DE60017628D1 - Halbleiteranordnung - Google Patents
HalbleiteranordnungInfo
- Publication number
- DE60017628D1 DE60017628D1 DE60017628T DE60017628T DE60017628D1 DE 60017628 D1 DE60017628 D1 DE 60017628D1 DE 60017628 T DE60017628 T DE 60017628T DE 60017628 T DE60017628 T DE 60017628T DE 60017628 D1 DE60017628 D1 DE 60017628D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
- G11C5/145—Applications of charge pumps; Boosted voltage circuits; Clamp circuits therefor
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
- G11C5/147—Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/08—Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Dram (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10260599A JP3506633B2 (ja) | 1999-04-09 | 1999-04-09 | 半導体装置 |
JP10260599 | 1999-04-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60017628D1 true DE60017628D1 (de) | 2005-03-03 |
DE60017628T2 DE60017628T2 (de) | 2006-03-30 |
Family
ID=14331881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60017628T Expired - Fee Related DE60017628T2 (de) | 1999-04-09 | 2000-02-29 | Halbleiteranordnung |
Country Status (5)
Country | Link |
---|---|
US (1) | US6304508B1 (de) |
EP (1) | EP1043727B1 (de) |
JP (1) | JP3506633B2 (de) |
KR (1) | KR100600461B1 (de) |
DE (1) | DE60017628T2 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002093195A (ja) * | 2000-09-18 | 2002-03-29 | Mitsubishi Electric Corp | 半導体記憶装置および半導体記憶装置のテスト方法 |
US6545310B2 (en) * | 2001-04-30 | 2003-04-08 | Motorola, Inc. | Non-volatile memory with a serial transistor structure with isolated well and method of operation |
US11984165B2 (en) * | 2022-05-24 | 2024-05-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory device with reduced area |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2838344B2 (ja) * | 1992-10-28 | 1998-12-16 | 三菱電機株式会社 | 半導体装置 |
JP2851757B2 (ja) * | 1992-12-18 | 1999-01-27 | 三菱電機株式会社 | 半導体装置および半導体記憶装置 |
US5600598A (en) * | 1994-12-14 | 1997-02-04 | Mosaid Technologies Incorporated | Memory cell and wordline driver for embedded DRAM in ASIC process |
JP3704188B2 (ja) * | 1996-02-27 | 2005-10-05 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
JPH10284705A (ja) * | 1997-04-10 | 1998-10-23 | Hitachi Ltd | ダイナミック型ram |
JP4330183B2 (ja) * | 1997-09-30 | 2009-09-16 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
-
1999
- 1999-04-09 JP JP10260599A patent/JP3506633B2/ja not_active Expired - Fee Related
-
2000
- 2000-02-29 DE DE60017628T patent/DE60017628T2/de not_active Expired - Fee Related
- 2000-02-29 EP EP00104156A patent/EP1043727B1/de not_active Expired - Lifetime
- 2000-03-06 US US09/519,573 patent/US6304508B1/en not_active Expired - Lifetime
- 2000-03-07 KR KR1020000011293A patent/KR100600461B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1043727A3 (de) | 2001-07-11 |
EP1043727B1 (de) | 2005-01-26 |
EP1043727A2 (de) | 2000-10-11 |
JP2000294751A (ja) | 2000-10-20 |
US6304508B1 (en) | 2001-10-16 |
DE60017628T2 (de) | 2006-03-30 |
KR20000076782A (ko) | 2000-12-26 |
JP3506633B2 (ja) | 2004-03-15 |
KR100600461B1 (ko) | 2006-07-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60006892D1 (de) | Halbleiteranordnung | |
DE69935182D1 (de) | Halbleiteranordnung | |
DE60034070D1 (de) | Integrierte Halbleitervorrichtung | |
DE69912565D1 (de) | Halbleiteranordnung | |
DE60129073D1 (de) | Halbleiterspeicheranordnung | |
DE69809694D1 (de) | Halbleiteranordnung | |
DE60102257D1 (de) | Halbleiterspeicheranordnung | |
DE60213889D1 (de) | Halbleiteranordnung | |
DE69937739D1 (de) | Halbleitervorrichtung | |
DE60024818D1 (de) | Strammvorrichtung | |
NO20000693D0 (no) | Festeanordning | |
DE60005959D1 (de) | Halbleiteranordnung | |
DE69923374D1 (de) | Halbleiteranordnung | |
DE60142141D1 (de) | Halbleiterbauelement | |
DE50006032D1 (de) | Greifervorrichtung | |
DE69934853D1 (de) | Halbleiterspeicheranordnung | |
DK1026405T3 (da) | Fastgørelsesanordning | |
FR2810160B1 (fr) | Dispositif a semiconducteur | |
DE10191585B8 (de) | Halbleitervorrichtung | |
DE60107174D1 (de) | Halbleiterspeicheranordnung | |
DE69902712D1 (de) | Halbleiterspeicheranordnung | |
DE69927476D1 (de) | Halbleiteranordnung | |
DE69937844D1 (de) | Verpackungsvorrichtung | |
DE60033467D1 (de) | Halbleiterspeicheranordnung | |
DE60019144D1 (de) | Halbleitervorrichtung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |