ATE392790T1 - Erhobene mikrostrukturen - Google Patents

Erhobene mikrostrukturen

Info

Publication number
ATE392790T1
ATE392790T1 AT04076015T AT04076015T ATE392790T1 AT E392790 T1 ATE392790 T1 AT E392790T1 AT 04076015 T AT04076015 T AT 04076015T AT 04076015 T AT04076015 T AT 04076015T AT E392790 T1 ATE392790 T1 AT E392790T1
Authority
AT
Austria
Prior art keywords
raised
raised microstructures
film
microstructures
raised micro
Prior art date
Application number
AT04076015T
Other languages
English (en)
Inventor
Michael Pederson
Peter V Loeppert
Original Assignee
Knowles Electronics Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/910,110 external-priority patent/US6987859B2/en
Application filed by Knowles Electronics Llc filed Critical Knowles Electronics Llc
Application granted granted Critical
Publication of ATE392790T1 publication Critical patent/ATE392790T1/de

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Silicon Compounds (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Inorganic Insulating Materials (AREA)
  • Amplifiers (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Silicon Polymers (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
AT04076015T 2000-08-11 2001-08-10 Erhobene mikrostrukturen ATE392790T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63740100A 2000-08-11 2000-08-11
US09/910,110 US6987859B2 (en) 2001-07-20 2001-07-20 Raised microstructure of silicon based device

Publications (1)

Publication Number Publication Date
ATE392790T1 true ATE392790T1 (de) 2008-05-15

Family

ID=27092826

Family Applications (2)

Application Number Title Priority Date Filing Date
AT04076015T ATE392790T1 (de) 2000-08-11 2001-08-10 Erhobene mikrostrukturen
AT01959715T ATE321429T1 (de) 2000-08-11 2001-08-10 Breitbandiger miniaturwandler

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT01959715T ATE321429T1 (de) 2000-08-11 2001-08-10 Breitbandiger miniaturwandler

Country Status (9)

Country Link
EP (2) EP1469701B1 (de)
JP (3) JP4338395B2 (de)
KR (1) KR100571967B1 (de)
CN (2) CN1498513B (de)
AT (2) ATE392790T1 (de)
AU (1) AU2001281241A1 (de)
DE (2) DE60118208T2 (de)
DK (2) DK1469701T3 (de)
WO (1) WO2002015636A2 (de)

Families Citing this family (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535460B2 (en) 2000-08-11 2003-03-18 Knowles Electronics, Llc Miniature broadband acoustic transducer
US6987859B2 (en) 2001-07-20 2006-01-17 Knowles Electronics, Llc. Raised microstructure of silicon based device
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US8623709B1 (en) 2000-11-28 2014-01-07 Knowles Electronics, Llc Methods of manufacture of top port surface mount silicon condenser microphone packages
US7166910B2 (en) 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US7439616B2 (en) 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
US6859542B2 (en) 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
US7023066B2 (en) 2001-11-20 2006-04-04 Knowles Electronics, Llc. Silicon microphone
KR100437681B1 (ko) * 2002-04-15 2004-06-30 부전전자부품 주식회사 지향성 마이크로폰
DE10238523B4 (de) 2002-08-22 2014-10-02 Epcos Ag Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung
US6781231B2 (en) 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
JP2004356707A (ja) * 2003-05-27 2004-12-16 Hosiden Corp 音響検出機構
US7030536B2 (en) * 2003-12-29 2006-04-18 General Electric Company Micromachined ultrasonic transducer cells having compliant support structure
JP4201723B2 (ja) * 2004-02-13 2008-12-24 東京エレクトロン株式会社 容量検知型センサ素子
DE102004020204A1 (de) 2004-04-22 2005-11-10 Epcos Ag Verkapseltes elektrisches Bauelement und Verfahren zur Herstellung
US7346178B2 (en) * 2004-10-29 2008-03-18 Silicon Matrix Pte. Ltd. Backplateless silicon microphone
US7329933B2 (en) 2004-10-29 2008-02-12 Silicon Matrix Pte. Ltd. Silicon microphone with softly constrained diaphragm
JP4539450B2 (ja) 2004-11-04 2010-09-08 オムロン株式会社 容量型振動センサ及びその製造方法
KR100685092B1 (ko) * 2005-03-14 2007-02-22 주식회사 케이이씨 Ｍｅｍｓ 공정을 이용한 마이크로폰 및 그 제조 방법
US7885423B2 (en) 2005-04-25 2011-02-08 Analog Devices, Inc. Support apparatus for microphone diaphragm
US7449356B2 (en) 2005-04-25 2008-11-11 Analog Devices, Inc. Process of forming a microphone using support member
US7825484B2 (en) * 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
SG127754A1 (en) * 2005-05-16 2006-12-29 Sensfab Pte Ltd Silicon microphone
DE102005031601B4 (de) * 2005-07-06 2016-03-03 Robert Bosch Gmbh Kapazitives, mikromechanisches Mikrofon
US8351632B2 (en) 2005-08-23 2013-01-08 Analog Devices, Inc. Noise mitigating microphone system and method
KR20080009735A (ko) 2005-09-09 2008-01-29 야마하 가부시키가이샤 캐패시터 마이크로폰
KR100765149B1 (ko) * 2005-10-05 2007-10-15 전자부품연구원 초소형 음향 감지 장치 및 그 제조 방법
KR100785803B1 (ko) * 2005-12-07 2007-12-13 한국전자통신연구원 판 스프링 구조를 갖는 초소형 마이크로 폰, 스피커 및이를 이용한 음성 인식／합성장치
DE102006001493B4 (de) * 2006-01-11 2007-10-18 Austriamicrosystems Ag MEMS-Sensor und Verfahren zur Herstellung
CN101371614A (zh) * 2006-01-20 2009-02-18 模拟设备公司 用于电容式传声器隔膜的支撑设备
JP4811035B2 (ja) * 2006-01-31 2011-11-09 パナソニック電工株式会社 音響センサ
JP4605470B2 (ja) * 2006-03-31 2011-01-05 ヤマハ株式会社 コンデンサマイクロホン
JP2007228345A (ja) * 2006-02-24 2007-09-06 Yamaha Corp コンデンサマイクロホン
JP4737720B2 (ja) * 2006-03-06 2011-08-03 ヤマハ株式会社 ダイヤフラム及びその製造方法並びにそのダイヤフラムを有するコンデンサマイクロホン及びその製造方法
JP4737719B2 (ja) * 2006-02-24 2011-08-03 ヤマハ株式会社 コンデンサマイクロホン
JP4737721B2 (ja) * 2006-03-10 2011-08-03 ヤマハ株式会社 コンデンサマイクロホン
JP2007267049A (ja) * 2006-03-29 2007-10-11 Yamaha Corp コンデンサマイクロホン
GB0605576D0 (en) 2006-03-20 2006-04-26 Oligon Ltd MEMS device
JP4605544B2 (ja) * 2006-03-29 2011-01-05 ヤマハ株式会社 コンデンサマイクロホン
TW200746869A (en) 2006-03-29 2007-12-16 Yamaha Corp Condenser microphone
US8270634B2 (en) 2006-07-25 2012-09-18 Analog Devices, Inc. Multiple microphone system
JP4567643B2 (ja) * 2006-08-24 2010-10-20 パナソニック株式会社 コンデンサ及びその製造方法
CN101141832B (zh) * 2006-09-06 2011-04-20 歌尔声学股份有限公司 单膜电容式传声器芯片
JP2010506532A (ja) 2006-10-11 2010-02-25 メムス テクノロジー ビーエイチディー 極低圧力センサーおよびその製造方法
US7894622B2 (en) 2006-10-13 2011-02-22 Merry Electronics Co., Ltd. Microphone
JP4144640B2 (ja) 2006-10-13 2008-09-03 オムロン株式会社 振動センサの製造方法
EP1931173B1 (de) 2006-12-06 2011-07-20 Electronics and Telecommunications Research Institute Kondensatormikrofon mit Membran mit Biegescharnier und Herstellungsverfahren dafür
US8111871B2 (en) 2007-01-17 2012-02-07 Analog Devices, Inc. Microphone with pressure relief
JP5029147B2 (ja) 2007-06-04 2012-09-19 オムロン株式会社 音響センサ
JP5034692B2 (ja) * 2007-06-04 2012-09-26 オムロン株式会社 音響センサ
JP5412031B2 (ja) * 2007-07-24 2014-02-12 ローム株式会社 Ｍｅｍｓセンサ
GB2452941B (en) * 2007-09-19 2012-04-11 Wolfson Microelectronics Plc Mems device and process
GB2453105B (en) * 2007-09-19 2011-01-12 Wolfson Microelectronics Plc MEMS device and process
GB2453104B (en) * 2007-09-19 2012-04-25 Wolfson Microelectronics Plc Mems device and process
JP2009089100A (ja) * 2007-09-28 2009-04-23 Yamaha Corp 振動トランスデューサ
US20090136064A1 (en) 2007-09-28 2009-05-28 Yamaha Corporation Vibration transducer and manufacturing method therefor
US8045733B2 (en) * 2007-10-05 2011-10-25 Shandong Gettop Acoustic Co., Ltd. Silicon microphone with enhanced impact proof structure using bonding wires
KR100932754B1 (ko) * 2007-12-12 2009-12-21 에스텍 주식회사 다기능 스피커
US7888754B2 (en) 2007-12-28 2011-02-15 Yamaha Corporation MEMS transducer
US8327711B2 (en) 2008-02-20 2012-12-11 Omron Corporation Electrostatic capacitive vibrating sensor
JP5332373B2 (ja) 2008-07-25 2013-11-06 オムロン株式会社 静電容量型振動センサ
JP4419103B1 (ja) 2008-08-27 2010-02-24 オムロン株式会社 静電容量型振動センサ
JP2010074523A (ja) * 2008-09-18 2010-04-02 Rohm Co Ltd 犠牲層のエッチング方法、ｍｅｍｓデバイスの製造方法およびｍｅｍｓデバイス
JP2010155306A (ja) 2008-12-26 2010-07-15 Panasonic Corp Ｍｅｍｓデバイス及びその製造方法
GB2467848B (en) * 2009-02-13 2011-01-12 Wolfson Microelectronics Plc MEMS device and process
US8363860B2 (en) 2009-03-26 2013-01-29 Analog Devices, Inc. MEMS microphone with spring suspended backplate
EP2239961A1 (de) * 2009-04-06 2010-10-13 Nxp B.V. Rückplatte für ein Mikrofon
DE102009026682A1 (de) * 2009-06-03 2010-12-09 Robert Bosch Gmbh Bauelement mit einer mikromechanischen Mikrofonstruktur und Verfahren zu dessen Herstellung
JP5513813B2 (ja) * 2009-08-31 2014-06-04 新日本無線株式会社 Ｍｅｍｓマイクロフォンおよびその製造方法
CN102056061A (zh) * 2009-10-29 2011-05-11 苏州敏芯微电子技术有限公司 电容式微型硅麦克风及其制造方法
DE102010000666A1 (de) * 2010-01-05 2011-07-07 Robert Bosch GmbH, 70469 Bauelement mit einer mikromechanischen Mikrofonstruktur und Verfahren zu dessen Herstellung
CN102223591B (zh) * 2010-04-19 2015-04-01 联华电子股份有限公司 微机电系统麦克风的晶片级封装结构及其制造方法
JP5402823B2 (ja) 2010-05-13 2014-01-29 オムロン株式会社 音響センサ
JP4947220B2 (ja) 2010-05-13 2012-06-06 オムロン株式会社 音響センサ及びマイクロフォン
JP5400708B2 (ja) 2010-05-27 2014-01-29 オムロン株式会社 音響センサ、音響トランスデューサ、該音響トランスデューサを利用したマイクロフォン、および音響トランスデューサの製造方法
JP2012070120A (ja) * 2010-09-22 2012-04-05 Panasonic Corp センサ
CN102740203A (zh) * 2011-04-06 2012-10-17 美律实业股份有限公司 结合式微机电麦克风及其制造方法
US20120328132A1 (en) * 2011-06-27 2012-12-27 Yunlong Wang Perforated Miniature Silicon Microphone
CN103999484B (zh) 2011-11-04 2017-06-30 美商楼氏电子有限公司 作为声学设备中的屏障的嵌入式电介质和制造方法
JP5177309B1 (ja) * 2012-01-31 2013-04-03 オムロン株式会社 静電容量型センサ
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
DE102012215251A1 (de) * 2012-08-28 2013-03-21 Robert Bosch Gmbh MEMS-Bauelement
JP5987572B2 (ja) 2012-09-11 2016-09-07 オムロン株式会社 音響トランスデューサ
JP5991475B2 (ja) 2012-09-14 2016-09-14 オムロン株式会社 音響トランスデューサ
CN102873020B (zh) * 2012-10-12 2015-05-06 北京七星华创电子股份有限公司 兆声波换能器的连接盖
KR101496817B1 (ko) * 2013-08-09 2015-02-27 삼성전기주식회사 음향 변환기
JP6179300B2 (ja) 2013-09-13 2017-08-16 オムロン株式会社 音響トランスデューサ、およびマイクロホン
JP6345926B2 (ja) * 2013-10-07 2018-06-20 新日本無線株式会社 Ｍｅｍｓ素子およびその製造方法
US20150162523A1 (en) 2013-12-06 2015-06-11 Murata Manufacturing Co., Ltd. Piezoelectric device
DE102014202009A1 (de) * 2014-02-05 2015-08-06 Robert Bosch Gmbh Verfahren und Mittel zum Regeln der elektrischen Vorspannung am Messkondensator eines MEMS-Sensorelements
US20150296306A1 (en) * 2014-04-10 2015-10-15 Knowles Electronics, Llc. Mems motors having insulated substrates
US10158951B2 (en) 2014-06-27 2018-12-18 Goertek Inc. Silicon microphone with suspended diaphragm and system with the same
CN105323687A (zh) * 2014-07-14 2016-02-10 北京卓锐微技术有限公司 一种多晶硅层上设置有突起的硅电容麦克风及其制备方法
CN104105041B (zh) * 2014-07-31 2019-01-04 歌尔股份有限公司 硅基mems麦克风及其制作方法
US9743191B2 (en) 2014-10-13 2017-08-22 Knowles Electronics, Llc Acoustic apparatus with diaphragm supported at a discrete number of locations
US9872116B2 (en) 2014-11-24 2018-01-16 Knowles Electronics, Llc Apparatus and method for detecting earphone removal and insertion
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
US9859879B2 (en) 2015-09-11 2018-01-02 Knowles Electronics, Llc Method and apparatus to clip incoming signals in opposing directions when in an off state
US9401158B1 (en) 2015-09-14 2016-07-26 Knowles Electronics, Llc Microphone signal fusion
CN106841396B (zh) * 2015-12-03 2019-05-28 中国科学院上海微系统与信息技术研究所 硅基电容式声发射传感器及其制备方法
US9779716B2 (en) 2015-12-30 2017-10-03 Knowles Electronics, Llc Occlusion reduction and active noise reduction based on seal quality
US9830930B2 (en) 2015-12-30 2017-11-28 Knowles Electronics, Llc Voice-enhanced awareness mode
US9812149B2 (en) 2016-01-28 2017-11-07 Knowles Electronics, Llc Methods and systems for providing consistency in noise reduction during speech and non-speech periods
KR101807071B1 (ko) * 2016-10-06 2017-12-08 현대자동차 주식회사 마이크로폰 및 그 제조 방법
KR101807069B1 (ko) 2016-10-21 2017-12-08 현대자동차 주식회사 마이크로폰 및 그 제조방법
JP6930101B2 (ja) * 2016-12-12 2021-09-01 オムロン株式会社 音響センサ及び静電容量型トランスデューサ
KR102322258B1 (ko) * 2017-05-19 2021-11-04 현대자동차 주식회사 마이크로폰 및 그 제조 방법
DE102017217151B3 (de) 2017-09-27 2019-01-03 Robert Bosch Gmbh Mikromechanischer Sensor
JP7067891B2 (ja) 2017-10-18 2022-05-16 Ｍｍｉセミコンダクター株式会社 トランスデューサ
WO2020072938A1 (en) 2018-10-05 2020-04-09 Knowles Electronics, Llc Methods of forming mems diaphragms including corrugations
DE112019004970T5 (de) 2018-10-05 2021-06-24 Knowles Electronics, Llc Mikrofonvorrichtung mit Eindringschutz
US10939214B2 (en) 2018-10-05 2021-03-02 Knowles Electronics, Llc Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance
CN110657880B (zh) * 2019-09-19 2022-05-03 天津大学 一种基于共振空气腔的新型水听器
CN111405444B (zh) * 2020-03-20 2022-01-25 西人马联合测控（泉州）科技有限公司 一种振膜带孔的电容式麦克风及其制造方法
US11528546B2 (en) 2021-04-05 2022-12-13 Knowles Electronics, Llc Sealed vacuum MEMS die
US11540048B2 (en) 2021-04-16 2022-12-27 Knowles Electronics, Llc Reduced noise MEMS device with force feedback
US11649161B2 (en) 2021-07-26 2023-05-16 Knowles Electronics, Llc Diaphragm assembly with non-uniform pillar distribution
US11772961B2 (en) 2021-08-26 2023-10-03 Knowles Electronics, Llc MEMS device with perimeter barometric relief pierce
US11780726B2 (en) 2021-11-03 2023-10-10 Knowles Electronics, Llc Dual-diaphragm assembly having center constraint

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4360955A (en) * 1978-05-08 1982-11-30 Barry Block Method of making a capacitive force transducer
JPS5938621A (ja) * 1982-08-27 1984-03-02 Nissan Motor Co Ltd 振動分析装置
JPS6055655A (ja) * 1983-09-07 1985-03-30 Nissan Motor Co Ltd 梁構造体を有する半導体装置
JPS61105861A (ja) * 1985-06-05 1986-05-23 Nissan Motor Co Ltd 梁構造体を有する半導体装置
JPH0726887B2 (ja) * 1986-05-31 1995-03-29 株式会社堀場製作所 コンデンサマイクロフオン型検出器用ダイアフラム
NL8702589A (nl) * 1987-10-30 1989-05-16 Microtel Bv Elektro-akoestische transducent van de als elektreet aangeduide soort, en een werkwijze voor het vervaardigen van een dergelijke transducent.
JPH05172843A (ja) * 1991-12-25 1993-07-13 Omron Corp 半導体加速度センサ
DE69325732T2 (de) * 1992-03-18 2000-04-27 Knowles Electronics Inc Festkörper-Kondensatormikrofon
US5452268A (en) * 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
JP3472493B2 (ja) * 1998-11-30 2003-12-02 ホシデン株式会社 半導体エレクトレットコンデンサーマイクロホン

Also Published As

Publication number Publication date
DE60118208T2 (de) 2007-04-12
WO2002015636A3 (en) 2002-10-24
EP1310136A2 (de) 2003-05-14
DE60118208D1 (de) 2006-05-11
JP2009153203A (ja) 2009-07-09
EP1469701B1 (de) 2008-04-16
EP1469701A2 (de) 2004-10-20
WO2002015636A2 (en) 2002-02-21
CN101867858A (zh) 2010-10-20
JP4338395B2 (ja) 2009-10-07
ATE321429T1 (de) 2006-04-15
JP2004506394A (ja) 2004-02-26
CN101867858B (zh) 2012-02-22
CN1498513B (zh) 2010-07-14
DK1469701T3 (da) 2008-08-18
DE60133679T2 (de) 2009-06-10
JP5049312B2 (ja) 2012-10-17
EP1469701A3 (de) 2005-11-16
KR20030033026A (ko) 2003-04-26
DE60133679D1 (de) 2008-05-29
DK1310136T3 (da) 2006-07-31
JP2007116721A (ja) 2007-05-10
EP1310136B1 (de) 2006-03-22
AU2001281241A1 (en) 2002-02-25
CN1498513A (zh) 2004-05-19
KR100571967B1 (ko) 2006-04-18

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