JP4532827B2 - 小型シリコンコンデンサマイクロフォンおよびその製造方法 - Google Patents
小型シリコンコンデンサマイクロフォンおよびその製造方法 Download PDFInfo
- Publication number
- JP4532827B2 JP4532827B2 JP2002546465A JP2002546465A JP4532827B2 JP 4532827 B2 JP4532827 B2 JP 4532827B2 JP 2002546465 A JP2002546465 A JP 2002546465A JP 2002546465 A JP2002546465 A JP 2002546465A JP 4532827 B2 JP4532827 B2 JP 4532827B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive material
- housing
- microphone package
- transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/01—Electrostatic transducers characterised by the use of electrets
- H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/4908—Acoustic transducer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Pressure Sensors (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US25354300P | 2000-11-28 | 2000-11-28 | |
| US09/886,854 US7166910B2 (en) | 2000-11-28 | 2001-06-21 | Miniature silicon condenser microphone |
| PCT/US2001/049462 WO2002045463A2 (en) | 2000-11-28 | 2001-10-22 | Miniature silicon condenser microphone and method for producing same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007250745A Division JP2008099271A (ja) | 2000-11-28 | 2007-09-27 | 小型シリコンコンデンサマイクロフォンおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004537182A JP2004537182A (ja) | 2004-12-09 |
| JP4532827B2 true JP4532827B2 (ja) | 2010-08-25 |
Family
ID=26943352
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002546465A Expired - Fee Related JP4532827B2 (ja) | 2000-11-28 | 2001-10-22 | 小型シリコンコンデンサマイクロフォンおよびその製造方法 |
| JP2007250745A Pending JP2008099271A (ja) | 2000-11-28 | 2007-09-27 | 小型シリコンコンデンサマイクロフォンおよびその製造方法 |
| JP2009184808A Expired - Lifetime JP5216717B2 (ja) | 2000-11-28 | 2009-08-07 | 小型シリコンコンデンサマイクロフォンおよびその製造方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007250745A Pending JP2008099271A (ja) | 2000-11-28 | 2007-09-27 | 小型シリコンコンデンサマイクロフォンおよびその製造方法 |
| JP2009184808A Expired - Lifetime JP5216717B2 (ja) | 2000-11-28 | 2009-08-07 | 小型シリコンコンデンサマイクロフォンおよびその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US7166910B2 (enExample) |
| EP (2) | EP1346601B1 (enExample) |
| JP (3) | JP4532827B2 (enExample) |
| AT (1) | ATE510415T1 (enExample) |
| AU (1) | AU2002229116A1 (enExample) |
| WO (1) | WO2002045463A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190070618A (ko) * | 2017-12-13 | 2019-06-21 | 현대자동차주식회사 | 멤스 마이크로폰 |
Families Citing this family (321)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7439616B2 (en) * | 2000-11-28 | 2008-10-21 | Knowles Electronics, Llc | Miniature silicon condenser microphone |
| US8623710B1 (en) | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages |
| US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
| US7166910B2 (en) * | 2000-11-28 | 2007-01-23 | Knowles Electronics Llc | Miniature silicon condenser microphone |
| US6856007B2 (en) | 2001-08-28 | 2005-02-15 | Tessera, Inc. | High-frequency chip packages |
| JP4620303B2 (ja) * | 2001-09-20 | 2011-01-26 | 株式会社東海理化電機製作所 | 半導体装置及びその製造方法 |
| ATE338301T1 (de) * | 2002-04-15 | 2006-09-15 | Epos Technologies Ltd | Verfahren und system zum erfassen von positionsdaten |
| FI118505B (fi) * | 2002-06-04 | 2007-11-30 | Aspocomp Oy | Monikerrospiirilevyrakenteeseen muodostettu akustisesti aktiivinen elementti, menetelmä akustisesti aktiivisen elementin muodostamiseksi monikerrospiirilevyrakenteeseen sekä monikerrospiirilevyrakenne |
| DE10238523B4 (de) * | 2002-08-22 | 2014-10-02 | Epcos Ag | Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung |
| US7072482B2 (en) | 2002-09-06 | 2006-07-04 | Sonion Nederland B.V. | Microphone with improved sound inlet port |
| US6781231B2 (en) * | 2002-09-10 | 2004-08-24 | Knowles Electronics Llc | Microelectromechanical system package with environmental and interference shield |
| DE10303263B4 (de) * | 2003-01-28 | 2012-01-05 | Infineon Technologies Ag | Mikrophonanordnung |
| US7501703B2 (en) * | 2003-02-28 | 2009-03-10 | Knowles Electronics, Llc | Acoustic transducer module |
| US7382048B2 (en) | 2003-02-28 | 2008-06-03 | Knowles Electronics, Llc | Acoustic transducer module |
| US6972480B2 (en) | 2003-06-16 | 2005-12-06 | Shellcase Ltd. | Methods and apparatus for packaging integrated circuit devices |
| CN100587962C (zh) | 2003-07-03 | 2010-02-03 | 泰塞拉技术匈牙利公司 | 用于封装集成电路器件的方法和设备 |
| US7129576B2 (en) * | 2003-09-26 | 2006-10-31 | Tessera, Inc. | Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps |
| US6932187B2 (en) * | 2003-10-14 | 2005-08-23 | Gore Enterprise Holdings, Inc. | Protective acoustic cover assembly |
| US20050116344A1 (en) * | 2003-10-29 | 2005-06-02 | Tessera, Inc. | Microelectronic element having trace formed after bond layer |
| KR100675026B1 (ko) * | 2003-11-05 | 2007-01-29 | 주식회사 비에스이 | 메인 pcb에 콘덴서 마이크로폰을 실장하는 방법 |
| EP1720794A2 (en) * | 2004-03-01 | 2006-11-15 | Tessera, Inc. | Packaged acoustic and electromagnetic transducer chips |
| DE102004011149B3 (de) * | 2004-03-08 | 2005-11-10 | Infineon Technologies Ag | Mikrophon und Verfahren zur Herstellung eines Mikrophons |
| DE102004011148B3 (de) * | 2004-03-08 | 2005-11-10 | Infineon Technologies Ag | Mikrophon und Verfahren zum Herstellen eines Mikrophons |
| CN1926919B (zh) * | 2004-03-09 | 2011-01-26 | 松下电器产业株式会社 | 驻极体电容式麦克风 |
| DE102004020204A1 (de) * | 2004-04-22 | 2005-11-10 | Epcos Ag | Verkapseltes elektrisches Bauelement und Verfahren zur Herstellung |
| DE102004020139A1 (de) * | 2004-04-24 | 2005-11-17 | Daimlerchrysler Ag | Lambdasonde |
| US7929714B2 (en) * | 2004-08-11 | 2011-04-19 | Qualcomm Incorporated | Integrated audio codec with silicon audio transducer |
| US7608789B2 (en) * | 2004-08-12 | 2009-10-27 | Epcos Ag | Component arrangement provided with a carrier substrate |
| EP1792517B1 (en) * | 2004-09-13 | 2013-04-10 | Oticon A/S | Audio processing device with encapsulated electronic component. |
| DK1638366T3 (en) | 2004-09-20 | 2015-12-14 | Sonion Nederland Bv | microphone device |
| US7897436B2 (en) * | 2004-11-26 | 2011-03-01 | Stmicroelectronics, S.A. | Process for packaging micro-components using a matrix |
| US7795695B2 (en) | 2005-01-27 | 2010-09-14 | Analog Devices, Inc. | Integrated microphone |
| US7373835B2 (en) | 2005-01-31 | 2008-05-20 | Sanyo Electric Industries, Ltd. | Semiconductor sensor |
| US20060183270A1 (en) * | 2005-02-14 | 2006-08-17 | Tessera, Inc. | Tools and methods for forming conductive bumps on microelectronic elements |
| DE102005008514B4 (de) * | 2005-02-24 | 2019-05-16 | Tdk Corporation | Mikrofonmembran und Mikrofon mit der Mikrofonmembran |
| KR20060094316A (ko) * | 2005-02-24 | 2006-08-29 | 주식회사 비에스이 | 콘덴서 마이크로폰 및 그 제조방법 |
| DE102005008511B4 (de) * | 2005-02-24 | 2019-09-12 | Tdk Corporation | MEMS-Mikrofon |
| DE102005008512B4 (de) * | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
| US8143095B2 (en) | 2005-03-22 | 2012-03-27 | Tessera, Inc. | Sequential fabrication of vertical conductive interconnects in capped chips |
| KR101309778B1 (ko) * | 2005-03-23 | 2013-09-23 | 에포스 디벨롭먼트 리미티드 | 디지털 펜 조립체 |
| DE102005017357A1 (de) * | 2005-04-14 | 2006-10-26 | Siemens Audiologische Technik Gmbh | Mikrofonvorrichtung für ein Hörgerät |
| US7825484B2 (en) * | 2005-04-25 | 2010-11-02 | Analog Devices, Inc. | Micromachined microphone and multisensor and method for producing same |
| US7449356B2 (en) * | 2005-04-25 | 2008-11-11 | Analog Devices, Inc. | Process of forming a microphone using support member |
| US7885423B2 (en) | 2005-04-25 | 2011-02-08 | Analog Devices, Inc. | Support apparatus for microphone diaphragm |
| JP4256367B2 (ja) * | 2005-07-06 | 2009-04-22 | 東京エレクトロン株式会社 | 振動波検出装置 |
| KR100648398B1 (ko) | 2005-07-07 | 2006-11-24 | 주식회사 비에스이 | 실리콘 콘덴서 마이크로폰의 패키징 구조 및 그 제조방법 |
| US7202552B2 (en) * | 2005-07-15 | 2007-04-10 | Silicon Matrix Pte. Ltd. | MEMS package using flexible substrates, and method thereof |
| US8483776B2 (en) * | 2005-07-27 | 2013-07-09 | Sony Corporation | Acoustic path for a wireless communications device |
| JP2007043327A (ja) * | 2005-08-01 | 2007-02-15 | Star Micronics Co Ltd | コンデンサマイクロホン |
| US20070040231A1 (en) * | 2005-08-16 | 2007-02-22 | Harney Kieran P | Partially etched leadframe packages having different top and bottom topologies |
| US8477983B2 (en) * | 2005-08-23 | 2013-07-02 | Analog Devices, Inc. | Multi-microphone system |
| US7961897B2 (en) | 2005-08-23 | 2011-06-14 | Analog Devices, Inc. | Microphone with irregular diaphragm |
| JP4812378B2 (ja) * | 2005-09-13 | 2011-11-09 | パナソニック株式会社 | コンデンサマイクロホン |
| DE102005050398A1 (de) * | 2005-10-20 | 2007-04-26 | Epcos Ag | Gehäuse mit Hohlraum für ein mechanisch empfindliches elektronisches Bauelement und Verfahren zur Herstellung |
| JP4642634B2 (ja) * | 2005-10-31 | 2011-03-02 | パナソニック株式会社 | 音響センサの製造方法 |
| US7620376B2 (en) * | 2005-11-03 | 2009-11-17 | Nokia Corporation | Method and arrangement for performing analog signal processing and measuring between a signal source and a load |
| US20080240482A1 (en) * | 2005-11-09 | 2008-10-02 | Nxp B.V. | Arrangement For Optimizing the Frequency Response of an Electro-Acoustic Transducer |
| DE102005053767B4 (de) * | 2005-11-10 | 2014-10-30 | Epcos Ag | MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau |
| DE102005053765B4 (de) * | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS-Package und Verfahren zur Herstellung |
| DE102005054177B4 (de) * | 2005-11-14 | 2011-12-22 | Infineon Technologies Ag | Verfahren zum Herstellen einer Vielzahl von gehäusten Sensormodulen |
| JP5186102B2 (ja) * | 2005-11-25 | 2013-04-17 | パナソニック株式会社 | マイクロホンパッケージの製造方法及びマイクロホンパッケージ |
| US7646092B2 (en) | 2005-12-06 | 2010-01-12 | Yamaha Corporation | Semiconductor device and manufacturing method thereof |
| EP1795496A2 (en) | 2005-12-08 | 2007-06-13 | Yamaha Corporation | Semiconductor device for detecting pressure variations |
| US20070138644A1 (en) * | 2005-12-15 | 2007-06-21 | Tessera, Inc. | Structure and method of making capped chip having discrete article assembled into vertical interconnect |
| JP2007178133A (ja) * | 2005-12-27 | 2007-07-12 | Yamaha Corp | 圧力センサモジュール、その製造方法、及び、半導体装置 |
| KR101175728B1 (ko) * | 2006-01-20 | 2012-08-22 | 삼성전자주식회사 | 디스플레이 모듈의 전자파 차폐장치 및 그 제조방법 |
| US7936062B2 (en) | 2006-01-23 | 2011-05-03 | Tessera Technologies Ireland Limited | Wafer level chip packaging |
| DE602007005405D1 (de) | 2006-01-26 | 2010-05-06 | Sonion Mems As | Elastomerschild für Miniaturmikrofone |
| TWI293500B (en) * | 2006-03-03 | 2008-02-11 | Advanced Semiconductor Eng | Microelectromechanical microphone packaging system |
| US7436054B2 (en) * | 2006-03-03 | 2008-10-14 | Silicon Matrix, Pte. Ltd. | MEMS microphone with a stacked PCB package and method of producing the same |
| KR100722689B1 (ko) | 2006-05-03 | 2007-05-30 | 주식회사 비에스이 | 부가적인 백 챔버를 갖는 실리콘 콘덴서 마이크로폰 |
| KR100722687B1 (ko) | 2006-05-09 | 2007-05-30 | 주식회사 비에스이 | 부가적인 백 챔버를 갖는 지향성 실리콘 콘덴서 마이크로폰 |
| JP4657974B2 (ja) * | 2006-05-09 | 2011-03-23 | パナソニック株式会社 | カード型memsマイクロホン |
| KR100722686B1 (ko) * | 2006-05-09 | 2007-05-30 | 주식회사 비에스이 | 부가적인 백 챔버를 갖고 기판에 음향홀이 형성된 실리콘콘덴서 마이크로폰 |
| US7763488B2 (en) * | 2006-06-05 | 2010-07-27 | Akustica, Inc. | Method of fabricating MEMS device |
| US8344487B2 (en) * | 2006-06-29 | 2013-01-01 | Analog Devices, Inc. | Stress mitigation in packaged microchips |
| KR20080005854A (ko) | 2006-07-10 | 2008-01-15 | 야마하 가부시키가이샤 | 압력 센서 및 그의 제조 방법 |
| JP4771290B2 (ja) * | 2006-07-19 | 2011-09-14 | ヤマハ株式会社 | 圧力センサの製造方法 |
| WO2008014324A2 (en) * | 2006-07-25 | 2008-01-31 | Analog Devices, Inc. | Multiple microphone system |
| KR20080011066A (ko) * | 2006-07-27 | 2008-01-31 | 스타 마이크로닉스 컴퍼니 리미티드 | 마이크로폰의 케이싱 및 콘덴서 마이크로폰 |
| TWI301823B (en) * | 2006-08-29 | 2008-10-11 | Ind Tech Res Inst | Package structure and packaging method of mems microphone |
| US7579678B2 (en) * | 2006-09-04 | 2009-08-25 | Yamaha Corporation | Semiconductor microphone unit |
| KR100740463B1 (ko) * | 2006-09-09 | 2007-07-18 | 주식회사 비에스이 | 실리콘 콘덴서 마이크로폰 |
| DE102006046292B9 (de) * | 2006-09-29 | 2014-04-30 | Epcos Ag | Bauelement mit MEMS-Mikrofon und Verfahren zur Herstellung |
| CA2664536A1 (en) * | 2006-10-03 | 2008-04-10 | Sonic Innovations, Inc. | Hydrophobic and oleophobic coating and method for preparing the same |
| US8846161B2 (en) * | 2006-10-03 | 2014-09-30 | Brigham Young University | Hydrophobic coating and method |
| KR100776210B1 (ko) * | 2006-10-10 | 2007-11-16 | 주식회사 비에스이 | 마이크로폰 조립체의 제조장치 및 그 제조방법 |
| EP2056675B1 (en) | 2006-10-12 | 2019-01-09 | Galera Labs, LLC | Methods of treating oral mucositis |
| FR2907632A1 (fr) * | 2006-10-20 | 2008-04-25 | Merry Electronics Co Ltd | Boitier de systeme micro-electromecanique |
| US8369555B2 (en) * | 2006-10-27 | 2013-02-05 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Piezoelectric microphones |
| US20080219482A1 (en) * | 2006-10-31 | 2008-09-11 | Yamaha Corporation | Condenser microphone |
| DE102006055147B4 (de) | 2006-11-03 | 2011-01-27 | Infineon Technologies Ag | Schallwandlerstruktur und Verfahren zur Herstellung einer Schallwandlerstruktur |
| JP2008141409A (ja) * | 2006-11-30 | 2008-06-19 | Star Micronics Co Ltd | コンデンサマイクロホンの製造方法及びコンデンサマイクロホン |
| TW200847827A (en) * | 2006-11-30 | 2008-12-01 | Analog Devices Inc | Microphone system with silicon microphone secured to package lid |
| US20080144863A1 (en) * | 2006-12-15 | 2008-06-19 | Fazzio R Shane | Microcap packaging of micromachined acoustic devices |
| US8604605B2 (en) | 2007-01-05 | 2013-12-10 | Invensas Corp. | Microelectronic assembly with multi-layer support structure |
| ITMI20070099A1 (it) | 2007-01-24 | 2008-07-25 | St Microelectronics Srl | Dispositivo elettronico comprendente dispositivi sensori differenziali mems e substrati bucati |
| US7607355B2 (en) | 2007-02-16 | 2009-10-27 | Yamaha Corporation | Semiconductor device |
| NZ597258A (en) * | 2007-03-14 | 2013-08-30 | Qualcomm Inc | An acoustic positioning system |
| TWI312763B (en) * | 2007-03-19 | 2009-08-01 | Ind Tech Res Inst | A multi-layer package structure for an acoustic microsensor |
| CN101279709B (zh) * | 2007-04-04 | 2011-01-19 | 财团法人工业技术研究院 | 微型声波传感器的多层式封装结构 |
| JP2008271426A (ja) * | 2007-04-24 | 2008-11-06 | Matsushita Electric Works Ltd | 音響センサ |
| WO2008134530A2 (en) * | 2007-04-25 | 2008-11-06 | University Of Florida Research Foundation, Inc. | A capacitive microphone with integrated cavity |
| JP5004840B2 (ja) * | 2007-04-25 | 2012-08-22 | 京セラ株式会社 | マイクロホン素子搭載基板およびマイクロホン装置 |
| US8767983B2 (en) * | 2007-06-01 | 2014-07-01 | Infineon Technologies Ag | Module including a micro-electro-mechanical microphone |
| KR100904285B1 (ko) * | 2007-06-04 | 2009-06-25 | 주식회사 비에스이 | 콘덴서 마이크로폰 |
| US7694610B2 (en) * | 2007-06-27 | 2010-04-13 | Siemens Medical Solutions Usa, Inc. | Photo-multiplier tube removal tool |
| GB2451909B (en) | 2007-08-17 | 2012-07-11 | Wolfson Microelectronics Plc | Mems process and device |
| KR101152071B1 (ko) * | 2007-08-02 | 2012-06-11 | 놀레스 일렉트로닉스 아시아 피티이 리미티드 | Mems 센서를 포함하는 전자 음향 변환기 |
| JP2009044600A (ja) * | 2007-08-10 | 2009-02-26 | Panasonic Corp | マイクロホン装置およびその製造方法 |
| US20090175477A1 (en) * | 2007-08-20 | 2009-07-09 | Yamaha Corporation | Vibration transducer |
| TWI328563B (en) * | 2007-08-28 | 2010-08-11 | Ind Tech Res Inst | A stacked package structure for reducing package volume of an acoustic microsensor |
| US8542850B2 (en) * | 2007-09-12 | 2013-09-24 | Epcos Pte Ltd | Miniature microphone assembly with hydrophobic surface coating |
| US9305735B2 (en) | 2007-09-28 | 2016-04-05 | Brigham Young University | Reinforced polymer x-ray window |
| TWI336770B (en) | 2007-11-05 | 2011-02-01 | Ind Tech Res Inst | Sensor |
| TWI339188B (en) * | 2007-11-21 | 2011-03-21 | Ind Tech Res Inst | A package structure for mems type microphone and method therefor |
| WO2009099091A1 (ja) * | 2008-02-08 | 2009-08-13 | Funai Electric Co., Ltd. | マイクロホンユニット |
| US7843021B2 (en) * | 2008-02-28 | 2010-11-30 | Shandong Gettop Acoustic Co. Ltd. | Double-side mountable MEMS package |
| US8349635B1 (en) * | 2008-05-20 | 2013-01-08 | Silicon Laboratories Inc. | Encapsulated MEMS device and method to form the same |
| US8604566B2 (en) | 2008-06-17 | 2013-12-10 | Infineon Technologies Ag | Sensor module and semiconductor chip |
| JP5320863B2 (ja) | 2008-07-02 | 2013-10-23 | オムロン株式会社 | 電子部品 |
| DE102008032319B4 (de) * | 2008-07-09 | 2012-06-06 | Epcos Ag | Verfahren zur Herstellung eines MST Bauteils |
| JP2010034990A (ja) * | 2008-07-30 | 2010-02-12 | Funai Electric Co Ltd | 差動マイクロホンユニット |
| US8193596B2 (en) * | 2008-09-03 | 2012-06-05 | Solid State System Co., Ltd. | Micro-electro-mechanical systems (MEMS) package |
| US8995677B2 (en) * | 2008-09-03 | 2015-03-31 | Apple Inc. | Accessory controller for electronic devices |
| US8265329B2 (en) * | 2008-09-05 | 2012-09-11 | Apple Inc. | Compact housing for portable electronic device with internal speaker |
| JP4366666B1 (ja) * | 2008-09-12 | 2009-11-18 | オムロン株式会社 | 半導体装置 |
| JP4553043B2 (ja) * | 2008-09-12 | 2010-09-29 | 株式会社村田製作所 | 音響的トランスデューサユニット |
| US8013404B2 (en) * | 2008-10-09 | 2011-09-06 | Shandong Gettop Acoustic Co. Ltd. | Folded lead-frame packages for MEMS devices |
| DE102008053327A1 (de) * | 2008-10-27 | 2010-04-29 | Epcos Ag | Anordnung mit einem Mikrofon |
| WO2010048833A1 (zh) * | 2008-10-28 | 2010-05-06 | 歌尔声学股份有限公司 | 硅电容麦克风 |
| US7915715B2 (en) | 2008-11-25 | 2011-03-29 | Amkor Technology, Inc. | System and method to provide RF shielding for a MEMS microphone package |
| JP4859253B2 (ja) * | 2008-12-22 | 2012-01-25 | 株式会社エレメント電子 | 空洞部を有する回路基板、その製造方法およびそれを用いた回路装置の製造方法 |
| JP2010161271A (ja) * | 2009-01-09 | 2010-07-22 | Panasonic Corp | 半導体パッケージ |
| US8199939B2 (en) * | 2009-01-21 | 2012-06-12 | Nokia Corporation | Microphone package |
| JP2010171631A (ja) * | 2009-01-21 | 2010-08-05 | Yamaha Corp | シリコンマイクロホン |
| JP2010183312A (ja) * | 2009-02-05 | 2010-08-19 | Funai Electric Co Ltd | マイクロホンユニット |
| US8115283B1 (en) | 2009-07-14 | 2012-02-14 | Amkor Technology, Inc. | Reversible top/bottom MEMS package |
| US8030722B1 (en) | 2009-03-04 | 2011-10-04 | Amkor Technology, Inc. | Reversible top/bottom MEMS package |
| US8330239B2 (en) * | 2009-04-29 | 2012-12-11 | Freescale Semiconductor, Inc. | Shielding for a micro electro-mechanical device and method therefor |
| US8158492B2 (en) * | 2009-04-29 | 2012-04-17 | Freescale Semiconductor, Inc. | MEMS microphone with cavity and method therefor |
| CN201438743U (zh) * | 2009-05-15 | 2010-04-14 | 瑞声声学科技(常州)有限公司 | 麦克风 |
| US8155366B2 (en) * | 2009-05-15 | 2012-04-10 | Mwm Acoustics, Llc | Transducer package with interior support frame |
| US20100303274A1 (en) * | 2009-05-18 | 2010-12-02 | William Ryan | Microphone Having Reduced Vibration Sensitivity |
| US8571249B2 (en) * | 2009-05-29 | 2013-10-29 | General Mems Corporation | Silicon microphone package |
| US7790492B1 (en) | 2009-06-13 | 2010-09-07 | Mwm Acoustics, Llc | Method for fabricating a transducer package with the transducer die unsupported by a substrate |
| CN101651913A (zh) * | 2009-06-19 | 2010-02-17 | 瑞声声学科技(深圳)有限公司 | 麦克风 |
| US9327316B2 (en) * | 2009-06-30 | 2016-05-03 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Multi-frequency acoustic array |
| US8314354B2 (en) * | 2009-07-27 | 2012-11-20 | Apple Inc. | Accessory controller for electronic devices |
| US8739626B2 (en) * | 2009-08-04 | 2014-06-03 | Fairchild Semiconductor Corporation | Micromachined inertial sensor devices |
| US8390083B2 (en) | 2009-09-04 | 2013-03-05 | Analog Devices, Inc. | System with recessed sensing or processing elements |
| CN101765047A (zh) * | 2009-09-28 | 2010-06-30 | 瑞声声学科技(深圳)有限公司 | 电容麦克风及其制作方法 |
| US20110103632A1 (en) * | 2009-10-30 | 2011-05-05 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Integrated acoustic horn and lead frame |
| JP5406675B2 (ja) * | 2009-11-09 | 2014-02-05 | 新日本無線株式会社 | Memsコンデンサマイクロフォン |
| US8421168B2 (en) * | 2009-11-17 | 2013-04-16 | Fairchild Semiconductor Corporation | Microelectromechanical systems microphone packaging systems |
| US9344805B2 (en) * | 2009-11-24 | 2016-05-17 | Nxp B.V. | Micro-electromechanical system microphone |
| JP2011114506A (ja) * | 2009-11-26 | 2011-06-09 | Funai Electric Co Ltd | マイクロホンユニット |
| US8724339B2 (en) | 2009-12-01 | 2014-05-13 | Apple Inc. | Compact media player |
| TWI444052B (zh) * | 2009-12-17 | 2014-07-01 | Ind Tech Res Inst | 電容式傳感器及其製造方法 |
| JP5434798B2 (ja) * | 2009-12-25 | 2014-03-05 | 船井電機株式会社 | マイクロホンユニット、及び、それを備えた音声入力装置 |
| US8577063B2 (en) * | 2010-02-18 | 2013-11-05 | Analog Devices, Inc. | Packages and methods for packaging MEMS microphone devices |
| US20120314390A1 (en) * | 2010-03-03 | 2012-12-13 | Mutual-Tek Industries Co., Ltd. | Multilayer circuit board |
| US7972888B1 (en) | 2010-03-11 | 2011-07-05 | Memsensing Microsystems Technology Co., Ltd. | Methods for manufacturing MEMS sensor and thin film and cantilever beam thereof with epitaxial growth process |
| DE102010003724A1 (de) * | 2010-04-08 | 2011-10-13 | Robert Bosch Gmbh | Drucksensoranordnung |
| DE102010018499A1 (de) * | 2010-04-22 | 2011-10-27 | Schweizer Electronic Ag | Leiterplatte mit Hohlraum |
| US8551799B2 (en) | 2010-05-06 | 2013-10-08 | Stmicroelectronics S.R.L. | Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer |
| CA2704683A1 (en) * | 2010-05-28 | 2010-08-12 | Ibm Canada Limited - Ibm Canada Limitee | Grounded lid for micro-electronic assemblies |
| JP4947191B2 (ja) | 2010-06-01 | 2012-06-06 | オムロン株式会社 | マイクロフォン |
| US8354747B1 (en) | 2010-06-01 | 2013-01-15 | Amkor Technology, Inc | Conductive polymer lid for a sensor package and method therefor |
| JP5348073B2 (ja) * | 2010-06-01 | 2013-11-20 | 船井電機株式会社 | 電気音響変換素子搭載基板及びマイクロホンユニット、並びにそれらの製造方法 |
| JP5029727B2 (ja) | 2010-06-01 | 2012-09-19 | オムロン株式会社 | 半導体装置及びマイクロフォン |
| KR101362398B1 (ko) | 2012-07-10 | 2014-02-13 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 및 그 제조 방법 |
| US7998776B1 (en) | 2010-06-10 | 2011-08-16 | Memsensing Microsystems Technology Co., Ltd. | Methods for manufacturing MEMS sensor and thin film thereof with improved etching process |
| DE102010030457B4 (de) | 2010-06-24 | 2019-09-05 | Robert Bosch Gmbh | Verfahren zur Herstellung von gehäusten mikromechanischen Bauelementen und entsprechendes gehäustes mikromechanisches Bauelement |
| US9420378B1 (en) | 2010-07-12 | 2016-08-16 | Amkor Technology, Inc. | Top port MEMS microphone package and method |
| US9258634B2 (en) | 2010-07-30 | 2016-02-09 | Invensense, Inc. | Microphone system with offset apertures |
| DE102010035168A1 (de) | 2010-08-23 | 2012-02-23 | Günter Kowalski | Sensor für Kondensatormikrofone |
| DE102010040370B4 (de) * | 2010-09-08 | 2016-10-06 | Robert Bosch Gmbh | MEMS-Mikrofon-Package |
| US9278845B2 (en) | 2010-09-18 | 2016-03-08 | Fairchild Semiconductor Corporation | MEMS multi-axis gyroscope Z-axis electrode structure |
| EP2616771B8 (en) | 2010-09-18 | 2018-12-19 | Fairchild Semiconductor Corporation | Micromachined monolithic 6-axis inertial sensor |
| CN103221331B (zh) | 2010-09-18 | 2016-02-03 | 快捷半导体公司 | 用于微机电系统的密封封装 |
| DE112011103124B4 (de) | 2010-09-18 | 2025-10-30 | Fairchild Semiconductor Corporation | Biegelager zum Verringern von Quadratur für mitschwingende mikromechanische Vorrichtungen |
| WO2012037492A2 (en) | 2010-09-18 | 2012-03-22 | Janusz Bryzek | Multi-die mems package |
| US9455354B2 (en) | 2010-09-18 | 2016-09-27 | Fairchild Semiconductor Corporation | Micromachined 3-axis accelerometer with a single proof-mass |
| EP2619536B1 (en) | 2010-09-20 | 2016-11-02 | Fairchild Semiconductor Corporation | Microelectromechanical pressure sensor including reference capacitor |
| EP2619130A4 (en) | 2010-09-20 | 2014-12-10 | Fairchild Semiconductor | SILICONE CONTINUITY WITH REDUCED CROSS-CAPACITY |
| US9407997B2 (en) * | 2010-10-12 | 2016-08-02 | Invensense, Inc. | Microphone package with embedded ASIC |
| DE102011002460A1 (de) | 2011-01-05 | 2012-07-05 | Robert Bosch Gmbh | Bauteil |
| US9544678B2 (en) | 2011-01-12 | 2017-01-10 | Blackberry Limited | Printed circuit board with an acoustic channel for a microphone |
| US8618619B1 (en) | 2011-01-28 | 2013-12-31 | Amkor Technology, Inc. | Top port with interposer MEMS microphone package and method |
| DE102011004577B4 (de) * | 2011-02-23 | 2023-07-27 | Robert Bosch Gmbh | Bauelementträger, Verfahren zur Herstellung eines solchen Bauelementträgers sowie Bauteil mit einem MEMS-Bauelement auf einem solchen Bauelementträger |
| US8921955B1 (en) | 2011-02-24 | 2014-12-30 | Amkor Technology, Inc. | Semiconductor device with micro electromechanical system die |
| CN103416075B (zh) | 2011-03-07 | 2017-07-04 | 声奇股份公司 | 音频设备 |
| US9013011B1 (en) | 2011-03-11 | 2015-04-21 | Amkor Technology, Inc. | Stacked and staggered die MEMS package and method |
| US8625832B2 (en) | 2011-04-04 | 2014-01-07 | Invensense, Inc. | Packages and methods for packaging microphone devices |
| TWI484835B (zh) * | 2011-04-12 | 2015-05-11 | Pixart Imaging Inc | 微機電系統麥克風裝置及其製作方法 |
| US8781140B2 (en) * | 2011-04-15 | 2014-07-15 | Knowles Electronics, Llc | Compact, highly integrated microphone assembly |
| DE102011007604A1 (de) | 2011-04-18 | 2012-10-18 | Robert Bosch Gmbh | Mikroelektromechanische Schalldetektionsvorrichtung sowie Verfahren zur Herstellung einer solchen |
| US8476087B2 (en) | 2011-04-21 | 2013-07-02 | Freescale Semiconductor, Inc. | Methods for fabricating sensor device package using a sealing structure |
| US8384168B2 (en) * | 2011-04-21 | 2013-02-26 | Freescale Semiconductor, Inc. | Sensor device with sealing structure |
| US8536663B1 (en) | 2011-04-28 | 2013-09-17 | Amkor Technology, Inc. | Metal mesh lid MEMS package and method |
| US9174412B2 (en) | 2011-05-16 | 2015-11-03 | Brigham Young University | High strength carbon fiber composite wafers for microfabrication |
| ITTO20110577A1 (it) | 2011-06-30 | 2012-12-31 | Stmicroelectronics Malta Ltd | Incapsulamento per un sensore mems e relativo procedimento di fabbricazione |
| JP5668627B2 (ja) * | 2011-07-19 | 2015-02-12 | 株式会社村田製作所 | 回路モジュール |
| EP2566189B1 (en) * | 2011-08-30 | 2014-03-05 | Harman International Industries Ltd. | Loudspeaker arrangement |
| JP5327299B2 (ja) * | 2011-09-09 | 2013-10-30 | オムロン株式会社 | 半導体装置及びマイクロフォン |
| WO2013048965A1 (en) | 2011-09-26 | 2013-04-04 | Galera Therapeutics, Llc | Methods for treatment of diseases |
| US9029962B1 (en) | 2011-10-12 | 2015-05-12 | Amkor Technology, Inc. | Molded cavity substrate MEMS package fabrication method and structure |
| US20130177192A1 (en) * | 2011-10-25 | 2013-07-11 | Knowles Electronics, Llc | Vented Microphone Module |
| CN103999484B (zh) | 2011-11-04 | 2017-06-30 | 美商楼氏电子有限公司 | 作为声学设备中的屏障的嵌入式电介质和制造方法 |
| KR101511946B1 (ko) | 2011-11-17 | 2015-04-14 | 인벤센스, 인크. | 사운드 파이프를 갖춘 마이크로폰 모듈 |
| DE102011086722A1 (de) * | 2011-11-21 | 2013-05-23 | Robert Bosch Gmbh | Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren |
| TWI504279B (zh) | 2011-12-01 | 2015-10-11 | 財團法人工業技術研究院 | Mems音波感測器及其製造方法 |
| DE102011088256A1 (de) * | 2011-12-12 | 2013-06-13 | Zf Friedrichshafen Ag | Multilayer-Leiterplatte sowie Anordnung mit einer solchen |
| US9362209B1 (en) | 2012-01-23 | 2016-06-07 | Amkor Technology, Inc. | Shielding technique for semiconductor package including metal lid |
| US9153543B1 (en) | 2012-01-23 | 2015-10-06 | Amkor Technology, Inc. | Shielding technique for semiconductor package including metal lid and metalized contact area |
| US9062972B2 (en) | 2012-01-31 | 2015-06-23 | Fairchild Semiconductor Corporation | MEMS multi-axis accelerometer electrode structure |
| US8978475B2 (en) | 2012-02-01 | 2015-03-17 | Fairchild Semiconductor Corporation | MEMS proof mass with split z-axis portions |
| US8983097B2 (en) | 2012-02-29 | 2015-03-17 | Infineon Technologies Ag | Adjustable ventilation openings in MEMS structures |
| US9002037B2 (en) | 2012-02-29 | 2015-04-07 | Infineon Technologies Ag | MEMS structure with adjustable ventilation openings |
| TWI448163B (zh) * | 2012-03-05 | 2014-08-01 | Merry Electronics Co Ltd | 駐極體電容麥克風 |
| WO2013134511A2 (en) * | 2012-03-07 | 2013-09-12 | Deka Products Limited Partnership | Volumetric measurement device, system and method |
| US8779535B2 (en) | 2012-03-14 | 2014-07-15 | Analog Devices, Inc. | Packaged integrated device die between an external and internal housing |
| CN104220365B (zh) | 2012-03-29 | 2016-08-17 | 罗伯特·博世有限公司 | 腔封装设计 |
| US8754694B2 (en) | 2012-04-03 | 2014-06-17 | Fairchild Semiconductor Corporation | Accurate ninety-degree phase shifter |
| US8742964B2 (en) | 2012-04-04 | 2014-06-03 | Fairchild Semiconductor Corporation | Noise reduction method with chopping for a merged MEMS accelerometer sensor |
| US9488693B2 (en) | 2012-04-04 | 2016-11-08 | Fairchild Semiconductor Corporation | Self test of MEMS accelerometer with ASICS integrated capacitors |
| US9069006B2 (en) | 2012-04-05 | 2015-06-30 | Fairchild Semiconductor Corporation | Self test of MEMS gyroscope with ASICs integrated capacitors |
| EP2647952B1 (en) | 2012-04-05 | 2017-11-15 | Fairchild Semiconductor Corporation | Mems device automatic-gain control loop for mechanical amplitude drive |
| EP2648334B1 (en) | 2012-04-05 | 2020-06-10 | Fairchild Semiconductor Corporation | Mems device front-end charge amplifier |
| EP2647955B8 (en) | 2012-04-05 | 2018-12-19 | Fairchild Semiconductor Corporation | MEMS device quadrature phase shift cancellation |
| US8890308B2 (en) | 2012-04-06 | 2014-11-18 | Freescale Semiconductor, Inc. | Integrated circuit package and method of forming the same |
| US9094027B2 (en) | 2012-04-12 | 2015-07-28 | Fairchild Semiconductor Corporation | Micro-electro-mechanical-system (MEMS) driver |
| US9625272B2 (en) | 2012-04-12 | 2017-04-18 | Fairchild Semiconductor Corporation | MEMS quadrature cancellation and signal demodulation |
| US9061884B1 (en) | 2012-04-24 | 2015-06-23 | Amkor Technology, Inc. | Integrated circuit with efficient MEMS architecture |
| US9046546B2 (en) | 2012-04-27 | 2015-06-02 | Freescale Semiconductor Inc. | Sensor device and related fabrication methods |
| US20140127446A1 (en) * | 2012-06-05 | 2014-05-08 | Moxtek, Inc. | Amorphous carbon and aluminum membrane |
| US9502206B2 (en) | 2012-06-05 | 2016-11-22 | Brigham Young University | Corrosion-resistant, strong x-ray window |
| US9738515B2 (en) * | 2012-06-27 | 2017-08-22 | Invensense, Inc. | Transducer with enlarged back volume |
| US9402118B2 (en) | 2012-07-27 | 2016-07-26 | Knowles Electronics, Llc | Housing and method to control solder creep on housing |
| US9491539B2 (en) | 2012-08-01 | 2016-11-08 | Knowles Electronics, Llc | MEMS apparatus disposed on assembly lid |
| US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
| DE102013014881B4 (de) | 2012-09-12 | 2023-05-04 | Fairchild Semiconductor Corporation | Verbesserte Silizium-Durchkontaktierung mit einer Füllung aus mehreren Materialien |
| US9181086B1 (en) | 2012-10-01 | 2015-11-10 | The Research Foundation For The State University Of New York | Hinged MEMS diaphragm and method of manufacture therof |
| US8841738B2 (en) | 2012-10-01 | 2014-09-23 | Invensense, Inc. | MEMS microphone system for harsh environments |
| US9156680B2 (en) | 2012-10-26 | 2015-10-13 | Analog Devices, Inc. | Packages and methods for packaging |
| US9018715B2 (en) | 2012-11-30 | 2015-04-28 | Silicon Laboratories Inc. | Gas-diffusion barriers for MEMS encapsulation |
| US9079760B2 (en) * | 2012-12-17 | 2015-07-14 | Invensense, Inc. | Integrated microphone package |
| KR20150087410A (ko) | 2012-12-19 | 2015-07-29 | 노우레스 일렉트로닉스, 엘엘시 | 고전압 i/o 정-전기 방전 보호를 위한 장치 및 방법 |
| US9676614B2 (en) | 2013-02-01 | 2017-06-13 | Analog Devices, Inc. | MEMS device with stress relief structures |
| US8965027B2 (en) | 2013-02-15 | 2015-02-24 | Invensense, Inc. | Packaged microphone with frame having die mounting concavity |
| US8999757B2 (en) | 2013-03-04 | 2015-04-07 | Unisem (M) Berhad | Top port MEMS cavity package and method of manufacture thereof |
| US9082883B2 (en) | 2013-03-04 | 2015-07-14 | Unisem (M) Berhad | Top port MEMS cavity package and method of manufacture thereof |
| US9809448B2 (en) | 2013-03-13 | 2017-11-07 | Invensense, Inc. | Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same |
| US8692340B1 (en) | 2013-03-13 | 2014-04-08 | Invensense, Inc. | MEMS acoustic sensor with integrated back cavity |
| US9467785B2 (en) * | 2013-03-28 | 2016-10-11 | Knowles Electronics, Llc | MEMS apparatus with increased back volume |
| US9301075B2 (en) | 2013-04-24 | 2016-03-29 | Knowles Electronics, Llc | MEMS microphone with out-gassing openings and method of manufacturing the same |
| US8928137B2 (en) * | 2013-05-15 | 2015-01-06 | Kamstrup A/S | Flow meter with ultrasound transducer directly connected to and fixed to measurement circuit board |
| DE102013106353B4 (de) * | 2013-06-18 | 2018-06-28 | Tdk Corporation | Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement |
| US9024396B2 (en) | 2013-07-12 | 2015-05-05 | Infineon Technologies Ag | Device with MEMS structure and ventilation path in support structure |
| US9296607B2 (en) | 2013-07-22 | 2016-03-29 | Invensense, Inc. | Apparatus and method for reduced strain on MEMS devices |
| US20150090030A1 (en) * | 2013-09-27 | 2015-04-02 | Infineon Technologies Ag | Transducer arrangement comprising a transducer die and method of covering a transducer die |
| CN104517944A (zh) * | 2013-09-30 | 2015-04-15 | 日月光半导体制造股份有限公司 | 封装结构及其制造方法 |
| US9299671B2 (en) | 2013-10-15 | 2016-03-29 | Invensense, Inc. | Integrated CMOS back cavity acoustic transducer and the method of producing the same |
| US9847462B2 (en) | 2013-10-29 | 2017-12-19 | Point Engineering Co., Ltd. | Array substrate for mounting chip and method for manufacturing the same |
| KR101469606B1 (ko) * | 2013-11-13 | 2014-12-05 | (주)파트론 | 마이크로폰 패키지의 제조 방법 |
| DE102013223359A1 (de) * | 2013-11-15 | 2015-05-21 | Robert Bosch Gmbh | Leiterplatte für die 2nd-Level-Montage eines Mikrofonbauteils und Mikrofonmodul mit einer derartigen Leiterplatte |
| CN103607688A (zh) * | 2013-11-19 | 2014-02-26 | 歌尔声学股份有限公司 | Mems麦克风的制造方法 |
| KR20150058780A (ko) | 2013-11-21 | 2015-05-29 | 삼성전기주식회사 | 마이크로폰 패키지 및 그 실장 구조 |
| US9307328B2 (en) | 2014-01-09 | 2016-04-05 | Knowles Electronics, Llc | Interposer for MEMS-on-lid microphone |
| DE102014203881A1 (de) | 2014-03-04 | 2015-09-10 | Robert Bosch Gmbh | Bauteil mit Mikrofon- und Mediensensorfunktion |
| JP6311376B2 (ja) | 2014-03-14 | 2018-04-18 | オムロン株式会社 | マイクロフォン |
| DE102014105754B4 (de) * | 2014-04-24 | 2022-02-10 | USound GmbH | Lautsprecheranordnung mit leiterplattenintegriertem ASIC |
| CN105765716B (zh) * | 2014-05-15 | 2018-06-22 | 富士电机株式会社 | 功率半导体模块和复合模块 |
| DE102014211197B4 (de) | 2014-06-12 | 2019-09-12 | Robert Bosch Gmbh | Mikromechanische Kombi-Sensoranordnung |
| US10167189B2 (en) | 2014-09-30 | 2019-01-01 | Analog Devices, Inc. | Stress isolation platform for MEMS devices |
| US9554214B2 (en) | 2014-10-02 | 2017-01-24 | Knowles Electronics, Llc | Signal processing platform in an acoustic capture device |
| EP3018092A1 (en) | 2014-11-10 | 2016-05-11 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | MEMS package |
| US20160150327A1 (en) * | 2014-11-25 | 2016-05-26 | Knowles Electronics, Llc | Photosensitive Microphone |
| TWI539831B (zh) | 2014-12-05 | 2016-06-21 | 財團法人工業技術研究院 | 微機電麥克風封裝 |
| US10429509B2 (en) | 2014-12-24 | 2019-10-01 | Stmicroelectronics Pte Ltd. | Molded proximity sensor |
| US9800971B2 (en) | 2015-03-17 | 2017-10-24 | Knowles Electronics, Llc | Acoustic apparatus with side port |
| DE102015107557A1 (de) * | 2015-05-13 | 2016-11-17 | USound GmbH | Leiterplattenmodul mit durchgehender Aussparung sowie diesbezügliche Schallwandleranordnung sowie Herstellungsverfahren |
| US10291973B2 (en) * | 2015-05-14 | 2019-05-14 | Knowles Electronics, Llc | Sensor device with ingress protection |
| EP3101441B1 (de) * | 2015-06-03 | 2018-05-16 | Pepperl + Fuchs GmbH | Ultraschallwandler |
| US9666558B2 (en) | 2015-06-29 | 2017-05-30 | Point Engineering Co., Ltd. | Substrate for mounting a chip and chip package using the substrate |
| US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
| UA126788C2 (uk) | 2015-08-11 | 2023-02-08 | Ґалера Лебз, Елелсі | Комплексні сполуки, що містять макроциклічне кільце пентаази, які мають пероральну біодоступність |
| US10131538B2 (en) | 2015-09-14 | 2018-11-20 | Analog Devices, Inc. | Mechanically isolated MEMS device |
| US9793237B2 (en) | 2015-10-19 | 2017-10-17 | Qorvo Us, Inc. | Hollow-cavity flip-chip package with reinforced interconnects and process for making the same |
| US9799637B2 (en) * | 2016-02-12 | 2017-10-24 | Qorvo Us, Inc. | Semiconductor package with lid having lid conductive structure |
| US20170240418A1 (en) * | 2016-02-18 | 2017-08-24 | Knowles Electronics, Llc | Low-cost miniature mems vibration sensor |
| US12220420B2 (en) | 2016-05-03 | 2025-02-11 | Galera Labs, Llc | Combination therapy for cancer treatment |
| AU2017318718B2 (en) | 2016-09-01 | 2023-06-29 | Galera Labs, Llc | Combination cancer therapy with pentaaza macrocyclic ring complex and ascorbate compound |
| WO2018128980A1 (en) * | 2017-01-03 | 2018-07-12 | Michigan Technological University | Solid-state transducer, system, and method |
| US10667701B1 (en) * | 2017-02-03 | 2020-06-02 | University Of South Florida | Systems and methods for determining physiological parameters from blood flow dynamics |
| US9932221B1 (en) | 2017-03-02 | 2018-04-03 | Amkor Technology, Inc. | Semiconductor package with multiple compartments |
| US10497650B2 (en) | 2017-04-13 | 2019-12-03 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
| WO2018210803A1 (en) | 2017-05-15 | 2018-11-22 | Analog Devices Global Unlimited Company | Integrated ion sensing apparatus and methods |
| EP3456682B1 (en) * | 2017-09-15 | 2023-09-13 | TE Connectivity Solutions GmbH | Sensor system, sensor arrangement, and assembly method using solder for sealing |
| JP6939429B2 (ja) * | 2017-11-02 | 2021-09-22 | 株式会社デンソー | 超音波センサ |
| US10730743B2 (en) | 2017-11-06 | 2020-08-04 | Analog Devices Global Unlimited Company | Gas sensor packages |
| DE102018203098B3 (de) * | 2018-03-01 | 2019-06-19 | Infineon Technologies Ag | MEMS-Sensor |
| WO2019190559A1 (en) * | 2018-03-30 | 2019-10-03 | Hewlett-Packard Development Company, L.P. | Microphone units with multiple openings |
| CN108882663B (zh) * | 2018-07-16 | 2020-04-21 | Oppo广东移动通信有限公司 | 电子设备 |
| US11533573B2 (en) * | 2018-12-31 | 2022-12-20 | Knowles Electronics, Llc | Receiver housing with integrated sensors for hearing device |
| DE102019201228B4 (de) * | 2019-01-31 | 2023-10-05 | Robert Bosch Gmbh | Verfahren zum Herstellen einer Mehrzahl von Sensoreinrichtungen und Sensoreinrichtung |
| US10871407B2 (en) * | 2019-04-25 | 2020-12-22 | Measurement Specialties, Inc. | Sensor assemblies with multirange construction |
| US11245975B2 (en) * | 2019-05-30 | 2022-02-08 | Bose Corporation | Techniques for wind noise reduction |
| US11587839B2 (en) | 2019-06-27 | 2023-02-21 | Analog Devices, Inc. | Device with chemical reaction chamber |
| WO2020258171A1 (zh) * | 2019-06-27 | 2020-12-30 | 瑞声声学科技(深圳)有限公司 | 振动传感器和音频设备 |
| WO2021064871A1 (ja) * | 2019-10-01 | 2021-04-08 | 日産自動車株式会社 | 電気部品用筐体 |
| US12474290B2 (en) | 2019-11-20 | 2025-11-18 | Analog Devices International Unlimited Company | Electrochemical device |
| JP2021081348A (ja) * | 2019-11-21 | 2021-05-27 | Tdk株式会社 | センサーモジュール |
| CN213694049U (zh) * | 2019-12-10 | 2021-07-13 | 楼氏电子(苏州)有限公司 | 麦克风组件和麦克风组件基板 |
| CN113132838B (zh) | 2019-12-30 | 2025-01-28 | 美商楼氏电子有限公司 | 用于麦克风组件的亥姆霍兹共振器 |
| CN213818100U (zh) | 2019-12-30 | 2021-07-27 | 楼氏电子(苏州)有限公司 | 麦克风组件 |
| CN213547840U (zh) | 2019-12-30 | 2021-06-25 | 美商楼氏电子有限公司 | 用于麦克风组件的声音端口适配器 |
| US11417611B2 (en) | 2020-02-25 | 2022-08-16 | Analog Devices International Unlimited Company | Devices and methods for reducing stress on circuit components |
| US11981560B2 (en) | 2020-06-09 | 2024-05-14 | Analog Devices, Inc. | Stress-isolated MEMS device comprising substrate having cavity and method of manufacture |
| US11706561B1 (en) | 2021-12-23 | 2023-07-18 | Knowles Electronics, Llc | Balanced armature receiver with liquid-resistant pressure relief vent |
Family Cites Families (86)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4958335U (enExample) * | 1972-08-30 | 1974-05-23 | ||
| US4127840A (en) | 1977-02-22 | 1978-11-28 | Conrac Corporation | Solid state force transducer |
| JPS5524423A (en) * | 1978-08-10 | 1980-02-21 | Nissan Motor Co Ltd | Semiconductor pressure sensor |
| US4454440A (en) * | 1978-12-22 | 1984-06-12 | United Technologies Corporation | Surface acoustic wave (SAW) pressure sensor structure |
| JPS55112864U (enExample) | 1979-02-02 | 1980-08-08 | ||
| US4277814A (en) * | 1979-09-04 | 1981-07-07 | Ford Motor Company | Semiconductor variable capacitance pressure transducer assembly |
| JPS5640268A (en) * | 1979-09-11 | 1981-04-16 | Mitsubishi Electric Corp | Semiconductor device |
| CA1165859A (en) | 1981-10-19 | 1984-04-17 | Guy J. Chaput | Electret microphone shield |
| US4533795A (en) | 1983-07-07 | 1985-08-06 | American Telephone And Telegraph | Integrated electroacoustic transducer |
| JPS60111129A (ja) | 1983-11-21 | 1985-06-17 | Yokogawa Hokushin Electric Corp | 圧力センサ |
| JPS62173814A (ja) * | 1986-01-28 | 1987-07-30 | Alps Electric Co Ltd | 弾性表面波素子搭載ユニツト |
| JPH0726887B2 (ja) | 1986-05-31 | 1995-03-29 | 株式会社堀場製作所 | コンデンサマイクロフオン型検出器用ダイアフラム |
| NL8702589A (nl) | 1987-10-30 | 1989-05-16 | Microtel Bv | Elektro-akoestische transducent van de als elektreet aangeduide soort, en een werkwijze voor het vervaardigen van een dergelijke transducent. |
| US5293781A (en) | 1987-11-09 | 1994-03-15 | California Institute Of Technology | Tunnel effect measuring systems and particle detectors |
| US4825335A (en) | 1988-03-14 | 1989-04-25 | Endevco Corporation | Differential capacitive transducer and method of making |
| US4993072A (en) * | 1989-02-24 | 1991-02-12 | Lectret S.A. | Shielded electret transducer and method of making the same |
| US5146435A (en) | 1989-12-04 | 1992-09-08 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer |
| DE4000903C1 (enExample) | 1990-01-15 | 1990-08-09 | Robert Bosch Gmbh, 7000 Stuttgart, De | |
| US5101543A (en) | 1990-07-02 | 1992-04-07 | Gentex Corporation | Method of making a variable capacitor microphone |
| JPH0465643A (ja) | 1990-07-05 | 1992-03-02 | Mitsubishi Electric Corp | 半導体圧力センサ及びその製造方法 |
| JP2925722B2 (ja) * | 1990-11-30 | 1999-07-28 | 三井化学株式会社 | ハーメチックシール型電気回路装置 |
| US5189777A (en) | 1990-12-07 | 1993-03-02 | Wisconsin Alumni Research Foundation | Method of producing micromachined differential pressure transducers |
| JP2579188Y2 (ja) * | 1991-06-28 | 1998-08-20 | 株式会社オーディオテクニカ | コンデンサマイクロホンユニット |
| US5178015A (en) * | 1991-07-22 | 1993-01-12 | Monolithic Sensors Inc. | Silicon-on-silicon differential input sensors |
| US5257547A (en) | 1991-11-26 | 1993-11-02 | Honeywell Inc. | Amplified pressure transducer |
| US5490220A (en) | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
| FR2697675B1 (fr) | 1992-11-05 | 1995-01-06 | Suisse Electronique Microtech | Procédé de fabrication de transducteurs capacitifs intégrés. |
| US5531787A (en) | 1993-01-25 | 1996-07-02 | Lesinski; S. George | Implantable auditory system with micromachined microsensor and microactuator |
| US5475606A (en) | 1993-03-05 | 1995-12-12 | International Business Machines Corporation | Faraday cage for a printed circuit card |
| US5477008A (en) | 1993-03-19 | 1995-12-19 | Olin Corporation | Polymer plug for electronic packages |
| US5459368A (en) * | 1993-08-06 | 1995-10-17 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device mounted module |
| JP3342748B2 (ja) * | 1993-09-06 | 2002-11-11 | 富士通株式会社 | 加速度センサ |
| JPH07111254A (ja) | 1993-10-12 | 1995-04-25 | Sumitomo Electric Ind Ltd | 半導体装置の製造方法 |
| US6191928B1 (en) | 1994-05-27 | 2001-02-20 | Littelfuse, Inc. | Surface-mountable device for protection against electrostatic damage to electronic components |
| US5452268A (en) | 1994-08-12 | 1995-09-19 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer with improved low frequency response |
| US5545912A (en) * | 1994-10-27 | 1996-08-13 | Motorola, Inc. | Electronic device enclosure including a conductive cap and substrate |
| JP3171043B2 (ja) | 1995-01-11 | 2001-05-28 | 株式会社村田製作所 | 弾性表面波装置 |
| US5506919A (en) | 1995-03-27 | 1996-04-09 | Eastman Kodak Company | Conductive membrane optical modulator |
| US5659195A (en) * | 1995-06-08 | 1997-08-19 | The Regents Of The University Of California | CMOS integrated microsensor with a precision measurement circuit |
| JPH098163A (ja) * | 1995-06-22 | 1997-01-10 | Nippon Avionics Co Ltd | 半導体気密封止パッケージ |
| JPH09107192A (ja) | 1995-10-09 | 1997-04-22 | Kitagawa Ind Co Ltd | プリント基板およびケース兼用プリント基板ならびに携帯型通信機器 |
| EP0774888B1 (en) | 1995-11-16 | 2003-03-19 | Matsushita Electric Industrial Co., Ltd | Printed wiring board and assembly of the same |
| US5748758A (en) | 1996-01-25 | 1998-05-05 | Menasco, Jr.; Lawrence C. | Acoustic audio transducer with aerogel diaphragm |
| JPH09222372A (ja) * | 1996-02-19 | 1997-08-26 | Mitsubishi Electric Corp | 半導体式センサ |
| US5888845A (en) | 1996-05-02 | 1999-03-30 | National Semiconductor Corporation | Method of making high sensitivity micro-machined pressure sensors and acoustic transducers |
| JPH09318650A (ja) * | 1996-05-27 | 1997-12-12 | Matsushita Electric Works Ltd | センサ装置及びその製造方法 |
| US5939968A (en) | 1996-06-19 | 1999-08-17 | Littelfuse, Inc. | Electrical apparatus for overcurrent protection of electrical circuits |
| US5889872A (en) * | 1996-07-02 | 1999-03-30 | Motorola, Inc. | Capacitive microphone and method therefor |
| US5740261A (en) | 1996-11-21 | 1998-04-14 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
| US5870482A (en) | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
| US5923995A (en) | 1997-04-18 | 1999-07-13 | National Semiconductor Corporation | Methods and apparatuses for singulation of microelectromechanical systems |
| US5831262A (en) | 1997-06-27 | 1998-11-03 | Lucent Technologies Inc. | Article comprising an optical fiber attached to a micromechanical device |
| TW387198B (en) * | 1997-09-03 | 2000-04-11 | Hosiden Corp | Audio sensor and its manufacturing method, and semiconductor electret capacitance microphone using the same |
| JPH1188992A (ja) * | 1997-09-03 | 1999-03-30 | Hosiden Corp | 集積型容量性変換器及びその製造方法 |
| US6282072B1 (en) | 1998-02-24 | 2001-08-28 | Littelfuse, Inc. | Electrical devices having a polymer PTC array |
| JP3516011B2 (ja) * | 1998-03-13 | 2004-04-05 | オムロン株式会社 | 静電容量型圧力センサ及びパッケージング構造 |
| FI105880B (fi) * | 1998-06-18 | 2000-10-13 | Nokia Mobile Phones Ltd | Mikromekaanisen mikrofonin kiinnitys |
| US6108184A (en) | 1998-11-13 | 2000-08-22 | Littlefuse, Inc. | Surface mountable electrical device comprising a voltage variable material |
| JP3472493B2 (ja) | 1998-11-30 | 2003-12-02 | ホシデン株式会社 | 半導体エレクトレットコンデンサーマイクロホン |
| US6078245A (en) | 1998-12-17 | 2000-06-20 | Littelfuse, Inc. | Containment of tin diffusion bar |
| JP3377957B2 (ja) * | 1998-12-25 | 2003-02-17 | 京セラ株式会社 | エレクトレットコンデンサマイクロホン |
| US7003127B1 (en) | 1999-01-07 | 2006-02-21 | Sarnoff Corporation | Hearing aid with large diaphragm microphone element including a printed circuit board |
| JP3378207B2 (ja) * | 1999-02-05 | 2003-02-17 | 京セラ株式会社 | 半導体エレクトレットコンデンサマイクロホン及びこれに用いられるケース |
| JP3987228B2 (ja) * | 1999-03-10 | 2007-10-03 | 松下電器産業株式会社 | エレクトレットコンデンサマイクロホン |
| JP2000277970A (ja) | 1999-03-24 | 2000-10-06 | Matsushita Electric Ind Co Ltd | 磁気遮蔽装置およびこれを備えた携帯情報機器 |
| JP3571575B2 (ja) | 1999-04-30 | 2004-09-29 | シャープ株式会社 | 携帯電話機 |
| US6136419A (en) | 1999-05-26 | 2000-10-24 | International Business Machines Corporation | Ceramic substrate having a sealed layer |
| JP2001054196A (ja) * | 1999-08-11 | 2001-02-23 | Kyocera Corp | エレクトレットコンデンサマイクロホン |
| CA2315417A1 (en) * | 1999-08-11 | 2001-02-11 | Hiroshi Une | Electret capacitor microphone |
| DK1219136T3 (da) | 1999-09-06 | 2003-08-25 | Sonionmems As | Tryktransducer |
| US6522762B1 (en) * | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
| US6656768B2 (en) | 2001-02-08 | 2003-12-02 | Texas Instruments Incorporated | Flip-chip assembly of protected micromechanical devices |
| US6535460B2 (en) | 2000-08-11 | 2003-03-18 | Knowles Electronics, Llc | Miniature broadband acoustic transducer |
| DK1310136T3 (da) | 2000-08-11 | 2006-07-31 | Knowles Electronics Llc | Bredbåndsminiaturetransducer |
| US6439869B1 (en) | 2000-08-16 | 2002-08-27 | Micron Technology, Inc. | Apparatus for molding semiconductor components |
| US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
| US7439616B2 (en) | 2000-11-28 | 2008-10-21 | Knowles Electronics, Llc | Miniature silicon condenser microphone |
| US7166910B2 (en) | 2000-11-28 | 2007-01-23 | Knowles Electronics Llc | Miniature silicon condenser microphone |
| US7146016B2 (en) | 2001-11-27 | 2006-12-05 | Center For National Research Initiatives | Miniature condenser microphone and fabrication method therefor |
| US6621392B1 (en) | 2002-04-25 | 2003-09-16 | International Business Machines Corporation | Micro electromechanical switch having self-aligned spacers |
| US6850133B2 (en) | 2002-08-14 | 2005-02-01 | Intel Corporation | Electrode configuration in a MEMS switch |
| US6781231B2 (en) * | 2002-09-10 | 2004-08-24 | Knowles Electronics Llc | Microelectromechanical system package with environmental and interference shield |
| US7501703B2 (en) | 2003-02-28 | 2009-03-10 | Knowles Electronics, Llc | Acoustic transducer module |
| US7233679B2 (en) * | 2003-09-30 | 2007-06-19 | Motorola, Inc. | Microphone system for a communication device |
| US7929714B2 (en) | 2004-08-11 | 2011-04-19 | Qualcomm Incorporated | Integrated audio codec with silicon audio transducer |
| DE102004058879B4 (de) | 2004-12-06 | 2013-11-07 | Austriamicrosystems Ag | MEMS-Mikrophon und Verfahren zur Herstellung |
-
2001
- 2001-06-21 US US09/886,854 patent/US7166910B2/en not_active Expired - Lifetime
- 2001-10-22 EP EP01990255A patent/EP1346601B1/en not_active Revoked
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- 2001-10-22 JP JP2002546465A patent/JP4532827B2/ja not_active Expired - Fee Related
- 2001-10-22 AU AU2002229116A patent/AU2002229116A1/en not_active Abandoned
- 2001-10-22 EP EP10173370.7A patent/EP2249583A3/en not_active Ceased
- 2001-10-22 AT AT01990255T patent/ATE510415T1/de not_active IP Right Cessation
-
2005
- 2005-04-22 US US11/112,043 patent/US7242089B2/en not_active Expired - Lifetime
-
2006
- 2006-10-03 US US11/538,056 patent/US7537964B2/en not_active Expired - Lifetime
-
2007
- 2007-09-27 JP JP2007250745A patent/JP2008099271A/ja active Pending
-
2009
- 2009-08-07 JP JP2009184808A patent/JP5216717B2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190070618A (ko) * | 2017-12-13 | 2019-06-21 | 현대자동차주식회사 | 멤스 마이크로폰 |
| KR102409521B1 (ko) * | 2017-12-13 | 2022-06-15 | 현대자동차주식회사 | 멤스 마이크로폰 |
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|---|---|
| EP2249583A3 (en) | 2014-12-10 |
| JP2009296630A (ja) | 2009-12-17 |
| JP2004537182A (ja) | 2004-12-09 |
| EP2249583A2 (en) | 2010-11-10 |
| ATE510415T1 (de) | 2011-06-15 |
| US20070082421A1 (en) | 2007-04-12 |
| US20050185812A1 (en) | 2005-08-25 |
| WO2002045463A2 (en) | 2002-06-06 |
| US7242089B2 (en) | 2007-07-10 |
| WO2002045463A3 (en) | 2003-05-15 |
| EP1346601A2 (en) | 2003-09-24 |
| EP1346601B1 (en) | 2011-05-18 |
| US7166910B2 (en) | 2007-01-23 |
| AU2002229116A1 (en) | 2002-06-11 |
| US20020102004A1 (en) | 2002-08-01 |
| US7537964B2 (en) | 2009-05-26 |
| JP5216717B2 (ja) | 2013-06-19 |
| JP2008099271A (ja) | 2008-04-24 |
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