CN101651913A - 麦克风 - Google Patents
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- CN101651913A CN101651913A CN200910108215A CN200910108215A CN101651913A CN 101651913 A CN101651913 A CN 101651913A CN 200910108215 A CN200910108215 A CN 200910108215A CN 200910108215 A CN200910108215 A CN 200910108215A CN 101651913 A CN101651913 A CN 101651913A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Abstract
本发明提供了一种麦克风，包括设有声孔的线路板、与线路板相连的盖板，该麦克风还包括设有背腔的微机电芯片以及分别与微机电芯片和线路板电连接的控制电路芯片，线路板和盖板形成一空腔，微机电芯片和控制电路芯片位于该空腔内且分别设在所述线路板上，盖板包括底板和自底板延伸的且与线路板相连的侧板，该麦克风还包括屏蔽罩，所述屏蔽罩包括本体和与本体相连的卷边，屏蔽罩本体覆盖侧板和线路板且屏蔽罩的卷边位于盖板的底板，通过卷边将盖板及线路板固定，屏蔽罩与声孔相对应的位置设有开口，微机电芯片的背腔与声孔相对。
Description
技术领域
本发明涉及一种麦克风，尤其涉及一种电容麦克风。
背景技术
随着无线通讯的发展，全球移动电话用户越来越多，用户对移动电话的要求已不仅满足于通话，而且要能够提供高质量的通话效果，尤其是目前移动多媒体技术的发展，移动电话的通话质量更显重要，移动电话的麦克风作为移动电话的语音拾取装置，其设计好坏直接影响通话质量。
而目前应用较多且性能较好的麦克风是微电机系统麦克风(Micro-Electro-Mechanical-System Microphone，简称MEMS)，相关技术中，参见图1，微电机系统麦克风1’包括线路板11’和与该线路板11’相连的框架12’和与框架12’相连的上板13’，其中，线路板11’、框架12’和上板13’构成了保护结构，MEMS芯片17’和控制电路16’位于该保护结构中。进声孔14’设置于上板13’。此种结构的麦克风由于声压从正面作用在MEME芯片17’上，背面的声腔171’不够大，使得信噪比(SNR)低。因此有必要提供一种新型的麦克风。
发明内容
本发明要解决的技术问题在于提供一种可以提高信噪比且屏蔽效果好的麦克风。
为解决上述技术问题，本发明提供的技术方案为：
一种麦克风，包括设有声孔的线路板、与线路板相连的盖板，该麦克风还包括设有背腔的微机电芯片以及分别与微机电芯片和线路板电连接的控制电路芯片，线路板和盖板形成一空腔，微机电芯片和控制电路芯片位于该空腔内且分别设在所述线路板上，盖板包括底板和自底板延伸的且与线路板相连的侧板，该麦克风还包括屏蔽罩，所述屏蔽罩包括本体和与本体相连的卷边，屏蔽罩本体覆盖侧板和线路板且屏蔽罩的卷边位于盖板的底板，通过卷边将盖板及线路板固定，屏蔽罩与声孔相对应的位置设有开口，微机电芯片的背腔与声孔相对。
优选的，在所述线路板上设有若干用于与埋设于陶瓷内部的电路电连接的第一组输出端子和用于与控制电路电连接的第二组输出端子，控制电路芯片的电信号通过第二组输出端子、线路板、第一组输出端子、盖板传递。
优选的，所述盖板与第一组输出端子连接处设有凸台，所述线路板相应位置设有凹槽。
优选的，所述盖板与第一组输出端子连接处设有凹槽，所述线路板相应位置设有凸台。
本发明的有益效果在于：由于微机电芯片的背腔与声孔相对，声音从微机电芯片的膜片背面作用到微机电芯片上，增大了背腔的空间，可以提高麦克风的信噪比；同时由于设有屏蔽罩，使得屏蔽效果好。
在发明的一个优选实施例中，由于盖板采用陶瓷材料，实现了空间上的弯曲走线，简化了工艺。
在发明的一个优选实施例中，由于盖板与第一组输出端子连接处设有凸台/凹槽，所述线路板相应位置设有凹槽/凸台，使得连接更加紧固，提高了麦克风的稳定性。
附图说明
图1是与本发明相关的麦克风的剖面图；
图2是本发明一个实施例的剖面图；
图3是本发明一个实施例中线路板的示意图；
图4是本发明一个实施例中盖板与第一组输出端子连接方式示意图。
具体实施方式
下面结合附图和实施方式对本发明作进一步说明。
本发明提供的麦克风，主要用于手机上，接受声音并将声音转化为电信号。
参见图2，本发明提供的麦克风1，包括线路板11、盖板12、由盖板12和线路板11形成的空腔17，微机电芯片14和控制电路芯片15设于空腔17中，且微机电芯片14和控制电路芯片15分别设于线路板11上。微机电芯片14设有背腔141。
盖板12包括底板122和自底板122向线路板11方向延伸的侧板121，侧板121与线路板相连。线路板上设有声孔111。声孔111与背腔141相对。
客户端设于盖板12上。
该麦克风1还包括屏蔽罩13。屏蔽罩13包括本体132以及与本体132相连的卷边133。本体132覆盖于盖板12的侧板121和线路板11，卷边设于盖板12的底板122的外侧，起固定的作用，即将线路板11和盖板12固定。此处，屏蔽罩13与侧板121和线路板11的连接方式采取铆接的方式。在屏蔽罩13与声孔111对应处开设有开口131，以便声音传入。
此种结构的麦克风1，由于微机电芯片14的背腔141与声孔111相对，声音从微机电芯片14的膜片背面作用到微机电芯片14上，增大了背腔141的空间，可以提高麦克风的信噪比。同时由于屏蔽罩13，使得屏蔽效果好。
在本发明提供的一个实施例中，盖板12为陶瓷材料制成，盖板12内部埋设有用于与线路板11电导通的电路。由于采用陶瓷材料制成盖板12，实现了空间走线，简化了工艺，也提高了麦克风1的性能。
参见图3，在线路板11上设有用于与埋设于陶瓷盖板12内部的电路电连接的第一组输出端子和用于与控制电路芯片15电连接的第二组输出端子，第一组输出端子包括a、b、c、d、e五个输出端子，第二组输出端子包括A、B、C、D、E五个输出端子。当然，第一组输出端子及第二组输出端子的个数不限于五个，可以是一个、两个或者其他，主要根据实际的需要设定。
控制电路芯片15的电信号通过第二组输出端子、线路板11、第一组输出端子、盖板13传递给位于盖板13的客户端。
为了使得第一组输出端子与陶瓷盖板12的连接更加紧固，在盖板12与第一组输出端子连接处设有凸台，线路板11相应位置设有凹槽，反之亦然，即在盖板处设有凹槽，在线路板处设有凸台，这样，通过凸台与凹槽的结合，提高了连接的稳定性。此处的连接和第二组输出端子与控制电路芯片15的连接都可以采用点银胶的方式实现。
本发明还提供了一种麦克风的制作方法，该方法包括如下步骤：
提供设有声孔111的线路板11、设有背腔141的微机电芯片14、控制电路芯片15、内部埋设有电路的陶瓷盖板12和设有开口131的屏蔽罩13，其中盖板12包括底板122和自底板122延伸的侧板121，屏蔽罩13包括本体132和与本体132相连的卷边133。
将线路板11和盖板12组装在一起形成一空腔17，将控制电路芯片15和微机电芯片14设置在该空腔17内且位于线路板11上，将屏蔽罩13本体132覆盖侧板121和线路板11且屏蔽罩13的卷边133位于盖板12的底板122，用来将盖板12及线路板11固定，微机电芯片14的背腔141与设在线路板11上的声孔111相对，屏蔽罩13的开口131与声孔111相对。
以上所述的仅是本发明的一种实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。
Claims (6)
1、一种麦克风，包括设有声孔的线路板、与线路板相连的盖板，其特征在于：该麦克风还包括设有背腔的微机电芯片以及分别与微机电芯片和线路板电连接的控制电路芯片，线路板和盖板形成一空腔，微机电芯片和控制电路芯片位于该空腔内且分别设在所述线路板上，盖板包括底板和自底板延伸的且与线路板相连的侧板，该麦克风还包括屏蔽罩，所述屏蔽罩包括本体和与本体相连的卷边，屏蔽罩本体覆盖侧板和线路板且屏蔽罩的卷边位于盖板的底板，通过卷边将盖板及线路板固定，屏蔽罩与声孔相对应的位置设有开口，微机电芯片的背腔与声孔相对。
2、根据权利要求1所述的麦克风，其特征在于：所述盖板为陶瓷材料制成，盖板内部埋设有用于与线路板电导通的电路。
3、根据权利要求2所述的麦克风，其特征在于：在所述线路板上设有若干用于与埋设于陶瓷内部的电路电连接的第一组输出端子和用于与控制电路电连接的第二组输出端子，控制电路芯片的电信号通过第二组输出端子、线路板、第一组输出端子、盖板传递。
4、根据权利要求3所述的麦克风，其特征在于：所述盖板与第一组输出端子连接处设有凸台，所述线路板相应位置设有凹槽。
5、根据权利要求3所述的麦克风，其特征在于：所述盖板与第一组输出端子连接处设有凹槽，所述线路板相应位置设有凸台。
6、一种麦克风的制作方法，其特征在于：该方法包括如下步骤：
提供设有声孔的线路板、设有背腔的微机电芯片、控制电路芯片、内部埋设有电路的陶瓷盖板和设有开口的屏蔽罩，其中盖板包括底板和自底板延伸的侧板，屏蔽罩包括本体和与本体相连的卷边；
将线路板和盖板组装在一起形成一空腔，将控制电路芯片和微机电芯片设置在该空腔内且位于线路板上，将屏蔽罩本体覆盖侧板和线路板且屏蔽罩的卷边位于盖板的底板，用来将盖板及线路板固定，微机电芯片的背腔与设在线路板上的声孔相对，屏蔽罩的开口与声孔相对。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910108215A CN101651913A (zh) | 2009-06-19 | 2009-06-19 | 麦克风 |
| US12/694,285 US8670579B2 (en) | 2009-06-19 | 2010-01-27 | MEMS microphone |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910108215A CN101651913A (zh) | 2009-06-19 | 2009-06-19 | 麦克风 |
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| CN101651913A true CN101651913A (zh) | 2010-02-17 |
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| CN200910108215A Pending CN101651913A (zh) | 2009-06-19 | 2009-06-19 | 麦克风 |
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| US (1) | US8670579B2 (zh) |
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| JP5951454B2 (ja) | 2012-11-20 | 2016-07-13 | 株式会社東芝 | マイクロフォンパッケージ |
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| US9301075B2 (en) | 2013-04-24 | 2016-03-29 | Knowles Electronics, Llc | MEMS microphone with out-gassing openings and method of manufacturing the same |
| US10028054B2 (en) | 2013-10-21 | 2018-07-17 | Knowles Electronics, Llc | Apparatus and method for frequency detection |
| CN105379308B (zh) | 2013-05-23 | 2019-06-25 | 美商楼氏电子有限公司 | 麦克风、麦克风系统及操作麦克风的方法 |
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| US20100322443A1 (en) | 2010-12-23 |
| US8670579B2 (en) | 2014-03-11 |
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