JP4621870B2 (ja) * 2003-09-11 2011-01-26 ナガセケムテックス株式会社 感放射線性樹脂組成物
JP4612999B2 (ja) 2003-10-08 2011-01-12 富士フイルム株式会社 ポジ型レジスト組成物及びそれを用いたパターン形成方法
JP4140506B2 (ja) * 2003-10-28 2008-08-27 Ｊｓｒ株式会社 感放射線性樹脂組成物
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EP1720072B1 (en) 2005-05-01 2019-06-05 Rohm and Haas Electronic Materials, L.L.C. Compositons and processes for immersion lithography
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KR101314033B1 (ko) * 2005-06-15 2013-10-01 제이에스알 가부시끼가이샤 감광성 수지 조성물, 표시 패널용 스페이서의 형성 방법
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JP4911469B2 (ja) 2007-09-28 2012-04-04 富士フイルム株式会社 レジスト組成物及びこれを用いたパターン形成方法
JP2009122325A (ja) 2007-11-14 2009-06-04 Fujifilm Corp トップコート組成物、それを用いたアルカリ現像液可溶性トップコート膜及びそれを用いたパターン形成方法
JP5150296B2 (ja) 2008-02-13 2013-02-20 富士フイルム株式会社 電子線、ｘ線またはｅｕｖ用ポジ型レジスト組成物及びこれを用いたパターン形成方法
US9046773B2 (en) 2008-03-26 2015-06-02 Fujifilm Corporation Actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method using the same, polymerizable compound and polymer compound obtained by polymerizing the polymerizable compound
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JP5746818B2 (ja) 2008-07-09 2015-07-08 富士フイルム株式会社 感活性光線性または感放射線性樹脂組成物及びそれを用いたパターン形成方法
JP5106285B2 (ja) 2008-07-16 2012-12-26 富士フイルム株式会社 光硬化性組成物、インク組成物、及び該インク組成物を用いたインクジェット記録方法
JP5277128B2 (ja) 2008-09-26 2013-08-28 富士フイルム株式会社 液浸露光用ポジ型レジスト組成物及びパターン形成方法
KR101987730B1 (ko) 2008-12-12 2019-06-11 후지필름 가부시키가이샤 감활성광선성 또는 감방사선성 수지 조성물 및 그 조성물을 이용한 패턴 형성 방법
KR101794035B1 (ko) 2008-12-12 2017-11-06 후지필름 가부시키가이샤 감활성광선성 또는 감방사선성 수지 조성물 및 그것을 사용한 패턴형성방법
JP5377172B2 (ja) 2009-03-31 2013-12-25 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物及びそれを用いたパターン形成方法
CN103733135B (zh) 2011-08-12 2018-11-27 三菱瓦斯化学株式会社 抗蚀剂组合物、抗蚀图案形成方法、用于其的多元酚化合物以及由其衍生而得到的醇化合物
EP2781504B1 (en) 2011-11-18 2017-01-04 Mitsubishi Gas Chemical Company, Inc. Cyclic compound, method for producing same, radiation-sensitive composition, and method for forming resist pattern
US20140329177A1 (en) 2011-11-18 2014-11-06 Mitsubishi Gas Chemical Company, Inc. Cyclic compound, method for producing same, radiation-sensitive composition, and resist pattern formation method
KR102115330B1 (ko) 2012-10-17 2020-05-26 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 레지스트 조성물
JP5764589B2 (ja) 2012-10-31 2015-08-19 富士フイルム株式会社 化学増幅型レジスト膜のパターニング用有機系処理液の収容容器、並びに、これらを使用したパターン形成方法及び電子デバイスの製造方法
CN104995559B (zh) 2013-02-08 2020-04-07 三菱瓦斯化学株式会社 抗蚀剂组合物、抗蚀图案形成方法和用于其的多元酚衍生物
WO2014196425A1 (ja) 2013-06-07 2014-12-11 三菱瓦斯化学株式会社 レジスト組成物
US20170066208A1 (en) 2015-09-08 2017-03-09 Canon Kabushiki Kaisha Substrate pretreatment for reducing fill time in nanoimprint lithography
US10488753B2 (en) 2015-09-08 2019-11-26 Canon Kabushiki Kaisha Substrate pretreatment and etch uniformity in nanoimprint lithography
US10620539B2 (en) 2016-03-31 2020-04-14 Canon Kabushiki Kaisha Curing substrate pretreatment compositions in nanoimprint lithography
US10095106B2 (en) 2016-03-31 2018-10-09 Canon Kabushiki Kaisha Removing substrate pretreatment compositions in nanoimprint lithography
US10134588B2 (en) 2016-03-31 2018-11-20 Canon Kabushiki Kaisha Imprint resist and substrate pretreatment for reducing fill time in nanoimprint lithography
US10509313B2 (en) 2016-06-28 2019-12-17 Canon Kabushiki Kaisha Imprint resist with fluorinated photoinitiator and substrate pretreatment for reducing fill time in nanoimprint lithography
WO2018155495A1 (ja) 2017-02-23 2018-08-30 三菱瓦斯化学株式会社 化合物、樹脂、組成物、パターン形成方法及び精製方法
US10317793B2 (en) 2017-03-03 2019-06-11 Canon Kabushiki Kaisha Substrate pretreatment compositions for nanoimprint lithography
JP7138622B2 (ja) 2017-03-31 2022-09-16 学校法人 関西大学 化合物、化合物を含むレジスト組成物及びそれを用いるパターン形成方法
EP3605227A4 (en) 2017-03-31 2020-04-22 The School Corporation Kansai University RESIST COMPOSITION AND PATTERN FORMING METHOD USING SAME, AND COMPOUND AND RESIN
US20200157060A1 (en) 2017-06-28 2020-05-21 Mitsubishi Gas Chemical Company, Inc. Film forming material, composition for film formation for lithography, material for optical component formation, resist composition, resist pattern formation method, permanent film for resist, radiation-sensitive composition, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for producing underlayer film for lithography, and circuit pattern formation method
WO2019066000A1 (ja) 2017-09-29 2019-04-04 学校法人関西大学 リソグラフィー用組成物、パターン形成方法、及び化合物
WO2019098338A1 (ja) 2017-11-20 2019-05-23 三菱瓦斯化学株式会社 リソグラフィー用膜形成用組成物、リソグラフィー用膜、レジストパターン形成方法、及び回路パターン形成方法
US20210047457A1 (en) 2018-01-22 2021-02-18 Mitsubishi Gas Chemical Company, Inc. Compound, resin, composition and pattern formation method
JP7385827B2 (ja) 2018-01-31 2023-11-24 三菱瓦斯化学株式会社 化合物、樹脂、組成物、レジストパターン形成方法、回路パターン形成方法及び樹脂の精製方法
CN111630111A (zh) 2018-01-31 2020-09-04 三菱瓦斯化学株式会社 组合物、以及抗蚀剂图案的形成方法和绝缘膜的形成方法
US20210331994A1 (en) 2018-08-24 2021-10-28 Mitsubishi Gas Chemical Company, Inc. Compound, composition containing the same, method for forming resist pattern and method for forming insulating film
JP7219822B2 (ja) 2019-09-30 2023-02-08 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法、及び電子デバイスの製造方法
KR102808955B1 (ko) * 2019-12-02 2025-05-16 듀폰스페셜티머터리얼스코리아 유한회사 포지티브형 감광성 수지 조성물 및 이로부터 제조된 경화막
WO2021200056A1 (ja) 2020-03-30 2021-10-07 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法、電子デバイスの製造方法、フォトマスク製造用感活性光線性又は感放射線性樹脂組成物、及びフォトマスクの製造方法
JP7389892B2 (ja) 2020-03-31 2023-11-30 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法、及び電子デバイスの製造方法
US20240369924A1 (en) * 2021-07-30 2024-11-07 Mitsubishi Gas Chemical Company, Inc. Resist composition and resist film forming method using same
WO2024014329A1 (ja) * 2022-07-14 2024-01-18 三菱瓦斯化学株式会社 レジスト組成物、及びそれを用いたレジスト膜形成方法
KR20250038640A (ko) * 2022-07-14 2025-03-19 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 시너 조성물, 및 해당 시너 조성물을 이용한 반도체 디바이스의 제조 방법
JPWO2024014330A1 (cg-RX-API-DMAC10.html) * 2022-07-14 2024-01-18

Family Cites Families (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2980534A (en) * 1956-12-17 1961-04-18 Monsanto Chemicals Photographic compositions and photographic elements
NL247588A (cg-RX-API-DMAC10.html) * 1959-01-21
US3635709A (en) * 1966-12-15 1972-01-18 Polychrome Corp Light-sensitive lithographic plate
US3589898A (en) * 1968-10-08 1971-06-29 Polychrome Corp Litho plate
US3707373A (en) * 1969-03-17 1972-12-26 Eastman Kodak Co Lithographic plate developers
US3666473A (en) * 1970-10-06 1972-05-30 Ibm Positive photoresists for projection exposure
GB1375461A (cg-RX-API-DMAC10.html) 1972-05-05 1974-11-27
US3826900A (en) * 1972-10-13 1974-07-30 Ncr Cordless scanning probe
US4164421A (en) 1972-12-09 1979-08-14 Fuji Photo Film Co., Ltd. Photocurable composition containing an o-quinonodiazide for printing plate
JPS4988603A (cg-RX-API-DMAC10.html) * 1972-12-29 1974-08-24
US4132550A (en) 1974-03-01 1979-01-02 Motorola, Inc. Photoresists with particles less than one micron
JPS5821257B2 (ja) * 1974-04-25 1983-04-28 富士写真フイルム株式会社 キンゾクガゾウケイセイザイリヨウ
JPS50141614A (cg-RX-API-DMAC10.html) * 1974-05-01 1975-11-14
JPS5128001A (en) * 1974-08-29 1976-03-09 Polychrome Corp Kizaijono kankohifuku oyobi sonoseizoho
CA1085212A (en) * 1975-05-27 1980-09-09 Ronald H. Engebrecht Use of volatile carboxylic acids in improved photoresists containing quinone diazides
JPS5934292B2 (ja) * 1975-06-24 1984-08-21 富士写真フイルム株式会社 ホトレジスト材料
US4197132A (en) * 1975-06-24 1980-04-08 Fuji Photo Film Co., Ltd. Photopolymer photoresist composition containing rosin tackifier adhesion improver and chlorinated polyolefin
NL7609513A (nl) * 1975-09-02 1977-03-04 Printing Dev Inc Voor licht gevoelig resistbekledingspreparaat en voor licht gevoelig voortbrengsel alsmede werkwijze voor het vervaardigen van een litho- grafische drukplaat.
JPS6023703B2 (ja) * 1976-04-10 1985-06-08 古河電気工業株式会社 耐熱性エチレン・四弗化エチレン共重合体組成物成形品の製造方法
GB1492529A (en) * 1976-05-26 1977-11-23 Vickers Ltd Treatment of planographic printing blanks
JPS5484728A (en) 1977-12-19 1979-07-05 Mitsubishi Paper Mills Ltd Liquid for removing picture on organic electronic photographic sensitive layer
JPS54135004A (en) * 1978-04-10 1979-10-19 Fuji Photo Film Co Ltd Photosensitive flat printing plate
JPS5555335A (en) * 1978-10-19 1980-04-23 Fuji Photo Film Co Ltd Photosensitive composition
JPS5562444A (en) * 1978-11-02 1980-05-10 Konishiroku Photo Ind Co Ltd Photosensitive composition
JPS5575758A (en) * 1978-12-06 1980-06-07 Fuji Photo Film Co Ltd Coating method and apparatus therefor
CA1160880A (en) 1979-02-02 1984-01-24 Keith E. Whitmore Imaging with nonplanar support elements
JPS55129341A (en) * 1979-03-29 1980-10-07 Daicel Chem Ind Ltd Photosensitive covering composition
US4370406A (en) * 1979-12-26 1983-01-25 Richardson Graphics Company Developers for photopolymer lithographic plates
JPS56140342A (en) * 1980-04-02 1981-11-02 Tokyo Ohka Kogyo Co Ltd Image forming composition and formation of resist image
DE3040156A1 (de) 1980-10-24 1982-06-03 Hoechst Ag, 6000 Frankfurt Lichtempfindliches gemisch und damit hergestelltes lichtempfindliches kopiermaterial
EP0054258B1 (en) 1980-12-17 1986-03-05 Konica Corporation Photosensitive compositions
JPS57178242A (en) 1981-04-27 1982-11-02 Konishiroku Photo Ind Co Ltd Photosensitive lithographic plate
JPS5811932A (ja) * 1981-07-15 1983-01-22 Konishiroku Photo Ind Co Ltd 感光性組成物
US4421841A (en) * 1981-07-28 1983-12-20 Mitsubishi Chemical Industries Limited Photosensitive lithographic plate with sulfonate containing photosensitive polyester
JPS58173740A (ja) * 1982-04-05 1983-10-12 Mitsubishi Chem Ind Ltd 感光性組成物
JPS5818625A (ja) * 1981-07-28 1983-02-03 Mitsubishi Chem Ind Ltd 感光性組成物
US4365019A (en) * 1981-08-06 1982-12-21 Eastman Kodak Company Positive-working resist quinone diazide containing composition and imaging method having improved development rates
JPS58150948A (ja) * 1982-03-03 1983-09-07 Dainippon Ink & Chem Inc 感光性組成物
US4439516A (en) * 1982-03-15 1984-03-27 Shipley Company Inc. High temperature positive diazo photoresist processing using polyvinyl phenol
US4499171A (en) * 1982-04-20 1985-02-12 Japan Synthetic Rubber Co., Ltd. Positive type photosensitive resin composition with at least two o-quinone diazides
JPS5937539A (ja) * 1982-08-26 1984-03-01 Mitsubishi Chem Ind Ltd 感光性平版印刷版
JPS59108037A (ja) * 1982-12-10 1984-06-22 Isuzu Motors Ltd 樹脂塗装用プライマ−
JPS59155838A (ja) * 1983-02-24 1984-09-05 Tokyo Ohka Kogyo Co Ltd ポジ型感光性塗膜形成用組成物
JPS59166947A (ja) * 1983-03-14 1984-09-20 Japan Synthetic Rubber Co Ltd 電離放射線用ネガ型レジスト
JPS59180539A (ja) * 1983-03-31 1984-10-13 Fujitsu Ltd 微細パタ−ン形成用ネガ型レジスト
US4526856A (en) * 1983-05-23 1985-07-02 Allied Corporation Low striation positive diazoketone resist composition with cyclic ketone(s) and aliphatic alcohol as solvents
DE3323343A1 (de) * 1983-06-29 1985-01-10 Hoechst Ag, 6230 Frankfurt Lichtempfindliches gemisch und daraus hergestelltes kopiermaterial
JPS6024545A (ja) * 1983-07-21 1985-02-07 Japan Synthetic Rubber Co Ltd ポジ型感光性樹脂組成物
JPH0658529B2 (ja) * 1983-08-17 1994-08-03 三菱化成株式会社 ポジ型クレゾ−ルノボラツクフオトレジスト組成物
US4626491A (en) 1983-10-07 1986-12-02 J. T. Baker Chemical Company Deep ultra-violet lithographic resist composition and process of using
JPS60104940A (ja) * 1983-11-14 1985-06-10 Fuji Photo Film Co Ltd 感光材料の製造方法
JPS60121445A (ja) * 1983-12-06 1985-06-28 Japan Synthetic Rubber Co Ltd 集積回路作製用ポジ型感光性樹脂組成物
JPS60136034A (ja) * 1983-12-23 1985-07-19 Sony Corp 磁気記録媒体
DE3586263D1 (de) * 1984-03-07 1992-08-06 Ciba Geigy Ag Verfahren zur herstellung von abbildungen.
JPS60245450A (ja) * 1984-05-18 1985-12-05 Matsushita Electric Ind Co Ltd 小型モ−タ
DE3421160A1 (de) 1984-06-07 1985-12-12 Hoechst Ag, 6230 Frankfurt Positiv arbeitende strahlungsempfindliche beschichtungsloesung
US4550069A (en) * 1984-06-11 1985-10-29 American Hoechst Corporation Positive photoresist compositions with o-quinone diazide, novolak, and propylene glycol alkyl ether acetate
JPS617839A (ja) * 1984-06-22 1986-01-14 Sanritsu Kogyo Kk ハ−ドマスク修正法
JPH0782236B2 (ja) * 1984-10-12 1995-09-06 三菱化学株式会社 感光性組成物
JPH0766183B2 (ja) * 1985-05-15 1995-07-19 三菱化学株式会社 ポジ型フオトレジスト組成物
US4626492A (en) 1985-06-04 1986-12-02 Olin Hunt Specialty Products, Inc. Positive-working o-quinone diazide photoresist composition containing a dye and a trihydroxybenzophenone compound
JPS61289019A (ja) 1985-06-18 1986-12-19 Geran Kaihatsu Kenkyusho:Kk 美爪エナメル除去剤
JPS62123444A (ja) * 1985-08-07 1987-06-04 Japan Synthetic Rubber Co Ltd ポジ型感放射線性樹脂組成物
US5215857A (en) * 1985-08-07 1993-06-01 Japan Synthetic Rubber Co., Ltd. 1,2-quinonediazide containing radiation-sensitive resin composition utilizing methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate or methyl 3-methoxypropionate as the solvent
US5238774A (en) * 1985-08-07 1993-08-24 Japan Synthetic Rubber Co., Ltd. Radiation-sensitive composition containing 1,2-quinonediazide compound, alkali-soluble resin and monooxymonocarboxylic acid ester solvent
EP0227487B1 (en) * 1985-12-27 1992-07-15 Japan Synthetic Rubber Co., Ltd. Positive type radiation-sensitive resin composition
US4845008A (en) 1986-02-20 1989-07-04 Fuji Photo Film Co., Ltd. Light-sensitive positive working, o-guinone diazide presensitized plate with mixed solvent
JPH0820730B2 (ja) * 1986-10-30 1996-03-04 日本合成ゴム株式会社 ポジ型感放射線性樹脂組成物
DE3752371T2 (de) * 1986-12-23 2004-04-15 Shipley Co. Inc., Marlborough Fotoresistzusammensetzungen und ihre Bestandteile
US5128230A (en) * 1986-12-23 1992-07-07 Shipley Company Inc. Quinone diazide containing photoresist composition utilizing mixed solvent of ethyl lactate, anisole and amyl acetate
DE3872289T2 (de) * 1987-04-03 1993-02-11 Sumitomo Chemical Co Verfahren zur rueckgewinnung von gallium durch chelatharz.
JP3139088B2 (ja) * 1991-04-26 2001-02-26 住友化学工業株式会社 ポジ型レジスト組成物

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US5494784A (en) 1996-02-27
EP0211667A2 (en) 1987-02-25
US5925492A (en) 1999-07-20
US6020104A (en) 2000-02-01
US6228554B1 (en) 2001-05-08
EP0211667A3 (en) 1987-09-09
EP0211667B1 (en) 1992-03-11
KR910009134A (ko) 1991-05-31
JPS62123444A (ja) 1987-06-04
US5405720A (en) 1995-04-11
KR910007224B1 (ko) 1991-09-20
KR870002181A (ko) 1987-03-30
EP0457367A1 (en) 1991-11-21
US6270939B1 (en) 2001-08-07
KR910007223B1 (ko) 1991-09-20

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