CN104822118B - 一种mems麦克风的封装结构 - Google Patents
一种mems麦克风的封装结构 Download PDFInfo
- Publication number
- CN104822118B CN104822118B CN201510227109.3A CN201510227109A CN104822118B CN 104822118 B CN104822118 B CN 104822118B CN 201510227109 A CN201510227109 A CN 201510227109A CN 104822118 B CN104822118 B CN 104822118B
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- China
- Prior art keywords
- vibrating diaphragm
- sound
- chamber
- substrate
- encapsulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims abstract description 50
- 239000010409 thin film Substances 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
Abstract
Description
Claims (10)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510227109.3A CN104822118B (zh) | 2015-05-06 | 2015-05-06 | 一种mems麦克风的封装结构 |
US15/554,980 US10250962B2 (en) | 2015-05-06 | 2015-12-10 | Package structure of MEMS microphone |
PCT/CN2015/096912 WO2016176993A1 (zh) | 2015-05-06 | 2015-12-10 | 一种mems麦克风的封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510227109.3A CN104822118B (zh) | 2015-05-06 | 2015-05-06 | 一种mems麦克风的封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104822118A CN104822118A (zh) | 2015-08-05 |
CN104822118B true CN104822118B (zh) | 2018-11-30 |
Family
ID=53732262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510227109.3A Active CN104822118B (zh) | 2015-05-06 | 2015-05-06 | 一种mems麦克风的封装结构 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10250962B2 (zh) |
CN (1) | CN104822118B (zh) |
WO (1) | WO2016176993A1 (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104822118B (zh) * | 2015-05-06 | 2018-11-30 | 歌尔股份有限公司 | 一种mems麦克风的封装结构 |
CN106454668A (zh) * | 2016-10-31 | 2017-02-22 | 歌尔股份有限公司 | 一种mems发声装置及电子设备 |
US10667038B2 (en) * | 2016-12-07 | 2020-05-26 | Apple Inc. | MEMS mircophone with increased back volume |
US10231061B2 (en) * | 2017-04-28 | 2019-03-12 | Infineon Technologies Ag | Sound transducer with housing and MEMS structure |
CN107238121B (zh) * | 2017-06-30 | 2018-08-14 | 田卓昊 | 一种基于互联网的智能厨房终端设备 |
KR102359943B1 (ko) * | 2017-09-13 | 2022-02-07 | 현대자동차 주식회사 | 마이크로폰 장치 |
WO2019190559A1 (en) * | 2018-03-30 | 2019-10-03 | Hewlett-Packard Development Company, L.P. | Microphone units with multiple openings |
US10805702B2 (en) * | 2018-05-18 | 2020-10-13 | Knowles Electronics, Llc | Systems and methods for reducing noise in microphones |
CN109257054A (zh) * | 2018-10-29 | 2019-01-22 | 咪付(广西)网络技术有限公司 | 一种具有增强灵敏度的声音接收装置 |
CN109660927B (zh) * | 2018-12-29 | 2024-04-12 | 华景科技无锡有限公司 | 一种麦克风芯片及麦克风 |
WO2020160348A1 (en) * | 2019-02-01 | 2020-08-06 | Knowles Electronics, Llc | Microphone assembly with back volume vent |
US10841710B1 (en) * | 2019-06-20 | 2020-11-17 | Solid State System Co., Ltd. | Package structure of micro-electro-mechanical-system microphone package and method for packaging the same |
CN212785847U (zh) * | 2020-06-30 | 2021-03-23 | 瑞声声学科技(深圳)有限公司 | 振动传感器 |
CN112118522B (zh) * | 2020-09-29 | 2022-04-29 | 瑞声声学科技(深圳)有限公司 | Mems麦克风 |
CN113328811B (zh) * | 2021-05-28 | 2023-03-31 | 歌尔微电子股份有限公司 | 声波收发装置及电子设备 |
CN114132889A (zh) * | 2021-11-15 | 2022-03-04 | 歌尔微电子股份有限公司 | 一种mems传感器的制作方法及其mems传感器 |
CN114339560B (zh) * | 2021-12-23 | 2024-03-19 | 歌尔微电子股份有限公司 | 微型麦克风和电子设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1433661A (zh) * | 2000-01-04 | 2003-07-30 | 美国技术公司 | 压电薄膜声发射器 |
CN101325820A (zh) * | 2007-06-14 | 2008-12-17 | 雅马哈株式会社 | 适用于半导体装置的传声器封装结构及其制造方法 |
CN101742388A (zh) * | 2008-11-10 | 2010-06-16 | 宏达国际电子股份有限公司 | 具有驻极体式电声换能器的电子装置 |
KR101303954B1 (ko) * | 2012-12-14 | 2013-09-05 | 주식회사 비에스이 | 광대역 및 방수 특성을 위한 보텀 포트형 마이크로폰 조립체 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7136496B2 (en) * | 2001-04-18 | 2006-11-14 | Sonion Nederland B.V. | Electret assembly for a microphone having a backplate with improved charge stability |
US20030007897A1 (en) * | 2001-07-06 | 2003-01-09 | Andrew Creasey | Pipette tips |
JP2004264374A (ja) * | 2003-02-24 | 2004-09-24 | Kobe Steel Ltd | 薄膜を用いた吸音構造 |
KR100648398B1 (ko) * | 2005-07-07 | 2006-11-24 | 주식회사 비에스이 | 실리콘 콘덴서 마이크로폰의 패키징 구조 및 그 제조방법 |
TWI293500B (en) * | 2006-03-03 | 2008-02-11 | Advanced Semiconductor Eng | Microelectromechanical microphone packaging system |
CN101198235B (zh) * | 2006-12-08 | 2011-05-18 | 美商富迪科技股份有限公司 | 电子装置以及将麦克风安装于该电子装置中的方法 |
KR101609270B1 (ko) * | 2009-08-12 | 2016-04-06 | 삼성전자주식회사 | 압전형 마이크로 스피커 및 그 제조 방법 |
US8577063B2 (en) * | 2010-02-18 | 2013-11-05 | Analog Devices, Inc. | Packages and methods for packaging MEMS microphone devices |
CN102332259B (zh) * | 2011-10-12 | 2012-07-25 | 中国科学院合肥物质科学研究院 | 一种自适应微穿孔板吸声器及其微孔实时调节方法 |
CN202364373U (zh) * | 2011-11-16 | 2012-08-01 | 瑞声声学科技(常州)有限公司 | 微电机系统麦克风 |
CN202587367U (zh) * | 2012-02-21 | 2012-12-05 | 瑞声声学科技(深圳)有限公司 | 微电机系统麦克风 |
TWI575961B (zh) * | 2012-04-13 | 2017-03-21 | Gong-Ben Lin | Speaker box |
US9809448B2 (en) * | 2013-03-13 | 2017-11-07 | Invensense, Inc. | Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same |
CN104219610A (zh) * | 2013-05-29 | 2014-12-17 | 山东共达电声股份有限公司 | 微机电系统麦克风 |
US9562846B2 (en) * | 2013-07-10 | 2017-02-07 | Kla-Tencor Corporation | Particle suspensions used as low-contrast standards for inspection of liquids |
CN203933949U (zh) * | 2014-06-16 | 2014-11-05 | 深圳市鲁粤盛科技有限公司 | 单指向性mems传声器 |
CN204559882U (zh) * | 2015-05-06 | 2015-08-12 | 歌尔声学股份有限公司 | 一种mems麦克风的封装结构 |
CN104822118B (zh) * | 2015-05-06 | 2018-11-30 | 歌尔股份有限公司 | 一种mems麦克风的封装结构 |
-
2015
- 2015-05-06 CN CN201510227109.3A patent/CN104822118B/zh active Active
- 2015-12-10 WO PCT/CN2015/096912 patent/WO2016176993A1/zh active Application Filing
- 2015-12-10 US US15/554,980 patent/US10250962B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1433661A (zh) * | 2000-01-04 | 2003-07-30 | 美国技术公司 | 压电薄膜声发射器 |
CN101325820A (zh) * | 2007-06-14 | 2008-12-17 | 雅马哈株式会社 | 适用于半导体装置的传声器封装结构及其制造方法 |
CN101742388A (zh) * | 2008-11-10 | 2010-06-16 | 宏达国际电子股份有限公司 | 具有驻极体式电声换能器的电子装置 |
KR101303954B1 (ko) * | 2012-12-14 | 2013-09-05 | 주식회사 비에스이 | 광대역 및 방수 특성을 위한 보텀 포트형 마이크로폰 조립체 |
Also Published As
Publication number | Publication date |
---|---|
CN104822118A (zh) | 2015-08-05 |
WO2016176993A1 (zh) | 2016-11-10 |
US10250962B2 (en) | 2019-04-02 |
US20180048951A1 (en) | 2018-02-15 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
EXSB | Decision made by sipo to initiate substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Applicant after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Applicant before: Goertek Inc. |
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COR | Change of bibliographic data | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200608 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |