WO2020258171A1 - 振动传感器和音频设备 - Google Patents

振动传感器和音频设备 Download PDF

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Publication number
WO2020258171A1
WO2020258171A1 PCT/CN2019/093333 CN2019093333W WO2020258171A1 WO 2020258171 A1 WO2020258171 A1 WO 2020258171A1 CN 2019093333 W CN2019093333 W CN 2019093333W WO 2020258171 A1 WO2020258171 A1 WO 2020258171A1
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WO
WIPO (PCT)
Prior art keywords
cavity
sheet
vibration sensor
frame
hole
Prior art date
Application number
PCT/CN2019/093333
Other languages
English (en)
French (fr)
Inventor
张金宇
Original Assignee
瑞声声学科技(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to PCT/CN2019/093333 priority Critical patent/WO2020258171A1/zh
Priority to CN201921052319.3U priority patent/CN210112275U/zh
Priority to US16/994,666 priority patent/US11317184B2/en
Publication of WO2020258171A1 publication Critical patent/WO2020258171A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Definitions

  • the utility model relates to the field of microphones, in particular to vibration sensors and audio equipment.
  • the prior art vibration sensor generally includes a housing, a mounting board arranged in the housing, an elastic membrane attached to the upper side of the mounting board, and a MEMS chip mounted on the lower side of the mounting board and enclosed with the mounting board to form a front cavity.
  • the plate is provided with a through hole connecting the front cavity and the elastic membrane.
  • the purpose of the utility model is to provide a vibration sensor with a simple structure and high sensitivity.
  • a vibration sensor which includes a cavity with an inner wall, an elastic sheet, a mass sheet and a MEMS chip with a back cavity arranged in the cavity, the elastic sheet is attached to the inner wall, and the mass sheet is mounted On the side surface of the elastic sheet facing away from the inner wall, the MEMS chip is mounted on the side surface of the mass sheet facing away from the elastic sheet, and the inner wall includes a bonding surface fixedly connected with the elastic sheet.
  • the bonding surface is recessed in a direction away from the elastic sheet to form a cavity, the elastic sheet covers the cavity and the elastic sheet is provided with a first through hole communicating with the cavity, and the quality sheet is provided with The first through hole communicates with a second through hole, and the first through hole and the second through hole communicate with the back cavity and the cavity.
  • the elastic sheet includes a frame, a sheet located in the frame and spaced apart from the frame to form a cavity, and a connecting sheet connecting the frame and the sheet, and the first through hole It is opened on the sheet body, and the quality sheet is installed on the sheet body.
  • the frame body is a rectangular frame
  • the sheet body is rectangular
  • the number of the connecting pieces is four
  • the four sides of the frame body and the four sides of the sheet body are arranged opposite to each other one by one.
  • the two ends of each connecting piece are respectively connected between the side edges of the frame body and the side edges of the sheet body that are arranged oppositely at intervals.
  • the connecting piece includes a connecting strip located in the empty slot and arranged in parallel with the side of the sheet body, a first bent portion connecting one end of the connecting strip to the frame body, and a connecting point. The other end of the connecting strip is at the second bent portion on the sheet body.
  • the vibration sensor further includes a sealing part arranged around the mass plate and used for sealing the empty groove.
  • the sealing part is a sealant.
  • the cavity includes a circuit board and a shell fixed on the circuit board, and the circuit board is formed as the inner wall.
  • cross-sectional area of the cavity is greater than the cross-sectional area of the inner cavity.
  • the vibration sensor further includes an integrated circuit chip housed in the cavity, and the integrated circuit chip is electrically connected between the MEMS chip and the circuit board.
  • An audio device including the vibration sensor described above.
  • the beneficial effect of the utility model is that the MEMS chip and the mass sheet are mounted on the side of the elastic sheet away from the cavity.
  • the MEMS chip and the mass sheet vibrate up and down, causing the cavity volume to change ,
  • the gas pressure in the cavity changes accordingly, and the changed pressure signal is picked up by the MEMS chip and converted into an electric signal.
  • the vibration sensor provided by the utility model has a simple structure, a small height and high sensitivity.
  • Figure 1 is a schematic structural diagram of a vibration sensor provided by an embodiment of the utility model
  • Figure 2 is an exploded view of the vibration sensor in Figure 1;
  • Figure 3 is a schematic cross-sectional view taken along line A-A of Figure 1;
  • FIG. 4 is a schematic structural view of the vibration sensor provided by the embodiment of the utility model with the outer shell and the sealing part removed;
  • FIG. 5 is a schematic diagram of the structure of the elastic sheet in the vibration sensor provided by the embodiment of the utility model.
  • Vibration sensor 1. Cavity; 2. Elastic sheet; 3. Mass sheet; 4. MEMS chip; 40. Back cavity; 101. Fitting surface; 10. Cavity; 20. First through hole; 30. Second through hole; 21, frame body; 22, sheet body; 23, empty groove; 24, connecting piece; 25, sealing part; 241, connecting strip; 242, first bending part; 243, second bending part; 11 1. Circuit board; 12. Shell; 120. Internal cavity; 5. Integrated circuit chip.
  • a vibration sensor please refer to Figures 1 to 3, comprising a cavity 1 with an inner wall, an elastic sheet 2, a mass sheet 3 and a MEMS chip 4 with a back cavity 40 arranged in the cavity 1.
  • the sheet 2 is attached to the inner wall, the mass sheet 3 is mounted on the side of the elastic sheet 2 facing away from the inner wall, and the MEMS chip 4 is mounted on the side of the quality sheet 3 facing away from the elastic sheet 2
  • the inner wall includes a bonding surface 101 fixedly connected to the elastic sheet 2, and the bonding surface 101 is recessed in a direction away from the elastic sheet 2 to form a cavity 10, and the elastic sheet 2 covers the cavity 10 10 and the elastic sheet 2 is provided with a first through hole 20 communicating with the cavity 10, and the quality sheet 3 is provided with a second through hole 30 communicating with the first through hole 20.
  • a through hole 20 and the second through hole 30 communicate with the back cavity 40 and the cavity 10.
  • the MEMS chip 4 is mounted on the upper side of the elastic sheet 2.
  • the MEMS chip 4 and the mass sheet 3 vibrate up and down with the elastic sheet 2, causing the volume of the cavity 10 to change.
  • the internal gas pressure changes accordingly, and the changed pressure signal is picked up by the MEMS chip 4.
  • the mass sheet 3 enhances the vibration effect, and the vibration sensor 100 is more sensitive.
  • the MEMS chip 4 and the mass sheet 3 replace the mass Block, the height of the vibration sensor 100 is reduced.
  • the elastic sheet 2 includes a frame 21, a sheet 22 located in the frame 21 and spaced apart from the frame 21 to form a slot 23, and a sheet connecting the frame 21 and the sheet 22
  • the connecting piece 24, the first through hole 20 is opened on the piece body 22, and the quality piece 3 is mounted on the piece body 22.
  • the connecting piece 24 connects the piece 22 and the frame 21, which improves the elasticity of the piece 22 relative to the frame 21 and enhances the effect of the up and down vibration of the piece 22.
  • the frame 21 can be a circular frame, a rectangular frame or any other shape.
  • the sheet body 22 can correspondingly be round, rectangular or irregular, and an annular cavity 23 is formed between the two.
  • the frame body 21 is a rectangular frame
  • the sheet body 22 is rectangular
  • the number of the connecting sheets 24 is four
  • the four sides of the frame body 21 and the four sides 22 of the sheet body are respectively
  • the two ends of each connecting piece 24 are arranged opposite each other at intervals, and the two ends of each connecting piece 24 are respectively connected with the side edge of the frame body 21 and the side edge of the sheet body 22 arranged at intervals.
  • the cavity 10 is rectangular, and the shape of the frame body 21 and the sheet body 22 are adapted to the shape of the cavity 10, and the connecting piece 24 can be a straight strip, perpendicular to the side of the sheet body 22 and the inner side of the frame body 21, or It is inclined relative to the sides of the sheet 22 and the inner side of the frame 21, that is, two diagonally opposite corners of a rectangular groove formed between each side of the sheet 22 and the inner side of the frame 21.
  • the connecting piece 24 includes a connecting strip 241 located in the cavity 23 and arranged in parallel with the side of the sheet body 22, and a second connecting strip 241 connecting one end of the connecting strip 241 to the frame 21 A curved portion 242 and a second curved portion 243 connecting the other end of the connecting strip 241 to the sheet body 22.
  • the first curved portion 242 and the second curved portion 243 strengthen the connection strength of the connecting strip 241 with the frame 21 and the sheet 22, respectively.
  • the vibration sensor 100 further includes a sealing portion 25 arranged around the mass piece 3 and used for sealing the cavity 23.
  • the sealing portion 25 is used to seal the cavity 23 to seal the cavity 10.
  • the sealing portion 25 is a sealant.
  • the cavity 1 includes a circuit board 11 and a housing 12 fixed on the circuit board 11, and the circuit board 11 is formed as the side wall.
  • the housing 12 has an inner cavity 120 opposite to the circuit board 11.
  • the housing 12 is arranged outside the elastic sheet 2, the mass sheet 3 and the MEMS chip 4, and the circuit board 11 is formed as the inner wall of the cavity 1, which is filled with the circuit board 11. , The size of the vibration sensor 100 is reduced.
  • the inner cavity 120 of the housing 12 is formed as the rear cavity of the vibration sensor 100, and the concave hole 10 and the elastic sheet 2 are enclosed to form the front cavity of the vibration sensor 100.
  • the MEMS chip is a MEMS microphone chip or a MEMS pressure sensor chip.
  • the cross-sectional area of the cavity 10 along the vibration direction of the elastic sheet 2 is larger than the cross-sectional area of the back cavity 40 along the vibration direction of the elastic sheet 2.
  • the vibration sensor 100 further includes an integrated circuit chip 5 housed in the cavity 1, and the integrated circuit chip 5 is electrically connected between the MEMS chip 4 and the circuit board 11.
  • the integrated circuit chip 5 is used to process the pressure change signal picked up by the MEMS chip 4.
  • the present invention also provides an audio device (not shown in the figure), including the vibration sensor 100 as described above.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本实用新型提供了振动传感器和音频设备，振动传感器包括具有内壁的腔体以及设于所述腔体内的弹性片、质量片和具有背腔的MEMS芯片，所述弹性片贴设于所述内壁上，所述质量片安装于所述弹性片背离所述内壁的侧面上，所述MEMS芯片安装于所述质量片背离所述弹性片的侧面上，所述内壁包括与所述弹性片固定连接的贴合面，所述贴合面向远离所述弹性片方向凹陷形成有凹腔，所述弹性片覆盖所述凹腔且所述弹性片上开设有与所述凹腔连通的第一通孔，所述质量片上开设有与所述第一通孔连通的第二通孔所述第一通孔和所述第二通孔连通所述背腔和所述凹腔。本实用新型提供的振动传感器结构简单、高度小且灵敏度高。

Description

振动传感器和音频设备 技术领域
本实用新型涉及麦克风领域，特别涉及振动传感器和音频设备。
 背景技术
现有技术的振动传感器一般包括外壳、设于外壳内的安装板、贴设于安装板的上侧面的弹性膜和安装于安装板的下侧与安装板围合形成前腔的MEMS芯片，安装板上开设有连通前腔和弹性膜的通孔，当外界振动信号通过结构传导至振动传感器上时，质量块上下振动，引起前腔体积变化，前腔内气体压强随之发生变化，变化的压强信号被MEMS芯片拾取到，转化为电信号，现有技术的振动传感器存在结构复杂且灵敏度低的问题。
因此，有必要提供一种结构简单且灵敏度高的振动传感器。
 技术问题
本实用新型的目的在于提供一种结构简单且灵敏度高的振动传感器。
 技术解决方案
本实用新型的技术方案如下：
提供一种振动传感器，包括具有内壁的腔体以及设于所述腔体内的弹性片、质量片和具有背腔的MEMS芯片，所述弹性片贴设于所述内壁上，所述质量片安装于所述弹性片背离所述内壁的侧面上，所述MEMS芯片安装于所述质量片背离所述弹性片的侧面上，所述内壁包括与所述弹性片固定连接的贴合面，所述贴合面向远离所述弹性片方向凹陷形成有凹腔，所述弹性片覆盖所述凹腔且所述弹性片上开设有与所述凹腔连通的第一通孔，所述质量片上开设有与所述第一通孔连通的第二通孔，所述第一通孔和所述第二通孔连通所述背腔和所述凹腔。
进一步地，所述弹性片包括框体、位于所述框体内且与所述框体间隔形成空槽的片体以及连接所述框体和所述片体的连接片，所述第一通孔开设于所述片体上，所述质量片安装于所述片体上。
进一步地，所述框体为矩形框，所述片体呈矩形，所述连接片的数量为四，所述框体的四条侧边与所述片体的四条侧边分别一一间隔相对设置，每个所述连接片的两端分别连接于间隔相对设置的所述框体的侧边与所述片体的侧边之间。
进一步地，所述连接片包括位于所述空槽内且与所述片体的侧边并行设置的连接条、连接所述连接条的一端于所述框体上的第一弯曲部和连接所述连接条的另一端于所述片体上的第二弯曲部。
进一步地，所述振动传感器还包括设于所述质量片周围且用于密封所述空槽的密封部。
进一步地，所述密封部为密封胶。
进一步地，所述腔体包括电路板和固定于所述电路板上的外壳，所述电路板形成为所述内壁。
进一步地，所述凹腔的横截面积大于所述内腔的横截面积。
进一步地，所述振动传感器还包括收容于所述腔体内的集成电路芯片，所述集成电路芯片电连接于所述MEMS芯片与所述电路板之间。
还提供一种音频设备，包括如上所述的振动传感器。
 有益效果
本实用新型的有益效果在于：MEMS芯片和质量片安装于弹性片背离凹腔的侧面上，当外界振动信号通过结构传导至振动传感器上时，MEMS芯片和质量片上下振动，引起凹腔体积变化，凹腔内气体压强随之变化，变化的压强信号被MEMS芯片拾取到，转化为电信号，本实用新型提供的振动传感器结构简单、高度小且灵敏度高。
 附图说明
图1为本实用新型实施例提供的振动传感器的结构示意图；
图2为图1中振动传感器的爆炸图；
图3为图1沿A-A线的剖面示意图；
图4为本实用新型实施例提供的振动传感器的去除外壳和密封部的结构示意图；
图5为本实用新型实施例提供的振动传感器中弹性片的结构示意图。
图中：
100、振动传感器；1、腔体；2、弹性片；3、质量片；4、MEMS芯片；40、背腔；101、贴合面；10、凹腔；20、第一通孔；30、第二通孔；21、框体；22、片体；23、空槽；24、连接片；25、密封部；241、连接条；242、第一弯曲部；243、第二弯曲部；11、电路板；12、外壳；120、内腔；5、集成电路芯片。
 本发明的实施方式
下面结合附图和实施方式对本实用新型作进一步说明。
一种振动传感器，请参照图1-图3，包括具有内壁的腔体1以及设于所述腔体1内的弹性片2、质量片3和具有背腔40的MEMS芯片4，所述弹性片2贴设于所述内壁上，所述质量片3安装于所述弹性片2背离所述内壁的侧面上，所述MEMS芯片4安装于所述质量片3背离所述弹性片2的侧面上，所述内壁包括与所述弹性片2固定连接的贴合面101，所述贴合面101向远离所述弹性片2方向凹陷形成凹腔10，所述弹性片2覆盖所述凹腔10且所述弹性片2上开设有与所述凹腔10连通的第一通孔20，所述质量片3上开设有与所述第一通孔20连通的第二通孔30所述第一通孔20和所述第二通孔30连通所述背腔40和所述凹腔10。
MEMS芯片4安装于弹性片2的上侧面，当外界振动信号通过结构传导至振动传感器100上时，MEMS芯片4和质量片3随弹性片2上下振动，引起凹腔10体积变化，凹腔10内气体压强随之发生变化，变化的压强信号被MEMS芯片4拾取到，质量片3增强了振动效果，振动传感器100灵敏度更高，除此之外，由于MEMS芯片4和质量片3代替了质量块，振动传感器100的高度减小。
优选地，所述弹性片2包括框体21、位于所述框体21内且与所述框体21间隔形成空槽23的片体22以及连接所述框体21和所述片体22的连接片24，所述第一通孔20开设于所述片体22上，所述质量片3安装于所述片体22上。
通过连接片24连接片体22和框体21，提高了片体22相对框体21的弹性，增强了片体22上下振动的效果，框体21可以为圆形框、矩形框或其他任何形状，片体22对应可以呈圆形、矩形或不规则形状，两者间隔形成环形空槽23。
优选地，所述框体21为矩形框，所述片体22呈矩形，所述连接片24的数量为四，所述框体21的四条侧边与所述片体的四条侧边22分别一一间隔相对设置，每个所述连接片24的两端分别连接间隔相对设置的所述框体21的侧边与所述片体22的侧边。
凹腔10呈矩形，框体21和片体22的形状与凹腔10的形状适配，连接片24可以呈直条型，与片体22的侧边和框体21的内侧垂直，也可以相对片体22的侧边和框体21的内侧倾斜，即连接片体22的每一侧边和框体21的内侧之间间隔形成的矩形槽的两斜对角。
优选地，所述连接片24包括位于所述空槽23内且与所述片体22的侧边并行设置的连接条241、连接所述连接条241的一端于所述框体21上的第一弯曲部242和连接所述连接条241的另一端于所述片体22上的第二弯曲部243。
连接条241越长，弹性越大，第一弯曲部242和第二弯曲部243分别加强了连接条241与框体21和片体22的连接强度。
优选地，所述振动传感器100还包括设于所述质量片3周围且用于密封所述空槽23的密封部25。密封部25用于密封空槽23从而密封凹腔10。
优选地，所述密封部25为密封胶。
优选地，所述腔体1包括电路板11和固定于所述电路板11上的外壳12，所述电路板11形成为所述侧壁。
所述外壳12具有与电路板11相对的内腔120，外壳12罩设于弹性片2、质量片3和MEMS芯片4外，电路板11形成为腔体1的内壁，充了利用电路板11，减小振动传感器100的尺寸。
具体地，外壳12的内腔120形成为振动传感器100的后腔，凹孔10与弹性片2围合形成为振动传感器100的前腔。
优选地，MEMS芯片为MEMS麦克风芯片或者MEMS压力传感器芯片。
优选地，所述凹腔10沿所述弹性片2振动方向的横截面积大于所述背腔40沿所述弹性片2振动方向的横截面积。
优选地，所述振动传感器100还包括收容于所述腔体1内的集成电路芯片5，所述集成电路芯片5电连接于所述MEMS芯片4与所述电路板11之间。
集成电路芯片5用于处理MEMS芯片4拾取的压力变化信号。
本实用新型还提供一种音频设备（图中未示），包括如上所述的振动传感器100。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。
 

Claims (10)

  1. 一种振动传感器，其特征在于，包括具有内壁的腔体以及设于所述腔体内的弹性片、质量片和具有背腔的MEMS芯片，所述弹性片贴设于所述内壁上，所述质量片安装于所述弹性片背离所述内壁的侧面上，所述MEMS芯片安装于所述质量片背离所述弹性片的侧面上，所述内壁包括与所述弹性片固定连接的贴合面，所述贴合面向远离所述弹性片方向凹陷形成有凹腔，所述弹性片覆盖所述凹腔且所述弹性片上开设有与所述凹腔连通的第一通孔，所述质量片上开设有与所述第一通孔连通的第二通孔，所述第一通孔和所述第二通孔连通所述背腔和所述凹腔。
  2. 根据权利要求1所述的振动传感器，其特征在于：所述弹性片包括框体、位于所述框体内且与所述框体间隔形成空槽的片体以及连接所述框体和所述片体的连接片，所述第一通孔开设于所述片体上，所述质量片安装于所述片体上。
  3. 根据权利要求2所述的振动传感器，其特征在于：所述框体为矩形框，所述片体呈矩形，所述连接片的数量为四，所述框体的四条侧边与所述片体的四条侧边分别一一间隔相对设置，每个所述连接片的两端分别连接于间隔相对设置的所述框体的侧边与所述片体的侧边之间。
  4. 根据权利要求3所述的振动传感器，其特征在于：所述连接片包括位于所述空槽内且与所述片体的侧边并行设置的连接条、连接所述连接条的一端于所述框体上的第一弯曲部和连接所述连接条的另一端于所述片体上的第二弯曲部。
  5. 根据权利要求2所述的振动传感器，其特征在于，所述振动传感器还包括设于所述质量片周围且用于密封所述空槽的密封部。
  6. 根据权利要求5所述的振动传感器，其特征在于：所述密封部为密封胶。
  7. 根据权利要求1所述的振动传感器，其特征在于：所述腔体包括电路板和固定于所述电路板上的外壳，所述电路板形成为所述内壁。
  8. 根据权利要求7所述的振动传感器，其特征在于：所述振动传感器还包括收容于所述腔体内的集成电路芯片，所述集成电路芯片电连接于所述MEMS芯片与所述电路板之间。
  9. 根据权利要求1所述的振动传感器，其特征在于：所述凹腔沿所述弹性片振动方向的横截面积大于所述背腔沿所述弹性片振动方向的横截面积。
  10. 一种音频设备，其特征在于，包括如权利要求1-9中任意一项所述的振动传感器。
PCT/CN2019/093333 2019-06-27 2019-06-27 振动传感器和音频设备 WO2020258171A1 (zh)

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