DK1310136T3 - Bredbåndsminiaturetransducer - Google Patents

Bredbåndsminiaturetransducer

Info

Publication number
DK1310136T3
DK1310136T3 DK01959715T DK01959715T DK1310136T3 DK 1310136 T3 DK1310136 T3 DK 1310136T3 DK 01959715 T DK01959715 T DK 01959715T DK 01959715 T DK01959715 T DK 01959715T DK 1310136 T3 DK1310136 T3 DK 1310136T3
Authority
DK
Denmark
Prior art keywords
bredbåndsminiaturetransducer
Prior art date
Application number
DK01959715T
Other languages
English (en)
Inventor
Sung Bok Lee
Michael Pedersen
Peter V Loeppert
Original Assignee
Knowles Electronics Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US63740100A priority Critical
Priority to US09/910,110 priority patent/US6987859B2/en
Application filed by Knowles Electronics Llc filed Critical Knowles Electronics Llc
Application granted granted Critical
Publication of DK1310136T3 publication Critical patent/DK1310136T3/da

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006Interconnection of transducer parts
DK01959715T 2000-08-11 2001-08-10 Bredbåndsminiaturetransducer DK1310136T3 (da)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US63740100A true 2000-08-11 2000-08-11
US09/910,110 US6987859B2 (en) 2001-07-20 2001-07-20 Raised microstructure of silicon based device

Publications (1)

Publication Number Publication Date
DK1310136T3 true DK1310136T3 (da) 2006-07-31

Family

ID=27092826

Family Applications (2)

Application Number Title Priority Date Filing Date
DK01959715T DK1310136T3 (da) 2000-08-11 2001-08-10 Bredbåndsminiaturetransducer
DK04076015T DK1469701T3 (da) 2000-08-11 2001-08-10 Ophöjede mikrostrukturer

Family Applications After (1)

Application Number Title Priority Date Filing Date
DK04076015T DK1469701T3 (da) 2000-08-11 2001-08-10 Ophöjede mikrostrukturer

Country Status (9)

Country Link
EP (2) EP1469701B1 (da)
JP (3) JP4338395B2 (da)
KR (1) KR100571967B1 (da)
CN (2) CN1498513B (da)
AT (2) AT392790T (da)
AU (1) AU8124101A (da)
DE (2) DE60133679T2 (da)
DK (2) DK1310136T3 (da)
WO (1) WO2002015636A2 (da)

Families Citing this family (108)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535460B2 (en) 2000-08-11 2003-03-18 Knowles Electronics, Llc Miniature broadband acoustic transducer
US7166910B2 (en) 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US7439616B2 (en) 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
US8617934B1 (en) 2000-11-28 2013-12-31 Knowles Electronics, Llc Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US6859542B2 (en) 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
US6987859B2 (en) 2001-07-20 2006-01-17 Knowles Electronics, Llc. Raised microstructure of silicon based device
US7023066B2 (en) 2001-11-20 2006-04-04 Knowles Electronics, Llc. Silicon microphone
KR100437681B1 (ko) * 2002-04-15 2004-06-30 부전전자부품 주식회사 지향성 마이크로폰
DE10238523B4 (de) 2002-08-22 2014-10-02 Epcos Ag Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung
US6781231B2 (en) 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
JP2004356707A (ja) * 2003-05-27 2004-12-16 Hosiden Corp 音響検出機構
US7030536B2 (en) * 2003-12-29 2006-04-18 General Electric Company Micromachined ultrasonic transducer cells having compliant support structure
JP4201723B2 (ja) * 2004-02-13 2008-12-24 ホシデン株式会社 容量検知型センサ素子
DE102004020204A1 (de) 2004-04-22 2005-11-10 Epcos Ag Verkapseltes elektrisches Bauelement und Verfahren zur Herstellung
US7346178B2 (en) * 2004-10-29 2008-03-18 Silicon Matrix Pte. Ltd. Backplateless silicon microphone
US7329933B2 (en) 2004-10-29 2008-02-12 Silicon Matrix Pte. Ltd. Silicon microphone with softly constrained diaphragm
JP4539450B2 (ja) 2004-11-04 2010-09-08 オムロン株式会社 容量型振動センサ及びその製造方法
KR100685092B1 (ko) * 2005-03-14 2007-02-22 주식회사 케이이씨 Mems 공정을 이용한 마이크로폰 및 그 제조 방법
US7449356B2 (en) 2005-04-25 2008-11-11 Analog Devices, Inc. Process of forming a microphone using support member
US7825484B2 (en) 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
US7885423B2 (en) 2005-04-25 2011-02-08 Analog Devices, Inc. Support apparatus for microphone diaphragm
SG127754A1 (en) * 2005-05-16 2006-12-29 Sensfab Pte Ltd Silicon microphone
DE102005031601B4 (de) * 2005-07-06 2016-03-03 Robert Bosch Gmbh Kapazitives, mikromechanisches Mikrofon
US8351632B2 (en) 2005-08-23 2013-01-08 Analog Devices, Inc. Noise mitigating microphone system and method
KR20080009735A (ko) 2005-09-09 2008-01-29 야마하 가부시키가이샤 캐패시터 마이크로폰
KR100765149B1 (ko) * 2005-10-05 2007-10-15 경기도 초소형 음향 감지 장치 및 그 제조 방법
KR100785803B1 (ko) * 2005-12-07 2007-12-13 한국전자통신연구원 판 스프링 구조를 갖는 초소형 마이크로 폰, 스피커 및이를 이용한 음성 인식/합성장치
DE102006001493B4 (de) * 2006-01-11 2007-10-18 Austriamicrosystems Ag MEMS-Sensor und Verfahren zur Herstellung
WO2007085017A1 (en) * 2006-01-20 2007-07-26 Analog Devices, Inc. Support apparatus for condenser microphone diaphragm
JP4811035B2 (ja) * 2006-01-31 2011-11-09 パナソニック電工株式会社 音響センサ
JP4737719B2 (ja) * 2006-02-24 2011-08-03 ヤマハ株式会社 コンデンサマイクロホン
JP2007228345A (ja) * 2006-02-24 2007-09-06 Yamaha Corp コンデンサマイクロホン
JP4737720B2 (ja) * 2006-03-06 2011-08-03 ヤマハ株式会社 ダイヤフラム及びその製造方法並びにそのダイヤフラムを有するコンデンサマイクロホン及びその製造方法
JP4737721B2 (ja) * 2006-03-10 2011-08-03 ヤマハ株式会社 コンデンサマイクロホン
GB0605576D0 (en) * 2006-03-20 2006-04-26 Oligon Ltd MEMS device
US8126167B2 (en) 2006-03-29 2012-02-28 Yamaha Corporation Condenser microphone
JP2007267049A (ja) * 2006-03-29 2007-10-11 Yamaha Corp コンデンサマイクロホン
JP4605544B2 (ja) * 2006-03-29 2011-01-05 ヤマハ株式会社 コンデンサマイクロホン
JP4605470B2 (ja) * 2006-03-31 2011-01-05 ヤマハ株式会社 コンデンサマイクロホン
EP2044802B1 (en) 2006-07-25 2013-03-27 Analog Devices, Inc. Multiple microphone system
JP4567643B2 (ja) * 2006-08-24 2010-10-20 パナソニック株式会社 コンデンサ及びその製造方法
US8569850B2 (en) 2006-10-11 2013-10-29 Sensfab Pte Ltd Ultra low pressure sensor
US7894622B2 (en) 2006-10-13 2011-02-22 Merry Electronics Co., Ltd. Microphone
JP4144640B2 (ja) 2006-10-13 2008-09-03 オムロン株式会社 振動センサの製造方法
EP1931173B1 (en) 2006-12-06 2011-07-20 Electronics and Telecommunications Research Institute Condenser microphone having flexure hinge diaphragm and method of manufacturing the same
US8111871B2 (en) 2007-01-17 2012-02-07 Analog Devices, Inc. Microphone with pressure relief
JP5029147B2 (ja) * 2007-06-04 2012-09-19 オムロン株式会社 音響センサ
JP5034692B2 (ja) 2007-06-04 2012-09-26 オムロン株式会社 音響センサ
US8363860B2 (en) 2009-03-26 2013-01-29 Analog Devices, Inc. MEMS microphone with spring suspended backplate
JP5412031B2 (ja) * 2007-07-24 2014-02-12 ローム株式会社 Memsセンサ
GB2452941B (en) * 2007-09-19 2012-04-11 Wolfson Microelectronics Plc Mems device and process
GB2453104B (en) * 2007-09-19 2012-04-25 Wolfson Microelectronics Plc Mems device and process
GB2453105B (en) * 2007-09-19 2011-01-12 Wolfson Microelectronics Plc MEMS device and process
TW200934273A (en) 2007-09-28 2009-08-01 Yamaha Corp Vibration transducer and manufacturing method therefor
JP2009089100A (ja) * 2007-09-28 2009-04-23 Yamaha Corp 振動トランスデューサ
US8045733B2 (en) * 2007-10-05 2011-10-25 Shandong Gettop Acoustic Co., Ltd. Silicon microphone with enhanced impact proof structure using bonding wires
KR100932754B1 (ko) * 2007-12-12 2009-12-21 에스텍 주식회사 다기능 스피커
US7888754B2 (en) 2007-12-28 2011-02-15 Yamaha Corporation MEMS transducer
KR101113366B1 (ko) * 2008-02-20 2012-03-02 오므론 가부시키가이샤 정전 용량형 진동 센서
JP5332373B2 (ja) * 2008-07-25 2013-11-06 オムロン株式会社 静電容量型振動センサ
JP4419103B1 (ja) 2008-08-27 2010-02-24 オムロン株式会社 静電容量型振動センサ
JP2010074523A (ja) * 2008-09-18 2010-04-02 Rohm Co Ltd 犠牲層のエッチング方法、memsデバイスの製造方法およびmemsデバイス
JP2010155306A (ja) 2008-12-26 2010-07-15 Panasonic Corp Memsデバイス及びその製造方法
GB2467848B (en) * 2009-02-13 2011-01-12 Wolfson Microelectronics Plc MEMS device and process
EP2239961A1 (en) * 2009-04-06 2010-10-13 Nxp B.V. Backplate for microphone
DE102009026682A1 (de) * 2009-06-03 2010-12-09 Robert Bosch Gmbh Bauelement mit einer mikromechanischen Mikrofonstruktur und Verfahren zu dessen Herstellung
JP5513813B2 (ja) * 2009-08-31 2014-06-04 新日本無線株式会社 Memsマイクロフォンおよびその製造方法
CN102056061A (zh) * 2009-10-29 2011-05-11 苏州敏芯微电子技术有限公司 电容式微型硅麦克风及其制造方法
DE102010000666A1 (de) * 2010-01-05 2011-07-07 Robert Bosch GmbH, 70469 Bauelement mit einer mikromechanischen Mikrofonstruktur und Verfahren zu dessen Herstellung
CN102223591B (zh) * 2010-04-19 2015-04-01 联华电子股份有限公司 微机电系统麦克风的晶片级封装结构及其制造方法
JP4947220B2 (ja) 2010-05-13 2012-06-06 オムロン株式会社 音響センサ及びマイクロフォン
JP5402823B2 (ja) 2010-05-13 2014-01-29 オムロン株式会社 音響センサ
JP5400708B2 (ja) 2010-05-27 2014-01-29 オムロン株式会社 音響センサ、音響トランスデューサ、該音響トランスデューサを利用したマイクロフォン、および音響トランスデューサの製造方法
JP2012070120A (ja) * 2010-09-22 2012-04-05 Panasonic Corp センサ
CN102740203A (zh) * 2011-04-06 2012-10-17 美律实业股份有限公司 结合式微机电麦克风及其制造方法
US20120328132A1 (en) * 2011-06-27 2012-12-27 Yunlong Wang Perforated Miniature Silicon Microphone
EP2774390A4 (en) 2011-11-04 2015-07-22 Knowles Electronics Llc Embedded dielectric as a barrier in an acoustic device and method of manufacture
JP5177309B1 (ja) * 2012-01-31 2013-04-03 オムロン株式会社 静電容量型センサ
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
DE102012215251A1 (de) * 2012-08-28 2013-03-21 Robert Bosch Gmbh MEMS-Bauelement
JP5987572B2 (ja) 2012-09-11 2016-09-07 オムロン株式会社 音響トランスデューサ
JP5991475B2 (ja) 2012-09-14 2016-09-14 オムロン株式会社 音響トランスデューサ
CN102873020B (zh) * 2012-10-12 2015-05-06 北京七星华创电子股份有限公司 兆声波换能器的连接盖
KR101496817B1 (ko) * 2013-08-09 2015-02-27 삼성전기주식회사 음향 변환기
JP6179300B2 (ja) 2013-09-13 2017-08-16 オムロン株式会社 音響トランスデューサ、およびマイクロホン
JP6345926B2 (ja) * 2013-10-07 2018-06-20 新日本無線株式会社 Mems素子およびその製造方法
US20150162523A1 (en) 2013-12-06 2015-06-11 Murata Manufacturing Co., Ltd. Piezoelectric device
DE102014202009A1 (de) * 2014-02-05 2015-08-06 Robert Bosch Gmbh Verfahren und Mittel zum Regeln der elektrischen Vorspannung am Messkondensator eines MEMS-Sensorelements
US20150296306A1 (en) * 2014-04-10 2015-10-15 Knowles Electronics, Llc. Mems motors having insulated substrates
US10158951B2 (en) 2014-06-27 2018-12-18 Goertek Inc. Silicon microphone with suspended diaphragm and system with the same
CN105323687A (zh) * 2014-07-14 2016-02-10 北京卓锐微技术有限公司 一种多晶硅层上设置有突起的硅电容麦克风及其制备方法
CN104105041B (zh) * 2014-07-31 2019-01-04 歌尔股份有限公司 硅基mems麦克风及其制作方法
US9743191B2 (en) 2014-10-13 2017-08-22 Knowles Electronics, Llc Acoustic apparatus with diaphragm supported at a discrete number of locations
US9872116B2 (en) 2014-11-24 2018-01-16 Knowles Electronics, Llc Apparatus and method for detecting earphone removal and insertion
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
US9859879B2 (en) 2015-09-11 2018-01-02 Knowles Electronics, Llc Method and apparatus to clip incoming signals in opposing directions when in an off state
US9401158B1 (en) 2015-09-14 2016-07-26 Knowles Electronics, Llc Microphone signal fusion
CN106841396B (zh) * 2015-12-03 2019-05-28 中国科学院上海微系统与信息技术研究所 硅基电容式声发射传感器及其制备方法
US9779716B2 (en) 2015-12-30 2017-10-03 Knowles Electronics, Llc Occlusion reduction and active noise reduction based on seal quality
US9830930B2 (en) 2015-12-30 2017-11-28 Knowles Electronics, Llc Voice-enhanced awareness mode
US9812149B2 (en) 2016-01-28 2017-11-07 Knowles Electronics, Llc Methods and systems for providing consistency in noise reduction during speech and non-speech periods
KR101807071B1 (ko) * 2016-10-06 2017-12-08 현대자동차 주식회사 마이크로폰 및 그 제조 방법
KR101807069B1 (ko) * 2016-10-21 2017-12-08 현대자동차 주식회사 마이크로폰 및 그 제조방법
KR20180127090A (ko) * 2017-05-19 2018-11-28 현대자동차주식회사 마이크로폰 및 그 제조 방법
DE102017217151B3 (de) 2017-09-27 2019-01-03 Robert Bosch Gmbh Mikromechanischer Sensor
JP2019075738A (ja) 2017-10-18 2019-05-16 オムロン株式会社 トランスデューサ
WO2020072904A1 (en) * 2018-10-05 2020-04-09 Knowles Electronics, Llc Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4360955A (en) * 1978-05-08 1982-11-30 Barry Block Method of making a capacitive force transducer
JPH0311418B2 (da) * 1982-08-27 1991-02-15 Nissan Motor
JPH0114711B2 (da) * 1983-09-07 1989-03-14 Nissan Motor
JPH023302B2 (da) * 1985-06-05 1990-01-23 Nissan Motor
JPH0726887B2 (ja) * 1986-05-31 1995-03-29 株式会社堀場製作所 コンデンサマイクロフオン型検出器用ダイアフラム
NL8702589A (nl) * 1987-10-30 1989-05-16 Microtel Bv Elektro-akoestische transducent van de als elektreet aangeduide soort, en een werkwijze voor het vervaardigen van een dergelijke transducent.
JPH05172843A (ja) * 1991-12-25 1993-07-13 Omron Corp 半導体加速度センサ
DK0561566T3 (da) * 1992-03-18 2000-03-27 Knowles Electronics Llc Faststofkondensatormikrofon
US5452268A (en) * 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
JP3472493B2 (ja) * 1998-11-30 2003-12-02 ホシデン株式会社 半導体エレクトレットコンデンサーマイクロホン

Also Published As

Publication number Publication date
EP1469701A3 (en) 2005-11-16
DE60133679D1 (de) 2008-05-29
EP1469701B1 (en) 2008-04-16
JP4338395B2 (ja) 2009-10-07
KR20030033026A (ko) 2003-04-26
CN1498513B (zh) 2010-07-14
DK1469701T3 (da) 2008-08-18
JP2004506394A (ja) 2004-02-26
EP1469701A2 (en) 2004-10-20
EP1310136A2 (en) 2003-05-14
EP1310136B1 (en) 2006-03-22
AT392790T (de) 2008-05-15
DE60118208D1 (de) 2006-05-11
CN101867858A (zh) 2010-10-20
WO2002015636A3 (en) 2002-10-24
JP2007116721A (ja) 2007-05-10
JP5049312B2 (ja) 2012-10-17
JP2009153203A (ja) 2009-07-09
WO2002015636A2 (en) 2002-02-21
KR100571967B1 (ko) 2006-04-18
DE60118208T2 (de) 2007-04-12
CN101867858B (zh) 2012-02-22
AU8124101A (en) 2002-02-25
AT321429T (de) 2006-04-15
CN1498513A (zh) 2004-05-19
DE60133679T2 (de) 2009-06-10

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