CN201274566Y - Mems麦克风 - Google Patents

Mems麦克风 Download PDF

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Publication number
CN201274566Y
CN201274566Y CN200820212178.2U CN200820212178U CN201274566Y CN 201274566 Y CN201274566 Y CN 201274566Y CN 200820212178 U CN200820212178 U CN 200820212178U CN 201274566 Y CN201274566 Y CN 201274566Y
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circuit board
mems microphone
transducer
cavity
sound
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吴志江
刘明
王凯
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AAC Technologies Pte Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
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Priority to US12/567,713 priority patent/US20100080405A1/en
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807Enclosures comprising vibrating or resonating arrangements
    • H04R1/2838Enclosures comprising vibrating or resonating arrangements of the bandpass type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/146Mixed devices
    • H01L2924/1461MEMS
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04Structural association of microphone with electric circuitry therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10General applications
    • H04R2499/11Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

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  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

一种MEMS麦克风,其包括:电路板、覆盖于电路板的具有收容腔的上盖和分别置于电路板上的换能器和控制电路,换能器设有第一声腔,其中,所述MEMS麦克风还设有声音隔离板,该声音隔离板将收容腔分成两个部分,即进声腔和后腔,所述换能器和控制电路收容于后腔内,上盖设有位于进声腔的入声孔,电路板设有连接进声腔的第一进声孔、连接换能器的第一声腔的第二进声孔和与第一、第二进声孔相通的进声通道。此结构的MEMS麦克风灵敏度较高和频响特性理想。另外,对换能器具有防尘保护的作用。

Description

MEMS麦克风
【技术领域】
本实用新型涉及一种麦克风,尤其涉及一种MEMS麦克风。
【背景技术】
随着无线通讯的发展,全球移动电话用户越来越多,用户对移动电话的要求已不仅满足于通话,而且要能够提供高质量的通话效果,尤其是目前移动多媒体技术的发展,移动电话的通话质量更显重要,移动电话的麦克风作为移动电话的语音拾取装置,其设计好坏直接影响通话质量。
而目前应用较多且性能较好的麦克风是MEMS(Micro-Electro-Mechanical-System Microphone)麦克风。如图1所示,相关技术的MEMS麦克风100’包括:电路板14’、覆盖于电路板14’的上盖20’、由电路板14’和上盖20’共同形成的腔体15’和收容于腔体15’内并分别置于电路板14’上的换能器12’和控制电路16’,其中,电路板14’设有第一声腔18’,上盖20’设有入声孔21’。
相关技术的MEMS麦克风100’,声音从入声孔21’直接进入腔体15’,该第一声腔18’的体积有限,导致MEMS麦克风100’的灵敏度不高、频响特性也不理想,另外,相关技术的MEMS麦克风100’,针对换能器12’也没有防尘保护的作用。
因此,有必要提供一种新的MEMS麦克风以克服上述缺陷。
【实用新型内容】
本实用新型要解决的技术问题在于提供一种灵敏度高、频响特性好的MEMS麦克风。
本实用新型通过这样的技术方案解决上述的技术问题:
一种MEMS麦克风,其包括:电路板、覆盖于电路板的具有收容腔的上盖和分别置于电路板上的换能器和控制电路,换能器设有第一声腔,其中,所述MEMS麦克风还设有声音隔离板,该声音隔离板将收容腔分成两个部分,即进声腔和后腔,所述换能器和控制电路收容于后腔内,上盖设有位于进声腔的入声孔,电路板设有连接进声腔的第一进声孔、连接换能器的第一声腔的第二进声孔和与第一、第二进声孔相通的进声通道。
与现有技术相比较,本实用新型具有以下优点:外部声源通过入声孔进入进声腔后,再通过第一进声孔、进声通道和第二进声孔传入换能器;同时,上盖设有声音隔离板,该声音隔离板将上盖隔离出一个较大的后腔,此结构的MEMS麦克风灵敏度较高和频响特性较理想。另外,本实用新型的MEMS麦克风对换能器具有防尘保护的作用。
【附图说明】
图1为相关技术MEMS麦克风的剖视示意图。
图2为本实用新型MEMS麦克风的剖视示意图。
【具体实施方式】
下面结合附图详细说明本实用新型的具体结构。
本实用新型MEMS麦克风100,主要用于手机上,接收声信号并将声信号转化为电信号。
请参图2所示,本实用新型MEMS麦克风100,主要包括电路板1、覆盖于电路板1的上盖(未标号)和分别置于电路板1上的换能器3和控制电路4。
上盖设有底壁21、自底壁21延伸的侧壁22、由底壁21和侧壁22共同形成的收容腔(未标号)和自底壁21延伸至电路板1的声音隔离板23。所述声音隔离板23将收容腔分成两个部分,即进声腔24和后腔25,应实际需要0,该声音隔离板23可随意调整后腔25的尺寸。上盖的底壁21还设有供外部声源进入进声腔24的入声孔26。
电路板1设有第一线路层11、第二线路层13和夹在第一线路层11和第二线路层13间的中间线路层12,其中,第一线路层11设有与进声腔24相通的第一进声孔14和与后腔25相通的第二进声孔15;中间线路层12设有进声通道16。所述进声通道16与第一进声孔14和第二进声孔15相通。
换能器3置于电路板1的第一线路层11上并同时收容于后腔25内,其设有第一声腔31,该第一声腔31可通过第二进声孔15与进声通道16贯通。
控制电路4置于电路板1的第一线路层11上并同时收容于后腔25内。
外部声源通过入声孔26进入进声腔24后,再通过第一进声孔14、进声通道16和第二进声孔15传入换能器3;同时,上盖设有声音隔离板23,该声音隔离板23将上盖的收容腔隔离出一个较大的后腔25,此结构的MEMS麦克风100灵敏度较高和频响特性较理想。另外,本实用新型的MEMS麦克风100对换能器3具有防尘保护的作用。
以上所述仅为本实用新型的较佳实施方式,本实用新型的保护范围并不以上述实施方式为限,但凡本领域普通技术人员根据本实用新型所揭示内容所作的等效修饰或变化,皆应纳入权利要求书中记载的保护范围内。

Claims (3)

1.一种MEMS麦克风,其包括:电路板、覆盖于电路板的具有收容腔的上盖和分别置于电路板上的换能器和控制电路,换能器设有第一声腔,其特征在于:所述MEMS麦克风还设有声音隔离板,该声音隔离板将收容腔分成两个部分,即进声腔和后腔,所述换能器和控制电路收容于后腔内,上盖设有位于进声腔的入声孔,电路板设有连接进声腔的第一进声孔、连接换能器的第一声腔的第二进声孔和与第一、第二进声孔相通的进声通道。
2.如权利要求1所述的MEMS麦克风,其特征在于:所述电路板包括第一线路层、第二线路层和夹在第一线路层和第二线路层间的中间线路层,所述第一、第二进声孔设于第一线路层,进声通道设于中间线路层。
3.如权利要求1或2所述的MEMS麦克风,其特征在于:所述上盖设有底壁和自底壁延伸的侧壁,所述声音隔离板自底壁延伸至电路板。
CN200820212178.2U 2008-09-26 2008-09-26 Mems麦克风 Expired - Lifetime CN201274566Y (zh)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102714200A (zh) * 2009-12-31 2012-10-03 德克萨斯仪器股份有限公司 用于微机电系统设备的具有声学气道的基于引脚框的预塑模封装
CN104796833A (zh) * 2015-04-16 2015-07-22 歌尔声学股份有限公司 一种含有麦克风的产品模组
CN105101025A (zh) * 2014-05-07 2015-11-25 鑫创科技股份有限公司 微机电系统麦克风
CN105657627A (zh) * 2014-11-11 2016-06-08 晶镁电子股份有限公司 具有防尘功能的电子装置以及用于制造该电子装置的方法
CN108605410A (zh) * 2016-02-10 2018-09-28 伯斯有限公司 具有嵌入式声学通道的电路板
CN109506764A (zh) * 2018-12-12 2019-03-22 电子科技大学 一种光纤mems麦克风阵列声波探测板及系统
CN111277938A (zh) * 2020-03-09 2020-06-12 无锡韦尔半导体有限公司 一种麦克风的封装结构

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US8779535B2 (en) * 2012-03-14 2014-07-15 Analog Devices, Inc. Packaged integrated device die between an external and internal housing
US8724840B2 (en) 2012-03-22 2014-05-13 Robert Bosch Gmbh Offset acoustic channel for microphone systems
CN102724338A (zh) * 2012-05-29 2012-10-10 上海安费诺永亿通讯电子有限公司 一种移动终端声学腔结构
US9173024B2 (en) 2013-01-31 2015-10-27 Invensense, Inc. Noise mitigating microphone system
KR101369464B1 (ko) * 2013-06-27 2014-03-06 주식회사 비에스이 멤스 마이크로폰
DE102014105849B3 (de) * 2014-04-25 2015-09-17 Epcos Ag Mikrofon mit vergrößertem Rückvolumen und Verfahren zur Herstellung
CN105142085B (zh) * 2015-09-21 2019-04-23 山东共达电声股份有限公司 一种指向性mems传声器及收音装置
CN105721998A (zh) * 2016-04-27 2016-06-29 歌尔声学股份有限公司 一种集成传感器的分腔封装结构
CN208971806U (zh) * 2018-08-02 2019-06-11 瑞声声学科技(深圳)有限公司 Mems麦克风的终端装配结构

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102714200A (zh) * 2009-12-31 2012-10-03 德克萨斯仪器股份有限公司 用于微机电系统设备的具有声学气道的基于引脚框的预塑模封装
CN102714200B (zh) * 2009-12-31 2015-09-30 德克萨斯仪器股份有限公司 用于微机电系统设备的具有声学气道的基于引脚框的预塑模封装
CN105101025A (zh) * 2014-05-07 2015-11-25 鑫创科技股份有限公司 微机电系统麦克风
CN105101025B (zh) * 2014-05-07 2019-05-03 鑫创科技股份有限公司 微机电系统麦克风
CN105657627A (zh) * 2014-11-11 2016-06-08 晶镁电子股份有限公司 具有防尘功能的电子装置以及用于制造该电子装置的方法
CN104796833A (zh) * 2015-04-16 2015-07-22 歌尔声学股份有限公司 一种含有麦克风的产品模组
CN108605410A (zh) * 2016-02-10 2018-09-28 伯斯有限公司 具有嵌入式声学通道的电路板
CN108605410B (zh) * 2016-02-10 2021-09-10 伯斯有限公司 具有嵌入式声学通道的电路板
CN109506764A (zh) * 2018-12-12 2019-03-22 电子科技大学 一种光纤mems麦克风阵列声波探测板及系统
CN111277938A (zh) * 2020-03-09 2020-06-12 无锡韦尔半导体有限公司 一种麦克风的封装结构

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