DE60034070D1 - Integrierte Halbleitervorrichtung - Google Patents

Integrierte Halbleitervorrichtung

Info

Publication number
DE60034070D1
DE60034070D1 DE60034070T DE60034070T DE60034070D1 DE 60034070 D1 DE60034070 D1 DE 60034070D1 DE 60034070 T DE60034070 T DE 60034070T DE 60034070 T DE60034070 T DE 60034070T DE 60034070 D1 DE60034070 D1 DE 60034070D1
Authority
DE
Germany
Prior art keywords
semiconductor device
integrated semiconductor
integrated
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60034070T
Other languages
English (en)
Other versions
DE60034070T2 (de
Inventor
Yoshiaki Kamigaki
Shinichi Minami
Kozo Katayama
Masataka Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE60034070D1 publication Critical patent/DE60034070D1/de
Publication of DE60034070T2 publication Critical patent/DE60034070T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/5671—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge trapping in an insulator
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0466—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS]
    • G11C16/0475—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS] comprising two or more independent storage sites which store independent data
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40117—Multistep manufacturing processes for data storage electrodes the electrodes comprising a charge-trapping insulator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66825—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a floating gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66833—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a charge trapping gate insulator, e.g. MNOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7887—Programmable transistors with more than two possible different levels of programmation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
    • H01L29/7923—Programmable transistors with more than two possible different levels of programmation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/10—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the top-view layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
  • Read Only Memory (AREA)
DE60034070T 1999-09-17 2000-09-11 Integrierte Halbleitervorrichtung Expired - Lifetime DE60034070T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP26315599 1999-09-17
JP26315499 1999-09-17
JP26315599 1999-09-17
JP26315499 1999-09-17
JP2000083246 2000-03-21
JP2000083246A JP4058219B2 (ja) 1999-09-17 2000-03-21 半導体集積回路

Publications (2)

Publication Number Publication Date
DE60034070D1 true DE60034070D1 (de) 2007-05-03
DE60034070T2 DE60034070T2 (de) 2007-10-25

Family

ID=27335204

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60004614T Expired - Lifetime DE60004614T2 (de) 1999-09-17 2000-09-11 Integrierte Halbleitervorrichtung
DE60034070T Expired - Lifetime DE60034070T2 (de) 1999-09-17 2000-09-11 Integrierte Halbleitervorrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60004614T Expired - Lifetime DE60004614T2 (de) 1999-09-17 2000-09-11 Integrierte Halbleitervorrichtung

Country Status (6)

Country Link
US (3) US6531735B1 (de)
EP (2) EP1085519B1 (de)
JP (1) JP4058219B2 (de)
KR (1) KR100776871B1 (de)
DE (2) DE60004614T2 (de)
TW (1) TW530303B (de)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19946883A1 (de) * 1999-09-30 2001-04-12 Micronas Gmbh Verfahren zur Herstellung eines integrierten CMOS-Halbleiterspeichers
JP4899241B2 (ja) * 1999-12-06 2012-03-21 ソニー株式会社 不揮発性半導体記憶装置およびその動作方法
JP4923321B2 (ja) * 2000-09-12 2012-04-25 ソニー株式会社 不揮発性半導体記憶装置の動作方法
JP4058232B2 (ja) 2000-11-29 2008-03-05 株式会社ルネサステクノロジ 半導体装置及びｉｃカード
JP4083975B2 (ja) * 2000-12-11 2008-04-30 株式会社ルネサステクノロジ 半導体装置
JP3496932B2 (ja) 2001-01-30 2004-02-16 セイコーエプソン株式会社 不揮発性半導体記憶装置を含む半導体集積回路装置
JP4715024B2 (ja) * 2001-05-08 2011-07-06 セイコーエプソン株式会社 不揮発性半導体記憶装置のプログラム方法
JP2002334588A (ja) * 2001-05-11 2002-11-22 Seiko Epson Corp 不揮発性半導体記憶装置のプログラム方法
KR100416599B1 (ko) * 2001-05-31 2004-02-05 삼성전자주식회사 집적도와 독출동작 속도를 향상시키고 전력소모를감소시킬 수 있는 메탈 프로그래머블 롬의 메모리셀 구조
TW546840B (en) 2001-07-27 2003-08-11 Hitachi Ltd Non-volatile semiconductor memory device
WO2003015169A1 (fr) * 2001-08-07 2003-02-20 Renesas Technology Corp. Dispositif semi-conducteur et carte ci
JP2003091999A (ja) * 2001-09-19 2003-03-28 Seiko Epson Corp 不揮発性半導体記憶装置
JP2003091996A (ja) * 2001-09-19 2003-03-28 Seiko Epson Corp 不揮発性半導体記憶装置
JP2003091998A (ja) * 2001-09-19 2003-03-28 Seiko Epson Corp 不揮発性半導体記憶装置
JP2003218244A (ja) 2002-01-24 2003-07-31 Seiko Epson Corp 半導体装置の製造方法
JP3702851B2 (ja) * 2002-01-24 2005-10-05 セイコーエプソン株式会社 不揮発性半導体装置の昇圧回路
JP3993438B2 (ja) 2002-01-25 2007-10-17 株式会社ルネサステクノロジ 半導体装置
US6901010B1 (en) * 2002-04-08 2005-05-31 Advanced Micro Devices, Inc. Erase method for a dual bit memory cell
US6670672B1 (en) * 2002-06-21 2003-12-30 Macronix International Co., Ltd. Structure of discrete NROM cell
EP1376676A3 (de) * 2002-06-24 2008-08-20 Interuniversitair Microelektronica Centrum Vzw Multibit-Festwertspeicherbauelement und Verfahren
US6861707B1 (en) * 2002-06-28 2005-03-01 Progressant Technologies, Inc. Negative differential resistance (NDR) memory cell with reduced soft error rate
US8050085B2 (en) 2002-08-29 2011-11-01 Renesas Electronics Corporation Semiconductor processing device and IC card
JP2004152924A (ja) * 2002-10-30 2004-05-27 Renesas Technology Corp 半導体記憶素子および半導体装置
JP2004152977A (ja) 2002-10-30 2004-05-27 Renesas Technology Corp 半導体記憶装置
US6831325B2 (en) * 2002-12-20 2004-12-14 Atmel Corporation Multi-level memory cell with lateral floating spacers
US6816414B1 (en) * 2003-07-31 2004-11-09 Freescale Semiconductor, Inc. Nonvolatile memory and method of making same
JP2005056889A (ja) 2003-08-04 2005-03-03 Renesas Technology Corp 半導体記憶装置およびその製造方法
US7608882B2 (en) * 2003-08-11 2009-10-27 Macronix International Co., Ltd. Split-gate non-volatile memory
US6987689B2 (en) 2003-08-20 2006-01-17 International Business Machines Corporation Non-volatile multi-stable memory device and methods of making and using the same
JP2005085903A (ja) * 2003-09-05 2005-03-31 Renesas Technology Corp 半導体装置およびその製造方法
JP2005101174A (ja) * 2003-09-24 2005-04-14 Hitachi Ltd 不揮発性半導体記憶装置およびその製造方法
JP2005191542A (ja) * 2003-12-01 2005-07-14 Renesas Technology Corp 半導体記憶装置
US7050330B2 (en) * 2003-12-16 2006-05-23 Micron Technology, Inc. Multi-state NROM device
US7569882B2 (en) * 2003-12-23 2009-08-04 Interuniversitair Microelektronica Centrum (Imec) Non-volatile multibit memory cell and method of manufacturing thereof
JP2005209931A (ja) 2004-01-23 2005-08-04 Renesas Technology Corp 不揮発性半導体記憶装置およびその製造方法
JP2005223234A (ja) * 2004-02-09 2005-08-18 Renesas Technology Corp 半導体記憶装置およびその製造方法
JP4640918B2 (ja) * 2004-03-11 2011-03-02 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置及びその製造方法
JP2005302850A (ja) 2004-04-08 2005-10-27 Renesas Technology Corp 半導体記憶装置
JP2005353646A (ja) 2004-06-08 2005-12-22 Renesas Technology Corp 不揮発性半導体記憶装置およびその製造方法
JP2006048784A (ja) * 2004-08-02 2006-02-16 Renesas Technology Corp 不揮発性メモリ
JP2006060030A (ja) 2004-08-20 2006-03-02 Renesas Technology Corp 半導体記憶装置
JP2006059481A (ja) * 2004-08-23 2006-03-02 Renesas Technology Corp 半導体記憶装置
DE112004003019T5 (de) 2004-11-30 2008-01-03 Spansion LLC, Santa Clara Nicht-flüchtiges Speicherbauelement und Verfahren zu dessen Herstellung
CN101120443B (zh) * 2004-12-28 2010-04-14 斯班逊有限公司 半导体装置
EP1833091A4 (de) * 2004-12-28 2008-08-13 Spansion Llc Halbleitereinrichtung und betriebssteuerverfahren dafür
JP4628114B2 (ja) * 2005-01-20 2011-02-09 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置
JP4890435B2 (ja) * 2005-01-28 2012-03-07 スパンション エルエルシー 不揮発性メモリ及びその制御方法
US20060226467A1 (en) * 2005-04-07 2006-10-12 Macronix International Co., Ltd. P-channel charge trapping memory device with sub-gate
US7312495B2 (en) * 2005-04-07 2007-12-25 Spansion Llc Split gate multi-bit memory cell
US7091551B1 (en) * 2005-04-13 2006-08-15 International Business Machines Corporation Four-bit FinFET NVRAM memory device
JP4836487B2 (ja) 2005-04-28 2011-12-14 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置
US7158420B2 (en) * 2005-04-29 2007-01-02 Macronix International Co., Ltd. Inversion bit line, charge trapping non-volatile memory and method of operating same
US8099783B2 (en) * 2005-05-06 2012-01-17 Atmel Corporation Security method for data protection
JP4657813B2 (ja) * 2005-05-31 2011-03-23 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置
JP4790335B2 (ja) * 2005-07-07 2011-10-12 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置
KR100746198B1 (ko) * 2005-07-08 2007-08-06 삼성전자주식회사 데이터 저장장치, 데이터 저장방법, 및 그 기록매체
JP4794231B2 (ja) * 2005-07-22 2011-10-19 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置
US7206214B2 (en) * 2005-08-05 2007-04-17 Freescale Semiconductor, Inc. One time programmable memory and method of operation
JP5250182B2 (ja) * 2005-10-28 2013-07-31 シャープ株式会社 不揮発性メモリ装置およびその駆動方法
JP2007184466A (ja) * 2006-01-10 2007-07-19 Renesas Technology Corp 半導体装置およびその製造方法
JP2007281137A (ja) * 2006-04-05 2007-10-25 Sharp Corp 不揮発性半導体記憶装置およびその製造方法、前記不揮発性半導体記憶装置を備えてなる携帯電子機器
US7414889B2 (en) * 2006-05-23 2008-08-19 Macronix International Co., Ltd. Structure and method of sub-gate and architectures employing bandgap engineered SONOS devices
US7718491B2 (en) * 2006-06-16 2010-05-18 Macronix International Co., Ltd. Method for making a NAND Memory device with inversion bit lines
US8188536B2 (en) 2006-06-26 2012-05-29 Macronix International Co., Ltd. Memory device and manufacturing method and operating method thereof
US7697344B2 (en) * 2006-11-03 2010-04-13 Samsung Electronics Co., Ltd. Memory device and method of operating and fabricating the same
JP5735726B2 (ja) * 2008-09-19 2015-06-17 スパンション エルエルシー 半導体記憶装置およびその読出方法
KR20100097468A (ko) * 2009-02-26 2010-09-03 삼성전자주식회사 반도체 메모리 장치 및 그 제조 방법
JP5538024B2 (ja) * 2010-03-29 2014-07-02 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置
CN101814510B (zh) * 2010-04-29 2015-07-29 上海华虹宏力半导体制造有限公司 共享字线的无触点sonos分栅式闪存
US20120119280A1 (en) * 2010-11-11 2012-05-17 Paolo Tessariol Charge Trap Non-Volatile Memory
JP5878797B2 (ja) * 2012-03-13 2016-03-08 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US8809184B2 (en) * 2012-05-07 2014-08-19 Globalfoundries Inc. Methods of forming contacts for semiconductor devices using a local interconnect processing scheme
US10170493B1 (en) * 2017-12-20 2019-01-01 Micron Technology, Inc. Assemblies having vertically-stacked conductive structures
CN114078900A (zh) * 2020-08-19 2022-02-22 联华电子股份有限公司 数据存储单元、存储器及其存储器制作方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4185318A (en) * 1971-04-26 1980-01-22 General Electric Company Charge storage memory with isolation nodal for each bit line
US4554643A (en) * 1979-06-18 1985-11-19 Texas Instruments Incorporated Electrically erasable programmable MNOS read only memory
JPS5851568A (ja) * 1981-09-22 1983-03-26 Nec Corp 半導体装置
JP2551595B2 (ja) * 1987-07-31 1996-11-06 工業技術院長 半導体不揮発性メモリ素子
US5278428A (en) * 1990-06-28 1994-01-11 Casio Computer Co., Ltd. Thin film memory cell
US5357134A (en) * 1991-10-31 1994-10-18 Rohm Co., Ltd. Nonvolatile semiconductor device having charge trap film containing silicon crystal grains
US5408115A (en) * 1994-04-04 1995-04-18 Motorola Inc. Self-aligned, split-gate EEPROM device
US5467308A (en) * 1994-04-05 1995-11-14 Motorola Inc. Cross-point eeprom memory array
KR0135247B1 (ko) * 1994-07-06 1998-04-22 김주용 플래쉬 메모리 셀 및 그 제조 방법
JP2910647B2 (ja) * 1995-12-18 1999-06-23 日本電気株式会社 不揮発性半導体記憶装置の製造方法
JPH09275196A (ja) * 1996-04-03 1997-10-21 Sony Corp 半導体装置及びその製造方法
US5768192A (en) * 1996-07-23 1998-06-16 Saifun Semiconductors, Ltd. Non-volatile semiconductor memory cell utilizing asymmetrical charge trapping
US5714412A (en) * 1996-12-02 1998-02-03 Taiwan Semiconductor Manufacturing Company, Ltd Multi-level, split-gate, flash memory cell and method of manufacture thereof
US6348387B1 (en) * 2000-07-10 2002-02-19 Advanced Micro Devices, Inc. Field effect transistor with electrically induced drain and source extensions
US6563151B1 (en) * 2000-09-05 2003-05-13 Samsung Electronics Co., Ltd. Field effect transistors having gate and sub-gate electrodes that utilize different work function materials and methods of forming same

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US6894344B2 (en) 2005-05-17
DE60004614T2 (de) 2004-08-12
DE60004614D1 (de) 2003-09-25
KR100776871B1 (ko) 2007-11-16
JP4058219B2 (ja) 2008-03-05
US6531735B1 (en) 2003-03-11
EP1288963A3 (de) 2004-01-14
DE60034070T2 (de) 2007-10-25
KR20010082522A (ko) 2001-08-30
US6674122B2 (en) 2004-01-06
US20030155607A1 (en) 2003-08-21
US20040070026A1 (en) 2004-04-15
EP1288963B1 (de) 2007-03-21
EP1085519B1 (de) 2003-08-20
EP1085519A1 (de) 2001-03-21
JP2001156275A (ja) 2001-06-08
TW530303B (en) 2003-05-01
EP1288963A2 (de) 2003-03-05

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