CN202587367U - 微电机系统麦克风 - Google Patents

微电机系统麦克风 Download PDF

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CN202587367U
CN202587367U CN2012200560743U CN201220056074U CN202587367U CN 202587367 U CN202587367 U CN 202587367U CN 2012200560743 U CN2012200560743 U CN 2012200560743U CN 201220056074 U CN201220056074 U CN 201220056074U CN 202587367 U CN202587367 U CN 202587367U
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microelectromechanical
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刘国俊
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AAC Technologies Pte Ltd
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H04R1/083—Special constructions of mouthpieces
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0027—Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本实用新型公开了一种微电机系统麦克风，包括线路板和与线路板盖接形成收容腔的外壳，在所述收容腔内，所述微电机系统麦克风设有置于线路板上的形成第一背腔的壳体，该壳体上设有具有第二背腔的微机电芯片以及控制电路芯片，所述壳体设有连通第一背腔和第二背腔的通孔。在微机电芯片和控制电路芯片下增加了一个设有第一背腔的壳体，第一背腔与微机电芯片的第二背腔连通从而增大了微电机系统麦克风的背腔，改善了灵敏度、降低了噪声、提高了信噪比、改善了频响。

Description

微电机系统麦克风
【技术领域】
本实用新型涉及一种麦克风，尤其涉及一种微电机系统麦克风。
【背景技术】
随着无线通讯的发展，全球移动电话用户越来越多，用户对移动电话的要求已不仅满足于通话，而且要能够提供高质量的通话效果，尤其是目前移动多媒体技术的发展，移动电话的通话质量更显重要，移动电话的麦克风作为移动电话的语音拾取装置，其设计好坏直接影响通话质量。
而目前应用较多且性能较好的麦克风是微电机系统麦克风(Micro-Electro-Mechanical-System Microphone，简称MEMS)。相关技术的微电机系统麦克风包括线路板和与线路板盖接形成收容腔的外壳，在所述收容腔内，设有置于线路板上的设有背腔的微机电芯片和控制电路芯片。背腔的大小影响着微电机系统麦克风产品的电声性能，由于相关技术的微电机系统麦克风的背腔很小，使得产品的电声性能不好。
因此，实有必要提供一种新的技术方案以克服上述缺陷。
【实用新型内容】
本实用新型的目的是提供一种电声性能更佳的微电机系统麦克风。
本实用新型的目的是这样实现的：
一种微电机系统麦克风，包括线路板和与线路板盖接形成收容腔的外壳，在所述收容腔内，所述微电机系统麦克风设有置于线路板上的形成第一背腔的壳体，该壳体上设有具有第二背腔的微机电芯片以及控制电路芯片，所述壳体设有连通第一背腔和第二背腔的通孔。
优选的，所述壳体还设有至少一个使得第一背腔与收容腔连通的泄气孔。
优选的，所述壳体为硅质方形壳体。
优选的，所述泄气孔为圆形。
优选的，所述微电机系统麦克风的声孔开设在外壳上。
优选的，微机电芯片与控制电路芯片通过绑定金线电连接。
本实用新型具有以下优点：在微机电芯片和控制电路芯片下增加了一个设有第一背腔的壳体，第一背腔与微机电芯片的第二背腔连通从而增大了微电机系统麦克风的背腔，改善了灵敏度、降低了噪声、提高了信噪比、改善了频响。同时，壳体上的使得第一背腔与收容腔连通的泄气孔在麦克风受热后可以将背腔内的气体排出，避免了背腔内的气体膨胀损坏产品，另外，同样可以改善产品的频率响应曲线以及灵敏度和信噪比。
【附图说明】
图1为本实用新型的微电机系统麦克风的剖视图。
【具体实施方式】
下面结合附图，对本实用新型作详细说明。
如图1所示，为本实用新型的微电机系统麦克风100，包括线路板1和与线路板1盖接形成收容腔3的外壳2，在所述收容腔3内，所述微电机系统麦克风100设有置于线路板1上的形成第一背腔9的壳体8，该壳体8上设有具有第二背腔7的微机电芯片6以及控制电路芯片5，所述壳体8设有连通第一背腔9和第二背腔7的通孔10。所述壳体8还设有至少一个使得第一背腔9与收容腔3连通的泄气孔11。
在本实施例中，声孔4开设在外壳2上，当然声孔4也可以开设在线路板1上。在本实施例中，控制电路芯片5和微机电芯片6是通过绑定金线12实现电连接的，当然也可以采取其他的方式实现电连接。在本实施例中，控制电路芯片5和微机电芯片6是分体结构，当然也可以将二者集成于一体。在本实施例中，所述泄气孔11为圆形，当然泄气孔11也可以为其他形状。在本实施例中，壳体8为硅质方形壳体，当然其形状和材质不限于此。泄气孔11的个数以及大小根据具体的频率响应曲线需求来定义。
本实用新型提出的解决方案是在微机电芯片6和控制电路芯片5下增加了一个设有第一背腔9的壳体8，第一背腔9与微机电芯片6的第二背腔7连通从而增大了微电机系统麦克风100的背腔，改善了灵敏度、降低了噪声、提高了信噪比、改善了频响。同时，壳体8上的使得第一背腔9与收容腔3连通的泄气孔11在麦克风受热后可以将背腔内的气体排出，避免了背腔内的气体膨胀损坏产品，另外，同样可以改善产品的频率响应曲线以及灵敏度和信噪比。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (6)

1.一种微电机系统麦克风，包括线路板和与线路板盖接形成收容腔的外壳，其特征在于：在所述收容腔内，所述微电机系统麦克风设有置于线路板上的形成第一背腔的壳体，该壳体上设有具有第二背腔的微机电芯片以及控制电路芯片，所述壳体设有连通第一背腔和第二背腔的通孔。
2.根据权利要求1所述的微电机系统麦克风，其特征在于：所述壳体还设有至少一个使得第一背腔与收容腔连通的泄气孔。
3.根据权利要求1所述的微电机系统麦克风，其特征在于：所述壳体为硅质方形壳体。
4.根据权利要求2所述的微电机系统麦克风，其特征在于：所述泄气孔为圆形。
5.根据权利要求1所述的微电机系统麦克风，其特征在于：所述微电机系统麦克风的声孔开设在外壳上。
6.根据权利要求1所述的微电机系统麦克风，其特征在于：微机电芯片与控制电路芯片通过绑定金线电连接。
CN2012200560743U 2012-02-21 2012-02-21 微电机系统麦克风 Expired - Lifetime CN202587367U (zh)

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US13/771,138 US8983107B2 (en) 2012-02-21 2013-02-20 Silicon based capacitive microphone

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Cited By (2)

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CN103313176A (zh) * 2013-07-01 2013-09-18 山东共达电声股份有限公司 一种传声器
CN104229720A (zh) * 2013-06-05 2014-12-24 英特尔移动通信有限责任公司 芯片布置及用于制造芯片布置的方法

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CN104822118B (zh) * 2015-05-06 2018-11-30 歌尔股份有限公司 一种mems麦克风的封装结构
CN105721998A (zh) * 2016-04-27 2016-06-29 歌尔声学股份有限公司 一种集成传感器的分腔封装结构
CN106981739A (zh) * 2017-05-12 2017-07-25 江苏华风电子有限公司 麦克风内置pcb板间的电连接结构
CN107948781A (zh) * 2017-11-27 2018-04-20 钰太芯微电子科技（上海）有限公司 一种新型麦克风结构及翻盖式电子设备
CN111314830B (zh) * 2019-12-07 2021-02-19 朝阳聚声泰（信丰）科技有限公司 一种信噪比高的mems麦克风及其生产方法

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US7434305B2 (en) * 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7843021B2 (en) * 2008-02-28 2010-11-30 Shandong Gettop Acoustic Co. Ltd. Double-side mountable MEMS package
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CN104229720A (zh) * 2013-06-05 2014-12-24 英特尔移动通信有限责任公司 芯片布置及用于制造芯片布置的方法
US9856136B2 (en) 2013-06-05 2018-01-02 Intel Deutschland Gmbh Chip arrangement and method for manufacturing a chip arrangement
CN103313176A (zh) * 2013-07-01 2013-09-18 山东共达电声股份有限公司 一种传声器

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