JP2008099271A - 小型シリコンコンデンサマイクロフォンおよびその製造方法 - Google Patents
小型シリコンコンデンサマイクロフォンおよびその製造方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/01—Electrostatic transducers characterised by the use of electrets
- H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/4908—Acoustic transducer
Abstract
【解決手段】シリコンコンデンサマイクロフォンパッケージ10は、トランスデューサ部12と、基板14と、カバー20から構成されている。基板14は、凹部が形成された上面を有する。トランスデューサ部12は、基板14の上面に取り付けられて、トランスデューサ部12の後部ボリューム18がトランスデューサ部12と基板14間に形成されている凹部の少なくとも一部に重なっている。カバー20はトランスデューサ部12上に配置され開口部24を有する。
【選択図】図1
Description
テーブル1:材料
Claims (38)
- 少なくとも一つの層が導電性材料から成り、少なくとも一つの層が絶縁材料から成る複数の層を有する印刷回路基板と、
導電層を有するカバーと、
ハウジング内に取り付けられたトランスデューサ部とを備え、
前記印刷回路基板と前記カバーは前記ハウジングの少なくとも一部を形成し、前記ハウジングは信号を受け取る開口部と電磁妨害を遮断する内側ライニングを有し、前記内側ライニングは前記導電層と前記少なくとも一つの導電性材料の層を有する、マイクロフォンパッケージ。 - 前記印刷回路基板と前記カバー間に配置されたスペーサ部材をさらに備え、前記スペーサ部材は、前記印刷回路基板と前記カバーと協働して前記ハウジングを形成し、前記スペーサ部材は少なくとも部分的に導電性材料で被覆されている側壁を有し、前記導電性材料が前記内側ライニングの一部を形成している請求項1に記載のマイクロフォンパッケージ。
- 前記スペーサ部材を前記カバーに接合させる導電性接着剤の第一層をさらに備える請求項2に記載のマイクロフォンパッケージ。
- 前記スペーサ部材を前記回路基板に接合させる導電性接着剤の第二層をさらに備える請求項3に記載のマイクロフォンパッケージ。
- 前記開口部内に位置する環境バリアをさらに備える請求項1に記載のマイクロフォンパッケージ。
- 前記開口部は前記カバーに形成され、前記カバーは、前記環境バリアを構成する非導電層を有する請求項5に記載のマイクロフォンパッケージ。
- 前記開口部は前記カバー内に位置し、前記カバーは、前記環境バリアを構成する重合体層を有する請求項5に記載のマイクロフォンパッケージ。
- 前記開口部は前記印刷回路基板内に位置し、前記印刷回路基板は、前記環境バリアを構成する重合体層を有する請求項5に記載のマイクロフォンパッケージ。
- 前記環境バリアは重合体材料を有する請求項5に記載のマイクロフォンパッケージ。
- 前記重合体材料がフィルムである請求項9に記載のマイクロフォンパッケージ。
- 前記フィルムがポリテトラフルオロエチレンを有する請求項10に記載のマイクロフォンパッケージ。
- 前記導電性材料が銅を有する請求項1に記載のマイクロフォンパッケージ。
- 前記印刷回路基板が、複数の導電性材料層と複数の絶縁材料層を有する請求項1に記載のマイクロフォンパッケージ。
- 前記複数の導電性材料層の一つが、トランスデューサ部との電気的接続を行う一対のリードパッドを有する請求項13に記載のマイクロフォンパッケージ。
- 前記複数の導電性材料層の一つが、第一電気的接地面を構成している請求項14に記載のマイクロフォンパッケージ。
- 前記複数の導電性材料層の一つが、第二電気的接地面を構成している請求項15に記載のマイクロフォンパッケージ。
- 前記第一および第二接地面が、前記一対のリードパッドに電気的に接続されている請求項16に記載のマイクロフォンパッケージ。
- 前記複数の導電性材料層の一つが、外部装置との電気的接続を行う一対のコネクタを有する請求項17に記載のマイクロフォンパッケージ。
- トランスデューサ部と、
前記トランスデューサ部を実質的に被覆し電磁妨害に対する防御を行うハウジングとを備え、
前記ハウジングが、第一非導電性材料層と前記第一層を実質的に被覆する第二導電性材料層とを有し、前記第二層が実質的に前記ハウジングの内側ライニングを形成し、前記ハウジングが信号を前記ハウジング内に受け取る開口部をさらに有するマイクロフォンパッケージ。 - 第三非導電性材料層をさらに備え、前記第三層が環境バリアを設ける前記開口部を実質的に被覆している請求項19に記載のマイクロフォンパッケージ。
- 前記第三層が、重合体材料を有する請求項20に記載のマイクロフォンパッケージ。
- 前記重合体材料がポリテトラフルオロエチレンである請求項21に記載のマイクロフォンパッケージ。
- 保持リングをさらに備え、前記トランスデューサ部が前記保持リングと係合している請求項19に記載のマイクロフォンパッケージ。
- トランスデューサ部と、
凹部が形成された上面を含む基板と、
開口部を含み、前記トランスデューサ部上に配置されたカバーとを備え、
前記基板の上面に取り付けられた前記トランスデューサ部が、前記トランスデューサ部の後部ボリュームが前記トランスデューサ部と前記基板との間に形成されている凹部の少なくとも一部に重なっている、シリコンコンデンサマイクロフォンパッケージ。 - トランスデューサ部と
前記トランスデューサ部を支持する上面を含む基板と、
前記基板の一部の上に配置されて、開口部と内表面とを有するカバーとを備え、
前記内表面の一部が前記トランスデューサ部を妨害信号から遮断する金属材料を有するシリコンコンデンサマイクロフォンパッケージ。 - トランスデューサ部と
前記トランスデューサ部を支持する上面を含む基板と、
前記基板の一部の上を封止し、信号を受け取る開口部と、前記トランスデューサを妨害信号から防御する遮蔽材料を有する内表面とを有するカバーとを備えるマイクロフォンパッケージ。 - トランスデューサ部と
絶縁材料層と、導電性材料層とを有し、さらに前記トランスデューサ部を支持する面を有する基板と、
前記基板の一部の上に配置されて、前記トランスデューサを妨害信号から防御する遮蔽材料を有するカバーとを備えるマイクロフォンパッケージ。 - 第一絶縁層と第一導電層とを有する印刷回路基板と、
前記印刷回路基板により支持されたトランスデューサ部と、
前記印刷回路基板の一部の上にあって、それと共に前記トランスデューサ部を保護するハウジングを形成し、開口部と、第二絶縁層と、第二導電層とを有し、前記第二導電層の一部が前記トランスデューサに露出されて前記トランスデューサを妨害信号から遮断しているカバーとを備えるマイクロフォンパッケージ。 - 第一絶縁層と、第一導電層と、開口部とを有する印刷回路基板と、
トランスデューサ部と、
前記印刷回路基板の一部の上にあって、それと共に前記トランスデューサ部を保護するハウジングを形成し、第二絶縁層と、第二導電層とを有し、前記第二導電層の一部が前記トランスデューサに露出されて前記トランスデューサを妨害信号から遮断しているカバーとを備えるマイクロフォンパッケージ。 - 電磁妨害を遮断する遮蔽体を提供し、信号を受け取るために設けられた開口部を含む内側ライニングと、
第一絶縁層と、前記内側ライニングの少なくとも一部を形成する第一導電層とを有する印刷回路基板と、
前記内側ライニングの少なくとも一部を形成する第二導電層を有するカバーとを備えるシリコンコンデンサマイクロフォンを収容するためのマイクロフォンハウジング。 - マイクロフォンパッケージを製造する方法において、
第一非導電性材料層と、前記非導電性材料を実質的に被覆する導電性材料を有する内側ライニングと、音響信号を受信する開口部とを有するハウジングを提供する工程と、
トランスデューサ部を提供する工程と、
前記内側ライニングが電磁妨害から前記トランスデューサ部を防御する前記ハウジング内に、前記トランスデューサを取り付ける工程とを備える方法。 - 重合体材料フィルタを有する環境バリア層を提供する工程と、
前記音響信号の実質的部分が前記開口部を通過することを可能にする一方、前記トランスデューサを環境条件から防御するように、前記環境バリア層をハウジングに対して、かつ、前記開口部上に固定させる工程とをさらに備える請求項31に記載の方法。 - 前記第一層と前記環境バリア層との間に第二導電性材料層を設ける工程をさらに備える請求項32に記載の方法。
- 第三導電性材料層を提供する工程と、
前記環境バリア層が前記第二層と前記第三層との間に位置するように前記第三層を環境バリア層に取り付ける工程とをさらに備える請求項33に記載の方法。 - 第四非導電性材料層を提供する工程と、
前記第四層を前記第三層上に配置する工程とをさらに備える請求項34に記載の方法。 - 第五導電性材料層を提供する工程と、
前記第五層を前記第四層上に配置する工程とをさらに備える請求項35に記載の方法。 - 前記ハウジングがさらにカバーを有し、前記カバーが、非導電性材料の外側層と、前記外側層を実質的に被覆して内側ライニングの少なくとも一部を構成している導電性材料の内側層とを有する請求項36に記載の方法。
- 前記カバーが、前記外側層に固着されて前記ハウジングの外表面の一部を形成している導電性材料の外部層をさらに有する請求項37に記載の方法。
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US25354300P | 2000-11-28 | 2000-11-28 | |
US09/886,854 US7166910B2 (en) | 2000-11-28 | 2001-06-21 | Miniature silicon condenser microphone |
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JP2010034990A (ja) * | 2008-07-30 | 2010-02-12 | Funai Electric Co Ltd | 差動マイクロホンユニット |
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US8890265B2 (en) | 2011-09-09 | 2014-11-18 | Omron Corporation | Semiconductor device and microphone |
Also Published As
Publication number | Publication date |
---|---|
US20020102004A1 (en) | 2002-08-01 |
EP2249583A2 (en) | 2010-11-10 |
JP4532827B2 (ja) | 2010-08-25 |
US20070082421A1 (en) | 2007-04-12 |
ATE510415T1 (de) | 2011-06-15 |
JP5216717B2 (ja) | 2013-06-19 |
WO2002045463A2 (en) | 2002-06-06 |
EP2249583A3 (en) | 2014-12-10 |
US7242089B2 (en) | 2007-07-10 |
US7166910B2 (en) | 2007-01-23 |
US20050185812A1 (en) | 2005-08-25 |
EP1346601A2 (en) | 2003-09-24 |
WO2002045463A3 (en) | 2003-05-15 |
AU2002229116A1 (en) | 2002-06-11 |
JP2009296630A (ja) | 2009-12-17 |
US7537964B2 (en) | 2009-05-26 |
EP1346601B1 (en) | 2011-05-18 |
JP2004537182A (ja) | 2004-12-09 |
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