WO2022062002A1 - 一种骨传导麦克风 - Google Patents

一种骨传导麦克风 Download PDF

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Publication number
WO2022062002A1
WO2022062002A1 PCT/CN2020/121820 CN2020121820W WO2022062002A1 WO 2022062002 A1 WO2022062002 A1 WO 2022062002A1 CN 2020121820 W CN2020121820 W CN 2020121820W WO 2022062002 A1 WO2022062002 A1 WO 2022062002A1
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Prior art keywords
bone conduction
conduction microphone
diaphragm
circuit board
vibration
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PCT/CN2020/121820
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English (en)
French (fr)
Inventor
张金宇
王凯
洪亭亭
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瑞声声学科技(深圳)有限公司
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Publication of WO2022062002A1 publication Critical patent/WO2022062002A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the utility model belongs to the technical field of microphones, in particular to a bone conduction microphone.
  • the purpose of the present invention is to provide a bone conduction microphone, which aims to reduce the size of the bone conduction microphone and enhance the anti-electromagnetic interference performance.
  • a bone conduction microphone comprising a shell, a circuit board that is joined with the shell cover to form a containing space, and a MEMS chip and an ASIC chip contained in the containing space, the bone conduction microphone. It also includes a vibrating structure arranged on the circuit board, the vibrating structure comprising a base plate with a hollow portion, a vibrating film fixed on the side of the base plate away from the circuit board, and a mass fixed on the vibrating film
  • the substrate, the diaphragm and the circuit board form a cavity for accommodating the MEMS chip and the ASIC chip.
  • the mass block is fixed on the side of the diaphragm away from the cavity.
  • the orthographic projection of the mass block along the vibration direction of the diaphragm falls within the range of the cavity.
  • the line connecting the center point of the mass block and the center point of the diaphragm is parallel to the vibration direction of the diaphragm.
  • the diaphragm and the mass block are bonded and fixed.
  • mass block is attached to the diaphragm through a semiconductor process.
  • the mass block is made of silicon.
  • the vibration structure of the bone conduction microphone of the present invention includes a base plate, a vibrating membrane fixed above the base plate, and a mass block fixed on the vibrating membrane.
  • the vibration structure is arranged inside the casing, compared with the related art, the vibration structure is added outside the MEMS microphone, which reduces the size of the device, is conducive to the miniaturization of the product, and can also enhance the anti-electromagnetic interference performance of the bone conduction microphone.
  • FIG. 1 is a schematic diagram of the overall structure of a bone conduction microphone provided by an embodiment of the present invention
  • FIG. 2 is a schematic diagram of an exploded structure of a bone conduction microphone provided by an embodiment of the present invention
  • FIG. 3 is a schematic cross-sectional view in the direction A-A of FIG. 1 .
  • a bone conduction microphone provided by an embodiment of the present invention includes a casing 1 , a circuit board 2 that is joined with the casing 1 to form a accommodating space 6 , and a MEMS chip that is accommodated in the accommodating space 6 .
  • the MEMS chip 4 and the ASIC chip 5 are electrically connected to the circuit board 2
  • the MEMS chip 4 and the ASIC chip 5 are electrically connected.
  • the housing 1 can protect the internal structure of the bone conduction microphone and serve as an electromagnetic shield.
  • the bone conduction microphone of this embodiment further includes a vibration structure 3 disposed on the circuit board 2 .
  • the vibration structure 3 includes a base plate 31 with a hollow portion, a diaphragm 32 fixed on a side of the base plate 31 away from the circuit board 2 , and a diaphragm 32 fixed on the vibration plate 2 .
  • the mass 33 on the membrane 32 , the substrate 31 , the vibrating membrane 32 and the circuit board 2 form a cavity 7 for accommodating the MEMS chip 4 and the ASIC chip 5 .
  • the mass 33 is displaced relative to the MEMS chip 4 in response to the vibration signal, so that the gas in the cavity 7 where the MEMS chip 4 is located is compressed and stretched , the pressure changes periodically, the changed pressure signal is picked up by the MEMS chip 4 and converted into an electrical signal, and the ASIC chip 5 further amplifies the signal.
  • the vibration structure 3 is arranged inside the housing 1, compared with the related art, the vibration structure 3 is added outside the MEMS microphone, which reduces the size of the device, is conducive to realizing the miniaturization of the product, and can also enhance the anti-electromagnetic interference performance of the bone conduction microphone. .
  • the mass block 33 is fixed on the side of the vibrating film 32 away from the cavity 7 .
  • the vibrating film 32 and the mass block 33 can be fixed by bonding, and the mass can also be fixed by a semiconductor process.
  • the block 33 is attached to the diaphragm 32 to ensure the consistency of the vibration of the diaphragm 32 and the mass 33 .
  • the mass block 33 in this embodiment is made of silicon material. In other possible implementation manners, the mass block 33 may also be selected from other types of elemental semiconductors, which are not limited in this embodiment.
  • the orthographic projection of the mass 33 along the vibration direction of the diaphragm 32 falls within the range of the cavity 7, that is, the edge of the mass 33 does not laterally exceed the edge of the cavity 7, because if the The edge is beyond the edge of the cavity 7 .
  • the connection line between the center point of the mass block 33 and the center point of the vibrating film 32 is parallel to the vibration direction of the vibrating film 32, which further ensures the consistency of the vibration of the vibrating film 32 and the mass block 33, and improves the stability of mechanical vibration. Thereby, the quality of sound transmission is improved.
  • the housing 1 of this embodiment is made of metal, which can protect the internal structure of the bone conduction microphone and serve as electromagnetic shielding.
  • the peripheral wall of the casing 1 is fixedly covered with the circuit board 2, and the peripheral wall of the casing 1 is flush with the edge of the circuit board 2, so that the overall balance and stability of the bone conduction microphone are more beautiful.
  • the vibration structure 3 of the bone conduction microphone of the present invention includes a base plate 31 , a diaphragm 32 fixed on the side of the base plate 31 away from the circuit board 2 , and a mass 33 fixed on the diaphragm 32 .
  • the mass block 33 is displaced relative to the MEMS chip 4 in response to the vibration signal, so that the gas in the cavity 7 where the MEMS chip 4 is located is compressed and stretched, and the pressure changes periodically and changes.
  • the pressure signal is picked up by the MEMS chip 4 and converted into an electrical signal, and the ASIC chip 5 further amplifies the signal.
  • the vibration structure 3 is arranged inside the housing 1, compared with the related art, the vibration structure 3 is added outside the MEMS microphone, which reduces the size of the device, is conducive to realizing the miniaturization of the product, and can also enhance the anti-electromagnetic interference performance of the bone conduction microphone. .

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本实用新型提供了一种骨传导麦克风，骨传导麦克风包括外壳、与所述外壳盖接合围形成收容空间的线路板以及收容于所述收容空间内的MEMS芯片和ASIC芯片，所述骨传导麦克风还包括设置于所述线路板上的振动结构，所述振动结构包括具有镂空部的基板、固定在所述基板的远离所述线路板一侧的振膜以及固定在所述振膜上的质量块，所述基板、所述振膜以及所述线路板合围形成收容所述MEMS芯片和所述ASIC芯片的腔体。本实用新型可以减小骨传导麦克风的尺寸以及增强抗电磁干扰性能。

Description

一种骨传导麦克风 技术领域
本实用新型属于麦克风技术领域，尤其涉及一种骨传导麦克风。
 背景技术
随着科技的进步，市面上出现一种利用骨传导方式实现声音传播的麦克风，在嘈杂的环境中实现清晰的声音还原，避免空气传播声音所产生的噪声干扰，极高地保证声音质量。但是相关技术中的骨传导麦克风是在传统的MEMS麦克风外部增设一振动结构件，使得麦克风整体占据较大的空间，并且由于没有受到屏蔽作用，容易受到电磁干扰。
 技术问题
本实用新型的目的在于提供一种骨传导麦克风，旨在减小骨传导麦克风的尺寸以及增强抗电磁干扰性能。
 技术解决方案
本实用新型的技术方案如下：一种骨传导麦克风，包括外壳、与所述外壳盖接合围形成收容空间的线路板以及收容于所述收容空间内的MEMS芯片和ASIC芯片，所述骨传导麦克风还包括设置于所述线路板上的振动结构，所述振动结构包括具有镂空部的基板、固定在所述基板的远离所述线路板一侧的振膜以及固定在所述振膜上的质量块，所述基板、所述振膜以及所述线路板合围形成收容所述MEMS芯片和所述ASIC芯片的腔体。
进一步地，所述质量块固定在所述振膜远离所述腔体一侧。
进一步地，所述质量块沿所述振膜的振动方向的正投影落在所述腔体范围内。
进一步地，质量块的中心点与所述振膜的中心点的连线平行于所述振膜的振动方向。
进一步地，所述振膜与所述质量块粘接固定。
进一步地，所述质量块通过半导体工艺附着在所述振膜上。
进一步地，所述质量块为硅材质。
 有益效果
本实用新型的有益效果在于：本实用新型的骨传导麦克风的振动结构包括基板、固定在基板上方的振膜以及固定在振膜上的质量块，当通过骨头传播的振动信号传递至骨传导麦克风时，质量块响应于振动信号后相对MEMS芯片发生位移，从而使得MEMS芯片所在腔体内的气体被压缩和拉伸，压强发生周期变化，变化的压强信号被MEMS芯片拾取，转化为电信号，ASIC芯片进一步将信号进行放大。并且由于振动结构设置于外壳内部，相比与相关技术在MEMS麦克风外部增设振动结构，减小了器件尺寸，有利于实现产品的小型化，还可以增强骨传导麦克风的抗电磁干扰性能。
 附图说明
图1是本实用新型实施例提供的骨传导麦克风的整体结构示意图；
图2是本实用新型实施例提供的骨传导麦克风的分解结构示意图；
图3是图1 A-A方向的剖视示意图。
 本发明的实施方式
下面结合附图和实施方式对本实用新型作进一步说明。
实施例：
请参阅图1至图3，为本实用新型实施例提供的一种骨传导麦克风，包括外壳1、与外壳1盖接合围形成收容空间6的线路板2以及收容于收容空间6内的MEMS芯片4和ASIC芯片5，MEMS芯片4和ASIC芯片5与线路板2电连接，MEMS芯片4和ASIC芯片5之间电连接。外壳1可起到保护骨传导麦克风内部结构以及电磁屏蔽作用。
本实施例的骨传导麦克风还包括设置于线路板2上的振动结构3，振动结构3包括具有镂空部的基板31、固定在基板31的远离线路板2一侧的振膜32以及固定在振膜32上的质量块33，基板31、振膜32以及线路板2合围形成收容MEMS芯片4和ASIC芯片5的腔体7。当通过骨头传播的振动信号传递至本实施例的骨传导麦克风时，质量块33响应于振动信号后相对MEMS芯片4发生位移，从而使得MEMS芯片4所在腔体7内的气体被压缩和拉伸，压强发生周期变化，变化的压强信号被MEMS芯片4拾取，转化为电信号，ASIC芯片5进一步将信号进行放大。并且由于振动结构3设置于外壳1内部，相比与相关技术在MEMS麦克风外部增设振动结构3，减小了器件尺寸，有利于实现产品的小型化，还可以增强骨传导麦克风的抗电磁干扰性能。
具体的，如图3所示，质量块33固定在振膜32远离腔体7一侧，可选的，振膜32与质量块33之间可以通过粘接固定，还可以通过半导体工艺将质量块33附着在振膜32上，确保了振膜32与质量块33振动的一致性。可选的，本实施例的质量块33为硅材质，在其他可能的实施方式中，质量块33也可以选用其他种类的元素半导体，本实施例对此不做限制。
进一步地，质量块33沿振膜32的振动方向的正投影落在腔体7范围内，也就是说，质量块33的边沿没有横向超出腔体7的边缘，这是因为如果质量块33的边沿超出了腔体7的边缘，当振膜32发生振动时，质量块33的对应腔体7边缘的部分必然会受到更大的应力，从而对质量块33的移动产生影响。并且，质量块33的中心点与振膜的32中心点的连线平行于振膜32的振动方向，进一步保证了振膜32与质量块33振动的一致性，提高了机械振动的稳定性，从而提高了声音传输的质量。
本实施例的外壳1为金属材质，可起到保护骨传导麦克风内部结构以及电磁屏蔽作用。外壳1的周壁与线路板2盖接固定，且外壳1的周壁与线路板2的边缘平齐，使得骨传导麦克风整体均衡稳定，也更加美观。
综上所述，本实用新型的骨传导麦克风的振动结构3包括基板31、固定在基板31的远离线路板2一侧的振膜32以及固定在振膜32上的质量块33，当通过骨头传播的振动信号传递至骨传导麦克风时，质量块33响应于振动信号后相对MEMS芯片4发生位移，从而使得MEMS芯片4所在腔体7内的气体被压缩和拉伸，压强发生周期变化，变化的压强信号被MEMS芯片4拾取，转化为电信号，ASIC芯片5进一步将信号进行放大。并且由于振动结构3设置于外壳1内部，相比与相关技术在MEMS麦克风外部增设振动结构3，减小了器件尺寸，有利于实现产品的小型化，还可以增强骨传导麦克风的抗电磁干扰性能。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (7)

  1. 一种骨传导麦克风，包括外壳、与所述外壳盖接合围形成收容空间的线路板以及收容于所述收容空间内的MEMS芯片和ASIC芯片，其特征在于：所述骨传导麦克风还包括设置于所述线路板上的振动结构，所述振动结构包括具有镂空部的基板、固定在所述基板的远离所述线路板一侧的振膜以及固定在所述振膜上的质量块，所述基板、所述振膜以及所述线路板合围形成收容所述MEMS芯片和所述ASIC芯片的腔体。
  2. 根据权利要求1所述的骨传导麦克风，其特征在于，所述质量块固定在所述振膜远离所述腔体一侧。
  3. 根据权利要求1所述的骨传导麦克风，其特征在于，所述质量块沿所述振膜的振动方向的正投影落在所述腔体范围内。
  4. 根据权利要求1所述的骨传导麦克风，其特征在于，质量块的中心点与所述振膜的中心点的连线平行于所述振膜的振动方向。
  5. 根据权利要求1所述的骨传导麦克风，其特征在于，所述振膜与所述质量块粘接固定。
  6. 根据权利要求1所述的骨传导麦克风，其特征在于，所述质量块通过半导体工艺附着在所述振膜上。
  7. 根据权利要求1所述的骨传导麦克风，其特征在于，所述质量块为硅材质。
PCT/CN2020/121820 2020-09-25 2020-10-19 一种骨传导麦克风 WO2022062002A1 (zh)

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114401478B (zh) * 2021-12-24 2024-03-08 歌尔微电子股份有限公司 一种骨声纹传感器

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108513241A (zh) * 2018-06-29 2018-09-07 歌尔股份有限公司 振动传感器和音频设备
CN209314103U (zh) * 2019-03-27 2019-08-27 歌尔科技有限公司 振动传感器和音频设备
CN209659621U (zh) * 2019-03-27 2019-11-19 歌尔科技有限公司 振动传感器和音频设备
CN209964302U (zh) * 2019-06-30 2020-01-17 瑞声声学科技(深圳)有限公司 骨传导mems麦克风和移动终端
CN210464558U (zh) * 2019-03-25 2020-05-05 共达电声股份有限公司 一种传感器
CN111131988A (zh) * 2019-12-30 2020-05-08 歌尔股份有限公司 振动传感器和音频设备
CN210927933U (zh) * 2019-12-30 2020-07-03 瑞声声学科技(深圳)有限公司 驻极体骨导麦克风
CN210958707U (zh) * 2019-12-30 2020-07-07 瑞声声学科技(深圳)有限公司 骨传导麦克风
CN211321503U (zh) * 2018-12-12 2020-08-21 美商楼氏电子有限公司 振动换能器
CN212572961U (zh) * 2020-06-30 2021-02-19 瑞声声学科技(深圳)有限公司 振动传感器及具有其的音频设备
CN212785847U (zh) * 2020-06-30 2021-03-23 瑞声声学科技(深圳)有限公司 振动传感器

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108513241A (zh) * 2018-06-29 2018-09-07 歌尔股份有限公司 振动传感器和音频设备
CN211321503U (zh) * 2018-12-12 2020-08-21 美商楼氏电子有限公司 振动换能器
CN210464558U (zh) * 2019-03-25 2020-05-05 共达电声股份有限公司 一种传感器
CN209314103U (zh) * 2019-03-27 2019-08-27 歌尔科技有限公司 振动传感器和音频设备
CN209659621U (zh) * 2019-03-27 2019-11-19 歌尔科技有限公司 振动传感器和音频设备
CN209964302U (zh) * 2019-06-30 2020-01-17 瑞声声学科技(深圳)有限公司 骨传导mems麦克风和移动终端
CN111131988A (zh) * 2019-12-30 2020-05-08 歌尔股份有限公司 振动传感器和音频设备
CN210927933U (zh) * 2019-12-30 2020-07-03 瑞声声学科技(深圳)有限公司 驻极体骨导麦克风
CN210958707U (zh) * 2019-12-30 2020-07-07 瑞声声学科技(深圳)有限公司 骨传导麦克风
CN212572961U (zh) * 2020-06-30 2021-02-19 瑞声声学科技(深圳)有限公司 振动传感器及具有其的音频设备
CN212785847U (zh) * 2020-06-30 2021-03-23 瑞声声学科技(深圳)有限公司 振动传感器

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