CN201274566Y - Mems麦克风 - Google Patents
Mems麦克风 Download PDFInfo
- Publication number
- CN201274566Y CN201274566Y CN200820212178.2U CN200820212178U CN201274566Y CN 201274566 Y CN201274566 Y CN 201274566Y CN 200820212178 U CN200820212178 U CN 200820212178U CN 201274566 Y CN201274566 Y CN 201274566Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- mems microphone
- transducer
- cavity
- sound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000000694 effects Effects 0.000 abstract description 5
- 230000035945 sensitivity Effects 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
- H04R1/2838—Enclosures comprising vibrating or resonating arrangements of the bandpass type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Landscapes
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
一种MEMS麦克风,其包括:电路板、覆盖于电路板的具有收容腔的上盖和分别置于电路板上的换能器和控制电路,换能器设有第一声腔,其中,所述MEMS麦克风还设有声音隔离板,该声音隔离板将收容腔分成两个部分,即进声腔和后腔,所述换能器和控制电路收容于后腔内,上盖设有位于进声腔的入声孔,电路板设有连接进声腔的第一进声孔、连接换能器的第一声腔的第二进声孔和与第一、第二进声孔相通的进声通道。此结构的MEMS麦克风灵敏度较高和频响特性理想。另外,对换能器具有防尘保护的作用。
Description
【技术领域】
本实用新型涉及一种麦克风,尤其涉及一种MEMS麦克风。
【背景技术】
随着无线通讯的发展,全球移动电话用户越来越多,用户对移动电话的要求已不仅满足于通话,而且要能够提供高质量的通话效果,尤其是目前移动多媒体技术的发展,移动电话的通话质量更显重要,移动电话的麦克风作为移动电话的语音拾取装置,其设计好坏直接影响通话质量。
而目前应用较多且性能较好的麦克风是MEMS(Micro-Electro-Mechanical-System Microphone)麦克风。如图1所示,相关技术的MEMS麦克风100’包括:电路板14’、覆盖于电路板14’的上盖20’、由电路板14’和上盖20’共同形成的腔体15’和收容于腔体15’内并分别置于电路板14’上的换能器12’和控制电路16’,其中,电路板14’设有第一声腔18’,上盖20’设有入声孔21’。
相关技术的MEMS麦克风100’,声音从入声孔21’直接进入腔体15’,该第一声腔18’的体积有限,导致MEMS麦克风100’的灵敏度不高、频响特性也不理想,另外,相关技术的MEMS麦克风100’,针对换能器12’也没有防尘保护的作用。
因此,有必要提供一种新的MEMS麦克风以克服上述缺陷。
【实用新型内容】
本实用新型要解决的技术问题在于提供一种灵敏度高、频响特性好的MEMS麦克风。
本实用新型通过这样的技术方案解决上述的技术问题:
一种MEMS麦克风,其包括:电路板、覆盖于电路板的具有收容腔的上盖和分别置于电路板上的换能器和控制电路,换能器设有第一声腔,其中,所述MEMS麦克风还设有声音隔离板,该声音隔离板将收容腔分成两个部分,即进声腔和后腔,所述换能器和控制电路收容于后腔内,上盖设有位于进声腔的入声孔,电路板设有连接进声腔的第一进声孔、连接换能器的第一声腔的第二进声孔和与第一、第二进声孔相通的进声通道。
与现有技术相比较,本实用新型具有以下优点:外部声源通过入声孔进入进声腔后,再通过第一进声孔、进声通道和第二进声孔传入换能器;同时,上盖设有声音隔离板,该声音隔离板将上盖隔离出一个较大的后腔,此结构的MEMS麦克风灵敏度较高和频响特性较理想。另外,本实用新型的MEMS麦克风对换能器具有防尘保护的作用。
【附图说明】
图1为相关技术MEMS麦克风的剖视示意图。
图2为本实用新型MEMS麦克风的剖视示意图。
【具体实施方式】
下面结合附图详细说明本实用新型的具体结构。
本实用新型MEMS麦克风100,主要用于手机上,接收声信号并将声信号转化为电信号。
请参图2所示,本实用新型MEMS麦克风100,主要包括电路板1、覆盖于电路板1的上盖(未标号)和分别置于电路板1上的换能器3和控制电路4。
上盖设有底壁21、自底壁21延伸的侧壁22、由底壁21和侧壁22共同形成的收容腔(未标号)和自底壁21延伸至电路板1的声音隔离板23。所述声音隔离板23将收容腔分成两个部分,即进声腔24和后腔25,应实际需要0,该声音隔离板23可随意调整后腔25的尺寸。上盖的底壁21还设有供外部声源进入进声腔24的入声孔26。
电路板1设有第一线路层11、第二线路层13和夹在第一线路层11和第二线路层13间的中间线路层12,其中,第一线路层11设有与进声腔24相通的第一进声孔14和与后腔25相通的第二进声孔15;中间线路层12设有进声通道16。所述进声通道16与第一进声孔14和第二进声孔15相通。
换能器3置于电路板1的第一线路层11上并同时收容于后腔25内,其设有第一声腔31,该第一声腔31可通过第二进声孔15与进声通道16贯通。
控制电路4置于电路板1的第一线路层11上并同时收容于后腔25内。
外部声源通过入声孔26进入进声腔24后,再通过第一进声孔14、进声通道16和第二进声孔15传入换能器3;同时,上盖设有声音隔离板23,该声音隔离板23将上盖的收容腔隔离出一个较大的后腔25,此结构的MEMS麦克风100灵敏度较高和频响特性较理想。另外,本实用新型的MEMS麦克风100对换能器3具有防尘保护的作用。
以上所述仅为本实用新型的较佳实施方式,本实用新型的保护范围并不以上述实施方式为限,但凡本领域普通技术人员根据本实用新型所揭示内容所作的等效修饰或变化,皆应纳入权利要求书中记载的保护范围内。
Claims (3)
1.一种MEMS麦克风,其包括:电路板、覆盖于电路板的具有收容腔的上盖和分别置于电路板上的换能器和控制电路,换能器设有第一声腔,其特征在于:所述MEMS麦克风还设有声音隔离板,该声音隔离板将收容腔分成两个部分,即进声腔和后腔,所述换能器和控制电路收容于后腔内,上盖设有位于进声腔的入声孔,电路板设有连接进声腔的第一进声孔、连接换能器的第一声腔的第二进声孔和与第一、第二进声孔相通的进声通道。
2.如权利要求1所述的MEMS麦克风,其特征在于:所述电路板包括第一线路层、第二线路层和夹在第一线路层和第二线路层间的中间线路层,所述第一、第二进声孔设于第一线路层,进声通道设于中间线路层。
3.如权利要求1或2所述的MEMS麦克风,其特征在于:所述上盖设有底壁和自底壁延伸的侧壁,所述声音隔离板自底壁延伸至电路板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200820212178.2U CN201274566Y (zh) | 2008-09-26 | 2008-09-26 | Mems麦克风 |
US12/567,713 US20100080405A1 (en) | 2008-09-26 | 2009-09-25 | Silicon condenser microphone package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200820212178.2U CN201274566Y (zh) | 2008-09-26 | 2008-09-26 | Mems麦克风 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201274566Y true CN201274566Y (zh) | 2009-07-15 |
Family
ID=40884904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200820212178.2U Expired - Lifetime CN201274566Y (zh) | 2008-09-26 | 2008-09-26 | Mems麦克风 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100080405A1 (zh) |
CN (1) | CN201274566Y (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102714200A (zh) * | 2009-12-31 | 2012-10-03 | 德克萨斯仪器股份有限公司 | 用于微机电系统设备的具有声学气道的基于引脚框的预塑模封装 |
CN104796833A (zh) * | 2015-04-16 | 2015-07-22 | 歌尔声学股份有限公司 | 一种含有麦克风的产品模组 |
CN105101025A (zh) * | 2014-05-07 | 2015-11-25 | 鑫创科技股份有限公司 | 微机电系统麦克风 |
CN105657627A (zh) * | 2014-11-11 | 2016-06-08 | 晶镁电子股份有限公司 | 具有防尘功能的电子装置以及用于制造该电子装置的方法 |
CN108605410A (zh) * | 2016-02-10 | 2018-09-28 | 伯斯有限公司 | 具有嵌入式声学通道的电路板 |
CN109506764A (zh) * | 2018-12-12 | 2019-03-22 | 电子科技大学 | 一种光纤mems麦克风阵列声波探测板及系统 |
CN111277938A (zh) * | 2020-03-09 | 2020-06-12 | 无锡韦尔半导体有限公司 | 一种麦克风的封装结构 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8577063B2 (en) * | 2010-02-18 | 2013-11-05 | Analog Devices, Inc. | Packages and methods for packaging MEMS microphone devices |
KR101094452B1 (ko) | 2010-05-20 | 2011-12-15 | 주식회사 비에스이 | 마이크로폰 조립체 |
WO2012103087A1 (en) * | 2011-01-24 | 2012-08-02 | Analog Devices, Inc. | Packaged microphone with reduced parasitics |
US8779535B2 (en) * | 2012-03-14 | 2014-07-15 | Analog Devices, Inc. | Packaged integrated device die between an external and internal housing |
US8724840B2 (en) | 2012-03-22 | 2014-05-13 | Robert Bosch Gmbh | Offset acoustic channel for microphone systems |
CN102724338A (zh) * | 2012-05-29 | 2012-10-10 | 上海安费诺永亿通讯电子有限公司 | 一种移动终端声学腔结构 |
US9173024B2 (en) | 2013-01-31 | 2015-10-27 | Invensense, Inc. | Noise mitigating microphone system |
KR101369464B1 (ko) * | 2013-06-27 | 2014-03-06 | 주식회사 비에스이 | 멤스 마이크로폰 |
DE102014105849B3 (de) * | 2014-04-25 | 2015-09-17 | Epcos Ag | Mikrofon mit vergrößertem Rückvolumen und Verfahren zur Herstellung |
CN105142085B (zh) * | 2015-09-21 | 2019-04-23 | 山东共达电声股份有限公司 | 一种指向性mems传声器及收音装置 |
CN105721998A (zh) * | 2016-04-27 | 2016-06-29 | 歌尔声学股份有限公司 | 一种集成传感器的分腔封装结构 |
CN208971806U (zh) * | 2018-08-02 | 2019-06-11 | 瑞声声学科技(深圳)有限公司 | Mems麦克风的终端装配结构 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005008512B4 (de) * | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
US7202552B2 (en) * | 2005-07-15 | 2007-04-10 | Silicon Matrix Pte. Ltd. | MEMS package using flexible substrates, and method thereof |
US7711136B2 (en) * | 2005-12-02 | 2010-05-04 | Fortemedia, Inc. | Microphone array in housing receiving sound via guide tube |
JP2008294556A (ja) * | 2007-05-22 | 2008-12-04 | Citizen Electronics Co Ltd | コンデンサマイクロホン |
JP5128919B2 (ja) * | 2007-11-30 | 2013-01-23 | 船井電機株式会社 | マイクロフォンユニット及び音声入力装置 |
TWM341025U (en) * | 2008-01-10 | 2008-09-21 | Lingsen Precision Ind Ltd | Micro electro-mechanical microphone package structure |
JP2010034990A (ja) * | 2008-07-30 | 2010-02-12 | Funai Electric Co Ltd | 差動マイクロホンユニット |
US20100086146A1 (en) * | 2008-10-02 | 2010-04-08 | Fortemedia, Inc. | Silicon-based microphone package |
JP5325555B2 (ja) * | 2008-12-05 | 2013-10-23 | 船井電機株式会社 | マイクロホンユニット |
-
2008
- 2008-09-26 CN CN200820212178.2U patent/CN201274566Y/zh not_active Expired - Lifetime
-
2009
- 2009-09-25 US US12/567,713 patent/US20100080405A1/en not_active Abandoned
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102714200A (zh) * | 2009-12-31 | 2012-10-03 | 德克萨斯仪器股份有限公司 | 用于微机电系统设备的具有声学气道的基于引脚框的预塑模封装 |
CN102714200B (zh) * | 2009-12-31 | 2015-09-30 | 德克萨斯仪器股份有限公司 | 用于微机电系统设备的具有声学气道的基于引脚框的预塑模封装 |
CN105101025A (zh) * | 2014-05-07 | 2015-11-25 | 鑫创科技股份有限公司 | 微机电系统麦克风 |
CN105101025B (zh) * | 2014-05-07 | 2019-05-03 | 鑫创科技股份有限公司 | 微机电系统麦克风 |
CN105657627A (zh) * | 2014-11-11 | 2016-06-08 | 晶镁电子股份有限公司 | 具有防尘功能的电子装置以及用于制造该电子装置的方法 |
CN104796833A (zh) * | 2015-04-16 | 2015-07-22 | 歌尔声学股份有限公司 | 一种含有麦克风的产品模组 |
CN108605410A (zh) * | 2016-02-10 | 2018-09-28 | 伯斯有限公司 | 具有嵌入式声学通道的电路板 |
CN108605410B (zh) * | 2016-02-10 | 2021-09-10 | 伯斯有限公司 | 具有嵌入式声学通道的电路板 |
CN109506764A (zh) * | 2018-12-12 | 2019-03-22 | 电子科技大学 | 一种光纤mems麦克风阵列声波探测板及系统 |
CN111277938A (zh) * | 2020-03-09 | 2020-06-12 | 无锡韦尔半导体有限公司 | 一种麦克风的封装结构 |
Also Published As
Publication number | Publication date |
---|---|
US20100080405A1 (en) | 2010-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201274566Y (zh) | Mems麦克风 | |
CN201750452U (zh) | 移动通信终端 | |
CN101765047A (zh) | 电容麦克风及其制作方法 | |
CN1856181A (zh) | 可电缆连接的立体声头戴式耳机 | |
CN101568057A (zh) | 电容麦克风 | |
CN204810369U (zh) | 移动通讯终端 | |
CN201491259U (zh) | 硅基电容麦克风 | |
CN210578700U (zh) | 电子设备 | |
CN206164794U (zh) | 耳机 | |
CN201491214U (zh) | Mems麦克风 | |
CN1816218B (zh) | 具有至少两个换能器的移动终端 | |
CN201226591Y (zh) | 电容式麦克风 | |
CN201403194Y (zh) | Mems麦克风 | |
CN202178856U (zh) | 麦克风 | |
CN202587368U (zh) | 微电机系统麦克风 | |
CN201252641Y (zh) | Mems麦克风 | |
CN214507136U (zh) | 电子设备 | |
CN201491261U (zh) | 电容麦克风 | |
CN201274552Y (zh) | Mems麦克风 | |
CN206060849U (zh) | 移动通信终端 | |
CN209419818U (zh) | 一种具有电话功能的音响 | |
CN201118978Y (zh) | 驻极体麦克风 | |
CN209390369U (zh) | 一种具有回声消声系统的麦克风及电子设备 | |
CN203896339U (zh) | 一种头戴式蓝牙对讲装置 | |
CN202998471U (zh) | 耳机测试盒 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170511 Address after: Singapore Ang Mo Kio 65 Street No. 10 techpoint Building 1 floor, No. 8 Patentee after: AAC Technologies (Singapore) Co., Ltd. Address before: 518057 Nanshan District province high tech Industrial Park, Shenzhen, North West New Road, No. 18 Patentee before: AAC Acoustic Technologies (Shenzhen) Co., Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20090715 |