DE60107174D1 - Halbleiterspeicheranordnung - Google Patents

Halbleiterspeicheranordnung

Info

Publication number
DE60107174D1
DE60107174D1 DE60107174T DE60107174T DE60107174D1 DE 60107174 D1 DE60107174 D1 DE 60107174D1 DE 60107174 T DE60107174 T DE 60107174T DE 60107174 T DE60107174 T DE 60107174T DE 60107174 D1 DE60107174 D1 DE 60107174D1
Authority
DE
Germany
Prior art keywords
memory device
semiconductor memory
semiconductor
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60107174T
Other languages
English (en)
Other versions
DE60107174T2 (de
Inventor
Daisaburo Takashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE60107174D1 publication Critical patent/DE60107174D1/de
Publication of DE60107174T2 publication Critical patent/DE60107174T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
DE60107174T 2000-09-05 2001-09-05 Halbleiterspeicheranordnung Expired - Lifetime DE60107174T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000269223 2000-09-05
JP2000269223A JP2002083493A (ja) 2000-09-05 2000-09-05 半導体記憶装置

Publications (2)

Publication Number Publication Date
DE60107174D1 true DE60107174D1 (de) 2004-12-23
DE60107174T2 DE60107174T2 (de) 2005-11-10

Family

ID=18755870

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60107174T Expired - Lifetime DE60107174T2 (de) 2000-09-05 2001-09-05 Halbleiterspeicheranordnung

Country Status (6)

Country Link
US (1) US6574133B2 (de)
EP (1) EP1187141B1 (de)
JP (1) JP2002083493A (de)
KR (1) KR100504315B1 (de)
DE (1) DE60107174T2 (de)
TW (1) TW556216B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002083493A (ja) * 2000-09-05 2002-03-22 Toshiba Corp 半導体記憶装置
US6522569B2 (en) * 2000-09-20 2003-02-18 Kabushiki Kaisha Toshiba Semiconductor memory device
US6587367B1 (en) * 2002-03-19 2003-07-01 Texas Instruments Incorporated Dummy cell structure for 1T1C FeRAM cell array
US6788602B2 (en) * 2002-08-09 2004-09-07 Macronix International Co., Ltd. Memory device and operation thereof
US6822891B1 (en) * 2003-06-16 2004-11-23 Kabushiki Kaisha Toshiba Ferroelectric memory device
US7269048B2 (en) * 2003-09-22 2007-09-11 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device
JP4074279B2 (ja) * 2003-09-22 2008-04-09 株式会社東芝 半導体集積回路装置、デジタルカメラ、デジタルビデオカメラ、コンピュータシステム、携帯コンピュータシステム、論理可変ｌｓｉ装置、ｉｃカード、ナビゲーションシステム、ロボット、画像表示装置、光ディスク記憶装置
KR100568861B1 (ko) * 2003-12-15 2006-04-10 삼성전자주식회사 레퍼런스 전압 발생 회로를 갖는 강유전체 메모리 장치
KR100631923B1 (ko) * 2004-10-12 2006-10-04 삼성전자주식회사 반도체 메모리에서의 레퍼런스전압 공급장치 및 그의구동방법
KR100562646B1 (ko) * 2004-12-22 2006-03-20 주식회사 하이닉스반도체 저전압용 반도체 메모리 장치
JP2007058958A (ja) * 2005-08-23 2007-03-08 Toshiba Corp 強誘電体半導体記憶装置
JP4840720B2 (ja) * 2005-10-06 2011-12-21 セイコーエプソン株式会社 半導体記憶装置および電子機器
JP2010160851A (ja) * 2009-01-08 2010-07-22 Toshiba Corp 参照電圧発生回路および半導体記憶装置
JP5156069B2 (ja) * 2010-09-17 2013-03-06 株式会社東芝 強誘電体メモリ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06208790A (ja) * 1993-01-12 1994-07-26 Toshiba Corp 半導体装置
JP3278981B2 (ja) * 1993-06-23 2002-04-30 株式会社日立製作所 半導体メモリ
EP0735540B1 (de) * 1995-03-31 2002-06-19 Infineon Technologies AG Nieder-Leistungs-Leseverstärker des Typs Gain Speicherzelle
US5917365A (en) * 1996-04-19 1999-06-29 Texas Instruments Incorporated Optimizing the operating characteristics of a CMOS integrated circuit
JP3766181B2 (ja) * 1996-06-10 2006-04-12 株式会社東芝 半導体記憶装置とそれを搭載したシステム
JP4083276B2 (ja) * 1998-02-27 2008-04-30 富士通株式会社 半導体記憶装置及び記憶情報の読み出し書き込み方法
JP2000349251A (ja) * 1999-06-09 2000-12-15 Nissan Motor Co Ltd 半導体装置
JP2002083493A (ja) * 2000-09-05 2002-03-22 Toshiba Corp 半導体記憶装置
DE10053171C2 (de) * 2000-10-26 2003-02-06 Infineon Technologies Ag Verfahren zum Herstellen einer ferroelektrischen oder paraelektrischen metalloxidhaltigen Schicht und eines Speicherbauelements daraus

Also Published As

Publication number Publication date
TW556216B (en) 2003-10-01
US6574133B2 (en) 2003-06-03
EP1187141B1 (de) 2004-11-17
KR100504315B1 (ko) 2005-07-28
EP1187141A3 (de) 2003-01-08
DE60107174T2 (de) 2005-11-10
US20020027797A1 (en) 2002-03-07
EP1187141A2 (de) 2002-03-13
JP2002083493A (ja) 2002-03-22
KR20020019411A (ko) 2002-03-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition