DE60032644D1 - Halbleiter-speicherbaustein - Google Patents

Halbleiter-speicherbaustein

Info

Publication number
DE60032644D1
DE60032644D1 DE60032644T DE60032644T DE60032644D1 DE 60032644 D1 DE60032644 D1 DE 60032644D1 DE 60032644 T DE60032644 T DE 60032644T DE 60032644 T DE60032644 T DE 60032644T DE 60032644 D1 DE60032644 D1 DE 60032644D1
Authority
DE
Germany
Prior art keywords
semiconductor memory
memory module
module
semiconductor
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60032644T
Other languages
English (en)
Other versions
DE60032644T2 (de
Inventor
Shouichi Kawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE60032644D1 publication Critical patent/DE60032644D1/de
Application granted granted Critical
Publication of DE60032644T2 publication Critical patent/DE60032644T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/24—Bit-line control circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/26—Sensing or reading circuits; Data output circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
DE60032644T 2000-06-29 2000-06-29 Halbleiter-speicherbaustein Expired - Lifetime DE60032644T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/004310 WO2002001574A1 (fr) 2000-06-29 2000-06-29 Memoire a semi-conducteurs

Publications (2)

Publication Number Publication Date
DE60032644D1 true DE60032644D1 (de) 2007-02-08
DE60032644T2 DE60032644T2 (de) 2007-10-04

Family

ID=11736201

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60032644T Expired - Lifetime DE60032644T2 (de) 2000-06-29 2000-06-29 Halbleiter-speicherbaustein

Country Status (4)

Country Link
US (1) US7102928B2 (de)
EP (1) EP1310963B1 (de)
DE (1) DE60032644T2 (de)
WO (1) WO2002001574A1 (de)

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JP4537680B2 (ja) 2003-08-04 2010-09-01 株式会社東芝 不揮発性半導体記憶装置及びその動作方法、製造方法、半導体集積回路及びシステム
US6967366B2 (en) * 2003-08-25 2005-11-22 Freescale Semiconductor, Inc. Magnetoresistive random access memory with reduced switching field variation
DE602004010239T2 (de) * 2004-05-20 2008-09-25 Stmicroelectronics S.R.L., Agrate Brianza Verbesserter Seitenspeicher für eine programmierbare Speichervorrichtung
US7379333B2 (en) 2004-10-28 2008-05-27 Samsung Electronics Co., Ltd. Page-buffer and non-volatile semiconductor memory including page buffer
JP4519612B2 (ja) * 2004-11-16 2010-08-04 株式会社東芝 不揮発性半導体記憶装置
US7298648B2 (en) * 2004-11-19 2007-11-20 Samsung Electronics Co., Ltd. Page buffer and multi-state nonvolatile memory device including the same
JP2006252624A (ja) * 2005-03-09 2006-09-21 Toshiba Corp 半導体記憶装置
JP4836487B2 (ja) * 2005-04-28 2011-12-14 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置
JP4822768B2 (ja) * 2005-08-26 2011-11-24 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置
JP5020608B2 (ja) * 2005-11-23 2012-09-05 三星電子株式会社 低負荷ビットライン構造を有する不揮発性半導体メモリ及びそのプログラミング方法
JP5016888B2 (ja) * 2006-10-04 2012-09-05 株式会社東芝 不揮発性半導体記憶装置
US7505298B2 (en) * 2007-04-30 2009-03-17 Spansion Llc Transfer of non-associated information on flash memory devices
US8549209B2 (en) * 2008-11-04 2013-10-01 Mosaid Technologies Incorporated Bridging device having a configurable virtual page size
JP5528869B2 (ja) * 2010-03-23 2014-06-25 スパンション エルエルシー 不揮発性半導体記憶装置及びその読み出し方法
JP5696065B2 (ja) * 2011-02-04 2015-04-08 株式会社東芝 半導体記憶装置の製造方法
KR20120119322A (ko) * 2011-04-21 2012-10-31 에스케이하이닉스 주식회사 반도체 메모리 장치
JP5674630B2 (ja) * 2011-12-02 2015-02-25 株式会社東芝 暗号化演算装置を搭載する不揮発性半導体記憶装置
US8593860B2 (en) 2011-12-09 2013-11-26 Gsi Technology, Inc. Systems and methods of sectioned bit line memory arrays
US8693236B2 (en) 2011-12-09 2014-04-08 Gsi Technology, Inc. Systems and methods of sectioned bit line memory arrays, including hierarchical and/or other features
JP2014026705A (ja) * 2012-07-27 2014-02-06 Toshiba Corp 不揮発性半導体記憶装置およびその使用方法
JP2014170599A (ja) 2013-03-01 2014-09-18 Toshiba Corp 半導体記憶装置
JP2014179142A (ja) 2013-03-14 2014-09-25 Toshiba Corp 半導体記憶装置
TWI509619B (zh) * 2013-10-29 2015-11-21 Macronix Int Co Ltd 記憶體之積體電路及其操作方法
US9191003B2 (en) * 2013-11-05 2015-11-17 Macronix International Co., Ltd. Integrated circuit for memory and operating method thereof
CN115862712A (zh) * 2021-03-30 2023-03-28 长江存储科技有限责任公司 三维存储器件和用于增强的页寄存器复位的方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911980B2 (ja) * 1975-12-23 1984-03-19 日本電気株式会社 ランダムアクセスメモリソウチ
JPS6363196A (ja) * 1986-09-02 1988-03-19 Fujitsu Ltd 半導体記憶装置
US5008856A (en) * 1987-06-29 1991-04-16 Kabushiki Kaisha Toshiba Electrically programmable nonvolatile semiconductor memory device with NAND cell structure
JPH01171195A (ja) * 1987-12-25 1989-07-06 Sony Corp メモリ装置
JPH02156497A (ja) * 1988-12-07 1990-06-15 Mitsubishi Electric Corp 半導体記憶装置
US5369609A (en) * 1992-03-13 1994-11-29 Silicon Storage Technology, Inc. Floating gate memory array with latches having improved immunity to write disturbance, and with storage latches
JPH06103789A (ja) 1992-09-18 1994-04-15 Oki Micro Design Miyazaki:Kk 不揮発性メモリ方式
JP3397404B2 (ja) * 1993-08-09 2003-04-14 株式会社日立製作所 半導体記憶装置
JPH07114794A (ja) 1993-10-19 1995-05-02 Matsushita Electric Ind Co Ltd 半導体記憶装置
JP3726337B2 (ja) * 1995-05-02 2005-12-14 ヤマハ株式会社 半導体記憶装置
US5912842A (en) * 1995-11-14 1999-06-15 Programmable Microelectronics Corp. Nonvolatile PMOS two transistor memory cell and array
US5682350A (en) * 1996-03-29 1997-10-28 Aplus Integrated Circuits, Inc. Flash memory with divided bitline
JPH1011981A (ja) * 1996-06-19 1998-01-16 Sony Corp 不揮発性半導体記憶装置
US6134172A (en) * 1996-12-26 2000-10-17 Rambus Inc. Apparatus for sharing sense amplifiers between memory banks
JP3489958B2 (ja) * 1997-03-19 2004-01-26 富士通株式会社 不揮発性半導体記憶装置
JPH10334662A (ja) * 1997-05-29 1998-12-18 Nec Corp 半導体記憶装置
JPH11195300A (ja) * 1997-12-26 1999-07-21 Sony Corp 不揮発性半導体記憶装置
JP3159159B2 (ja) * 1998-03-19 2001-04-23 日本電気株式会社 半導体記憶装置

Also Published As

Publication number Publication date
US7102928B2 (en) 2006-09-05
EP1310963A4 (de) 2005-08-10
DE60032644T2 (de) 2007-10-04
WO2002001574A1 (fr) 2002-01-03
EP1310963B1 (de) 2006-12-27
US20030072175A1 (en) 2003-04-17
EP1310963A1 (de) 2003-05-14

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: KAWAMURA, SHOUICHI, KAWASAKI-SHI, KANAGAWA 211, JP

8364 No opposition during term of opposition