JP5216717B2 - 小型シリコンコンデンサマイクロフォンおよびその製造方法 - Google Patents
小型シリコンコンデンサマイクロフォンおよびその製造方法 Download PDFInfo
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- JP5216717B2 JP5216717B2 JP2009184808A JP2009184808A JP5216717B2 JP 5216717 B2 JP5216717 B2 JP 5216717B2 JP 2009184808 A JP2009184808 A JP 2009184808A JP 2009184808 A JP2009184808 A JP 2009184808A JP 5216717 B2 JP5216717 B2 JP 5216717B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/01—Electrostatic transducers characterised by the use of electrets
- H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/4908—Acoustic transducer
Description
テーブル1:材料
Claims (16)
- 周辺部および中央部を含む天面と底面とを有する硬質印刷回路基板から構成された平面基板と、
周辺部および中央部を含む非平面カバーと、
前記カバーの前記周辺部の下部を前記平面基板の前記天面の前記周辺部に機械的に取り付けることにより形成されたパッケージハウジングと、
前記平面基板の前記天面の前記中央部に機械的に取り付けられ、かつ前記パッケージハウジングにより物理的に保護されたシリコンコンデンサマイクロフォンダイと、
前記平面基板の前記底面上にあり、かつはんだリフロー工程を用いて前記パッケージを外部の印刷回路基板の表面に機械的に取り付けかつ電気的に接続するよう構成された複数のはんだパッドと、
前記平面基板の前記天面上にあり、かつ少なくとも1つが前記シリコンコンデンサマイクロフォンダイに電気的に接続された複数のボンドパッドと、
前記平面基板内にあり、かつ前記平面基板の前記天面上にある前記ボンドパッドの1つと、前記平面基板の前記底面上にある前記はんだパッドの1つとの間にある少なくとも1つの電気経路を含む複数の電気経路と、
前記パッケージハウジング内にあり、かつ前記パッケージハウジングの外部から前記パッケージハウジングの内部へ音波を通過させるよう構成された音響ポートと、を備える、表面搭載シリコンコンデンサマイクロフォンパッケージ。 - 前記音響ポートは、前記平面基板内にあり、かつ前記シリコンコンデンサマイクロフォンダイの真下に配された、請求項1記載の表面搭載シリコンコンデンサマイクロフォンパッケージ。
- 前記音響ポートは、前記平面基板内にあり、かつ前記シリコンコンデンサマイクロフォンダイの真下を除く近傍に配された、請求項1記載の表面搭載シリコンコンデンサマイクロフォンパッケージ。
- 前記音響ポートは、前記カバー内にある、請求項1記載の表面搭載シリコンコンデンサマイクロフォンパッケージ。
- 前記硬質印刷回路基板はFR−4材から構成された、請求項1記載の表面搭載シリコンコンデンサマイクロフォンパッケージ。
- 周辺部および中央部を含む天面と底面とを有する硬質印刷回路基板から構成された平面基板と、
周辺にある側壁と内側にある窓とを有する硬質印刷回路基板から構成された平面側部と、
天面と周辺部および中央部を含む底面とを有する硬質印刷回路基板から構成された平面カバーと、
前記カバーの前記底面の前記周辺部を前記平面側部の前記側壁の上部へ機械的に取り付けることにより、かつ前記平面側部の前記側壁の下部を前記平面基板の前記天面の前記周辺部へ機械的に取り付けることにより形成されたパッケージハウジングと、
前記平面基板の前記天面の前記中央部へ機械的に取り付けられ、かつ前記パッケージハウジングにより物理的に保護されたシリコンコンデンサマイクロフォンダイと、
前記平面基板の前記底面上にあり、かつはんだリフロー工程を用いて前記パッケージを外部の印刷回路基板の表面へ機械的に取り付けかつ電気的に接続するよう構成された複数のはんだパッドと、
前記平面基板の前記天面上にあり、かつ少なくとも1つが前記シリコンコンデンサマイクロフォンダイに前記的に接続された複数のボンドパッドと、
前記平面基板内にあり、かつ前記平面基板の前記天面上にある前記ボンドパッドの1つと、前記平面基板の前記底面上にある前記はんだパッドの1つとの間にある少なくとも1つの電気経路を含む複数の電気経路と、
前記パッケージハウジング内にあり、かつ前記パッケージハウジングの外部から前記パッケージハウジングの内部へ音波を通過させるよう構成された音響ポートと、を備える、表面搭載シリコンコンデンサマイクロフォンパッケージ。 - 前記音響ポートは、前記平面基板内にあり、かつ前記シリコンコンデンサマイクロフォンダイの真下に配された、請求項6記載の表面搭載シリコンコンデンサマイクロフォンパッケージ。
- 前記音響ポートは、前記平面基板内にあり、かつ前記シリコンコンデンサマイクロフォンダイの真下を除く近傍に配された、請求項6記載の表面搭載シリコンコンデンサマイクロフォンパッケージ。
- 前記音響ポートは、前記カバー内にある、請求項6記載の表面搭載シリコンコンデンサマイクロフォンパッケージ。
- 前記平面基板、前記平面側部および前記カバーの前記硬質印刷回路基板はFR−4材から構成された、請求項6記載の表面搭載シリコンコンデンサマイクロフォンパッケージ。
- 周辺部および中央部を含む天面と底面とを有する硬質印刷回路基板から構成された平面基板と、
周辺部および中央部を含む非平面カバーと、
前記カバーの前記周辺部の下部を前記平面基板の前記天面の前記周辺部へ機械的に取り付けることにより形成されたパッケージハウジングと、
前記平面基板の前記天面の前記中央部へ機械的に取り付けられ、かつ前記パッケージのハウジングにより物理的に保護されたMEMSマイクロフォンダイと、
前記平面基板の前記底面上にあり、かつはんだリフロー工程を用いて前記パッケージを外部の印刷回路基板の表面へ機械的に取り付けかつ電気的に接続するよう構成された複数のはんだパッドと、
前記平面基板内にあり、前記MEMSマイクロフォンダイの真下に配され、かつ前記パッケージハウジングの外部から前記パッケージハウジングの内部へ音波を通過させるよう構成された音響ポートと、を備える、表面搭載MEMSマイクロフォンパッケージ。 - 前記平面基板は硬質印刷回路基板である、請求項11記載の表面搭載MEMSマイクロフォンパッケージ。
- 前記MEMSマイクロフォンダイはシリコンコンデンサマイクロフォンダイである、請求項11記載の表面搭載MEMSマイクロフォンパッケージ。
- 周辺部および中央部を含む天面と底面とを有する硬質印刷回路基板から構成された平面基板と、
天面と周辺部および中央部を含む底面とを有する硬質印刷回路基板から構成された平面カバーと、
周辺にある側壁と内側にある窓とを有する硬質印刷回路基板から構成された平面側部と、
前記カバーの前記底面の前記周辺部を前記平面側部の前記側壁の上部へ機械的に取り付けることにより、かつ前記平面側部の前記側壁の下部を前記平面基板の前記天面の前記周辺部へ機械的に取り付けることにより形成されたハウジングと、
前記平面基板の前記天面の前記中央部へ機械的に取り付けられ、かつ前記ハウジングにより物理的に保護されたMEMSマイクロフォンダイと、
前記平面基板の前記底面上にあり、かつはんだリフロー工程を用いて前記パッケージを外部の印刷回路基板の表面へ機械的に取り付けかつ電気的に接続するよう構成された複数のはんだパッドと、
前記平面基板内にあり、MEMSマイクロフォンダイの真下に配され、かつ前記パッケージハウジングの外部から前記パッケージハウジングの内部へ音波を通過させるよう構成された音響ポートと、を備える、表面搭載MEMSマイクロフォンパッケージ。 - 前記平面基板は硬質印刷回路基板である、請求項14記載の表面搭載MEMSマイクロフォンパッケージ。
- 前記MEMSマイクロフォンダイはシリコンコンデンサマイクロフォンダイである、請求項14記載の表面搭載MEMSマイクロフォンパッケージ。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25354300P | 2000-11-28 | 2000-11-28 | |
US60/253,543 | 2000-11-28 | ||
US09/886,854 US7166910B2 (en) | 2000-11-28 | 2001-06-21 | Miniature silicon condenser microphone |
US09/886,854 | 2001-06-21 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007250745A Division JP2008099271A (ja) | 2000-11-28 | 2007-09-27 | 小型シリコンコンデンサマイクロフォンおよびその製造方法 |
Publications (3)
Publication Number | Publication Date |
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JP2009296630A JP2009296630A (ja) | 2009-12-17 |
JP2009296630A5 JP2009296630A5 (ja) | 2012-03-01 |
JP5216717B2 true JP5216717B2 (ja) | 2013-06-19 |
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JP2002546465A Expired - Fee Related JP4532827B2 (ja) | 2000-11-28 | 2001-10-22 | 小型シリコンコンデンサマイクロフォンおよびその製造方法 |
JP2007250745A Pending JP2008099271A (ja) | 2000-11-28 | 2007-09-27 | 小型シリコンコンデンサマイクロフォンおよびその製造方法 |
JP2009184808A Expired - Lifetime JP5216717B2 (ja) | 2000-11-28 | 2009-08-07 | 小型シリコンコンデンサマイクロフォンおよびその製造方法 |
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JP2002546465A Expired - Fee Related JP4532827B2 (ja) | 2000-11-28 | 2001-10-22 | 小型シリコンコンデンサマイクロフォンおよびその製造方法 |
JP2007250745A Pending JP2008099271A (ja) | 2000-11-28 | 2007-09-27 | 小型シリコンコンデンサマイクロフォンおよびその製造方法 |
Country Status (6)
Country | Link |
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US (3) | US7166910B2 (ja) |
EP (2) | EP2249583A3 (ja) |
JP (3) | JP4532827B2 (ja) |
AT (1) | ATE510415T1 (ja) |
AU (1) | AU2002229116A1 (ja) |
WO (1) | WO2002045463A2 (ja) |
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-
2001
- 2001-06-21 US US09/886,854 patent/US7166910B2/en not_active Expired - Lifetime
- 2001-10-22 WO PCT/US2001/049462 patent/WO2002045463A2/en active Application Filing
- 2001-10-22 AU AU2002229116A patent/AU2002229116A1/en not_active Abandoned
- 2001-10-22 EP EP10173370.7A patent/EP2249583A3/en not_active Ceased
- 2001-10-22 EP EP01990255A patent/EP1346601B1/en not_active Revoked
- 2001-10-22 JP JP2002546465A patent/JP4532827B2/ja not_active Expired - Fee Related
- 2001-10-22 AT AT01990255T patent/ATE510415T1/de not_active IP Right Cessation
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2005
- 2005-04-22 US US11/112,043 patent/US7242089B2/en not_active Expired - Lifetime
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2006
- 2006-10-03 US US11/538,056 patent/US7537964B2/en not_active Expired - Lifetime
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2007
- 2007-09-27 JP JP2007250745A patent/JP2008099271A/ja active Pending
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Also Published As
Publication number | Publication date |
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ATE510415T1 (de) | 2011-06-15 |
US20070082421A1 (en) | 2007-04-12 |
AU2002229116A1 (en) | 2002-06-11 |
JP2008099271A (ja) | 2008-04-24 |
WO2002045463A2 (en) | 2002-06-06 |
US7166910B2 (en) | 2007-01-23 |
US7242089B2 (en) | 2007-07-10 |
JP2004537182A (ja) | 2004-12-09 |
EP1346601B1 (en) | 2011-05-18 |
JP2009296630A (ja) | 2009-12-17 |
EP2249583A2 (en) | 2010-11-10 |
EP1346601A2 (en) | 2003-09-24 |
EP2249583A3 (en) | 2014-12-10 |
JP4532827B2 (ja) | 2010-08-25 |
US20050185812A1 (en) | 2005-08-25 |
WO2002045463A3 (en) | 2003-05-15 |
US20020102004A1 (en) | 2002-08-01 |
US7537964B2 (en) | 2009-05-26 |
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