CN201438743U - 麦克风 - Google Patents

麦克风 Download PDF

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Publication number
CN201438743U
CN201438743U CN2009201314710U CN200920131471U CN201438743U CN 201438743 U CN201438743 U CN 201438743U CN 2009201314710 U CN2009201314710 U CN 2009201314710U CN 200920131471 U CN200920131471 U CN 200920131471U CN 201438743 U CN201438743 U CN 201438743U
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Prior art keywords
microphone
wiring board
tone
mems chip
entering hole
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Expired - Lifetime
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CN2009201314710U
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吴志江
苏永泽
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AAC Technologies Holdings Shenzhen Co Ltd
AAC Technologies Holdings Changzhou Co Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
AAC Acoustic Technologies Changzhou Co Ltd
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Priority to CN2009201314710U priority Critical patent/CN201438743U/zh
Priority to US12/626,835 priority patent/US8379881B2/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)

Abstract

本实用新型提供了一种麦克风，包括设置有第一入声孔的外壳、收容在外壳内的MMES芯片和控制电路，该麦克风还包括用于放置MEMS芯片的第一线路板、用于放置控制电路的第二线路板以及电连接MEMS芯片和控制电路的电连接装置，所述第一线路板包括靠近外壳的第一表面和与第一表面相对的第二表面，第一线路板上设置有贯穿第一表面和第二表面的第二入声孔，该第二入声孔与第一入声孔相对，MEMS芯片设置在第一线路板的第二表面且覆盖第二入声孔。该麦克风提高了麦克风的信噪比。

Description

麦克风
技术领域
本实用新型涉及一种麦克风，尤其涉及一种微机电麦克风。
背景技术
随着无线通讯的发展，全球移动电话用户越来越多，用户对移动电话的要求已不仅满足于通话，而且要能够提供高质量的通话效果，尤其是目前移动多媒体技术的发展，移动电话的通话质量更显重要，移动电话的麦克风作为移动电话的语音拾取装置，其设计好坏直接影响通话质量。
而目前应用较多且性能较好的麦克风是微电机系统麦克风(Micro-Electro-Mechanical-System Microphone，简称MEMS)，其封装体积比传统的驻极体麦克风小。如图1所示，相关技术中，麦克风1’包括MEMS芯片11’和控制电路芯片12’，MEMS芯片11’和控制电路芯片12’设置在同一个线路板13’上。此种结构的麦克风由于声压从正面作用到MEMS芯片11’上，背面的声腔14’不够大，使得信噪比低。
发明内容
本实用新型需解决的技术问题提供信噪比高的麦克风。
根据上述需解决的技术问题，设计了一种麦克风，包括设置有第一入声孔的外壳、收容在外壳内的MEMS芯片和控制电路，该麦克风还包括用于放置MEMS芯片的第一线路板、用于放置控制电路的第二线路板以及电连接MEMS芯片和控制电路的电连接装置，所述第一线路板包括靠近外壳的第一表面和与第一表面相对的第二表面，第一线路板上设置有贯穿第一表面和第二表面的第二入声孔，MEMS芯片设置在第一线路板的第二表面且覆盖第二入声孔。
优选的，所述电连接装置是设置在第一线路板与第二线路板之间的腔体和设置在该腔体上的金属连接杆。
优选的，所述连接杆为2个。
优选的，所述MEMS芯片的背部声腔与第二入声孔贯通。
优选的，第二入声孔与第一入声孔相对。
本实用新型的有益效果在于：声音从MEMS的膜片背面作用到MEMS芯片上，提高了麦克风的信噪比，同时节省了内部空间。
附图说明
图1是相关技术的剖面图；
图2是本发明提供的一个实施例的剖视图；
图3是本发明提供的一个实施例的立体分解图。
具体实施方式
下面结合附图和实施方式对本实用新型作进一步说明。
参见图3，本实用新型提供的麦克风1，包括设置有第一入声孔19的外壳18、收容在外壳18内的MMES芯片15、控制电路16、第一电路板11、第二电路板12以及腔体13和设置在腔体13上的连接杆14。其中，腔体13起固定连接杆14的作用。连接杆14为2个。
MEMS芯片15放置在第一线路板11、控制电路16放置在第二线路板12，MMES芯片15和控制电路16之间的信号传递用导电的金属连接杆14实现。
第一线路板11包括靠近外壳18的第一表面111和与第一表面111相对的第二表面112，第一线路板11上设置有贯穿第一表面111和第二表面112的第二入声孔17，该第二入声孔17与第一入声孔19相对，MEMS芯片15设置在第一线路板11的第二表面112且覆盖第二入声孔17，即MEMS芯片15设置在第二入声孔17上。
参见图2，MEMS芯片15的背部声腔151与第二入声孔17相连，即MEMS芯片15的背部声腔151与贯通。
MEMS芯片15和控制电路16也可以通过绑线的方式实现电连接。
以上所述的仅是本实用新型的一种实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (5)

1.一种麦克风，包括设置有第一入声孔的外壳、收容在外壳内的MMES芯片和控制电路，其特征在于：该麦克风还包括用于放置MEMS芯片的第一线路板、用于放置控制电路的第二线路板以及电连接MEMS芯片和控制电路的电连接装置，所述第一线路板包括靠近外壳的第一表面和与第一表面相对的第二表面，第一线路板上设置有贯穿第一表面和第二表面的第二入声孔，MEMS芯片设置在第一线路板的第二表面且覆盖第二入声孔。
2.根据权利要求1所述的麦克风，其特征在于：所述电连接装置是设置在第一线路板与第二线路板之间的腔体和设置在该腔体上的金属连接杆。
3.根据权利要求2所述的麦克风，其特征在于：所述连接杆为2个。
4.根据权利要求1所述的麦克风，其特征在于：所述MEMS芯片的背部声腔与第二入声孔贯通。
5.根据权利要求1所述的麦克风，其特征在于：第二入声孔与第一入声孔相对。
CN2009201314710U 2009-05-15 2009-05-15 麦克风 Expired - Lifetime CN201438743U (zh)

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US12/626,835 US8379881B2 (en) 2009-05-15 2009-11-27 Silicon based capacitive microphone

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KR100982239B1 (ko) * 2007-11-02 2010-09-14 주식회사 비에스이 피시비에 음공이 형성된 멤스 마이크로폰 패키지

Cited By (4)

* Cited by examiner, † Cited by third party
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CN101984674A (zh) * 2010-10-19 2011-03-09 歌尔声学股份有限公司 耳机降噪麦克风杆装置
CN101984674B (zh) * 2010-10-19 2012-12-05 歌尔声学股份有限公司 耳机降噪麦克风杆装置
CN109587594A (zh) * 2019-01-16 2019-04-05 歌尔科技有限公司 一种耳机及耳机麦克风杆装置
CN109587594B (zh) * 2019-01-16 2024-02-27 歌尔科技有限公司 一种耳机及耳机麦克风杆装置

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